SERIO Printing Systems - AIM Electronica · 04 / 2016. SERIO Printing Systems page 2 ... IPC Award Winner for Best Innovation on iPAG Dispensing System SIMPLEX ... mobile tooling

page 1 SERIO Printing Systems

Welcome

SERIO Printing Systems

04 / 2016


›ASYS Group / EKRA Company Overview

›EKRA SERIO Printing Process

›EKRA SERIO Printing Solutions

›EKRA Quality Assurance

›Q & A

Agenda


EKRA, a part of the ASYS Group

Wertheim

Mönchweiler

Dornstadt

(Headquarter)

Bönnigheim

847 employees in Germany (2015)


ASYS Group

Location: Dornstadt/Ulm

Founded: April 1992

Managing Directors: Werner Kreibl

Klaus Mang

Employees 2015: 1051


ASYS Group: 1051 employees worldwide (2016)

900 employees in Germany

USA

Brazil

Spain 3

Rumania Hungary

3

Finland/Sweden

2

6

Singapore/Manufacturing

17

Shanghai

28

11

India

9

2

32

Korea

Mexico

21

8

Czech

Republic

3 6

Taiwan

6


1992

1996

1997

1998

1999

2000

2001

2002

2003

2004

2005

2006

2008

2009

2011

1992

1996

1997

1998

1999

2000

2001

2002

2003

2004

2005

2006

2008

2009

2011

Extension

Extension to 30,000 ft²

Office extension to 14,500 ft²

Extension Production Floor by um 54,000 ft²

Extension Production Floor by 96,875 ft²,

Office extension to 16,791 ft²

Company

ASYS GmbH

ASYS P&R GmbH

ASYS Metall GmbH

MEVO GmbH

EKRA GmbH

Botest GmbH

ASYS TECTON

Establishments

ASYS Automation LLC, USA

ASYS Automation Asia Pacific, Singapore

ASYS Automation Kft., Hungary

ASYS Automation Asia China, Shanghai

ASYS Automation Nordic Oy, Finland

ASYS Automation, Mexico

ASYS Automation, Brazil

ASYS Group Iberia, Spain

Office Hillsboro/OR, USA

ASYS Group ASIA South Korea

ASYS Group ASIA India

Corporate History


ASYS Product Range

Handling | Marking | Printing | Depaneling | Customized | Tray and Transfer | Solar


Systems Installed

Installed equipment

From April 1992 to

December 2015 56510

9639

14571

180

37

5647

937

25499


ASYS Group ‒ Trading volume (Mio. €)

137 Mio.


EKRA ‒ Headquarter

Location:

Founded:

Managing

Directors:

Employees:

Bönnigheim

1946

Werner Kreibl

Klaus Mang

Jakob Szekeresch

149


EKRA – Corporate History

1946

1967

1976

1984

1989

1995

1998

1999

2000

2005

2006

2007

2008

2011

EKRA was founded by Mr. Eduard Kraft as a mechanical workshop

EKRA became a key equipment supplier to the electronics industry

First EKRA Screen printer was launched

First SMT printer was launched

First Printer installed at Bosch in Stuttgart

EKRA moved into its new facility in Bönnigheim with 6.000 m² (64.000 Ft²) production site

EKRA Eduard Kraft Asia Pte. Ltd. was founded in Singapore

EKRA America Inc. was founded in Marlborough, MA, USA

Bosch Award Winner for Special Supplier Performance

EKRA GmbH was integrated as an independent company in the worldwide ASYS Group

Global Sales & Service Structures of ASYS and EKRA implemented in the ASYS Group

Foundation of ASYS Group Manufacturing in Singapore

IPC Award Winner for Best Innovation on iPAG Dispensing System

SIMPLEX (User Interface), Winner of the “New Product Introduction Award NPI” 2011


EKRA Installed Base

2803 1468

3948

1062

87

17

32 Total installed base: ≆ 9417 Systems*

Fully automated Systems: ≆ 5802

Semi automated Systems: ≆ 2983 *incl. handling systems, set-up and storage systems, by Dec. 2015


EKRA Options

For increased print system efficiency

EKRA Process-/ Application Support

EKRA HYCON Product Line Special Applications

EKRA SERIO SMT Printing Systems

› Solution for your SMT challenges

› Scalable platforms

› Special printing applications (Hybrid, 3D, foils, wafer, glass, LTCC

› Turn-key line solutions, custom processes

› Best in class flexibility

› Automatic dispenser, clamping systems, camera systems, paste & glue dispenser, …

