Placitus

Platform Circuit Technology UnderlyingHeterogeneous Nano & Tera SystemsProf. Dr. Q. Huang

12 May 2011

12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems

Outline

Background

Motivation

Sensor Interface and Data Acquisition

Body Area Network and Short Range Communication

Wide Area Network and Cellular Link

Summary

2


Great Expectations

3

Impressive Advances in• Microsystems Technology• Wireless Communications• Internet Connectivity

Have Set the Scene for the Next Big Thing

The Internet of Thingsor M2M Communication


Great Expectations

4

Global Interest • Chinese companies already moving fast• Chinese universities not far behind• National Priority and Support

Giving us a run for our money


Modern Healthcare EnvisionsSophisticated, Heterogeneous Systems


Sophisticated Electronics Needed to Bind Sensors & Actuators Into Useful Systems


Few Can Rely on Off-the-Shelf ComponentsMost Require Full Custom Integrated Circuits

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The Underlying TechnologiesSensors & Systems

8

Nano devices above passivation?

ETH Implantable Passive Telemetry IC

CSEM ISM RF SoC

CSEM WL Sensor Node

Sensors Based on Micro & Nano Technologies


The Underlying Platform - ICs for Medical Data Acquisition and Communication

Data Acquisition Sensor Interface Instrumentation amplifier (sub-µV offset, low noise) Signal conditioning, data conversion, calibration

DSP and Control Loop Algorithm or Circuitry Energy Harvesting and Supply Regulation Short Range Wireless

Incorporating wake-up radio for low duty cycle operations

Broad Range Wireless

9

12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 10

battery powered nodesremote powered nodes

Project Partners

ETH Q. Huang, T. Burger

EPFL C. Deholain

CSEM C. Enz

3 Main SwissInstitutions inIC Research

Introduction

WBAN Require ULP Miniaturized Sensor Nodes Wireless body area networks

(WBAN) for health monitoring, connecting wearable devices and as smart user interface

The nodes feature sensing, processing, storing and wireless communication

They are usually battery powered or use remote powering

They require ultralow-power (ULP) and miniaturized wireless sensor nodes

Combination of CMOS system-on-chip (SoC), RF and LF MEMS in a system-in-package (SiP) to achieve a 2.4 GHz, <mW-level, <20 mm3 node

© C. Enz | 2011 Slide 11Ultralow-power MEMS-based Radio for Wireless Body Area Networks

battery powered nodes

remote powered nodes

M. Contaldo, et al., TBioCAS, Dec. 2010.

battery powered nodesremote powered nodes

WBAN WWAN

BAN Scenario and System View

Contaldo, Banerjee, Enz Slide 12for Placitus November Meeting


INTERFACE ELECTRONICSData Acquisition and Remote Powering

13


Passive Telemetry By ETH

Sensor

SupplyOscillator Data

Acquisition Circuit

PPM-OutputA

DLPN

Rectifier Startup ModulatorVoltage

Regulator

RF/DC-Converter

Sensor

Antenna

PPM-AM reflected RF

t

Systole

Diastole

Artery

Magnet

Transponder

MagnetoresistiveSensor

Implant

Base-Unit

Transmitter

Low-power, single-chip, fully-implantable micro transponder

Wireless powering and communication

Accurate long-term monitoring

Independent of time and location for diagnosis and therapy

Low risk of infection (no external catheter)

Block diagram of microtransponder ASICSensor-transponder-system

Monitoring setup


Implantable Passive Telemetry By ETH

Chip area: 4.359 mm x 5.245 mm

2 μm 40 V BiCMOS technology

Measured characteristics of the micro transponder

RF Carrier 27/40 MHz (ISM)

Baud Rate 1 kBaud

Modulation PPM-AM

S/N Ratio 39.7 dB

Equiv. I/P-Offset 170 μV

THD (@ f=3.737 Hz, Vpp=5.8 mV)

0.16%

Power Consumption 0.5 mW

Power Consumption of Data Acquisition Unit

250 μW @ 3V


PH; Glucose;K+, Ca2+, Mg2+;

