4D LABS Nanofabrication Facility · 2013-08-29 · 4D LABS, Simon Fraser University 8888 University Drive, Burnaby, B.C. V5A 1S6 E [email protected] T 778.782.8084 F 778.782.3765

4D LABS, Simon Fraser University 8888 University Drive, Burnaby, B.C. V5A 1S6

E [email protected] T 778.782.8084 F 778.782.3765 W www.4dlabs.ca

4D LABS Nanofabrication Facility

User and Safety Manual

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Table of Contents

Safety Philosophy ..................................................................................................................................... 6

1. Introduction ......................................................................................................................................... 6

1.1 Clean Room Classification .............................................................................................................. 6

2. General Procedures for the Nanofabrication Facility .............................................................................. 7

2.1 Access ........................................................................................................................................... 7

2.2 Safety and Orientation Training ...................................................................................................... 7

2.3 Initiate Billing ................................................................................................................................. 8

2.4 Access Cards .................................................................................................................................. 8

2.5 Additional Requirements for Non-Academic Users .......................................................................... 9

2.6 Visitors .......................................................................................................................................... 9

2.7 Locations ....................................................................................................................................... 9

2.8 Clean Room Conduct ..................................................................................................................... 9

2.9 Materials Policy ............................................................................................................................ 10

2.10 Hours of Operation..................................................................................................................... 10

3. Equipment use ................................................................................................................................... 11

3.1 Certified Users ............................................................................................................................. 11

3.2 Equipment Operation ................................................................................................................... 11

3.3 Equipment Booking ...................................................................................................................... 12

3.4 Computer/Internet Use in the Nanofabrication Facility ................................................................... 12

3.5 Maintenance and Troubleshooting................................................................................................ 12

4. Laboratory Practices ........................................................................................................................... 13

4.1 Clean Room Gowning .................................................................................................................. 13

4.2 Telephones .................................................................................................................................. 13

4.3 User Storage Inside and Outside of the Clean Room...................................................................... 14

4.3.1 Lockers and Storage of Personal Belongings .......................................................................... 14

4.3.2 Storage Bins in the Clean Room ............................................................................................ 14

4.4 Clean Room Alarms ..................................................................................................................... 14

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4.5 Oxygen Depletion Monitor ............................................................................................................ 15

4.6 Hazard and Evacuation Procedures ............................................................................................... 15

5. Overview of Laboratory Hazards ......................................................................................................... 16

5.1 Wet Chemical Hazards ................................................................................................................. 17

5.2. Chemical hazard classification ..................................................................................................... 17

5.3 Gas Hazards ................................................................................................................................ 19

5.4 Mechanical Hazards ..................................................................................................................... 20

5.5 Electrical Hazards ......................................................................................................................... 20

5.6 Radiation Hazards ........................................................................................................................ 20

5.7 Thermal Hazards .......................................................................................................................... 21

5.7.1 Cryogenic Hazards ................................................................................................................ 21

5.7.2 Burn Hazards ........................................................................................................................ 22

5.8 Power Outages ............................................................................................................................ 22

5.9 Seismic Hazards ........................................................................................................................... 22

6. Chemical Safety ................................................................................................................................. 24

6.1 Chemical Handling and Labeling .................................................................................................. 24

6.2 Chemical Personal Protective Equipment....................................................................................... 25

6.3 Chemical Spills ............................................................................................................................. 26

6.4 Eyewash Stations and Safety Showers ........................................................................................... 28

6.5 Material Safety Data Sheets (MSDSs) ............................................................................................ 29

6.6 Hydrofluoric Acid (HF) .................................................................................................................. 29

6.6.1 Personal Protection Equipment (PPE) ..................................................................................... 29

6.6.2 Contact Exposure .................................................................................................................. 30

6.6.3 Inhalation Exposure .............................................................................................................. 30

6.7 Wet Bench Usage Guidelines ........................................................................................................ 31

6.8 Hot Plate Usage Policy ................................................................................................................. 32

6.9 Labware Use & Cleaning .............................................................................................................. 32

6.9.1 Labware ............................................................................................................................... 32

6.9.2 Labware Labels ..................................................................................................................... 33

6.9.3 Waste Disposal & Wet Bench Cleanup ................................................................................... 33

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6.9.4 Cleaning of Labware & Tweezers........................................................................................... 34

6.10 Chemical Storage ....................................................................................................................... 35

6.11 Pregnancy .................................................................................................................................. 35

6.12 Chemical Waste Disposal ........................................................................................................... 35

6.13 Disposal of Sharps ...................................................................................................................... 35

6.14 Disposal of Empty Bottles ........................................................................................................... 36

6.15 Fire Extinguishers ....................................................................................................................... 36

7. Gas Safety .......................................................................................................................................... 38

7.1 Safe Practices for Use of Compressed Air and Nitrogen ................................................................. 38

7.2 Compressed Gas Cylinder Handling and Usage ............................................................................. 38

7.3 Hazardous Gases Present in the Clean Room ................................................................................ 39

7.4 Hazardous Gases Characterization ................................................................................................ 40

7.5 Cylinder Leak Checking ................................................................................................................ 42

7.6 Toxic Gas Cylinder Change ........................................................................................................... 42

8. Electrical Safety .................................................................................................................................. 43

8.1 Electrical Hazards and Avoiding Exposure ..................................................................................... 43

8.2 Emergency Procedures for Electrical Accidents .............................................................................. 43

8.3 Lockout/Tagout of Electrical Devices ............................................................................................. 44

9. Radiation and Ultraviolet Hazards ...................................................................................................... 45

9.1 Radio Frequency Power (RF) Hazards ............................................................................................ 45

9.2 Ultraviolet Radiation Hazards ....................................................................................................... 45

10. Emergency Services ......................................................................................................................... 46

10.1 Fire Response ............................................................................................................................. 46

10.2 Chemical Spills Response ........................................................................................................... 46

10.3 Gas Leakage Response ............................................................................................................... 46

10.4 Medical Emergencies .................................................................................................................. 46

11. Staff Contact Information ................................................................................................................ 47

Appendix A – After Hours Usage ............................................................................................................ 48

A.1 Procedures .................................................................................................................................. 48

A.2 Equipment ................................................................................................................................... 49

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Appendix B – Accident Waiver and Release of Liability Form ................................................................... 51

Appendix C – Disciplinary Policy and Procedures ..................................................................................... 53

C.1 Overview ..................................................................................................................................... 53

C.2 Demerit Offenses ......................................................................................................................... 53

C.3 Procedures ................................................................................................................................... 54

Appendix D: Chemical Policies ............................................................................................................... 55

D.1 Overview ..................................................................................................................................... 55

D.2 Chemical Spill Response ............................................................................................................... 55

D.2.1 Acid and Base Spills .............................................................................................................. 55

D.2.2 Hydrofluoric Acid Spills ......................................................................................................... 57

D.3 New Chemical Approvals ............................................................................................................. 58

D.4 Specific Chemical Procedures ....................................................................................................... 59

D.4.1 Photoresist ........................................................................................................................... 59

D.4.2 Polydimethylsiloxane (PDMS) ................................................................................................ 59

D.4.3 Spin Coating Nanoparticles and Clean up Procedure ............................................................. 60

D.5 Forms .......................................................................................................................................... 62

Appendix E: Evacuation Routes.............................................................................................................. 64

Appendix F – Glove Selection Table ........................................................................................................ 65

Appendix G – Hazard Identification ........................................................................................................ 67

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Safety Philosophy

The staff and management of the 4D LABS Nanofabrication Facility have implemented measures to

ensure that the Facility provides a clean and safe working environment. It is the responsibility of all users

and staff to act in a professional, courteous, and safe manner at all times while in the Facility.

1. Introduction

This safety manual was developed by 4D LABS’ staff and management, and is specifically designed

for the 4D LABS Nanofabrication Facility. This document is a reference manual covering basic safety prac-

tices for use in the 4D LABS Clean Room and other areas of the Facility at Simon Fraser University (SFU). It

applies equally to all users and staff and governs both safety and operational rules. All users are expected

to have read and understood these procedures before entering the Facility. This manual, along with man-

datory SFU laboratory safety training, is expected to be sufficient safety training for Facility users. The 4D

LABS Clean Room is located at SFU in the TASC 2 building, Room 6060. The Clean Room houses a large

investment in process equipment that is fragile and sensitive. The Clean Room houses toxic gases and

chemicals, which pose significant hazards if handled incorrectly. This manual attempts to document ac-

ceptable operating procedures and conduct for use of the Nanofabrication Facility, which includes the

Clean Room. It is impossible, however, to define a policy for every conceivable situation. Rules and policies

are no substitute for common sense. Anyone who fails to act in a professional, safe, and responsible man-

ner while in the Facility will be banned from further access at the discretion of the management. Users’

suggestions and feedback on the Facility, its staff, its operation, and its equipment are welcome at all

times.

1.1 Clean Room Classification

The 4D LABS Clean Room is classified as an ISO 5 clean space (also commonly referred to as Class

100). The basic criterion for this classification is a count of not more than 3520 particles greater than or

equal to one half micron (micrometer) per cubic meter of air.

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2. General Procedures for the Nanofabrication Facility

2.1 Access

Access to the Nanofabrication Facility is limited to certified users, 4D LABS staff, and authorized

SFU campus personnel who have completed the required training and orientation. Certified users will be

allowed personal access at any time during normal operating hours. After-hours access may be granted on

an individual basis with tool usage limitations (see Appendix A for policy and procedures to qualify). Use of

the facility is a privilege that can be revoked by the 4D LABS management at any time.

Access to the Nanofabrication Facility begins with the following procedures to receive safety and

orientation training, initiate billing for facility usage, and obtain an access card. These procedures are out-

lined below.

2.2 Safety and Orientation Training

General and chemical safety training must be successfully completed by all users prior to use of the

equipment in the Nanofabrication Facility. Access to the facility requires all users to maintain regular safety training

as required by both the EH&S Department and the Nanofabrication Facility at SFU.

Users from SFU must successfully complete the SFU EH&S Department safety training course for general,

chemical, fire and spill response safety. This course must been taken at least every three years for all SFU users.

Users from SFU who have not completed the SFU EH&S Department’s training within the last three years

will be required to complete this training prior to receiving access to the equipment within the Nanofabri-

cation Facility. These users will also need to successfully complete the next safety training course offered by

the EH&S Department and then inform the Nanofabrication Facility staff in order that the staff may update

the users files accordingly.

Users that are not from SFU (external users) must pass safety training courses required by their own

employer and have proof of this employer safety training. These users must also pass a safety quiz issued by the

SFU EH&S Department. This quiz will be administered by the Nanofabrication Facility staff.

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All users (internal and external to SFU) must also successfully complete a safety course offered by the

Nanofabrication Facility staff with an emphasis on chemicals specific to the Clean Room. Trained users will receive

a “4D LABS User Training” form for their records.

In addition to receiving the required general and chemical safety training, users must also complete the

orientation training to the Nanofabrication Facility from the staff. Orientation training includes two parts,

“Nanofabrication Facility Orientation” training and “Use of Hydrofluoric Acid” training.

2.3 Initiate Billing

Before using the equipment within the Nanofabrication Facility, new users must complete a “4D

LABS User Information and Billing Form” obtained from the Nanofabrication Facility staff. Once this form

has been completed the user will begin tool-specific training in the Nanofabrication Facility.