› Over 60 years experience

› Local experts for your challenges

› Process trainings

EKRA – Your solution provider

EKRA S10 SERIES*

Consumables, accessories and supplementary products *only for EUROPE

› Cleaning papers, squeegees, mobile tooling and storage systems


EKRA - German Quality across 5 Continents

›Worldwide sales and service centers

›24 / 7 / 365 availability for service and spare parts

Branch offices in more then 40 countries for best customer support

http://www.google.com.hk/url?sa=i&rct=j&q=service+asys&source=images&cd=&cad=rja&docid=X3zaXHm7gGp98M&tbnid=J90ZpjIIywDGcM:&ved=0CAUQjRw&url=http://www.asys.de/agweb/america/Sales-Services/training&ei=-yCxUuH2JKaKiQeY5oHAAg&psig=AFQjCNEonaJwrNoYKQidEGYYr6aK4BE-sw&ust=1387426424542943






›Q & A

Agenda


› Should not require investment into excessive trainings

› Should be as easy to operate

› Should not require more than one person

› Reducing down times to an minimum

› Must be flexible for the future

Machine Operation


›Smart control over gesture (tablet like)

›Clear and transparent structure

›Language neutral and icon based

›Capture PCB image for easiest operation

SIMPLEX User Interface Winner of the “New Product Introduction Award NPI” 2011

SIMPLEX – setting the benchmark

SIMPLEX_140219_V_CC_E.wmv


›New Product Introduction

in less than 2 minutes

›Live image for:

› Optical stencil stop

› Easy fiducial teaching

› 2 ½ D inspection programming

within seconds

SIMPLEX – NPI w/o gerber data or tape meassure

SIMPLEX User Interface Winner of the “New Product Introduction Award NPI” 2011

SERIO4000_NPI_131029_V_CC_E.wmv


PCB Handling and Clamping

Fast & reliable transport


PCB recognition

›Reliable

›Improved optical detection

›Dual beam sensor

›Improved adjustment possibility




›Over top and side clamping is standard

on every printer

›Clamp force can be automatically adjusted by

print program (option)

Standard Transport with Over Top & Side Clamping

incl. Adjustable pressure for side clamps

fixed rail flexible rail

Reduce PCB stress & increased process control


›Support of the substrate on the outer edge if

you need to print all the way to the end of

the substrate.

Disc Transport Systems





›Straighten the substrate with the over top

snugger, clamp the substrate with the side

clamps and retract the over top snugger for

a absolute flat surface.

Retractable Clamping



›The combination of disc transport and

retractable clamping; straighten the substrate

and retract the over top snugger for a absolute

flat surface as well as supporting the very edge

of the substrate.

MultiClamp System



Automatic Height Adjustment of the Substrate


›MultiClamp with automatic height adjustment


›Various transport systems for best

performance and safe substrate handling

›Single rail transport system

›HSP – High Speed transport

› 3x 508mm

›Heavy duty transport

›Shuttle transport

›DualCon transport

›FlexCon transport

Transport Systems



Fast & reliable transport


› Various clamping systems

› EKRA standard: Side & Top clamping

› Retractable clamping

› MultiClamp

› Various transport systems for best performance and safe substrate handling

› Single segment transport system (11 – 9 – 7 seconds)

› Standard transport up to 2kg (optional 10kg)

› Standard PCB size 508 x 508 mm

› HSP 3 segment transport system

›3 x 508mm for up to 6 second

›3 x 320mm for up to 5 second

SERIO – Transport and Clamping Systems

EKRA transport systems – adapted to your needs


PCB & Substrate Support

›Wrong or insufficient support will result in

bad printing results

›Bridging

›Volume variations

›Misprints

Table


Proper Support / Tooling

Table

›Standard support blocks

›Laser guided pin placement

›Dedicated print nest

›Vacuum print nest

›Carrier support

PCB support is required for perfect printing results!


›Standard support blocks

›Laser guided pin placement

›Dedicated print nest

›Vacuum print nest

›Carrier support

Solid Support Systems


›Quicktool

›Variogrid

›Gridlock

›Vacunest

Flexible Support Systems

PCB support for all kind of applications!