CRP;

Heart&

Brain Activity

Motion Detect

Bio-electricSensors

Bio-medical ISET Sensors

Thermal Couples Temperature

Multiple Purpose Sensor Interface (EPFL)

Sensor Type

pH ISFET sensorAccelerometer

Supply Voltage 1.5V 1.7-3.6VCurrent

Consumption1nA 70μA 11μA

Sensitivity -56mV / pH 56 count/ gSampling Rate - 100/400Hz 40/10Hz

Power Consumption 13nW @ pH7 ≤175μW ≤27μW

Sensor Type

ECG-electrode

ensor

Contact Resistance 100KΩSignal Bandwidth 300Hz

Accuracy 10 Bits


Wireless Powering of Implants in Human Body

The control unit which is placed on the body can remotelypowered the sensors and communicate with them


Remote Powering By EPFL

Magnetic Coupling

Electromagnetic Coupling

L1 L2

PAC1

C2

RectifierInputAC

voltage

Base Station Implant

M12

2d

RL

OutputDC

voltageCL

Reg.

2d


SHORT RANGE WIRELESSPersonal and Body Area Network

19

Introduction

MEMS-based Short Range Transceiver Architecture Front-end filters before the LNA Interferers and image rejection, relax linearity requirements, avoid impedance matching network

Front-end filters after the power amplifier (PA) Spurious filtering, avoid impedance matching network

Synthesizer Fixed low phase noise RF LO thanks to high Q Merged Time & Frequency reference with LF silicon resonator (SiRes)


Digital Baseband

D. Ruffieux, et al., ESSCIRC 2010.

BAW-based Class-E Power Amplifier

Transmitter Chip

0.18µm CMOS technology

1.25 x 1.5 mm2

Integrated in a complete BAW-based transceiver

No external components in the TX other than the BAW filter and the BALUN for test purposes



Modulated Spectrum

1 Mb/s GFSK

BT modulation

-21.7 dBc, -21.4 dBc @ ±500 kHz

ACP 2: -42 dBm

ACP 3: -49 dBm

BT LE modulation ACP 2: -41 dBm

ACP 3: -44 dBm


-4 -3 -2 -1 0 1 2 3 4 -80

-70

-60

-50

-40

-30

-20

-10

0

Frequency offset [MHz]

dBc

BT mask

BT mi=0.34BT LE


Power Consumption Breakdown


Block Cons. [mW]Synthesis 11.11BAW DCO 2.37Dividers, ΣΔ 3.28LC VCO 3.38PLL div., PFD, CP 2.08Selective TX 36.19IF buffer 0.56RC/CR 2.34SSB mixer 3.68PPA 3.82PA 25.79Chip in TX mode 47.3