2.4 Access Cards

After completing the 3 phases of training, users can apply for their own access card to the Nanofabrica-

tion Facility, which includes the Clean Room. When all documentation has been completed and training received,

users will complete and submit the 4D LABS Access Card Agreement form. There is a deposit for all access cards.

Loss of this access card will require an application for a replacement card. Lost access cards must be reported im-

mediately to Nanofabrication Facility staff. The Nanofabrication Facility staff will coordinate the deactivation of all

returned or lost access cards. Deposits are refundable with the return of the access card at the end of the user’s

project.

The access card may be further updated for after-hours access. This level of entry may be granted for ex-

perienced users who require extended access and present a strong case for it. The project supervisor must also

approve this special request.

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2.5 Additional Requirements for Non-Academic Users

All non-academic users need to sign an accident waiver and release of liability form with 4D LABS and

SFU (see Appendix B). These users will also need to submit proof of appropriate worker's compensation insurance

before working in the Nanofabrication Facility.

2.6 Visitors

Visitors into the Clean Room must be authorized by 4D LABS management and escorted by a staff

member. Visitors are not allowed to operate equipment, to use chemicals, or to be left alone. An author-

ized service contractor may be left alone, but must first be authorized by the manager, and must be provid-

ed an orientation to safety and evacuation procedures, as well as access to a contact person at all times.

2.7 Locations

•Gowning room entrance: This area is a controlled environment and should only be accessed by au-

thorized personnel. Approved visitors can access this area when accompanied by a staff member.

• Clean Room: This area is a restricted clean space and should only be accessed by authorized personnel.

Frequent entry and exit is discouraged.

• Service areas: These areas are semi-clean spaces for support equipment and utilities. Access is limited

to staff and management personnel.

2.8 Clean Room Conduct

Proper conduct, safe practices, and a professional attitude are required at all times. This facility is

used by a broad client base; many sensitive experiments are taking place on a regular basis. You must act

in a manner that will not disturb other researchers using the Nanofabrication Facility. As a user of the Facil-

ity you are responsible for reporting any activities that deviate from acceptable behavior. Any violator(s)

may lose access privileges, based on a “three strikes and you are out” policy. This is a disciplinary proce-

dure with escalating consequences for repeated infractions by a user (see Appendix C for detailed proce-

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dures). Any damage to the facility and/or equipment may also be charged to the user at the discretion of

4D LABS management.

See also Appendix B for Accident Waiver and Release of Liability Form.

2.9 Materials Policy

The only materials that may be brought into the Clean Room are those that have been approved

by 4D LABS Nanofabrication Facility staff and management. This includes all chemicals, tools, paper goods,

and other hardware that a user might wish to use in the Clean Room. The form to request access into the

Clean Room for a new chemical must be completed by the user and approved by Clean Room Staff (also

requires an electronic and hardcopy of the MSDS, which will be kept on file) prior to bringing the chemical

into the facility (find the form included in Appendix D, “Chemical Policies” that describes the handling of

the various chemical classes). Materials must be carefully cleaned using isopropanol and Clean Room

wipes to minimize particulate contamination before introduction into the Clean Room. Clean Room staff

will assist with appropriate instructions and supervision for bringing new materials into the Clean Room.

Please note that purses, notebooks, ball-point pens, conventional paper items, and all outerwear

clothing are not allowed in the Clean Room. Storage for such items is provided in individual lockers outside

the gowning room; see staff for access to these lockers. Personal computers are discouraged but may be

brought in if absolutely necessary, after thoroughly cleaning it. Personal music players may be used as

long as they do not compromise safety. They must be at a volume where the user can easily hear a normal

conversation and are not distracted by the device. Mobile phones and cameras may also be brought into

the Facility provided that they are properly wiped down with isopropanol. Under no circumstances shall a

user take photos of another user’s work.

2.10 Hours of Operation

The normal hours of operation are 9:00 am to 5:00 pm, excluding holidays and weekends.

Usage outside of these operating hours must be authorized by individual tool owners. Certified users utiliz-

ing the Clean Room after normal hours must adhere to the requirements outlined in the After-hours Usage

section of this manual (see Appendix A).

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All after-hours users must opt either to team up with an approved lab buddy or to use the tele-

phone check-in system with SFU Security Operations.

3. Equipment use

3.1 Certified Users

The equipment in the Nanofabrication Facility may be used only by certified users who have been

specifically trained in its use and approved by the equipment owner. All certified users must have success-

fully completed SFU’s WHMIS, laboratory safety, and fire safety training courses. In addition, certified users

must complete 4D LABS’ Clean Room orientation session and a Hydrofluoric Acid safety presentation.

Training on specific equipment is conducted in a three-phase approach leading to independent and

unsupervised operation by a Clean Room user. Phase 1 is an explanation/observation step wherein the tool

owner demonstrates all operations on the process tool and explains the theory of operation. Phase 2 is a

dependent step wherein the new user conducts tool operations with assistance from the tool owner. Phase

3 is a more independent step wherein the new user conducts tool operations under direct supervision of

the tool owner. Phase 3 is complete when the new user has demonstrated to the tool owner independent

operation of the tool. Any phase may be repeated or lengthened at the discretion of the tool owner, who

determines when a user is fully certified to operate the process tool independently. After passing all three

phases of training, a user can independently operate the process tool without direct supervision.

3.2 Equipment Operation

The process equipment in the 4D LABS Clean Room is highly sophisticated and delicate, and can

be potentially hazardous if not used properly. Each instrument has operating instructions, restrictions, and

safety rules in place to ensure safe and proper operation of the instrument. Failure to follow proper proce-

dures can result in personal injury, expensive equipment damage, and costly down time.

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3.3 Equipment Booking

All use of major equipment in the Nanofabrication Facility must be scheduled in advance on our

booking website (http://www.sfu.ca/nanofabrication/bookings/). If you must change a booking, please do

so at least 8 hours prior to the appointment. In addition to scheduling, all equipment use must be record-

ed in the electronic spreadsheets in the Clean Room and in the log book next to the tool. The spreadsheet

is for billing purposes and the log book is for maintenance purposes. Misuse of these scheduling and bill-

ing systems will result in disciplinary actions according to our policies.

3.4 Computer/Internet Use in the Nanofabrication Facility

There are numerous computer systems throughout the Nanofabrication Facility including several

general-use workstations. All computers in the facility are for work use only and not for personal use. The

computers may be used for collecting and analyzing data, writing papers, and other work-related activities.

In addition, the Internet is available on several computers for data transfer and research. Users are not

permitted to download anything other than research papers or related material (no music, movies, soft-

ware, etc.). No software may be installed on the computers in the Nanofabrication Facility without permis-

sion. If a user needs a special program installed, they must discuss it with a staff member.

Users must not use the computers in the Nanofabrication Facility for long-term data storage. All

research data should be transferred to personal computers as soon as possible. Data may be transferred

with a USB drive or sent by email. All user files may be periodically removed from facility computers as

necessary.

3.5 Maintenance and Troubleshooting

All maintenance, repair, and troubleshooting activities will be conducted solely by Clean Room

staff. Under no circumstances will any user undertake such activities on any process equipment. Any

equipment problems must be immediately reported to Clean Room staff, who will take the necessary steps

to resolve equipment issues.

http://booking.bcitbusiness.ca/

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4. Laboratory Practices

4.1 Clean Room Gowning

All users accessing the Clean Room must wear appropriate Clean Room attire before entering. Be-

neath the supplied gown all users are required to provide long pants (no shorts at any time of the year), a

shirt or blouse that is comfortable and non-binding, and closed-toe shoes (no sandals at any time of the

year). Instructions for proper gowning are located above the entrance doors leading into the Clean Room

hallway from the gowning room. Further personal protective equipment (PPE) may be required depending

on the work of the user. Safety Glasses are required at all times when working in the Clean Room; pre-

scription glasses are permitted but do require the use of safety goggles instead of safety glasses as the lens

exposed to the Clean Room. Contact lens users must be aware of the extra degree of care needed to pre-

vent entrapment of substances behind the lenses; if possible, these users are encouraged to switch to con-

ventional prescription glasses with safety goggles for their work in the Clean Room.

Proper attire serves several functions in the Clean Room environment. In addition to affording

some protection to users, proper attire is designed to minimize shedding of particles from the human body

into the Clean Room atmosphere. Safety glasses help to isolate and contain the constant flow of water

vapour from the human eye, which is the only commonly exposed mucous membrane on the body. Nitrile

gloves serve to contain oils and moisture from the human hand, which can be deposited on samples and

process chambers. Face masks help to contain water vapour and droplets discharged from the mouth and

nose while breathing and speaking.

4.2 Telephones

There are telephones throughout the Clean Room. The phones can be used for person-to-person

communication, for emergency communication, and for check-in calls to SFU Security Operations.

Emergency calls: If an injury occurs in the Clean Room, dial 2-4500 to provide your location

and the type of injury to the emergency responder. Then notify staff members of the incident.

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4.3 User Storage Inside and Outside of the Clean Room

4.3.1 Lockers and Storage of Personal Belongings

Users may store personal belongings in the lockers located in the hallway outside the entrance to

the Clean Room. Users may borrow a locker key from the Nanofabrication Facility staff for day use of a

locker. Lockers are for storage of jackets, backpacks, winter boots and other items not permitted in the

Clean Room. No hazardous chemicals are permitted to be stored in the lockers. Keep in mind that no stor-

age of personal items or supplies is permitted within the gowning room of the Clean Room. Users breaking

these rules may receive a fine (e.g., $1,000) proportional to their impact on the cleanliness of the gowning

room and the HEPA filters.

4.3.2 Storage Bins in the Clean Room

One bin is provided to each user for storage of their samples, wafers, tweezers, and notebooks.

These bins are located in the Clean Room (room 6060.2). No hazardous chemicals are to be stored in these

bins. All chemical storage must be arranged through the Nanofabrication Facility staff. Users who need

more than one bin will be charged $5/month for each additional bin.

Users are responsible to clean-up after themselves whether working inside or outside of the Clean

Room. No samples, notebooks or waste should be left overnight on the counters. Users need to put away

all their own samples and supplies on a daily basis. Each user should also return all supplies, chemicals,

and labware to its proper place of storage within the Nanofabrication Facility.

4.4 Clean Room Alarms

There are multiple alarms in the Nanofabrication Facility. The user must be able to identify all

alarms quickly and react properly. If you cannot identify the alarm, leave the Clean Room and notify staff.

Types of Alarms:

• End of Cycle Alarm: Some alarms signify end of cycle on instruments; these are usually not very loud,

and may be recognized by a repetitious beep.

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• Tool Alarm: Many of the individual tools have various interlocks to ensure safety and process integrity

and will alarm when certain conditions occur (e.g., when the tool senses loss of exhaust, when the pro-

cessing conditions cannot be achieved, etc.). Contact a staff member should you experience a tool alarm.

• Fire Alarms: These are located throughout the Clean Room. They can be recognized by a flashing

strobe and horn (red and white colored alarms). You are required to leave the Clean Room immediately

and do not stop to remove your gown. Assemble outside on the grassy hill on the south side of TASC2, so

you can be accounted for. See Section 4.6 below for evacuation procedures.

• Toxic Gas Detector Alarms: These are identified by a loud repeating siren with the activation of the

flashing evacuation strobe (blue colored alarms). You are required to leave the Clean Room immediately

and do not stop to remove your gown. Assemble outside on the grassy hill on the south side of TASC2, so

you can be accounted for. See Section 4.6 below for evacuation procedures.