Guidence

›Highly accurate and programmable print pressure

with closed loop feedback from 10 to 250N

›Down-stop adjustment

›Squeegee can swivel up to +/- 6 degrees

›Real Closed Loop Functionality due to two

independent print heads with permanent

compensation of pressure differences

›Compensates uneven Substrate surfaces

›Works like an pneumatic suspension system

Closed Loop Print Head


Closed Loop Print Head Pressure Control

Pressure on stencil will be checked and adapted every 40 ms.


Substrate with uneven surface structure

Stencil / screen frame

Pressure value (squeegee pressure)

SET value REAL value

Default value

Software input

Pneumatic cylinder in

the squeegee head

Stencil / screen

Closed Loop System

No mechanical limitation of the squeegee

stroke

The squeegee can follow the surface of

the substrate

No product specific down stop set

necessary

Squeegee pressure controlled every

40ms, if different from the set value

directly adjusted during the print stroke

High Precise Squeegee Head System






Default value

Software input


the squeegee head

Stencil / screen


Closed Loop System


stroke


the substrate


necessary









Default value

Software input


the squeegee head

Stencil / screen


Closed Loop System


stroke


the substrate


necessary




SERIO_ClosedLoop_PrintHead_141102.wmv


› Real Closed Loop functionality due to two independent print heads with permanent

compensation of pressure differences

› Compensates uneven substrate surfaces

›Tool free intelligent Quick Exchange Squeegee System

Closed Loop Print Head and iQUESS

iQUESS – For fastest product changeover

iQUESS_131209_V_CC_E.wmv


›Tool free intelligent Quick Exchange Squeegee System

›Fast and easy operation from front side

›Upgradeable on most existing systems

›No additional cables or pneumatics required

iQUESS – Quick Exchange Squeegee System


Optimized Squeegee Side Dams

›Special design automatically

seals to stencil

›No manual adjustment required

›Minimize paste leakage

›Less waste

›Can be upgraded on nearly

all EKRA squeegees


Printing with Squeegees

›Less paste causes miss printed substrates

›To much paste causes bridging's

Stencil

Squeegee Paste

Pad

Frame

Print direction

PCB


Paste Height Control

›3 level’s selectable:

›Low level for interrupting production

›Second level to refill / reload paste

›Third level indicates excessive paste on stencil

›System measures in between the squeegees

›Paste can not influence the sensor

›Maintenance free

›Works for different type of paste, adhesive, etc.

This is a real USP – only with EKRA


› Fully programmable for amount, frequency

and placement of deposits

› Automatic dispense depending on paste height

› Available for 650g or 1200g paste cartridges

› Single or dual cartridge capability available

› Automatic paste shearing and cartridge

sealing avoids drips after dispensing

› Paste Dispenser “Straight out of the jar”

Reload paste while printing increases throughput

Automatic Dispenser


Paste Dispenser “Straight out of the jar”

› New type paste dispenser

› Dispensing paste out of the standard container

› Usable for most jar types

Put used paste back into the jar


Stencil Cleaning

›Clean stencil underside is required for excellent printing

results

›During printing paste pollutes around the apertures

›Insufficient cleaning can cause bridging's,

solder balls, failures


SERIO Stencil Underside Cleaning System

›Standard cleaner, iROCS light, iROCS and

iROCS advanced

›Easy wipe exchange

›Vacuum side channel blower for excellent

cleaning results and low energy consumption

›Electronic gear including paper feed

sensor to ensure constant transport

›Automatic sprinkler settings; just moistening

as long the substrate is

›No pump to dispense cleaning agent

Environment friendly

SERIO4000_Befeuchtung_und_Papierwechsel_131029_V_CC_E.wmv


iROCS – Integrated Rapid Oscillating Cleaning System

› iROCS Light

› Oscillating movement selectable

› Faster cycle time

(30% with two sweep cleaning)

› iROCS

› Oscillating movement selectable

› Faster cycle time

(30% with two sweep cleaning)

› Wipe exchange for NON STOP operation!

