View
365
Download
1
Category
Tags:
Preview:
DESCRIPTION
This project investigates the challenges in mixed signal platforms, such as those embedded in biomedical electronics, micro-systems, sensor networks and wireless communications, from both device and systems perspective. Demonstrators will be developed that cover generic sensor interface/data acquisition, passive telemetry, wireless body area network, wireless sensor networking and wireless wide area networks. The achievements will benefit other Nano-Tera projects focusing on the sensor/actuator side of microsystems, as well as wireless communications SoCs that will challenge the state-of-the-art in integration level, versatility and sophistication of nano CMOS systems.
Citation preview
Platform Circuit Technology UnderlyingHeterogeneous Nano & Tera SystemsProf. Dr. Q. Huang
12 May 2011
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Outline
Background
Motivation
Sensor Interface and Data Acquisition
Body Area Network and Short Range Communication
Wide Area Network and Cellular Link
Summary
2
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Great Expectations
3
Impressive Advances in• Microsystems Technology• Wireless Communications• Internet Connectivity
Have Set the Scene for the Next Big Thing
The Internet of Thingsor M2M Communication
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Great Expectations
4
Global Interest • Chinese companies already moving fast• Chinese universities not far behind• National Priority and Support
Giving us a run for our money
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Modern Healthcare EnvisionsSophisticated, Heterogeneous Systems
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Sophisticated Electronics Needed to Bind Sensors & Actuators Into Useful Systems
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Few Can Rely on Off-the-Shelf ComponentsMost Require Full Custom Integrated Circuits
Coc
hlea
r Im
plan
t
Ret
ina
Impl
ant
Coc
hlea
r Im
pl. E
lect
roni
cs
Def
ibril
lato
r & E
lect
roni
cs
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
The Underlying TechnologiesSensors & Systems
8
Nano devices above passivation?
ETH Implantable Passive Telemetry IC
CSEM ISM RF SoC
CSEM WL Sensor Node
Sensors Based on Micro & Nano Technologies
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
The Underlying Platform - ICs for Medical Data Acquisition and Communication
Data Acquisition Sensor Interface Instrumentation amplifier (sub-µV offset, low noise) Signal conditioning, data conversion, calibration
DSP and Control Loop Algorithm or Circuitry Energy Harvesting and Supply Regulation Short Range Wireless
Incorporating wake-up radio for low duty cycle operations
Broad Range Wireless
9
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems 10
battery powered nodesremote powered nodes
Project Partners
ETH Q. Huang, T. Burger
EPFL C. Deholain
CSEM C. Enz
3 Main SwissInstitutions inIC Research
Introduction
WBAN Require ULP Miniaturized Sensor Nodes Wireless body area networks
(WBAN) for health monitoring, connecting wearable devices and as smart user interface
The nodes feature sensing, processing, storing and wireless communication
They are usually battery powered or use remote powering
They require ultralow-power (ULP) and miniaturized wireless sensor nodes
Combination of CMOS system-on-chip (SoC), RF and LF MEMS in a system-in-package (SiP) to achieve a 2.4 GHz, <mW-level, <20 mm3 node
© C. Enz | 2011 Slide 11Ultralow-power MEMS-based Radio for Wireless Body Area Networks