4.5 Oxygen Depletion Monitor

An oxygen depletion monitoring system is installed in the south greyspace corridor (TASC2, room

#6075) of the Nanofabrication Facility complex. A sensor unit provides a continual real-time readout of the

oxygen concentration percentage in breathing air in the vicinity of the nitrogen generator system.

The oxygen concentration value is displayed outside the restricted access door to room 6075. In

the event of oxygen concentration falling below 20.0 %, an audible alarm will sound in the room and the

Toxic Gas Detector Alarms will be activated. All persons hearing these alarms and/or seeing a displayed

oxygen concentration below 20.0 % are required to follow the Hazard and Evacuation Procedures as speci-

fied in Section 4.6 below.

4.6 Hazard and Evacuation Procedures

If an explosion hazard, fire hazard, and/or toxicity hazard exists:

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1. Pull the handle at any one of the fire alarm pull stations located throughout the building, and evacuate

all personnel according to evacuation procedure.

2. Call Campus Security at 2-4500 to relay significant details about the emergency.

3. Do not attempt to remove injured persons if doing so risks your health and/or safety, or risks further

injury to the injured.

4. Note the hazardous materials involved. Arrange to secure the Material Safety Data Sheet (MSDS) for

the materials involved in the incident. MSDS will be needed by responding emergency personnel.

5. Meet emergency personnel at the south entrance to TASC2.

Emergency Evacuation Procedure:

1. Contain any hazardous work in progress if safe to do so, but do not take time to finish your tasks in

the lab.

2. Leave immediately. Do not stop to remove your gown.

3. Leave the Clean Room through the gowning room exit.

4. Go to the Evacuation Assembly Point on the grassy hill on the south side of the TASC2 building, so you

can be accounted for.

5. Provide information that may be of assistance to the Emergency Response personnel and Clean Room

staff at the Evacuation Assembly Point.

6. Do not leave this staging area until instructed to do so by Clean Room staff.

Note: Reference the map of the facility (Appendix E) for evacuation routes based on your specific location

within the facility. Primary evacuation pathway is through the gowning room (red), but alternative path-

ways (blue) have been identified in case the primary exit route is blocked.

5. Overview of Laboratory Hazards

The Nanofabrication Facility at 4D LABS houses many process tools which are serviced by high

voltage electricity, pressurized gases, liquid chemicals, radiation sources, and mechanical components.

Each of these utilities poses its own set of risks to the user, who must be aware of the presence of hazards

on the specific tools he/she is using (see tool risk assessment documents in the Appendix G).

17



Hazards in the 4D LABS Clean Room fall into several general categories. The first consists of wet

chemicals including acids, bases, and organic solvents commonly used for etching and lithography. Second-

ly, the facility uses a variety of compressed gases, some of which are toxic, corrosive, flammable, or explo-

sive. The third, electrical hazards, always exist when using the process equipment inside the Clean Room.

Radiation hazards are presented by Radio Frequency generators, laser sources, infrared lamps, and ultra-

violet light generated by plasma or mercury lamps. Mechanical hazards exist wherever drive belts, pulleys,

lead screws, and chamber lids are present. Thermal hazards exist where process tools produce high heat or

extreme cold in their operation. Seismic hazards are present in buildings located in regions of potential

seismic activity, such as the greater Vancouver metropolitan area.

Immediately report any hazardous situation, medical emergencies, or other safety concern to the

Clean Room staff.

5.1 Wet Chemical Hazards

Chemicals commonly used in the laboratory can cause severe burns, deep tissue injury, organ

damage, and can ignite and explode. The greatest health risks posed by liquid chemicals are environmental

(fire, explosion), direct contact with skin and eyes (tissue damage), and inhalation (pulmonary damage or

long term chronic effects). General information about these chemicals and their uses can be found in sec-

tions 6 and 7. For more detailed hazard information, consult the pertinent MSDS. Make every effort to un-

derstand the chemical processes you use and respect the chemicals you work with. Knowing the general

rules for how to safely transport, pour, use, and dispose of these chemicals is every user’s responsibility. If

unsure of the hazards of a particular chemical, or the method of proper use, contact Clean Room staff.

5.2. Chemical hazard classification

• Corrosives

A corrosive (or "caustic") chemical destroys or permanently damages living tissue. On contact, cor-

rosives can destroy skin and underlying tissues. Splashes in the eyes can cause blindness. Inhalation

18



of vapors can destroy lung tissue. Corrosives in the laboratory include acids and bases. In case of lo-

calized external exposure, promptly flush the affected area with plenty of water for at least 15

minutes. For more general external exposure, use a safety shower (see section 9.7). Remove cloth-

ing while under the shower and flush for at least 15 minutes. Exposure of the eyes to corrosive

chemicals is extremely serious; flush immediately, either with a spray gun at your wet bench or the

nearest eyewash station. Eyes should be rolled up and down, and side to side, continuously, to al-

low clean water to flush behind the eyeball. For any exposure to corrosives, you should get help.

The victim should be taken to the emergency center for evaluation and treatment.

• Oxidizers

Technically, an oxidizing agent is a chemical compound that readily gains electrons in a chemical re-

action. When mixed with compounds that can act as reducing agents, the result is often a violent

reaction, possibly an explosion. Oxidizers should not be stored or mixed with solvents that generally

make excellent reducing agents. The most commonly noted example of an oxidizer in the laboratory

is hydrogen peroxide. However, other compounds, such as acetic acid and nitric acid, are oxidizers

as well as corrosives.

• Water Reactives

Water reactive is used to describe compounds (generally concentrated acids and bases), which very

quickly generate heat and/or gas upon mixing with water. The primary hazard presented by water-

reactive compounds is incomplete mixing, which can lead to superheating and explosion. Thus, wa-

ter-reactive mixtures should never be poured directly into a sink drain.

• Flammables

These compounds include most solvents, such as acetone, isopropanol, and methanol. In air, above

a critical concentration, called the "flash point", the vapors from a flammable can ignite and ex-

plode. The source of ignition may be heat (such as a hot plate) or a spark (such as from an electrical

tool). Because the vapors can travel over considerable distances, the source of ignition can be far

away from the flammables container itself.

19



To minimize hazards, always work well within the exhausted area of the appropriate wet bench. The

air pulled into the exhaust area will keep the concentration of vapors below the flash point. Where

possible, minimize the quantities of flammables used. Before working with flammables, always note

the location of the nearest safety shower and fire extinguisher. Flammables should be stored in the

designated flammables cabinet; no flammables may be stored elsewhere in the laboratory.

• Toxics and Poisons

A toxic material is one that has poisonous or harmful effects on the human body. Care must be tak-

en to limit or avoid exposure to such materials, and to use proper personal protective equipment

when exposure is unavoidable.

• Non-toxics

A non-toxic material is one that is not likely to result in harmful effects with normal use. This desig-

nation is used sparingly. Pure water is considered non-toxic.

5.3 Gas Hazards

Compressed gases pose both chemical and physical hazards. Some of the gases used in the Clean

Room are considered inert; others fall into the categories of toxic, corrosive, flammable, or explosive. The

primary health risks posed by gases are the physical hazards (fire, explosion) and inhalation (toxics and

corrosives). General information about some of the common gases used in the Clean Room can be found in

section 7 (for more detailed hazard information, please refer to the pertinent MSDS.) Because of these po-

tential hazards, safe use of these gases is strictly controlled by Provincial and local regulations, as well as

by SFU policy. Although potential hazards are minimized by use of engineering controls and the toxic gas

monitoring system (see section 7 on toxic gas safety), as a user, you must still be aware of the types of

gases and the hazards posed in the equipment you operate.

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5.4 Mechanical Hazards

Mechanical hazards may be posed by many pieces of equipment and their support equipment

found in Clean Room and greyspace areas of 4D LABS. Typical hazards might include pinching of fingers

and snagging of clothing, posed by various exposed gears, stepper motors, or vacuum chamber lids.

All users are advised to use common sense and basic precautions when working around such pinch

and snag hazards. Staff are never to perform maintenance tasks when gears, pulleys, belts, or drive motors

are in motion. Loose-fitting gowns are subject to being “grabbed” by machinery in motion and resulting

injury to personnel can be serious.

5.5 Electrical Hazards

The danger of injury due to electrical shock is present wherever electricity is used. Although all

equipment is interlocked to prevent exposing users to electrical hazards, you must be acquainted with the

electrical hazards that may be encountered on the tool you are using.

The primary effects of electric shock are due to current flowing through the body. Burns occur

wherever the body completes a circuit connecting the power source with the ground. Although the re-

sistance of dry, unbroken skin to electric current is relatively high, the amount of current needed to kill a

person is small. It is easy to exceed lethal levels of current, especially if the skin is broken, wet, or damp

with sweat.

Unless it is in your training, never open electrical enclosures or cabinets on equipment, even when

the power is off. If you feel an electrical "tingle" when you touch a piece of equipment, stop using the tool

and immediately notify Clean Room staff. Never stick your hands, fingers or conductive tools inside equip-

ment. Immediately notify Clean Room staff of any potential electrical hazard that you notice.

5.6 Radiation Hazards

• Ultraviolet Radiation

21



Chance of exposure to UV radiation is clearly a risk in lithography, where high power UV lamps are

used in the mask aligners. However, UV exposure is also a potential risk in plasma etch, plasma depo-

sition, and sputter tools, where highly energized plasmas are generated. In addition, the laser lithogra-

phy systems have lasers with wavelengths in the UV region. All equipment is shielded to prevent direct

exposure, but exposure risks may arise from reflection. UV absorbing goggles are provided at the li-

thography stations for use to protect your eyes. Report to the Clean Room staff any damage to shield-

ing on the equipment or to these protective goggles.

• Electromagnetic Radiation

Electromagnetic radiation is a hazard presented by equipment using Radio Frequency (RF) power (pri-

marily within plasma etch and plasma deposition tools). If you have a pacemaker, be aware that RF

sources are present in the laboratory. All equipment is shielded to prevent exposure; report to Clean

Room staff any damage to shielding on the equipment or cables.

5.7 Thermal Hazards

5.7.1 Cryogenic Hazards

Cryogenic vacuum pumps used on some process tools in the Clean Room pose an unusual thermal

hazard given the low temperatures reached within these pumps. The user is advised to avoid touching

cryogenic pumps or their housings with any bare or inappropriately covered skin, since the primary risk

lies in the possibility of skin freezing to the unit on contact, causing it to stick to the cryopump hous-

ing. Depending on the duration of skin contact with cold pump housing, the possibility of deep tissue

freezing or frostbite exists and should be avoided. Cryogenic hazards also exist where liquid nitrogen is

used in the cold trap for some vacuum equipment. The same hazards exist for touching the exposed

parts of these instruments that can conduct heat, as well as for personal contact with the vessels used

to transport the liquid nitrogen.

22



5.7.2 Burn Hazards

Hot surfaces exist in the Clean Room that can pose a contact hazard for the user. Hot plates are in use

in rooms 6060.5 and 6060.7, and ovens or furnaces are in use within rooms 6060.3, 6060.4, 6060.7,

and 6060.13. Care must be taken when removing beakers or other receptacles since there are no visi-

ble indicators of heat on glassware. All users are required to use the log books for the hot plates. Any

hot plates found unattended and without appropriate notation in the log book will be turned off im-

mediately. Anyone not properly following protocol for using the hot plates may have Clean Room privi-

leges removed at the discretion of the Clean Room staff and management.