30% faster than standard cleaning

SERIO4000_Reinigung_131029_V_CC_E.wmv


›Cassette system for cleaning wipe, the fastest

and easiest way to exchange the cleaning wipe

›One cassette in use

›Second cassette outside for preparation

›Storage for two cassettes; no separate table

needed when exchanging cassettes

›Cassette exchange during automatic operation

within 20 seconds

-> no stop of production required

iROCS Advanced

02_iROCS_131106_V_CC_E.wmv


SERIO Stencil Underside Cleaning System

›Fast & superior stencil underside cleaning

›Environment friendly usage of consumables

›Constant wipe feed

›Wipe exchange w/o machine stop

›Exchange wipe w/o stencil movement


SIMPLEX – Stencil Mounting

Semi Automatic Optical Target

Semi Automatic Mechanical Hard Stop

Full Automatic Stencil Loader


›For fastest product change overs

1. Call print program

2. Slide in the stencil all the way to the optical target or

hard stop

3. Put Past on the Stencil

4. Mount Squeegees

5. Close the cover

6. Run in PCB

7. Systems verifies the fiducials

›Start the automatic run

Fastest Product Change Over

Fastest and easiest way to mount stencils


Machine set-up

› Wrong set up of tools, squeegees, stencils or materials cause problems

Cost

Loose of Image

Injury of life

Damage to property

RECALL


Process Control using DMC Code

›Recognition and analysis of DMC on PCBs and / or stencils

›DMC can be linked with the SPC file for product traceability

›No additional equipment is required in front of the Printer

Traceability


Set Up Verification – Barcode & DMC Code

›Set up control for easy printer configuration

›Use mobile scanner for setup of tools and consumables

›Up to 10 different objects selectable

›Process verification for stencils, squeegees, paste and PCB support

›All data stored within the print recipe


Set up verification / SIMPLEX

›The system guides the operator through the set-up procedure

›All recipe required components must be scanned

›Full flexible solution, programmable

›Easy to use and process safe

Set up verification avoids wrong operation


›Storage of squeegees directly on

the machine

›Fast and easy access to

›Support blocks

›Paste

›Wipes

›iPAG glue cartridges

›Upgradeable of existing systems

Quick Set-Up S10 Storage System

Tools & materials where they are needed


Alignment and Inspection

›Precise alignment of PCB to stencil is

essential for highest printing accuracy

›EKRAs unique camera with EVA”EKRA

Vision Alignment” technology ensures best

results

›Special illuminations give best in class

results for fiducial recognition

›Special camera systems with red, white or

blue illumination

›Extraordinary camera including polarizing

filter complete the camera variety


Camera Field of View

›4 different FoV are available

›High resolution camera, very

small FoV (6µm)

›High speed camera, large FoV

(21µm)

›Inspection speed depends on the

FoV

12 x 9 20 x 16

22 x 22

SMALL MEDIUM

LARGE

8 x 6

High-Res

Cameras for every purpose


SIMPLEX – Fiducials

›Product image will be

scanned automatically by

the machine

›Define / select up to 5

fiducials with your

fingertips

›Auto detection of shape

and size

›Learn the fiducial

Fiducial set-up in less than 30 seconds


EVA™ EKRA Vision System

CCD Camera

Stencil

Substrate

Light Source 2 (Spot)

Lower Diffused Light Source

Reflector Cube

Lens

Illumination Cube

Light Source 1 (Spot)

CCD Camera

Upper Diffused Light Source (Optional)

Lens

›EVA™ is using 2 cameras and 2 different types of illumination

› LED spot light source and LED diffused light source

›Fast inspection up to 3 pictures (2D) per second possible

›2½ D Inspection with short cut and bridging detection


EVA™ & 2½ D Post Print Inspection System

CCD Camera Diffused light

Diffused light is ON and spot light is OFF.

Substrate

Pad Solder paste (Appears bright as light is reflected into the camera)

Solder paste (Appears dark as light is deflected away from camera)

Substrate

Pad

CCD Camera

Diffused light is OFF and spot light is ON

Light scattered away due to solder balls deflecting

light

Pad

surface

reflects

light

back to

camera

Diffused light:

Solder paste appears bright,

due to LED light reflection

Spot light:

Solder paste appears dark,

due to light deflection


EVA™ 2½ D Post Print Inspection System

CCD camera Diffused light

Diffused light ON

and spot light OFF

PCB Pad

Solder Paste appears bright

due to reflection.

No solder area reflects

different, more dark.

PCB

Pad

CCD camera

Diffused light OFF

and spot light ON

Deflection, due to round

solder balls surface

Pad surface

reflects light back

to the camera

Solder paste appears dark,

due to deflection

No solder area reflects

different, more bright.

› In case of solder paste height deviation and missing paste the reflection of the

paste changes.

› This change will be identified by the vision system and a volumetric view of

the solder paste will be achieved.