battery powered nodes
remote powered nodes
M. Contaldo, et al., TBioCAS, Dec. 2010.
battery powered nodesremote powered nodes
WBAN WWAN
BAN Scenario and System View
Contaldo, Banerjee, Enz Slide 12for Placitus November Meeting
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
INTERFACE ELECTRONICSData Acquisition and Remote Powering
13
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Passive Telemetry By ETH
Sensor
SupplyOscillator Data
Acquisition Circuit
PPM-OutputA
DLPN
Rectifier Startup ModulatorVoltage
Regulator
RF/DC-Converter
Sensor
Antenna
PPM-AM reflected RF
t
Systole
Diastole
Artery
Magnet
Transponder
MagnetoresistiveSensor
Implant
Base-Unit
Transmitter
Low-power, single-chip, fully-implantable micro transponder
Wireless powering and communication
Accurate long-term monitoring
Independent of time and location for diagnosis and therapy
Low risk of infection (no external catheter)
Block diagram of microtransponder ASICSensor-transponder-system
Monitoring setup
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Implantable Passive Telemetry By ETH
Chip area: 4.359 mm x 5.245 mm
2 μm 40 V BiCMOS technology
Measured characteristics of the micro transponder
RF Carrier 27/40 MHz (ISM)
Baud Rate 1 kBaud
Modulation PPM-AM
S/N Ratio 39.7 dB
Equiv. I/P-Offset 170 μV
THD (@ f=3.737 Hz, Vpp=5.8 mV)
0.16%
Power Consumption 0.5 mW
Power Consumption of Data Acquisition Unit
250 μW @ 3V
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
PH; Glucose;K+, Ca2+, Mg2+;
CRP;
Heart&
Brain Activity
Motion Detect
Bio-electricSensors
Bio-medical ISET Sensors
Thermal Couples Temperature
Multiple Purpose Sensor Interface (EPFL)
Sensor Type
pH ISFET sensorAccelerometer
Supply Voltage 1.5V 1.7-3.6VCurrent
Consumption1nA 70μA 11μA
Sensitivity -56mV / pH 56 count/ gSampling Rate - 100/400Hz 40/10Hz
Power Consumption 13nW @ pH7 ≤175μW ≤27μW
Sensor Type
ECG-electrode
ensor
Contact Resistance 100KΩSignal Bandwidth 300Hz
Accuracy 10 Bits
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Wireless Powering of Implants in Human Body
The control unit which is placed on the body can remotelypowered the sensors and communicate with them
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Remote Powering By EPFL
Magnetic Coupling
Electromagnetic Coupling
L1 L2
PAC1
C2
RectifierInputAC
voltage
Base Station Implant
M12
2d
RL
OutputDC
voltageCL
Reg.
2d
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
SHORT RANGE WIRELESSPersonal and Body Area Network
19
Introduction
MEMS-based Short Range Transceiver Architecture Front-end filters before the LNA Interferers and image rejection, relax linearity requirements, avoid impedance matching network
Front-end filters after the power amplifier (PA) Spurious filtering, avoid impedance matching network
Synthesizer Fixed low phase noise RF LO thanks to high Q Merged Time & Frequency reference with LF silicon resonator (SiRes)
© C. Enz | 2011 Slide 20Ultralow-power MEMS-based Radio for Wireless Body Area Networks
Digital Baseband
D. Ruffieux, et al., ESSCIRC 2010.
BAW-based Class-E Power Amplifier
Transmitter Chip
0.18µm CMOS technology
1.25 x 1.5 mm2
Integrated in a complete BAW-based transceiver
No external components in the TX other than the BAW filter and the BALUN for test purposes
© C. Enz | 2011 Slide 21Ultralow-power MEMS-based Radio for Wireless Body Area Networks
BAW-based Class-E Power Amplifier
Modulated Spectrum
1 Mb/s GFSK
BT modulation
-21.7 dBc, -21.4 dBc @ ±500 kHz
ACP 2: -42 dBm
ACP 3: -49 dBm