5.8 Power Outages

In the event of a power outage in the Clean Room, users are advised to move to the central corri-

dor within the Clean Room that leads to the gowning area. Emergency lighting and/or flashlights will come

on automatically during an electrical power outage, illuminating the way for an orderly evacuation of the

Clean Room.

5.9 Seismic Hazards

In the event of seismic activity, Clean Room users are advised to follow standard recommendations

to avoid personal injury from falling objects or from falling structural elements of the building. These rec-

ommendations are as follows:

1. Move to seek the cover of a heavy table or furniture that will shield you from falling or flying debris.

Another good choice would be the central corridor leading from the gowning room, where the inside

walls can afford some shielding from moving objects. Practice the “duck, cover, hold” technique of

covering the head and neck with your arms while holding onto the furniture protecting your body.

2. Count to 60 after all shaking stops, then evacuate the facility and make your way to the Evacuation

Assembly Point on the grassy hill on the south side of the TASC2 building. Remain alert for overhead

power lines, downed power lines, and any structures overhead that could fall during an after-shock.

23



3. Do not re-enter the building until instructed to do so. There is a high probability of after-shocks follow-

ing the initial shake, some of which may be more powerful than the initial earthquake. After-shocks

may also cause objects or structural elements to move even if they seemed stable during the initial

earthquake activity; the loosening effect of the first shake may set the stage for further damage to take

place during subsequent seismic activity.

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6. Chemical Safety

6.1 Chemical Handling and Labeling

Handling chemicals in the Clean Room is a common practice. Chemicals are periodically refreshed

and are brought into the Clean Room by staff. Chemicals are retrieved from the chemical storage area and

are introduced into the Clean Room via a pass-through by Clean Room staff.

• Transport: Use a transport cart with a secondary container or bottle carriers when moving bottles

containing chemicals. Use caution and proceed slowly when transporting chemicals. Do not transport

chemicals that are incompatible with one another. Never transport acids with solvents or bases. Acids

can produce heat from an exothermic reaction and can lead to ignition of solvents. Acids mixed with

strong bases can produce violent reactions that can cause the chemicals to suddenly splash onto per-

sonnel.

• Chemical Deliveries: A 4D LABS staff member will receive chemicals and place them into appro-

priate chemical storage cabinets, refrigerator, or shelves. All bottled chemicals must be handled with

chemically resistant gloves and eye protection. It is a recommended practice to wash hands after han-

dling chemicals and chemical containers.

• Pouring: Move slowly, and hold the bottle with two hands. One hand should be firmly around the

neck and the other hand should support the bottom of the bottle. Immediately clean up any chemical

residue on the outside of the bottle.

• Labeling: WorkSafeBC regulations require all containers to be properly labeled with contents and

hazards. You can use plastic ID labels when using chemicals in Petri dishes or beakers. Label any con-

tainers (e.g., glass or plastic) you introduce for your process with date, chemical name, and contact in-

formation using a Clean Room approved marking pen. Moreover, if you are using a fresh, previously

unopened bottle of chemical, label it with the date that it is opened.

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6.2 Chemical Personal Protective Equipment

Personal Protective Equipment (PPE) is mandatory when using chemicals. Special protective

equipment is required for HF processing and toxic gas cylinder changes. Some chemicals and toxic gases

require specialized PPE training, and this equipment cannot be used without proper training. The personal

protective equipment available to all users in the Clean Room is listed below:

• Acid Aprons

• Nitrile gloves*

• Wrist-length neoprene and nitrile gloves

• Face shields, safety glasses, and safety goggles

* Nitrile gloves used in the Clean Room provide minimal chemical protection, and are primarily used to

control human particulate contamination. A second set of (coloured, heavier material) gloves (e.g., neo-

prene or nitrile gloves) is recommended as necessary for chemical handling. See Appendix F to select the

type of gloves for appropriately handling chemicals in the laboratory.

For PPE to be effective, proper use is essential. The following describes the procedures required to

provide maximum protection when using the supplied PPE.

• Adjustable face shield: The face shield is used in conjunction with safety glasses. It can be ad-

justed to fit most head sizes. There are adjustment knobs on the straps that can be used to tighten the

apparatus around the head. There are other adjustment knobs that can be used to make the face

shield snug and secure. Do not use the face shield if the adjustments are too loose; it may fall off your

head or otherwise obscure your vision.

• Chemical gloves: Choose gloves that fit over the mandatory protective nitrile glove. A glove that

is too loose will not provide the required dexterity needed to use the chemical process equipment (e.g.,

timer buttons, tweezers, and wet bench controls).

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6.3 Chemical Spills

Chemical spills are an area for concern because there can be multiple exposure hazards to person-

nel from the spilled material, damaged equipment, and potential damage to the facility.

Immediately report any spill (large or small) to the Nanofabrication Facility staff. Staff will assist in

assessing the situation and will assist with the clean-up procedures. The staff may, however, determine

that the spill will require the attention of a trained HAZMAT team.

A professional HAZMAT team will be called in for clean-up of large chemical spills. In the case of a

large chemical spill, immediate contact must be made to SFU Campus Security by calling 2-4500. Describe

what chemical was spilled, approximately how much was spilled, and provide them with the appropriate

MSDS information. Campus Security will coordinate the arrival of the HAZMAT team.

In the event that a small spill (or a spill that can be cleaned up, based on a risk assessment) oc-

curs, the spill can be contained using spill kits supplied in the Nanofabrication Facility. These include neu-

tralizing powders for use exclusively outside of the Clean Room. Within the Clean Room, spill kits include

Spilfyter Liquid Neutralizer for acidic spills and Spilfyter Liquid Neutralizer for caustic spills. These neutral-

ized spills and other solvent spills can be collected using sorbent pads.

Exposure: If you are exposed to the spilled chemicals, do not stop to contain the spill. Remove con-

taminated clothing, rinse with copious amounts of water under a safety shower for 15 min, and seek

assistance. Your health and life are the first priority in a situation that involves a chemical exposure

from a spill; the spill will be cleaned up after you are cared for.

Note that emergency numbers for Campus Security and contact numbers for Nanofabrication Facility staff

are posted by every phone throughout the Nanofabrication Facility.

Spill Clean-Up Procedures (also see Appendix D.D.2, “Chemical Spill Response” for addition-

al detail).

Information

1. Advise other laboratory occupants of the spill and evacuate the immediate area.

2. Notify Nanofabrication Facility staff of the spill. Provide details such as quantity spilled, chemical com-

position, and approximate chemical concentrations. All spills must be cleaned up with the assistance

and/or supervision of Nanofabrication Facility staff.

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Risk Assessment

3. Conduct an initial risk assessment to determine:

(i) Is building evacuation is required? If yes, pull the fire alarm and contact SFU Cam-

pus Security at 2-4500.

(ii) Are external resources (HAZMAT team) required to contain and clean up the spill?

If not, continue with step 4.

Clean-Up

4. Ensure the spill area has adequate ventilation to clear gases or vapours generated during the neutrali-

zation process. If there is a potential for gases to concentrate in the area, or if odours are overpower-

ing, leave the area, mark the door to the area (e.g., position restricted access signage provided at the

entrance to the wet bench room within the Clean Room), and contact Campus Security at 2-4500.

5. Always wear appropriate personal safety equipment (e.g., safety glasses, secondary gloves).

6. Select the appropriate neutralizer or vapour inhibitor.

(i) Spilfyter Liquid Neutralizer for acidic spills (bottom rack of shelf in Room 6060.5)

(ii) Spilfyter Liquid Neutralizer for caustic spills (bottom rack of shelf in Room 6060.5)

(iii) Adsorbent pads for solvent spills (on the wall to left of the Transfer Station in

Room 6060.5)

7. If cleaning up a non-acidic or non-caustic solvent, proceed to step 12-14.

8. For acids and caustics, apply the liquid neutralizer on the spill working from the outside of the spill in-

ward. Start at a distance 3-5 times larger than the visible spill area.

9. Use pH paper to determine when the neutralization is complete. The pH should be between 3 and 10.

10. Add more neutralizer until the appropriate pH is reached.

11. When the neutralization is complete, absorb the liquid using the absorbent pads.

12. Place the absorbent pad over the spill and draw the free liquid into the pad.

13. Place the used absorbent pads in plastic bags for disposal along with contaminated disposable person-

al protective equipment (e.g., gloves).

14. Rinse the spill area with water and thoroughly wipe up the area to ensure no remaining residue is left

behind.

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Waste Disposal

15. If you are uncertain about waste disposal, inform the Nanofabrication Facility staff who will assist. The

staff will contact SFU Science Stores or the SFU Department of Environmental Health and Safety if nec-

essary.

16. Disposal will vary depending on the liquid neutralized. After neutralization, some liquids produce a

mixture that can go directly to the landfill. Other liquids retain toxic properties and must be handled

accordingly.

6.4 Eyewash Stations and Safety Showers

There is a safety shower and an eyewash station in room 6060.3, near the organic and acid wet

benches in the Clean Room. These are to be used in the event of spillage or splashing of wet chemicals

onto a person’s clothing, skin, or eyes. It is critical that any person suffering contact with wet chemicals in

the Clean Room act quickly to flush the contact area with a large volume of water as the first step taken in

response to the emergency.

In the event of clothing or skin contact, the person must step under the safety shower and activate

full flow of water by pulling down on the overhead handle while still fully clothed. While standing under

the safety shower stream, the person must disrobe completely and pile their clothing for decontamination

and/or disposal. The person must remain under the full stream of water for a minimum of 15 minutes, dur-

ing which time their laboratory buddy or Clean Room staff must place a call to Campus Security at 2-4500

to report the emergency.

In the event of eye contact, the person must manually hold open their eyes, lean over the eyewash

outlets, and activate full water flow into their eyes using the foot paddle control attached to the eyewash

station. Rinsing of the open eyes should be done for a minimum of 15 minutes, during which time their

laboratory buddy or Clean Room staff must call Campus Security at 2-4500 to report the incident.

• Eyewash stations

- Located at the end of the chemical wet bench in room 6060.3

- Also located in the corridors immediately outside the Clean Room and outside room 6140

• Safety Showers

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- Located at the end of the wet bench in room 6060.3

- Also located in the corridor outside room 6140

6.5 Material Safety Data Sheets (MSDSs)

MSDSs provide information about all chemicals (wet and gaseous) used in the 4D LABS Clean

Room. Each sheet includes data on product composition, reactivity, health effects, necessary personal pro-

tective equipment (PPE), exposure prevention measures, and emergency procedures.

Summary sheets are mounted for quick reference on Clean Room walls adjacent to the process

tools using the gases and chemicals described on the MSDS forms. Users are advised to refer to these

summaries to refresh their knowledge of hazards and procedures before starting work on any process tool

in the Clean Room.

Full copies of MSDSs are available on several labeled computers throughout the Clean Room.

6.6 Hydrofluoric Acid (HF)

Hydrofluoric acid (HF) poses unusual hazards to the user and requires unique safety measures. Hy-

drofluoric acid (HF) is an extremely dangerous chemical. Because it is commonly used in the Clean Room in

various concentrations, you may become exposed to HF even if you do not use it. Therefore you must be

aware of HF safety procedures. The primary hazard lies in HF contact with skin and/or clothing of the user.