2½D-Post Print Inspection System

Step 1:

›Define the inspection

region by touch and

drag a frame

›Teach in of the stencil

apertures (master)

independent from any

aperture geometry.

Tech in from stencil – no gerber data



Step 2:

›„Learning“ of the solder paste by using the „Auto paste teach in“ function (all available light settings will be adjusted automatically).

›The grey scale analysis defines a characteristically reflection behaviour for this paste.

›This „Paste profile“ will be stored automatically in the program data.

Automatic setting of histograms



›Paste coverage and

bridging will be detected

at the same time

2 ½D inspection, see more than just coverage



›Stencil inspection detects

for paste clogging.

›Auto trigger of stencil

cleaning

›Independent stencil / PCB

inspection

2 ½D inspection, excellent price performance ratio


SPI Closed Loop that can do more.

›Take the full advantage of your SPI

›Minimize print offset due to board

variations

›Optimizing stencil cleaning

›Realized with industry partners

› KohYoung

› Parmi

› Pemtron

› TRI

› Viscom

›…

EKRA offers an open platform for every SPI


Closed-Loop Print Offset Correction

›Less deviation across the PCB

›Increased repeatability

›Larger process window

›Minimizes print direction offset

›Higher first pass yield

Automatic correction for ideal process conditions

Offset Y

OK

Offset X

correction corrected

manually

disturb offset


Closed-Loop Dynamic Stencil Cleaning

›SPI triggers for stencil cleaning

›Increased quality @ less cleaning cycles

›More stable process

›Cleaning before defects occur

›Increases throughput

Automatic stencil cleaning for highest throughput


Closed Loop Printer SPI

3000

3250

3500

3750

4000

4250

4500

4750

5000

5250

5500

2 4 6 8 10 12 14T

hro

ug

hp

ut

pe

r d

ay

Cleaning ech x PCB

Troughput optimized by cleaning cycles, assumed 15seconds for Print & Handling

15

Optimized quality and increased throughput using Closed Loop solutions


Double Side SMT Reflow Process

›Tall or heavy components can twist or fall off during second reflow cycle

›Adding adhesive and glue the components down


Adding paste at THT device holes

›Add paste directly after printing to increase the fill grade of THT device holes

No need for additional step stencils


›Apply glue or paste directly after printing

›Add paste on deposits where more solder

is needed i.e.

›THT, power components, shields

› iPAG with temperature control for a better

repeatable process

›distance control for contact-free application

of solder-paste

›Single or Twin iPAG configurations possible

Single / Twin iPAG, Heating, contact-free, interchangeable

iPAG – Paste and Glue Dispenser


›Jet dispensing for glue application

›Dot size down to 0,5 mm* possible (*depending on materials)

›Camera inspection of applied glue dots

›4 times faster then other dispense solution in printers

› 20 dots in 6 seconds

› 20 dots including inspection in 30 seconds

iPAG Jet - the first jet dispenser within a printing system

iPAG – Jet


›Test Equipment: CeTaQ-Cm Controller

›Dispense 25 times each 24 Dots on

CeTaQ MLP09 Plate

›Dot size 0,5mm

›Glue Type: Heraeus PD 205-A

iPAG – Jet Repeatability


iPAG – Advantages

›Fully programmable in dot size and position

›Individual parameters for each dot

›Inspection of applied dots

›Laser distance control or stand off

›SIMPLEX Programming

›Various nozzle diameters to adapt various paste / glue types

›Up to 1000 dots per recipe programmable


Next generation Components, the 03015 and beyond

› printed 03015 structure in comparison with a human hair

Component size,

Metric code

Component size,

Imperial code

Lenght in mm

Width in mm

0201 0,2 0,10

03015 0,3 0,15

0402 01005 0,4 0,2

0603 0201 0,6 0,3

1005 0402 1,0 0,5

1608 0603 1,6 0,8


03015 – A NEW COMPONENT SIZE 300µm by 150µm

›Yes we can! SERIO is ready for 03015 or 0201

›Conditions: Printer with high accuracy alignment system 12,5µm@6s

and linear measurement scales at the camera axis

›Stencil: stencil thickness 40 – 50µm, nano coated or plasma treated

›Printing: Use normal print parameters

›Paste: Type 5 is recommended,

Type 4.5 is only limited suitable

SERIO 4000 – ready for the future!