BT LE modulation ACP 2: -41 dBm
ACP 3: -44 dBm
© C. Enz | 2011 Slide 22Ultralow-power MEMS-based Radio for Wireless Body Area Networks
-4 -3 -2 -1 0 1 2 3 4 -80
-70
-60
-50
-40
-30
-20
-10
0
Frequency offset [MHz]
dBc
BT mask
BT mi=0.34BT LE
BAW-based Class-E Power Amplifier
Power Consumption Breakdown
© C. Enz | 2011 Slide 23Ultralow-power MEMS-based Radio for Wireless Body Area Networks
Block Cons. [mW]Synthesis 11.11BAW DCO 2.37Dividers, ΣΔ 3.28LC VCO 3.38PLL div., PFD, CP 2.08Selective TX 36.19IF buffer 0.56RC/CR 2.34SSB mixer 3.68PPA 3.82PA 25.79Chip in TX mode 47.3
55%
8%
8%
6%
23%
At Pout = 5.4 dBm
PA PPASSB mix RC/CR, Buf IFSynthesis
BAW-based Class-E Power Amplifier
Prototype
© C. Enz | 2011 Slide 24Ultralow-power MEMS-based Radio for Wireless Body Area Networks
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
BROAD RANGE WIRELESSWide Area Network – Cellular Radio
25
26Integrated Systems Laboratory
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Multi Standard RF Transceiver for WAN
27
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
GSM, EDGE, WCDMA & TD-SCDMA
28
Center 915 MHz Span 1 MHz100 kHz/
3DB
Ref 10 dBm Att 10 dB * SWT 1 s
RBW 30 kHz
VBW 30 kHz
TRG
Modulation Spectrum
*
*
GAT
*
*
1 AVAVG
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
10
SWP 4 of 200
LIMIT CHECK PASS
MODU_G
Center 915 MHz Span 1 MHz100 kHz/
3DB
Ref 5 dBm Att 10 dB * SWT 1 s
RBW 30 kHz
VBW 30 kHz
TRG
Modulation Spectrum
*
*
GAT
*
*
1 AVAVG
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
SWP 4 of 200
LIMIT CHECK PASS
MODU_E
A
3DB
B
3DB
BS,TDS:CODE POWER
dB TOTChan 1.16Slot 4
Start Code 1 1 Code/ Stop Code 16
1 AVG
RESULT SUMMARY TABLE
Chan 1.16Slot 4
PA
Att 0 dBAtt 0 dB
Att 0 dBAtt 0 dB
DR 52.8 kbps
DR 52.8 kbps
Ref 0.00
dBm
Ref 0.00
dBm
Ref 0.00
dBm
1 CLRWR
CF 0 Hz
Ref 0.00
dBm
Ref 0.00
dBm
Ref 0.00
dBm
CF 0 Hz
B1M
-63
-56
-49
-42
-35
-28
-21
-14
-7
GLOBAL RESULTS FOR SET 0:
Chip Rate Error -0.14 ppm Trg to Frame --.--
SLOT RESULTS Carr Freq Err -72.46 Hz
P Data -8.12 dBm IQ Imbal/Offs 0.12/0.51 %
P D1 -8.20 dBm RHO 0.9986
P D2 -8.05 dBm Composite EVM 3.77 %
P Midamble -7.64 dBm Pk CDE(SF 16) -36.11 dB
Active Channels 1 Average RCDE -40.04 dB
CHANNEL RESULTS
Channel.SF 1.16 Data Rate 52.8 kbps
ChannelPwr Rel -0.01 dB ChannelPwr Abs -8.13 dBm
Symbol EVM 1.00 %rms Symbol EVM 2.31 %Pk
Ref 20 dBm Att 25 dB
1 RMCLRWR
A
3DB
SWT 2 s
RBW 30 kHzVBW 300 kHz
***
Center 1.95 GHz Span 25.5 MHz2.55 MHz/
-70
-60
-50
-40
-30
-20
-10
0
10
Tx Channel W-CDMA 3GPP REV Bandwidth 3.84 MHz Power 23.65 dBm Adjacent Channel Bandwidth 3.84 MHz Lower -45.20 dB Spacing 5 MHz Upper -44.54 dB Alternate Channel Bandwidth 3.84 MHz Lower -55.36 dB Spacing 10 MHz Upper -55.93 dB
64QAM TD-HSPA Rx WCDMA Band I Tx
GSM Tx EDGE Tx
Digital Baseband Evolved EDGE (E‐EDGE)
• International Solid‐State Circuit Conference 2010
30Integrated Systems Laboratory
PrototypeIC #11mm2
PrototypeIC #22mm2
• Supports also Level‐A E‐EDGE 4 modulation types, 23 CS• Efficient solution for 16QAM/32QAM channel equalization• Flexible Viterbi and Turbo decoder with shared memories
• GSM/GPRS/EDGE 2 modulation types 15 coding schemes (CS)• Low cost channel equalizer• Flexible Viterbi decoder
31Integrated Systems Laboratory
IC #1 IC #2
Core size 1.0mm2 2.0mm2
Max clock frequency fmax 172MHz 151MHz
Leakage current 0.49mA 0.6mA
Continuous burst reception (8 time slots)Avg power at ftarget=40MHz and VDD=1.2V
GPRS CS1 (GMSK) 2.4mW 6.8mW
EDGE MCS9 (8‐PSK) 5.2mW 11.2mW
E‐EDGE DAS12 (32QAM) ‐‐‐ 19.9mW
Scale supply voltage