A secondary hazard is associated with inhalation of HF fumes. In the event of a spill, HF requires specific

containment, neutralization, and disposal procedures. The area where HF is used and stored is limited to

the acid wet bench area (room 6060.5). A HF Acid Eater Spill Kit (including absorbents) and the Emergen-

cy Kit for Hydrofluoric Acid are both located on the bottom shelf of the rack in Room 6060.5. Stay alert

and work carefully in this area of the Clean Room.

6.6.1 Personal Protection Equipment (PPE)

PPE consists of nitrile gauntlets (see Appendix F for glove usage guidelines), apron covering your

Clean Room smock, and a full face shield. Special care must be taken to prevent dripping or splashing of

HF onto your feet or lower legs; standard Clean Room booties and footwear will not serve as an adequate

barrier to HF exposure.

30



6.6.2 Contact Exposure

Skin and eye contact with HF are to be avoided at all cost. While there is little or no physical pain

experienced by the user upon contact, HF will pass through soft tissue and react with the skeletal system,

breaking down and consuming bone calcium. There may be a rosy light red patch of skin discoloration at

the point of contact, but this sign is often ignored or discounted in the absence of significant physical pain.

Pain may only be associated with exposure to high concentrations of HF, and the onset of pain may also be

delayed by a few hours as the HF reacts with calcium in the nervous system. If you feel you may have been

exposed, it is best to take immediate preventative action. If you are exposed to HF, follow the procedures

listed below:

1. Immediately remove contaminated clothing.

2. Rinse with copious amounts of water under a Safety Shower or eye wash.

3. Report the exposure to your laboratory buddy or Clean Room staff.

4. Apply Calcium Gluconate gel by a gentle massage onto the exposed area of skin for 15 minutes (do

not use on eyes). Calcium Gluconate is stored in the “Emergency Kit for Hydrofluoric Acid Burns” lo-

cated on the bottom rack of shelves located in Room 6060.5.

5. Call 2-4500 to report the incident.

6. Continue to monitor the exposed area; a buddy or safety officer will need to continue to monitor your

health. If conditions worsen, you will need to be taken to a hospital.

7. Fill out an SFU incident report form.

6.6.3 Inhalation Exposure

All laboratory work with HF should be performed using an approved fume hood, which provides

constant exhaust air flow across the sample or container. If inhalation exposure is suspected:

1. Remove the affected person to fresh air.

2. Give mylanta or 4 effervescent calcium gluconate tablets (600 mg) by mouth every 2 hours until the

patient is admitted to hospital. These tablets can also be found in the “Emergency Kit for Hydrofluoric

Acid Burns” located on the bottom rack of shelves in Room 6060.5.

31



3. Call 2-4500 to report the incident.

4. Fill out an SFU incident report form.

6.7 Wet Bench Usage Guidelines

The 4D LABS Clean Room provides three wet bench process tools: an organic bench for acetone,

isopropanol, and other organic solvents; an acid bench for acids, such as hydrofluoric acid, and BOE; and a

developer bench for developing photoresists and cleaning of quartz tubes. The following are guidelines for

the proper and safe use of each of the wet bench areas.

1. Safety glasses and nitrile gloves are the basic level of required PPE; use of HF requires additional PPE

(see further notes in Section 6.6 and see Appendix F for glove choice guidelines).

2. The wet bench areas must be kept clean at all times to avoid cross-contamination of samples.

3. Heating of any solvents on the wet benches must be approved by Clean Room staff. Appropriate sign-

age and labels are required during heating to avoid injury to other users and/or a solvent fire.

4. All waste solvents, acids, and developers must be collected and put into the appropriately labeled

waste solution receptacles. Be very cautious to avoid accidental mixing of waste; waste should only be

added to appropriately designated and labeled waste containers. If you cannot find an appropriate

waste container, contact the Clean Room staff. There is no dumping of waste solutions directly down

wet bench drains.

5. In the case of HF and BOE solutions used at the acid wet bench, it is permitted to pour waste solutions

down the specific drain that lead to the HF neutralization tank.

6. When quartz tube cleaning is done at the developer wet bench, the waste solution will be directed to

drain into the HF neutralization tank. This process is carried out by Clean Room staff.

7. Acid waste, base waste, and organic solvent waste must never be mixed together in the same con-

tainer; this can produce an explosive reaction. Even some solutions of acids must not be mixed and

must be discarded in separate containers to avoid explosive reactions. If you have any questions re-

garding waste disposal, ask the Clean Room staff for assistance.

32



6.8 Hot Plate Usage Policy

1. Always keep the surfaces of the hot plate clean

2. Clean the back side of your sample so that the photoresist will not stick to the surfaces of the hot plate

3. Each hot plate corresponds to a specific spin coater. Priority for each hot plate is given to users of that

designated spin coater. Be sure you use the appropriate hot plate.

4. Check the appropriate MSDS and chemical information sheets before heating any chemicals to deter-

mine safe operating temperatures

5. When heating solutions, place the container with the heated chemicals and/or samples within a second

container. This outer container can be filled with a layer of water for thermal equilibration between the

hotplate and the inner container. It is recommended to place a watch glass over the inner container.

6. Keep flammable solvents and chemicals away from the hot plates.

Log Sheet

1. Users are required to record their use of the hot plates on the appropriate log sheet before turning on

the hot plate. The log sheet is kept near the spin coaters.

2. Users must log out of the log sheet and turn off the hot plate when they have finished using a hot

plate.

3. Hot plates turned on but without their usage signed into the log sheet will be turned off immediately

by Nanofabrication Facility staff.

4. If another user wishes to use the same hot plate, the first user must sign out of the log book and the

second user must sign in for that same hot plate.

Flammable hazards

No flammable chemicals are allowed to be heated on the hot plates without direct permission and instruc-

tions from Clean Room staff.

6.9 Labware Use & Cleaning

6.9.1 Labware

Use chemical containers of the appropriate size, in order to minimize waste and hazards, as well as

an appropriate material. Bear in mind that chemical disposal costs may be higher than the original cost of

33



the chemical. If a solution is to be heated, only glass should be used. Because HF is incompatible with

glass, only plasticware should be used at room temperature for an HF process. If your research requires

heated HF, contact the clean room staff to advise on specific plastic materials that will withstand your tem-

perature requirement.

Clean glassware and plasticware for general use are available on storage shelves in the wet bench

rooms. Users are not authorized to store labware for their own use. Some labware has been designated for

specific chemicals. If it is available for your process chemistry, use the designated labware. If there is no

labware of the appropriate size designated for your process, use unlabelled labware; do not use labware

designated for a different process chemistry.

Before any chemicals are used, it is the user's responsibility to be familiar with chemical hazards

(refer to the MSDS), to be aware of the specific waste disposal policies for those chemicals, and to ensure

that there is a suitable waste disposal container available (see Waste Disposal section). Each user is re-

sponsible for disposing of waste appropriately and cleaning and drying the labware which they have used

promptly.

6.9.2 Labware Labels

All chemical containers are required to be labeled, even if they will not be left unattended. Con-

tainers should be labeled before chemicals are poured in. Labels must identify:

1. Contents (e.g. chemical name and concentration)

2. User's first & last names; initials are insufficient.

3. Date

6.9.3 Waste Disposal & Wet Bench Cleanup

When a user has finished using chemicals, they should be disposed of in a designated waste con-

tainer (see Waste Disposal section).

When the user has finished working on a wet bench, all items placed on the bench by the user

should be removed, including containers, wipes, thermometers, and hot plates. Any wipes with water sol-

uble chemicals on them should be rinsed, squeezed dry, and placed in a garbage can. Any chemicals spilled

on the wet bench must be cleaned up by the user (see Wet Bench SOP and Spill Cleanup SOP).

34



Chemicals which are to be used again later in the day may be left on a wet bench; however, there

is not sufficient room on the wet benches to allow users to store chemicals for long periods of time. By the

end of each day, all items used should be cleaned up, except as follows. Hot chemicals may be left over-

night to cool but a note to this effect must be placed on the container. If required by the process, sub-

strates may be left to soak overnight but, again, a note to this effect must be left on the container. When-

ever a chemical container is left on the wet bench overnight it must be labeled with the contact infor-

mation of the user. It should be cleaned up promptly the next day.

6.9.4 Cleaning of Labware & Tweezers

Labware

Scrub labware with a brush in a Cleanroom detergent solution.

Rinse thoroughly in running DI water for two minutes.

Perform the water break test, as follows:

1) Submerge the item in DI water, raise it out of the water, and observe the film of draining water.

2) On a clean surface, there will be an unbroken, uniform film. Breaks, other irregularities, such as is-

lands, or droplets remaining on the surface are indicators of residual contaminants.

If any item fails the water break test, clean and rinse again.

Dry glassware on an aluminum foil sheet in the oven or with a nitrogen gun. Use only the nitrogen gun

for plasticware. Never wipe labware or it may become contaminated.

When labware is dry, return it to the storage shelf.

Tweezers

Stainless steel and PTFE tweezers should be cleaned in the same manner as labware or as follows:

1. Soak in acetone for 5 minutes

2. Rinse immediately with isopropanol

3. Rinse in running DI water for 1 minute

4. Dry with a nitrogen gun

35



6.10 Chemical Storage

Chemicals are to be stored in properly designated areas; these may include clearly labeled chemical

cabinets or the refrigerator. Transfer chemicals only in the appropriate fume hood. Note that each fume

hood (or wet bench) is designated for a specific type of chemistry and set of processes. These chemistries

are not to be mixed. The Clean Room has separate chemical fume hoods for organic solvents, bases, and

acids, and the hoods are labeled accordingly. Do not store incompatible substances next to each other. If

you do not know what chemicals are incompatible you must contact a Clean Room staff member before

using the chemicals. All flammable chemicals and all solvents must be stored in the yellow Flammables

cabinets located in room 6060.7 and 6060.13 of the Clean Room.

6.11 Pregnancy

Users who may be pregnant are not restricted from using the Clean Room, but may want to dis-

cuss potential hazards with a SFU Environmental Health and Safety representative, their research group

leader, and/or the 4D LABS management team. Some chemicals such as organic solvents and photoresists

can be potentially harmful to the unborn fetus.

6.12 Chemical Waste Disposal

Chemical waste generated in the Clean Room must be stored in a properly labeled container and

placed in the designated storage areas. SFU is contracted with a company for the removal and disposal of

chemical waste. Waste is removed on specific days. DO NOT take chemical waste to Science Stores.

Clean Room staff will assist with making the necessary arrangements for chemical disposal using infor-

mation that you provide to them. Labels on waste containers must indicate all chemical contents (no chem-

ical formulas) as well as concentrations.

6.13 Disposal of Sharps

Under no circumstance are any sharps to be disposed of with regular trash. Improper disposal

could endanger Nanofabrication Facility staff or other SFU staff involved with the disposal of the trash. In

36



all circumstances the sharps should be discarded in the appropriate waste disposal container and Nanofab-

rication Facility staff will arrange for further disposal.

Glass Waste: Broken glassware must be disposed of in the appropriate waste bucket located in

Transfer Bay 1 (near the acid wet bench).

Silicon Wafer Pieces: A waste container for silicon pieces is located on the shelf in the spin

coater room (6060.7).

Metal Sharps and Non-Silicon Wafer Pieces: A waste container for non-silicon wafer pieces

(e.g., wafers pieces of other semiconductors) is located on the shelf in the spin coater room

(6060.7).