›Q & A

Agenda


Portfolio - from Manual to High Performance Inline


SERIO Portfolio - from Manual to High Performance Inline

SERIO – Define what you need!

SERIO 4000 E2 XM SERIO 5000 SERIO 8000 X5 Professional


SERIO – define your performance!

SERIO 4000 SERIES

11 - 7 sec

SERIO 5000 SERIES

7 sec

5 sec

X5 Professional

Performance “in-line”


XM

› Side clamping or vacuum print table

› Pneumatic print head

PCB size XM 50 x 50 / 350 x 400 mm

PCB thickness 0,5 – 6 mm

PCB weight <20kg

Cycle time Manual

Stencil frame size XM 300 x 300 – 590 x 590

Alignment accuracy Manual

Weight XM 85kg

XM – simply start


E2 / E2XL

› Side clamping or vacuum print table

› Screen print head

› MOPS – Manual Optical Positioning System

› For further options ask your EKRA specialist

PCB size E2 / E2XL 370 x 450 / 550 x 610 mm


PCB weight <20kg

Cycle time Semi Automatic

Stencil frame size E2 / E2XL 300 x 300 – 620 x 740 / 740 x 920

Alignment accuracy ± 10µm

Weight E2 / E2XL 550 / 650 kg

E2 – easy to use, high accuracy



SERIO 4000 – Back To Back

› SIMPLEX user interface

› Closed loop head

› EVA ™ - EKRA vision alignment system

› iQUESS – intelligent squeegee exchange system

› Optional “Mobile Package” with 20µm and enhanced print head

PCB size 510 x 360 mm

PCB thickness 0,2* – 4 mm

PCB weight 0,1 – 2 kg

Cycle time 11-7 sec

Stencil frame size 738 x 738mm

Alignment repeatability

Print repeatability

± 12,5µm@6Sigma

± 25µm@6Sigma

Weight 1100 kg

SERIO 4000 BtB– Reduce to the Max *requires a vacuum print nest for PCB 0,2 – 0,5mm

** depending on installed options


SERIO 4000 Back To Back B

TB


SERIO 4000 Back to Back


SERIO 4000








Cycle time 11 sec

Stencil frame size 450 x 450 – 800 x 900


Print repeatability

± 12,5µm@6Sigma

± 25µm@6Sigma

Weight 1200 kg

SERIO 4000 – SCALE IT UP! *requires a vacuum print nest for PCB 0,2 – 0,5mm



SERIO 4000 Compact








Cycle time 11 sec



Print repeatability

± 12,5µm@6Sigma

± 25µm@6Sigma

Weight 1200 kg

› Preparation option upgrade

› iROCS light - Oscillating cleaning system

*requires a vacuum print nest for PCB 0,2 – 0,5mm



SERIO 4000 Volume






› Vacuum option for print nest

› Paste height detection with 3 levels




Cycle time 9 sec



Print repeatability

± 12,5µm@6Sigma

± 25µm@6Sigma

Weight 1200 kg




SERIO 4000 Speed




› iQUESS – intelligent squeege exchange system



› iROCS – Non stop operation




Cycle time 7 sec



Print repeatability

± 12,5µm@6Sigma

± 25µm@6Sigma

Weight 1200 kg




SERIO 4000 Dual Lane




› iQUESS – intelligent squeege exchange system

› Special Dual Lane configuration




Fixed Rails: 1 and 3 or 1 and 4



Print repeatability

± 12,5µm@6Sigma

± 25µm@6Sigma

Weight 1200 kg




Further benefit*

›Supply of the bypass lane through the 1. printer

During e.g. maintenance of the 2. printer – 1. printer is able to keep up production

* Only with ASYS Group complete solution

Power supply* and

control*

STOP

Power supply* and

control*

2014-11-05 SERIO DUAL LINE_C.WMV


SERIO 4000 Multistep aa


- Special developed system to print extra-large / long boars

- i.e. LED application

- Offers better print accuracy than printing the PCB at once

- SERIO 4000 Multistep can process PCB from 100mm x 50mm up to 610 x 508mm single step

- SERIO 4000 Multistep can process PCB from 611mm x 50 up to 1200 x 300mm in double step

- SERIO 4000 Multistep can process PCB from 1200mm x 80mm up to 1500 x 200mm in triple step