55%

8%

8%

6%

23%

At Pout = 5.4 dBm

PA PPASSB mix RC/CR, Buf IFSynthesis


Prototype



BROAD RANGE WIRELESSWide Area Network – Cellular Radio

25

26Integrated Systems Laboratory


Multi Standard RF Transceiver for WAN

27


GSM, EDGE, WCDMA & TD-SCDMA

28

Center 915 MHz Span 1 MHz100 kHz/

3DB

Ref 10 dBm Att 10 dB * SWT 1 s

RBW 30 kHz

VBW 30 kHz

TRG

Modulation Spectrum

*

*

GAT

*

*

1 AVAVG

-90

-80

-70

-60

-50

-40

-30

-20

-10

0

10

SWP 4 of 200

LIMIT CHECK PASS

MODU_G

Center 915 MHz Span 1 MHz100 kHz/

3DB

Ref 5 dBm Att 10 dB * SWT 1 s

RBW 30 kHz

VBW 30 kHz

TRG

Modulation Spectrum

*

*

GAT

*

*

1 AVAVG

-90

-80

-70

-60

-50

-40

-30

-20

-10

0

SWP 4 of 200

LIMIT CHECK PASS

MODU_E

A

3DB

B

3DB

BS,TDS:CODE POWER

dB TOTChan 1.16Slot 4

Start Code 1 1 Code/ Stop Code 16

1 AVG

RESULT SUMMARY TABLE

Chan 1.16Slot 4

PA

Att 0 dBAtt 0 dB

Att 0 dBAtt 0 dB

DR 52.8 kbps

DR 52.8 kbps

Ref 0.00

dBm

Ref 0.00

dBm

Ref 0.00

dBm

1 CLRWR

CF 0 Hz

Ref 0.00

dBm

Ref 0.00

dBm

Ref 0.00

dBm

CF 0 Hz

B1M

-63

-56

-49

-42

-35

-28

-21

-14

-7

GLOBAL RESULTS FOR SET 0:

Chip Rate Error -0.14 ppm Trg to Frame --.--

SLOT RESULTS Carr Freq Err -72.46 Hz

P Data -8.12 dBm IQ Imbal/Offs 0.12/0.51 %

P D1 -8.20 dBm RHO 0.9986

P D2 -8.05 dBm Composite EVM 3.77 %

P Midamble -7.64 dBm Pk CDE(SF 16) -36.11 dB

Active Channels 1 Average RCDE -40.04 dB

CHANNEL RESULTS

Channel.SF 1.16 Data Rate 52.8 kbps

ChannelPwr Rel -0.01 dB ChannelPwr Abs -8.13 dBm

Symbol EVM 1.00 %rms Symbol EVM 2.31 %Pk

Ref 20 dBm Att 25 dB

1 RMCLRWR

A

3DB

SWT 2 s

RBW 30 kHzVBW 300 kHz

***

Center 1.95 GHz Span 25.5 MHz2.55 MHz/

-70

-60

-50

-40

-30

-20

-10

0

10

Tx Channel W-CDMA 3GPP REV Bandwidth 3.84 MHz Power 23.65 dBm Adjacent Channel Bandwidth 3.84 MHz Lower -45.20 dB Spacing 5 MHz Upper -44.54 dB Alternate Channel Bandwidth 3.84 MHz Lower -55.36 dB Spacing 10 MHz Upper -55.93 dB

64QAM TD-HSPA Rx WCDMA Band I Tx

GSM Tx EDGE Tx

Digital Baseband Evolved EDGE (E‐EDGE)

• International Solid‐State Circuit Conference 2010


PrototypeIC #11mm2

PrototypeIC #22mm2

• Supports also Level‐A E‐EDGE 4 modulation types, 23 CS• Efficient solution for 16QAM/32QAM channel equalization• Flexible Viterbi and Turbo decoder with shared memories

• GSM/GPRS/EDGE 2 modulation types 15 coding schemes (CS)• Low cost channel equalizer• Flexible Viterbi decoder


IC #1 IC #2

Core size 1.0mm2 2.0mm2

Max clock frequency fmax 172MHz 151MHz

Leakage current 0.49mA 0.6mA

Continuous burst reception (8 time slots)Avg power at ftarget=40MHz and VDD=1.2V

GPRS CS1 (GMSK) 2.4mW 6.8mW

EDGE MCS9 (8‐PSK) 5.2mW 11.2mW

E‐EDGE DAS12 (32QAM) ‐‐‐ 19.9mW

Scale supply voltage

Less than 5mW in fastest mode

Achieve throughput requirements with

ftarget=40MHz

Turbo Decoder ASICs forWCDMA‐HSDPA and LTE

• International Solid‐State Circuit Conference 2008• Journal of Solid‐State Circuits 2009

• International Solid‐State Circuit Conference 2010• Journal of Solid‐State Circuits 2011


Our chip

ISSCC2003

ISSCC2002

ISSCC2002 Units

Standard UMTS, HSDPA

UMTS,HSDPA UMTS

UMTS(cdma2000)