6.14 Disposal of Empty Bottles

Empty plastic or glass solvent bottles must be kept in the solvent cart located near the organic wet

bench. Nanofabrication Facility staff will clean these bottles. Appropriate bottles will be recycled as

waste containers, and staff will change the label for the designated chemical waste.

Do not leave empty photoresist bottles inside the fridge. Store these bottles in the “Out” bay of

Transfer Bay 1 located in the acid wet bench room. Nanofabrication Facility staff will take care of

proper disposal.

6.15 Fire Extinguishers

Carbon dioxide fire extinguishers covering Class B and Class C fires (electrical and chemical) are

wall-mounted throughout the Clean Room. Under no circumstances should a Class A-B-C dry powder ex-

tinguisher be discharged in the Clean Room or any grey space area. The resulting contamination from use

of a dry powder extinguisher would be catastrophic anywhere in the Nanofabrication Facility.

Standard fire emergency protocols must always be followed by all users at all times. The presence

of fire extinguishers in the Nanofabrication Facility in no way represents a recommendation to stand and

fight a fire; evacuation of personnel and initiating a building fire alarm are the only recommended courses

of action in the event of fire.

Should a person decide to extinguish a small fire or spark situation, he/she must bear in mind the

very limited capacity of the carbon dioxide extinguishers in the facility, and apply the extinguisher stream to

37



the source of ignition as instructed in laboratory safety training at SFU. The person who elects to fight a

small fire must situate him/herself with his/her back to a clear fire exit presenting a route for quick egress

from the area of the fire.

38



7. Gas Safety

7.1 Safe Practices for Use of Compressed Air and Nitrogen

There are numerous outlets in the Clean Room for the use of compressed air and compressed ni-

trogen. Compressed air is largely used for the pneumatic actuation of valves on process tools, while com-

pressed nitrogen is used in spray guns fitted on the wet benches. The gas pressure from these applications

is sufficient to cause damage to the user’s vision and hearing if he/she does not exercise good judgment in

using these devices. The following are recommended practices for the proper use of compressed air and

nitrogen:

1. Never allow compressed gases to discharge into the eyes or ears. Always use approved eye protection

and ear plugs if you know you will be working around open discharge of compressed gases.

2. When discharging compressed nitrogen, do so in limited quantities; remember that nitrogen poses an

asphyxiation risk since it displaces oxygen.

3. Never discharge compressed gases into the mouth or lungs for any reason.

7.2 Compressed Gas Cylinder Handling and Usage

Pressurized gas cylinders are used extensively throughout the Nanofabrication Facility to supply a

variety of process gases (see section 7.3). These cylinders are prefilled at very high pressure and must be

handled by trained personnel with extreme care. Rapid release of pressure presents a unique projectile

hazard, propelling the open cylinder in random directions at a high speed. There will be no handling of gas

cylinders by users of the Nanofabrication Facility.

1. Cylinder transport: Must always be performed using an approved cylinder cart. During transport, regu-

lators must be removed. For situations where work is being conducted in a large area (i.e. hallway) and

the cylinder requires constant re-positioning (moving very short distances), the regulator may remain

on; however, the regulator must be removed if the cylinder is to be re-located more than a short dis-

tance.

2. Secure cylinder mounting and storage: The gas cylinder must be mounted at all times to an approved

saddle-type mount with a proper chain or strap restraint. Temporary clamp-on mounts secured to a ta-

39



ble or ledge while also using a cylinder strap restraint are approved for short-term storage. Short-term

storage of a cylinder on a hand cart is only permissible if the cart itself is secured by chain or strap to a

fixed surface. Regulators are permitted on short-term stored cylinders.

3. Use of cylinder while on an approved cylinder cart: During use, the cylinder w/ regulator may remain on

the hand cart (as in the case of orbital welding), so long as the hand cart is under direct control of the

operator at all times and is physically separated from other occupants in the area, i.e. with a safety

cone around the area where the cart is located, to prevent accidental bumping. When possible, it is

recommended that the cylinder is wall mounted and a longer gas line is used to deliver gas, so long as

the gas line is not resulting in a tripping hazard.

4. Cylinder changes: To be performed only by appropriately trained and authorized Clean Room staff.

5. Leak checking: To be performed only by appropriately trained and authorized Clean Room staff.

7.3 Hazardous Gases Present in the Clean Room

The following hazardous gases are used in the Clean Room:

Gas Assay Hazard

100% Silane SiH4 Unpredictable. Burns in moist air. Toxic.

15% Phosphine / 85% Silane PH3/SiH4 Unpredictable. Burns in moist air. Toxic.

Dichlorosilane SiCl2H2 Corrosive. Toxic.

Ammonia NH3 Corrosive. Toxic.

Hydrogen H2 Flammable.

Boron Trichloride BCl3 Highly Toxic.

Chlorine Cl2 Corrosive. Highly Toxic.

Oxygen O2 Combustible

Nitrogen N2 Asphyxiation

Several Noble Gases Ar or He Asphyxiation

Several Fluorinated Gases SF6, CF4, or CHF3 Asphyxiation

40



7.4 Hazardous Gases Characterization

• Ammonia

Corrosive liquid and gas under pressure. Harmful if inhaled. Can cause eye, skin, and respiratory tract

burns. May cause kidney and respiratory system damage. Can catch fire. Self-contained breathing appa-

ratus and protective clothing must be worn by rescue workers. Under ambient conditions, this is a colour-

less gas with a pungent, irritating odour.

• Argon

High-pressure gas. Can cause rapid suffocation. May cause dizziness and drowsiness. Self-contained

breathing apparatus may be required by rescue workers.

• Boron trichloride

Toxic, corrosive liquid and gas under pressure. Harmful or fatal if inhaled. Causes eye, skin, and respiratory

tract burns. May cause liver, kidney, and respiratory system damage. Self-contained breathing apparatus

must be worn by rescue workers. Pungent and irritating odour.

• Chlorine

Poisonous, corrosive liquid and gas under pressure. Harmful or fatal if inhaled. Causes eye, skin, and res-

piratory tract burns. Can support combustion. Self-contained breathing apparatus and protective clothing

must be worn by rescue workers. Under ambient conditions; this is a greenish-yellow gas with a pungent,

irritating, choking odour.

• Dichlorosilane

Toxic, flammable, corrosive, high-pressure liquid & gas. May be fatal if inhaled. Can cause eye, skin and

respiratory tract burns. Water can cause violent reaction. Symptoms may be delayed. Self-contained breath-

ing apparatus must be worn by rescue workers.

• Helium


breathing apparatus may be required by rescue workers. No odour present.

41



• Hydrogen

Flammable high-pressure gas. Can form explosive mixtures with air. May ignite if valve is opened to air.

Burns with an invisible flame. May cause dizziness and drowsiness. Self-contained breathing apparatus

may be required by rescue workers. Under ambient conditions, this is a colorless, odourless, tasteless gas.

• Nitrogen


breathing apparatus may be required by rescue workers. No odour present.

• Oxygen

High pressure, oxidizing gas. Vigorously accelerates combustion. Self-contained breathing apparatus may

be required by rescue workers. No odour present.

• Phosphine 15% / Silane 85%

Flammable gas; may be fatal if inhaled. Contents under pressure. Contains material which causes damage

to the following organs: lungs, mucous membranes, heart, respiratory tract, skin, central nervous system,

lens or cornea of the eye. Vapor may cause flash fire. Self-contained breathing apparatus is required by

rescue workers.

• Silane

Pyrophoric, flammable high-pressure gas. Can ignite on contact with air. May form explosive mixtures with

air. Does not need a source of ignition. Respiratory irritant. May cause respiratory system damage. Self-

contained breathing apparatus is required by rescue workers.

• Sulfur Hexafluoride

Liquid and gas under pressure. Can cause rapid suffocation. May cause dizziness and drowsiness. Self-

contained breathing apparatus is required by rescue workers. No odour present.

• Tetrafluoromethane

42




breathing apparatus is required by rescue workers. Under ambient conditions, this is a colorless odourless

gas.

• Trifluoromethane

High-pressure liquid and gas. Can cause rapid suffocation. May cause dizziness and drowsiness. Self-

contained breathing apparatus must be worn by rescue workers. Under ambient conditions, this is a color-

less gas with an ether-like odour.

7.5 Cylinder Leak Checking

Process gas cylinders should be checked for leaks before accepting delivery. This is typically done

by the delivery company before loading the truck and on-site before receiving the gas delivery. Clean Room

staff will also check for gas leaks upon receipt of a new cylinder.

7.6 Toxic Gas Cylinder Change

Toxic gas cylinder replacement is a two-man operation, to be undertaken only by Clean Room staff

members certified to use self-contained breathing apparatus (SCBA). Both individuals are required to wear

SCBA equipment during cylinder replacement. A third Clean Room staff member must be on hand during

the change-out for any toxic gas cylinder. Internal notification must be given to 4D LABS management dur-

ing all toxic gas cylinder changes. Notification must also be given once the installation or change-out is

complete.

Fit testing, training, and documentation for staff members using SCBA for this and any other pur-

pose is outsourced to a private company equipped to provide these services.

43



8. Electrical Safety

As electricity is the prevalent source of energy in process tools, it is important to know the poten-

tial hazards and proper procedure in minimizing and avoiding hazards as well as dealing with an injury.

8.1 Electrical Hazards and Avoiding Exposure

Electrical energy is potentially dangerous and accidental exposure to high voltage and/or high am-

perage can be fatal. Although many electrical hazards can be avoided by proper procedures, there is no

substitute for common sense. Some critical ways for avoiding exposure to electrical hazards include:

• Use properly grounded or double insulated equipment.

• Avoid the use of electrical equipment under wet conditions.

• Avoid the use of extension cords.

• Do not use damaged power cords (damaged cords should be repaired immediately).

• Do not overload outlets. Always be aware of the full-load-amperage of the equipment you are con-

necting to the outlet, and the capacity of the outlet.

• If equipment sparks, smokes, and/or shocks, notify the Clean Room staff immediately to prevent po-

tential injury to users and/or the equipment, and so that it may be repaired as soon as possible.

• Replace fuses with the correct type and rating as the original/required fuse.

8.2 Emergency Procedures for Electrical Accidents

1. Do not touch the person. Touching the victim can result in you also becoming a victim.

2. Call/shout for help. Notify Clean Room staff and have someone call Campus Security (2-4500).

3. Shut off the electrical power if possible.

4. Remove the victim from the live contact using a nonconductive material such as a hard rubber or wood

rod, as quickly as possible.

5. Keep the victim warm and accompany them until help arrives.

6. Following the accident, complete an SFU incident report.

44



8.3 Lockout/Tagout of Electrical Devices

The Nanofabrication Facility provides hardware to enable Clean Room staff members to lock out

and tag out de-energized electrical sources prior to starting any maintenance procedures. Always follow

proper Lockout procedures when servicing equipment. All maintenance work will be performed exclusively

by Facility staff.

45



9. Radiation and Ultraviolet Hazards

9.1 Radio Frequency Power (RF) Hazards

Several process tools in the 4D LABS Clean Room utilize 13.56 megahertz Radio Frequency power

to generate plasma in their chambers. These include the chlorine-based reactive ion etch tool (RIE 1), the

fluorine-based reactive ion etch tool (RIE 2), the plasma-enhanced chemical vapour deposition tool

(PECVD), the Bestec physical vapour deposition tool (PVD 1), and the plasma cleaning instruments. All the-

se devices are equipped with adequate shielding to prevent RF exposure while in use. Do not compromise

the safety interlocks on these tools.