- There is no other system like this on the Market

- Stencil design rules are available at EKRA

- Special system based on the SERIO 4000 technology

- but it is not possible to upgradeable a normal SERIO 4000 to Multistep

SERIO 4000 Multistep


SERIO 5000 and SERIO 5000 Volume











Cycle time 7 sec



Print repeatability

± 12,5µm@6Sigma

± 20µm@6Sigma

Weight 1200 kg




X5 Professional





› Print repeatability 20µm@6sigma


PCB size 508 x 508 mm*

PCB thickness 0,2** – 6 mm


Cycle time 8 – 6*sec *(with HSP 3x508mm)



Print repeatability

± 12,5µm@6Sigma

± 20µm@6Sigma

Weight ca.1185 - 1250kg

› iROCS & iROCS Advanced

› 2 ½ D Plus or Super inspection



› Hybrid & Optilign applications

› Dual iPAG / iPAG Jet




X5 Professional Large








PCB weight <10kg

Cycle time 12 sec



Print repeatability

± 12,5µm@6Sigma

± 25µm@6Sigma

Weight 1200 kg


› iROCS




› Hybrid & Optilign applications





SERIO 8000

› XXL Print Format



› Up to 400N print force



PCB weight <10kg

Cycle time 15 sec



Print repeatability

± 12,5µm@6Sigma

± 25µm@6Sigma

Weight app.1200 kg




SERIO 8000


X5 Professional Dual Lane






PCB size 2 tracks á 420 x 300 mm



Fixed Rail 1 and 3 or 1 and 4



Print repeatability

± 12,5µm@6Sigma

± 25µm@6Sigma

Weight 790 kg each

› iROCS & iROCS Advanced








Overview of Inline Printing System

SERIO 4000 SERIO 5000 X5-Professional SERIO 8000

X-Axis Servo Motor Servo Motor Servo Motor Servo Motor

Y-Axis Servo Motor Servo Motor Servo Motor Servo Motor

Hoist Z-Axis Servo Motor Servo Motor Servo Motor Servo Motor

X-Axis Scale 1µm Scale 1µm Scale 1µm Scale 1µm

Y-Axis Scale 1µm Scale 1µm Scale 1µm Scale 1µm

Stepper Motor 1µm resolution Stepper Motor with linear scale

1µm resolution

Stepper Motor with linear scale

1µm resolution Servo Motor 0,25µm resolution

± 12,5 µm @ 6 Sigma

± 25 µm @ 6 Sigma

± 12,5 µm @ 6 Sigma

± 20 µm @ 6 Sigma

± 12,5 µm @ 6 Sigma

± 20 µm @ 6 Sigma

± 12,5 µm @ 6 Sigma

± 25 µm @ 6 Sigma

availabe availabe availabe on request

availabe availabe availabe on request

na na availabe standard is heavy duty transport

11s 7s 7s 15s

7s with speet transport na 5 sec- HSP Transport na

up to 1,6 picrures / sec up to 1,6 picrures / sec up to 3 pictrures / sec up to 2 pictrures / sec

Single iPAG Jet Single iPAG Jet Single op Twin iPAG / iPAG Jet Single iPAG Jet

iROCs light and iROCs iROCs iROCs and iROCs Advanced iROCs

508 x 508 (610x508 optional) 508 x 508 508 x 508 1000 x 610

alignment repeatability

(MFU):

print repeatability(PFU):

Item

Camera positioning

Print table adjustment

Camera gentry

Stencil Cleaner

max. PCB Size

Disc Transport

High Speet Transports

Mulitclamp:

Hybrid Transport:

Inspection

iPAG:

Cycle Time


Unique Feature‘s of EKRA Printers






›Q & A

Agenda


›Dimensional deviations or tolerances of mechanical parts can have an impact on printing results

›Assembly deviations or tolerances can have an impact on printing result

›This deviations have to be eliminated in order to achieve constant printing results

›EKRA method to eliminate this deviations is printer calibration using calibration stencil & board

Calibrating the Printer. Why?