Less than 5mW in fastest mode
Achieve throughput requirements with
ftarget=40MHz
Turbo Decoder ASICs forWCDMA‐HSDPA and LTE
• International Solid‐State Circuit Conference 2008• Journal of Solid‐State Circuits 2009
• International Solid‐State Circuit Conference 2010• Journal of Solid‐State Circuits 2011
33Integrated Systems Laboratory
Our chip
ISSCC2003
ISSCC2002
ISSCC2002 Units
Standard UMTS, HSDPA
UMTS,HSDPA UMTS
UMTS(cdma2000)
CMOS 0.13 0.18 0.18 0.25 μm
Die size 1.2 14.5 9.0 8.9 mm²
Max. Θ@ 6 iters 18.6 24 4.1 5.5 Mb/s
Power@ (iters)
57.8(10.8)
956(10.8)
292(2.0) n.a. mW
Mb/s
EnergyEfficiency 0.7 11.1 14.6 6.9 nJ/b
/iter
Smallest die size, lowest power consumption and best energy efficiency published so far
fixed VDD and fclk
scaled VDD and fclk
10.8Mb/s
Power [m
W]
Eb/N0[dB]0.5 4.5
60
10
Early termination Less than 10mW in high SNR regimes
34Integrated Systems Laboratory
• First-generation LTE terminals will target ~100Mb/s• Maximum LTE throughput is 326.4Mb/s in downlink
35Integrated Systems Laboratory
• Low-power turbo decoding for HSPA+ requires 57.8mW• 8 -28 x higher power consumption is not tolerable
• 8 x radix-4 MAP decoder cores
• Master/slave Batcher network for efficient address mapping
• Implementation loss within 0.14dB SNR
36Integrated Systems Laboratory
37
power measurements conducted at T=300K for block‐size 3200
Integrated Systems Laboratory
38
Our ASIC achieves 10x higher throughput at the same power required by a state‐of‐the‐art HSDPA turbo decoder
power measurements conducted at T=300K for block‐size 3200
• LTE maximum throughput requires 503mW• 100Mb/s milestone requires only 68.6mW
Integrated Systems Laboratory
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Summary
Internet of Things Builds on Synergy of Three Major Fields
Circuit Technology Platform Is a Pillar for Medical Electronics
The Placitus Consortium Aims To Create Low Power and Highly Integrated Solutions
Data Acquisition, Remote Powering, Short Range Radio and WAN module Are Among the Focuses
Early Results Are Promising
Much Is Still To Be Done
39
Soft‐In Soft‐Out MMSE Parallel Interference Cancellation
• European Solid‐State Circuit Conference 2010• Journal of Solid‐State Circuits 2011• Swisscom Award 2010
41Integrated Systems Laboratory
4x4 exhaustivesearch detector
64-QAM
3x3 exhaustivesearch detector
64-QAM
1.0mm1.0mm
7.8mm
7.8mm
63mm
63mm
2x2 exhaustive search detector
64QAM
• Complexity grows exponentially in the number of Tx antennas• Example: IEEE 802.11n WLAN would require evaluation of up to 0.5 quadrillion (0.5∙1015) candidate vectors per second• Smarter way: Sphere Decoder (STS‐SD) still very complex
Iteratively exchange soft‐information tremendous gain
42Integrated Systems Laboratory
channeldecoder
SISOMIMOdetector
iterations
soft‐info
a‐priori infoy
best
100
10‐1
10‐2
10‐36 8 10 12 14 16 18 20 22 24
SISO STS‐SDSISO MMSE‐PIC
iterativeMIMO
decoding
soft‐outputMIMOdecoding
7dB
2dB
• Parallel Interference Cancellation (PIC) cancels spatial interference
• MMSE‐PIC close to (optimum) Sphere Decoder performance
• MMSE‐PIC significantly less complex
43Integrated Systems Laboratory
1.225m
m
1.225mm
• Supports four Tx antennas• Compliant to 802.11n WLAN
PIC
pre-process
MMSE filter &soft information
matrixinversion
I/O
Clock frequency 560MHzCore area 1.5mm2Data rate 750Mb/sPower consumption 190mW
Phase-ADC
Phase Analog-to-Digital Converters – Basics
Phase demodulation can be performed directly in the phase domain without the need for a multi-bit - ADC