9.2 Ultraviolet Radiation Hazards

There are three sources of ultraviolet radiation in the 4D LABS Clean Room. The first is the mercury

lamps found in the OAI and the Kasper mask aligners (mask aligners 1 and 2); it is necessary to avoid any

direct visual observation of these bulbs while doing photolithography work. The use of protective UV ab-

sorbing goggles is required to avoid ambient or reflected light exposure to the eyes while these sources are

energized. The second source of UV radiation is in the plasma generated in the process tools outlined in

section 9.1. While the user is allowed to look at the plasma cloud through viewing ports to check for ap-

propriate coloration of the plasma, he/she should limit their optical exposure time as a precautionary

measure. The third source of UV radiation is the UV laser diodes used in the direct write laser tool and the

laser mask writer. It is essential to avoid direct visual observation of the laser. Do not compromise the safe-

ty interlocks on these tools. The use of protective UV absorbing goggles is also required to avoid reflected

light exposure to the eyes while these sources are energized.

46



10. Emergency Services

10.1 Fire Response

All users should follow emergency procedures provided through SFU EHS training, such as the use

of fire alarm pull stations. Furthermore, at SFU the emergency number for reporting a fire in the laboratory

or building is 2-4500. All fires must also be reported immediately to the Clean Room staff. Following the

accident, an SFU incident report must be completed by all parties involved.

10.2 Chemical Spills Response

Chemical spills at SFU can be reported to Campus Security at 2-4500. Be prepared to provide all

pertinent information to the Campus Security such as what, where and how much was spilled. All

chemical spills must also be reported immediately to the Clean Room staff. Following the accident, an SFU

incident report must be completed by all parties involved.

10.3 Gas Leakage Response

Accidental gas leakage at SFU can be reported to Campus Security at 2-4500. All gas leaks must

also be reported immediately to the Clean Room staff. Following the accident, an SFU incident report must

be completed by all parties involved.

10.4 Medical Emergencies

Medical emergencies such as chemical burns, inhalation injuries, falls, heart attacks, etc. require

you to contact Campus Security at 2-4500. All medical emergencies must also be reported immediately to

the Clean Room staff. Following the emergency, an SFU incident report must be completed by all parties

involved.

47



11. Staff Contact Information

The following staff members may be contacted on campus by users of the 4D LABS Nanofabrication Facility

for any questions or concerns that these users may have:

Mary Boysel Manager 778-782-8084

Chris Balicki Technician (EIT) 778-782-8026

Tom Cherng Process Engineer 778-782-8075

Michael Driscoll Senior Process Engineer 778-782-8026

Philip Kubik Process Engineer 778-782-8026

Grace Li Technician 778-782-8075

Nathanael Sieb Technical Outreach Professional 778-782-8075

48



Appendix A – After Hours Usage

A.1 Procedures

The standard operating hours of the Nanofabrication Facility Clean Room are 9am-5pm Monday-

Friday, excluding holidays. Users are encouraged to work within these hours whenever possible.

After-hours privileges will be granted on an individual basis. A user may only be given after-hours

access if they are a certified user of the equipment they wish to operate. The tool owner of the equipment

in question will determine if the user can access the equipment after-hours. An additional training session

may be required prior to granting this extra level of access. After a user has been granted after-hours ac-

cess on a specific tool, if they have not used it for more than one month, they must check with the tool

owner before using it again after hours.

Users working after hours are highly encouraged to work with another user present in the Clean

Room. The buddy system is the safest way to operate in the laboratory and should be used whenever pos-

sible. Please plan your experiments accordingly.

All users must sign in on the after-hours log sheet outside the Clean Room entrance. The user has

two options to help ensure their safety while working after-hours in the Clean Room: the first option allows

the user to work as long as another authorized user is present anywhere in the Clean Room facility; the

second option requires the after-hours user to phone in to SFU Security (dial 778-782-3100) to establish

the user’s presence in the Clean Room. This second option requires an initial call announcing the user’s

entry into the Clean Room, mandatory check-in calls to SFU Security every hour, and a final call to establish

the user’s time of departure from the Clean Room. Departing users can use the phone at the entrance to

the Clean Room, located near the after-hours log sheets, for this final call to SFU Security.

Failure to make the required check-in calls will result in emergency response by SFU Security,

which may include their need to quickly enter the Clean Room. Costs incurred for cleanup of the Clean

49



Room facility following a failure to make the required check-in calls will be assessed against the offending

user and his/her company or supervisor. The user also must sign out when leaving the Clean Room; failure

to sign out will serve as cause to revoke a user’s after-hours access.

In summary, the required steps to be taken by a lone after-hours user are as follows:

1. Initial call to SFU Security (778-782-3100) upon arrival: provide estimated working time, and establish

the exact time for hourly check-in calls to commence.

2. Users must sign in on the after-hours access log at the gowning room entrance.

3. Hourly check-in calls to 778-782-3100 must be made. Users should use the stop watches on lanyards

within the gowning room to establish a time prior to 1 hour as a reminder to call Security.

4. A final call must be placed to Security as the user exits the Clean Room, announcing the end of the

work session.

5. User must sign out on the after-hours usage log upon exiting the Clean Room.

After-hours access can be revoked for reason without warning. Some examples of reasons to re-

voke after-hours access include, but are not limited to: acting in an unsafe manner in the Clean Room, im-

proper operation of equipment, using equipment that the user is not certified on, failure to adhere to the

buddy system or Security check-in calls, or not following proper cleanliness procedures. After-hours access

is a privilege and must not be abused.

A.2 Equipment

Access to the following equipment and processes is prohibited‡ after-hours:

Tystar Mini Tytan Furnace

NEXX plasma-enhanced chemical vapour deposition (PECVD)

Chlorine-based reactive ion etcher (RIE 1)

‡ Prohibited access: Absolutely no user may access this equipment or processes while working after hours.

Following equipment and processes have restricted* access after-hours:

Use of hydrofluoric acid

50



Use of any other acids (e.g., Nanostrip, Aqua Regia, Piranha)

Heating of any organic solvents

* Restricted access: Only qualified users may access this equipment while accompanied by another user

who is also certified on the aforementioned equipment and processes. Absolutely no user may access this

equipment or processes if working alone, or if accompanied by a user who is not certified to use this

equipment or process.

Following equipment and processes are allowed for certified users after-hours:

All characterization tools (including probe station)

Plasma cleaners

Spin-rinse-dryer

Spin coating

Robotic lithography tool

Photoresist developing

Optical lithography

Direct write laser lithography

Electron beam lithography

Soft lithography

Hot plates in spin-coater room

Ovens

Fluorine-based reactive ion etcher (RIE2)

All physical vapour deposition systems (PVD 1, 2, and 3)

Rapid thermal processor

51



Appendix B – Accident Waiver and Release of Liability Form

Accident Waiver and Release of Liability Form

4D LABS and Simon Fraser University BETWEEN:

4D LABS and SIMON FRASER UNIVERSITY, a corporation continued under the University Act of British Co-

lumbia, having offices at Multi-Tenant Facility, 8888 University Drive, Burnaby, British Columbia, Canada

V5A 1S6, ("SFU");

AND:

full name of individual (printed):_______________________________department:_____________

____________________ company/institution name: _______________________________having

an office at______________________________________________________ ("PARTICIPANT").

As the PARTICIPANT, I HEREBY ASSUME ALL RISKS ASSOCIATED WITH PARTICIPATING AND/OR VOLUNTEERING IN ANY RESEARCH ACTIVITY ASSOCIATED WITH 4D LABS AT SIMON FRASER UNIVERSI-TY ("ACTIVITY"), including but not limited to, any risks that may arise from loss of data, theft, as well as risks from dangerous or defective equipment or property, or personal injury which may include exposure to chemical, thermal, mechanical, radiological, electromagnetic, and electrical hazards. SFU and 4D LABS do not provide any insurance coverage and the PARTICIPANT will be responsible for its property and will in-sure its property accordingly. Theft of any equipment, loss or damage of any equipment (borrowed or oth-erwise) due to the PARTICIPANT’s negligence will be the responsibility of the PARTICIPANT and will require appropriate compensation to SFU and 4D LABS. The PARTICIPANT agrees to indemnify, defend and save harmless SFU and 4D LABS, without limi-tation, its officers, employees, agents, students, faculty, servants and members of its Board of Governors (collectively, the “University Representatives”) from any and all suits, proceedings, claims (including, with-out limitation, claims for damage to property and bodily injury—as injury, sickness, disease, disability, shock, assault and battery, mental suffering, mental injury including death—to persons, and breaches of copyright and patent infringement), demands, actions, causes of action, damages, losses (including conse-quential losses), liabilities, expenses or fees (including legal fees on a solicitor and own client basis) arising out of or in any way connected with the ACTIVITY, the use by the PARTICIPANT of the facilities at SFU, the exercise by the PARTICIPANT of its rights under this Agreement or the negligent or wrongful act of the PARTICIPANT or any person for whom at law the PARTICIPANT is responsible, excluding matters caused by the gross negligence of SFU and 4D LABS. SFU and 4D LABS are not responsible for subsequent use and fitness of purpose of data, materials and/or intellectual property obtained from the ACTIVITY, which are the responsibility of the PARTICIPANT. SFU and 4D LABS will, to the best of their abilities, strive to uphold a well-maintained facility and will do their best to work with the PARTICIPANT to ensure that any changes, repairs, and/or modifications to equipment will have minimal impact on the ACTIVITY. However, SFU and 4D LABS reserve the right to

52



change, repair, and/or modify equipment as necessary. The PARTICIPANT waives SFU and 4D LABS of all claims related to the results of processes, experiments, and related work performed in SFU facilities. I agree to abide by all the required preparations and training procedures for participation in the ACTIVITY, and have not been advised to not participate in the ACTIVITY by a qualified medical profession-al. I certify that there are no health-related reasons or problems which preclude my participation in any ACTIVITY. To help ensure the safety of the PARTICIPANT, 4D LABS reserves the right to assess the abilities of the PARTICIPANT and may require the PARTICIPANT to obtain further training as determined by 4D LABS to be necessary. I acknowledge that this Accident Waiver and Release of Liability Form will be used by SFU and 4D LABS, and that it will govern my actions and responsibilities at said ACTIVITY. I acknowledge that I have reviewed the SFU Environmental Health and Safety’s Lab Safety Manual and the 4D LABS’ Nanofabrication User Safety Manual, and that I have made myself familiar with safety and emergency procedures for working within the facilities. I acknowledge that I will be upheld to the terms outlined in these safety manuals. In consideration of my application to participate in any ACTIVITY, I hereby take action for myself, my executors, administrators, heirs, next of kin, successors, and assigns as follows:

(A) I WAIVE, RELEASE, AND DISCHARGE from any and all liability, including but not limited to, lia-bility arising from the negligence or fault of the entities or persons released, for my death, disabil-ity, personal injury, property damage, property theft, or actions of any kind which may hereafter occur to me including my traveling to and from SFU; (B) I INDEMNIFY AND HOLD HARMLESS SFU, 4D LABS and any of their respective employees from any and all liabilities or claims made as a result of participation in this ACTIVITY, unless caused by the gross negligence or willful misconduct of SFU and 4D LABS.