CMOS 0.13 0.18 0.18 0.25 μm

Die size 1.2 14.5 9.0 8.9 mm²

Max. Θ@ 6 iters 18.6 24 4.1 5.5 Mb/s

Power@ (iters)

57.8(10.8)

956(10.8)

292(2.0) n.a. mW

Mb/s

EnergyEfficiency 0.7 11.1 14.6 6.9 nJ/b

/iter

Smallest die size, lowest power consumption and best energy efficiency published so far

fixed VDD and fclk

scaled VDD and fclk

10.8Mb/s

Power [m

W]

Eb/N0[dB]0.5 4.5

60

10

Early termination Less than 10mW in high SNR regimes


• First-generation LTE terminals will target ~100Mb/s• Maximum LTE throughput is 326.4Mb/s in downlink


• Low-power turbo decoding for HSPA+ requires 57.8mW• 8 -28 x higher power consumption is not tolerable

• 8 x radix-4 MAP decoder cores

• Master/slave Batcher network for efficient address mapping

• Implementation loss within 0.14dB SNR


37

power measurements conducted at T=300K for block‐size 3200

Integrated Systems Laboratory

38

Our ASIC achieves 10x higher throughput at the same power required by a state‐of‐the‐art HSDPA turbo decoder

power measurements conducted at T=300K for block‐size 3200

• LTE maximum throughput requires 503mW• 100Mb/s milestone requires only 68.6mW

Integrated Systems Laboratory


Summary

Internet of Things Builds on Synergy of Three Major Fields

Circuit Technology Platform Is a Pillar for Medical Electronics

The Placitus Consortium Aims To Create Low Power and Highly Integrated Solutions

Data Acquisition, Remote Powering, Short Range Radio and WAN module Are Among the Focuses

Early Results Are Promising

Much Is Still To Be Done

39

Soft‐In Soft‐Out MMSE Parallel Interference Cancellation

• European Solid‐State Circuit Conference 2010• Journal of Solid‐State Circuits 2011• Swisscom Award 2010


4x4 exhaustivesearch detector

64-QAM

3x3 exhaustivesearch detector

64-QAM

1.0mm1.0mm

7.8mm

7.8mm

63mm

63mm

2x2 exhaustive search detector

64QAM

• Complexity grows exponentially in the number of Tx antennas• Example: IEEE 802.11n WLAN would require evaluation of up to 0.5 quadrillion (0.5∙1015) candidate vectors per second• Smarter way: Sphere Decoder (STS‐SD) still very complex

Iteratively exchange soft‐information tremendous gain


channeldecoder

SISOMIMOdetector

iterations

soft‐info

a‐priori infoy

best

100

10‐1

10‐2

10‐36 8 10 12 14 16 18 20 22 24

SISO STS‐SDSISO MMSE‐PIC

iterativeMIMO

decoding

soft‐outputMIMOdecoding

7dB

2dB

• Parallel Interference Cancellation (PIC) cancels spatial interference

• MMSE‐PIC close to (optimum) Sphere Decoder performance

• MMSE‐PIC significantly less complex


1.225m

m

1.225mm

• Supports four Tx antennas• Compliant to 802.11n WLAN

PIC

pre-process

MMSE filter &soft information

matrixinversion

I/O

Clock frequency 560MHzCore area 1.5mm2Data rate 750Mb/sPower consumption 190mW

Phase-ADC

Phase Analog-to-Digital Converters – Basics

Phase demodulation can be performed directly in the phase domain without the need for a multi-bit - ADC

