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Ramon Chips 1 Ramon Chips, Haifa, Israel Technion 1925 2000

Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. [email protected]

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Page 1: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 1

Ramon Chips, Haifa, Israel

Technion 1925 2000

Page 2: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips

Converting PLD-based SoCinto RadSafe™ ASIC

Prof. Ran Ginosar, CEO, Ramon ChipsMAPLD, September [email protected]

Ramon Chips is named in memory of Col. Ilan Ramon, Israeli astronaut who died on board the Columbia space shuttle, 1/2/2003

Ramon Chips

Page 3: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 3

About Ramon Chips• Private company, incorporated 2004• Based in Haifa, Israel• Developed RadSafeTM technology• Made, qualified and delivered several

space grade components • Focused on ASIC for space Most products FPGAASIC conversions Higher reliability and performance

at lower cost and power

Page 4: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 4

Outline• RadSafeTM concepts• RadSafeTM libraries and cores• Example FPGAASIC conversions

Page 5: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 5

RadSafeTM concepts• Rad Hard By Design• Rad Hard By Similarity• Commercial CMOS technology Tower Semi 0.18µ CMOS ( 0.13µ)

• Static CMOS circuits• Own library (rad hard circuits)• Own methodology• Proven Rad Hard, qualifiable

Page 6: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 6

Radiation effects mitigated by RadSafeTM

• TID• SEL• SEU/SET in flip-flops• SEU in SRAMs• SEFI caused by PLL/DLLs

Page 7: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 7

Mitigating TID effects• Advanced CMOS process – ≤0.18µ with STI

• Fixed layout – predictable parasitic devices; insensitive to placement

• Only 30% area penalty• TID immunity: >300Krad in all tests

INA

INB

OUT

Page 8: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 8

Performance under TID stress

-0.02

0

0.02

0.04

0.06

0.08

0.1

0.12

0.14

0 0.25 0.5 0.75 1 1.25 1.5 1.07 2Vds(V)

Id(A

)

0.0000010

0.0000100

0.0001000

0.0010000

0.0100000

0.1000000

0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2

Vgs(V)

Id(A

)

-0.02

0

0.02

0.04

0.06

0.08

0.1

0.12

0 -0.3 -0.6 -0.9 -1.2 -1.5 -1.8Vds(V)

Id(A

)

m

0.0000100

0.0001000

0.0010000

0.0100000

0.1000000

0 -0.25 -0.5 -0.75 -1 -1.25 -1.5 -1.07 -2

Vgs(V)

Id(A

)

NMOS

PMOS

Page 9: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 9

Mitigating SEL• Fixed PNPN geometry insensitive to placement

• Double/triple guard rings in I/O circuits• No SEL detected up to 106MeV·cm2/mg

Page 10: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 10

Mitigating SEU in flip-flops• SEP = Single Error Protected FF• Continuous self-correcting feedback At each latch (x2)

• SET filter for data • SET Filter for clock • SET Filter for async Set/Reset• All flip-flops tested by SCAN• Less than 10-12 errors/bit/day

Page 11: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 11

RadSafe SRAM cell

• Less than 2×10-7 errors/bit/day• EDAC tested to fix all SEU in SRAM

BL BLB

WL

Conventional SRAM cell

BL BLB

WLB

RadSafeTM SRAM cell

Many NMOS devices connected to bit-lines

Only PMOS devices connected to bit-lines

Page 12: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 12

Analog PLL sensitive to TID, SET

• TID affects analog transistors• SET unlock PLL• SET Phase accumulation • False relock Missing cycles• Sensitive to process, voltage,

temperature variations

PFD+

CPVCO

/N

clk_refclk_out

Ionizing particle might discharge the capacitor, which hold the control

voltagefrequency

control voltage

frequency

phase

Discharge by ionizing particle

Missing clock cycle

Page 13: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 13

RH all-digital DLL• Standard cell logic: TID, SEL protection Effective over a wide range of

process, voltage and temperature variations• SEP flip-flops: SET/SEU protection• Low jitter: typical 1% clock cycle• Frequency multiplication by 2X,4X• Clock de-skewing

PHD CTRL

DCDL

up

dn

ctrl[m-1:0]

MUL

clkfb

REFCLK

CLK1XCLK2XCLK4X

Page 14: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 14

RadSafe™ libraries• Logic 80 cells, 40 Kgates/mm2

• I/O 15 cells (incl. 500 Mbps LVDS)

• SRAM Single / dual port, 100 Kbit/mm2

• DLL• And our own methodology Conversion, design, layout

Page 15: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 15

Examples of ASICs

FPGAconversion

Radiation &qualification

test

LEON3 SoCprototype

Page 16: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 16

LEON3FT SoC• Prototype in 2006

GR702RC

• Tested: 120 MHz (CPU)

250 Mbps (SpW)

All SEUs corrected

REG

I-TRC

B-TRC

INSTCACHE

DATACACHE

CLK

SpWCLK

Now developing second generation…

Page 17: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 17

Image Compression ASIC• Standard JPEG2000• 5 Mbit (250 cores), 750 Kgates

30M transistors, 12×12mm• Less than 3W• Converted from Stratix-II FPGA• For imaging satellites ASIC: 44 12-bit Mpix/s, 1 Tops Many ASICs in system

• Fab in 2008

Page 18: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 18

Converting FPGA to ASIC• Add mitigation Enforce HDL coding rules SEU detection and recovery

• Add reconfigurability Never believe constants

• Verify new HDL on old FPGA+System Or on FPGA-based test system

Page 19: Ramon Chips, Haifa, Israel - NASA · 2008-10-08 · Ramon Chips Converting PLD-based SoC into RadSafe™ ASIC Prof. Ran Ginosar, CEO, Ramon Chips MAPLD, September 2008. ran@ramon-chips.com

Ramon Chips 19

Summary• RadSafe™ On commercial process, using standard EDA Proven Rad-Hard-By-Design High performance, low power, low cost

ASICs

• Example projects FPGA conversions LEON3FT SoC

• Future: Now developing 0.13µ