Ultralow-power MEMS-based Radio for Wireless Body Area Networks
0000
'0111
0000
'111
1
0001
'111
1
0011
'1111
1111'1000
1111'0000
1110'0000
1100'0000
1000'0000
)(sin)(
)(cos)(ttQttI
in
in
1202
sin)()(
cos)()(
,
,
NkNk
tQtQ
tItI
k
kinkin
kinkin
with
N=4
kkinkink ttQtII )(cos)()( ,,
© C. Enz | 2011 Slide 44
S. Samadian, et al., JSSC, Aug. 2003.
Phase-ADC
Phase ADC – Coding
Ultralow-power MEMS-based Radio for Wireless Body Area Networks
0000
'0111
0000
'111
1
0001
'111
1
0011
'1111
1111'1000
1111'0000
1110'0000
1100'0000
1000'0000
© C. Enz | 2011 Slide 45
Phase-ADC
Final 4-bit Phase ADC Architecture
© C. Enz | 2011 Slide 46Ultralow-power MEMS-based Radio for Wireless Body Area Networks
B. Banerjee, C. Enz, E. Le Roux, ISCAS, 2010.
gm
gm/2
R
R
R
R
R
R
R
R
R
R
R
R R
R
R
R
2R
2R
2R
2R
2R2R
2R
2R
I(0+)
I(0+)
I(0-)
I(90-) I(90+)
I(45-)
I(45+
)
I(135+)
I(135-)
V(0+)
V(22+)
V(45+)
V(67+)
V(90+)V(112+)
V(135+)
V(157+)
V(0-)
V(22-)
V(45-)
V(67-)V(90-)
V(112-)
V(135-)
V(157-)V(0+)V(0-)
V(22+)V(22-)
V(157+)V(157-)
Latch 1
L
Pre-amplifiers comparators
VI+
gm
VI- I(0-)
VQ+VQ-
I(90+)I(90-)
gm/2
gm/2
gm/2
I(45+)I(45+)
VI+VQ-VI-VQ+
VQ+
VI-
VQ-
VI+I(135+)I(135-)
Latch 2
Latch 8
C1
C2
C8
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Switzerland Is a Leaderin ICs for Microsystems and Wireless Three teams each a leader internationally Skill sets complementary to each other
EPFL & ETH in data acquisition and energy harvesting
CSEM in modeling, short range wireless and protocol
ETH in wide range wireless and sensor interface
Combined to cover complete technology platform for miniaturized medical and other systems
Concentration of know-how unrivalled by other countries
47
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Excellent Track Record
48
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
In the Grand Scheme of Things
The Technology Haves and Have-Nots Access to semiconductor manufacturing deprived in Europe Asian universities better funded in microelectronics Stakes are too high to be complacent
Knowledge-Based Economy More Critical than Ever Labor abundance favors Asia in manufacturing CH/EU must retain/create high value-add industries
No Wealth Generation without Products No products without a system (Lab sensors alone don’t suffice) Circuit/system technology platform underlying it all
49
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
More Than Just WearableIntegrated Circuits Serve Many Prolific Sectors
Medical Electronics Global annual revenue ~ 125bn USD Growing at 7.2% per annum in next 5 years
Cellular Communications Hardware Global annual revenue ~ 210bn USD
Swiss GDP 490bn USD in 2008
50
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Holding Our OwnIn Research and Entrepreneurship
Amongst Top Ten at Chip Olympics
At forefront in tech transfer
51
110
100 Accepted Papers at ISSCC 2010
110
100 Spin-Off Companies Per Year
75% by the proposers
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
What Circuit Technology Can Do- Making A Difference at Top Tier
52
Nokia6788
SamsungBlueEarth Samsung
SGH-F480i
ETH Startup Supplies RF Transceiver To Tier-One Mobile Phone VendorsETH Startup Sold GPS Platform to QualcommETH Startup Supplies Home Networking Kits
Konka: E3TCL: T36Samsung: NC10 Dell: Inspiron Mini 10 Hasee: Q130T
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Demonstrators Universal Data Acquisition System for (Remotely
Powered) Sensor Networks Applicable to a wide range of sensors With continued collaborations with sensor groups
Short Range Wireless System on a Chip for Body Area Networks Relay acquired sensor info to a more powerful WL link
Wide Area Wireless System on a Chip Relay information to monitoring centers
53
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Sensor Interface and Data Acquisition
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Some of the Challenges
i
i
s
s
i
scd Z
ZZZ
ZZVV
221 ss
sZZZ
221 ii
iZZZ
• Large CM Voltage
• Differential Offset
• Low noise instrumentation
• Multi channel capability
• Low power drain
12 May 2011 Platform Circuit Technology Underlying Heterogenous Nano & Tera Systems
Multi Channel EEG Interface by ETH
Recommended