Ultralow-power MEMS-based Radio for Wireless Body Area Networks

0000

'0111

0000

'111

1

0001

'111

1

0011

'1111

1111'1000

1111'0000

1110'0000

1100'0000

1000'0000

)(sin)(

)(cos)(ttQttI

in

in

1202

sin)()(

cos)()(

,

,

NkNk

tQtQ

tItI

k

kinkin

kinkin

with

N=4

kkinkink ttQtII )(cos)()( ,,

© C. Enz | 2011 Slide 44

S. Samadian, et al., JSSC, Aug. 2003.

Phase-ADC

Phase ADC – Coding

Ultralow-power MEMS-based Radio for Wireless Body Area Networks

0000

'0111

0000

'111

1

0001

'111

1

0011

'1111

1111'1000

1111'0000

1110'0000

1100'0000

1000'0000

© C. Enz | 2011 Slide 45

Phase-ADC

Final 4-bit Phase ADC Architecture


B. Banerjee, C. Enz, E. Le Roux, ISCAS, 2010.

gm

gm/2

R

R

R

R

R

R

R

R

R

R

R

R R

R

R

R

2R

2R

2R

2R

2R2R

2R

2R

I(0+)

I(0+)

I(0-)

I(90-) I(90+)

I(45-)

I(45+

)

I(135+)

I(135-)

V(0+)

V(22+)

V(45+)

V(67+)

V(90+)V(112+)

V(135+)

V(157+)

V(0-)

V(22-)

V(45-)

V(67-)V(90-)

V(112-)

V(135-)

V(157-)V(0+)V(0-)

V(22+)V(22-)

V(157+)V(157-)

Latch 1

L

Pre-amplifiers comparators

VI+

gm

VI- I(0-)

VQ+VQ-

I(90+)I(90-)

gm/2

gm/2

gm/2

I(45+)I(45+)

VI+VQ-VI-VQ+

VQ+

VI-

VQ-

VI+I(135+)I(135-)

Latch 2

Latch 8

C1

C2

C8


Switzerland Is a Leaderin ICs for Microsystems and Wireless Three teams each a leader internationally Skill sets complementary to each other

EPFL & ETH in data acquisition and energy harvesting

CSEM in modeling, short range wireless and protocol

ETH in wide range wireless and sensor interface

Combined to cover complete technology platform for miniaturized medical and other systems

Concentration of know-how unrivalled by other countries

47


Excellent Track Record

48


In the Grand Scheme of Things

The Technology Haves and Have-Nots Access to semiconductor manufacturing deprived in Europe Asian universities better funded in microelectronics Stakes are too high to be complacent

Knowledge-Based Economy More Critical than Ever Labor abundance favors Asia in manufacturing CH/EU must retain/create high value-add industries

No Wealth Generation without Products No products without a system (Lab sensors alone don’t suffice) Circuit/system technology platform underlying it all

49


More Than Just WearableIntegrated Circuits Serve Many Prolific Sectors

Medical Electronics Global annual revenue ~ 125bn USD Growing at 7.2% per annum in next 5 years

Cellular Communications Hardware Global annual revenue ~ 210bn USD

Swiss GDP 490bn USD in 2008

50


Holding Our OwnIn Research and Entrepreneurship

Amongst Top Ten at Chip Olympics

At forefront in tech transfer

51

110

100 Accepted Papers at ISSCC 2010

110

100 Spin-Off Companies Per Year

75% by the proposers


What Circuit Technology Can Do- Making A Difference at Top Tier

52

Nokia6788

SamsungBlueEarth Samsung

SGH-F480i

ETH Startup Supplies RF Transceiver To Tier-One Mobile Phone VendorsETH Startup Sold GPS Platform to QualcommETH Startup Supplies Home Networking Kits

Konka: E3TCL: T36Samsung: NC10 Dell: Inspiron Mini 10 Hasee: Q130T


Demonstrators Universal Data Acquisition System for (Remotely

Powered) Sensor Networks Applicable to a wide range of sensors With continued collaborations with sensor groups

Short Range Wireless System on a Chip for Body Area Networks Relay acquired sensor info to a more powerful WL link

Wide Area Wireless System on a Chip Relay information to monitoring centers

53


Sensor Interface and Data Acquisition


Some of the Challenges

i

i

s

s

i

scd Z

ZZZ

ZZVV

221 ss

sZZZ

221 ii

iZZZ

• Large CM Voltage

• Differential Offset

• Low noise instrumentation

• Multi channel capability

• Low power drain


Multi Channel EEG Interface by ETH