Calibration Stencil

›Highly accurate calibration stencil

›Up to 360 apertures used for calibration

›Test pattern for optical & visual Inspection


Calibration Plate

›Calibration plate with fiducials & test pattern

›Test pattern for optical and visual inspection

It is important to have the calibration stencil and calibration plate manufactured by the same supplier


Before Calibration Procedure Starts

›Place support blocks

› Insert calibration plate

› Insert calibration stencil

›Put paste on stencil


Printing result before Calibration

› In the majority of cases, if printer is not calibrated, printing will show a printing offset

Printed deposits and printed layouts


›Select fiducial 1 & fiducial 2 on calibration board

›Camera starts scanning the complete calibration board

›Offset of each printed deposit according to the stencil position is calculated

›Software is automatically correcting the positions in x, y and theta

Calibration Procedure

D

X=20mm

Y=20mm

D= 2mm


Print Test after Calibration

› Visual Inspection using printer camera


›Visual Inspection using high resolution microscope

Print Test after Calibration


Conclusion

›Calibration is a necessary requirement to achieve

good printing results

›Calibration is a easy possibility to verify printing

accuracy

›Calibration is performed on each system

prior delivery

›Calibration is very fast and recommended at least

during regular maintenance

›Calibration does not necessarily require EKRA

Service personnel


What is a Machine Capability Test?

During the measuring process, it is important to

prevent any disturbing influences such as vibrations,

temperature fluctuations, light fluctuations, etc.

›The machine capability test proves if the machine meets one or more of the specified criteria.

› In case of EKRA printing systems the most important specified criteria is alignment repeatability.

›To measure the alignment repeatability an external measurement system is used.

›The accuracy of the external measurement system is benchmarking the accuracy of the tested system.

› It is a short-term study.

›50 measuring results are statistically evaluated.

›This evaluation defines the quality of the machine.


› Machine capability test is performed for each EKRA printing system prior delivery.

› Machine capability test procedure was jointly developed with CeTaq.

Test unit equipped with 2 HR cameras

Physical resolution: 8µm/pixel

Detection limit (Sub Pixel): < 1/8 pixel (<1µm)

To perform the machine capability test,

the unit is mounted instead of the stencil

Machine Capability Test


measuring alignment in

print position using fiducial

3+4

Show measurement and

add to dataset

snap off / Lift down Run out PCB

Print position alignment Recognition of fiducials 1 +

2 by EVA

PCB loading

PCB

2

4 3

1

PCB

2

4 3

1

PCB

2

4 3

1

PCB

2

4 3

1

PCB

2

4 3

1

PCB

2

4 3

1

PCB

2

4 3

1

0,0015 0,002 0,0013 0,0018

How is the Machine Capability Test performed ?

›Repeat measurement

cycle at least 50 times


›Test protocol supplied with each single system

Example of the EKRA capability test protocol

Result of Machine Capability Test






›Q & A

Agenda



SERIO Print Systems

Designed to Meet the Highest Industry Requirements

›Unbeatable performance at lowest energy consumption

›All print responsible movements are servo controlled

›Highest repeatability and throughput, proven with 01005 technology

›Unique product-engineering and design

›Innovative, award winning SIMPLEX Software (NPI AWARD, 2011)

›Low self heating, low heat load to environment

›Limitless flexible, many options to customize / upgrade your system


Vielen herzlichen Dank

Thank you very much

Muchas gracias

बहुत बहुत धन्यवाद

Köszönöm szépen

Děkuju mnohokrát

Mulțumesc mult

非常感謝

Terima kasih banyak

Thank you for your attention!


Welcome

SERIO Printing Systems

04-2016


Common USP

›ASYS Group financial strength

›ASYS Group Network

›World Wide Service / Sales Organization

›Leading supplier in the solar industry

›1


SERIO Inline Systems USP

›U-shape Belt

›ESD conform

›Not edge shape sensitive

›Simplex

›Fast – easy operation

›NPI in 2 Min

›Self-explaining

›3 Level Paste Height detection

›Never to less paste

›Control refil (man / auto)

›Stop when over loaded

›Dispenser

›Reloade past automatically

› iQUESS

›Tool less + easy squeegee exchange

› iROCS oscillating stencil leaning

›Fast and ferfectly cleaned stencil

›Moistening on substrate length


SERIO 4000 / 5000 USP

›Cost effective

›Solide

›Auto stencil load

›1


X5 Professional / SERIO 8000 USP

›HSP

›Dual iPAG /iPAG Jet

› iROCS Advanced

›Exchange wipe in les than 20seconds

›Boot transport

›Optilign

›Screen Printing

›1

Documents

SERIO Printing Systems - AIM Electronica · 04 / 2016. SERIO Printing Systems page 2 ... IPC Award Winner for Best Innovation on iPAG Dispensing System SIMPLEX ... mobile tooling