I hereby consent to receive medical treatment which may be deemed advisable in the event of inju-ry, accident, and/or illness during any ACTIVITY. The accident waiver and release of liability shall be construed broadly to provide a release and waiver to the maximum extent permissible under applicable law. I CERTIFY THAT I AM OVER THE AGE OF 19 YEARS (LEGAL AGE OF MAJORITY IN BRITISH COLUMBIA), HAVE READ THIS DOCUMENT, AND I FULLY UNDERSTAND ITS CONTENT. I AM AWARE THAT THIS IS A RELEASE OF LIABILITY AND A CONTRACT AND I SIGN IT OF MY OWN FREE WILL. Name: _________________________________ Witness: _______________________________

Signature: ______________________________ Signature: ______________________________

Date: _________________________________ Date: __________________________________

53



Appendix C – Disciplinary Policy and Procedures

Because of the expense of equipment, dangers in the facility and the fragility of other user’s devic-

es, users of the Clean Room need to act accordingly. For most users, this is not a problem, it’s just common

sense. However, the following policy is in place for those users who choose to cause problems.

C.1 Overview

The policy is a ‘three strikes and you’re out policy’. Gross negligence, however, may result in an

immediate suspension of Clean Room access. Once a user has had access removed, the user has to reapply

and begin training again. They will also be placed on probation until they have proven that they will not be

a problem in the facility. To ensure that a user knows how many strikes (demerits) they have, an email de-

scribing the violation will be sent to them and to their supervisor. This policy is not to punish people who

are learning and make mistakes or occasional lapses in judgment. These are understandable and are part

of the learning process. The point of this policy is to deal with users that consistently put their needs and

desires above the safe and efficient operation of the facility. Please encourage safety and proper lab usage

among the other lab users and report any violations to the Clean Room staff. Violations may be safety or

non-safety related.

C.2 Demerit Offenses

1. Consistent violation of clean room protocols. 2. Consistent violation of safety policies. 3. Intimidation of other users (taking over lab space, damaging other user’s devices, etc.). 4. Damaging equipment by not following procedures after sufficient training or making unauthorized modi-fications to the equipment. 5. Using equipment without the proper training sign-off. 6. Abusing equipment scheduling. 7. Consistent improper/incomplete use of the billing system.

54



C.3 Procedures

First Offense: The Manager will send an email to the user and copy the user’s supervisor indicating the

offense and the fact that it is a first warning.

Second Offense: The Manager will send an email to the user and copy the user’s supervisor indicating the

offense and the fact that it is a second warning. In addition, a face-to-face meeting will be arranged be-

tween the user, their supervisor, and the Clean Room Manager.

Third Offense: The individual will be expelled from the Clean Room.

Enforcement: All Clean Room staff have the responsibility to ensure the proper and safe operation of the

facility. All staff can ask a user to conform to the policies. The Clean Room Manager will administer the

‘Three Strikes’ policy.

55



Appendix D: Chemical Policies

D.1 Overview

This document provides an overview of the chemical policies in the 4D LABS Nanofabrication Facil-

ity. Formal Training is required for all users prior to using any chemicals.

D.2 Chemical Spill Response

Perform chemical spill control only if:

The personnel is familiar with equipment and clean-up procedures

More than one person is in the lab

No ignition sources are present

Always wear all personal protective equipment:

Chemical splash goggles

Face shield

Gloves (double layer)

Plastic or Tyvek aprons

D.2.1 Acid and Base Spills

The spill kit is located near the acid bench. The supplies included in the kit are KOLOR-SAFE®

LIQUID NEUTRALIZER for Acids, KOLOR-SAFE® LIQUID NEUTRALIZER for Bases, and universal chemical

absorbent pads. Be sure to select the appropriate material.

1. Evacuate the room/area, close doors if applicable, restrict the area, and notify others in the area of

the spill.

2. Contact:

Name Phone Reporting

Grace Li x28075 Chemical spills

Tom Cherng x28075 Chemical spills

56



Nathanael Sieb x28075 Chemicals spills

SFU Campus Security x24500 Major chemicals spills

3. Assess the risks and determine if you are able to clean up the spill.

4. Ventilate the contaminated area.

5. Contain the spill with universal sorbent material.

6. For best results, place universal sorbent pads on the spill to soak it up.

7. Slowly spray or pour the appropriate neutralizer on the spilled chemical (base neutralizer on caustic

or acid neutralizer on acid).

CAUTION: Some HEAT or OUT-GASSING may be generated.

8. Use the pH paper located on the glassware shelf by the acid bench to determine when the spill is

neutralized. The final pH should be 7-9. Add more neutralizer if necessary.

9. Allow neutralized liquid to cool.

10. Soak up remaining neutralized liquid with sorbent materials.

11. Place used sorbents into temporary disposal bags.

12. Wipe up residue and all neutralized liquids with non-woven cloth material.

13. Place the waste wipes in the normal solid trash ONLY if there are no secondary hazards present in

the waste (i.e. heavy metals).

14. Document all spill incidents and emergencies with pertinent details (see table at the end of this

section), including:

o Who was involved

o Where and when the spill occurred

o Why the spill occurred

o How the spill was cleaned up

15. Go to www.sfu.ca/security and fill out an online EHS Incident Report Form.

NOTE: Depending on the extent of the clean-up process, additional equipment may be required.

http://www.sfu.ca/security

57



CAUTION: Do not use KOLORSAFE® Liquid Base Neutralizer on any solution containing (in any form) me-

tallic nitrates, cyanides, sulfides, strong oxidizers, or hypochlorite (sodium or calcium) solutions since dan-

gerous gases will be generated.

D.2.2 Hydrofluoric Acid Spills

An HF Acid Safety Spill Kit is located near the Acid Bench. Follow these steps for spill clean-up:

1. Wear and use all personal protective equipment (PPE) contained in HF Acid Eater Safety Spill Kit at

all times before, during and after spill clean-up.

2. Follow Steps 1-3 for General Acid Spills (as above).

3. Atomize HF Acid Eater into the air surrounding spill to neutralize any vapors and reduce initial

odours with spray apparatus.

4. Gently pour and/or spray the HF Acid Eater on the spill working from the outside of the spill in-

ward. The neutralizer should cover an area 3-5 times larger than the spill area.

5. The HF Acid Eater will change colors in the presence of hydrofluoric acid from a beige color to red

indicating the neutralization process is completed.

6. Wipe, mop, or allow the spill to air dry.

7. Place the waste wipes in the normal solid trash ONLY if there are no secondary hazards present in

the waste (i.e. heavy metals).

8. Rinse personal protective equipment with plenty of water to remove any chemical residues before

re-using.

9. Document all spill incidents and emergencies with pertinent details (see table at the end of this

section), including:

a. Who was involved

b. Where and when the spill occurred

c. Why the spill occurred

d. How the spill was cleaned up

10. Go to www.sfu.ca/security and fill out an online EHS Incident Report Form.

http://www.sfu.ca/security

58



D.3 New Chemical Approvals

To get clearance for new chemicals, users should provide the following information in electronic

form to Grace Li ([email protected]) and Mary Boysel ([email protected]):

MSDS

quantity of chemicals to be stored in the Clean Room

intended purpose of the chemicals

equipment that will be used with the chemicals

protective gear and other supplies that may be needed

disposal plan

Permission will be granted for new chemicals on a case-by-case basis. The determination will be

based on the hazard of the substance towards equipment or personnel. The following categories of chemi-

cals are banned:

powders due to the hazard of generating particulates in the Clean Room

thiols and silanes due to the contamination hazard of surfaces in the Clean Room

Chemicals that will be relatively quick to authorize include:

photoresists

aqueous solutions

Classes of chemical that will require more detailed research into their hazards and may require

special handling procedures include:

nanoparticle solutions (see, Section 3.3)

organic solvents

halogenated solvents

strong acids and bases

highly reactive chemicals

59



In general, each wet bench is dedicated for a specific class of chemicals. The organic bench in

6060.3 is used for all organic and halogenated solvents. It is also used for spin-coating hazardous materi-

als, such as nanoparticles. The acid wet bench in 6060.5 is assigned to acids and bases, including most

etchants. The developer wet bench in 6060.7 is used mainly for aqueous solutions, such as photoresist

developers. The plan for newly approved chemicals will include information regarding where the work is to

take place and a disposal plan for any generated waste. If necessary, the plan must also include a spill re-

sponse procedure for chemicals requiring a response different from those outlined above.

D.4 Specific Chemical Procedures

D.4.1 Photoresist

1. All photoresist spin-coating and developing should be done in 6060.7.

2. Each spin-coater and hot plate is labeled for specific photoresists. Be sure to use the correct

equipment.

3. Dispense the photoresist from the small bottles using the provided plastic pipettes. Withdraw the

resist from the middle of the bottle, not the top or bottom. Try to take only the amount of photo-

resist that you need. Never return excess photoresist to the bottle. If you need more photoresist,

always use a new pipette.

4. During spin-coating and baking, fumes will be generated. Try to limit your exposure to these

fumes.

5. After you are complete, wipe the bowl of the spin-coater with the provided acetone and clean

wipes.

D.4.2 Polydimethylsiloxane (PDMS)

1. PDMS preparation should be done in the labeled tray to prevent spillage on the work surfaces in

the Clean Room

2. A desiccator is provided for degassing the unpolymerized, mixed PDMS reagents

3. Spin-coating should be done on the labeled spinner in 6060.13

60



4. Samples should be placed in a covered (petri) dish and baked in the PDMS oven in 6060.13

5. Be sure to thoroughly clean up all chemicals after use

D.4.3 Spin Coating Nanoparticles and Clean up Procedure

1. Rules for using nanoparticles in the Clean Room:

Only nanoparticle solutions can be brought into the Clean Room (the nanoparticles must be

dispersed in a solvent prior to bringing it in the Clean Room)

The bottle of nanoparticle solution must be sealed by Parafilm after every use

Spin coating must be performed on the (exhausted) Organic Wet Bench

Only Spin Coater #5 (blue color one) can be used for spin-coating Nanoparticle samples

Remember to book the Organic Bench before you use it to spin-coat nanoparticles (label the

setup: “nanoparticle work”)

2. Procedure for spin coating:

Transfer Spin Coater #5 from the top of solvent cabinet to the Organic Bench in room 6060.3

Plug in the spin coater power cord to the wall outlet

Plug in the vacuum tubing to the quick-connect on the organic wet bench

Press Power button on the spin coater

Open the lid of the spin coater

Load the substrate on the sample holder and press the vacuum on

Set the spin speed and time as required

Dispense the solution by pipette onto the substrate

Close the lid to avoid the nanoparticles spreading everywhere

Press “Start” to begin the spin

3. Bake

Bake should be performed in the “Dirty Oven” *

61



After spin coating, transfer the sample into a glass covered (Petri) dish* and bake the sample

(in the dish) in the pre-programmed “Dirty Oven”**for the desired time.

*Use the Petri dishes labeled with: “Nanoparticle sample”. They are stored in a separate box, and

located on the shelf in the Organic Bench Room

**Dirty Oven is labeled and located in Room 6060.7 (Developer Bench Room)

4. Clean up

Use an appropriate solvent, such as acetone, with Clean Room wipes to clean the lid and bowl

of the spin coater completely

Put the waste wipes in a separate small garbage bag (located on the bottom level of the shelf)

Return the spin coater to its original location

Wipe up the surface of the bench completely with Clean Room wipe (use solvent if necessary)

Seal the small garbage bag and put it into the standard garbage can

Completely clean and rinse the nanoparticle Petri dishes at the organic wet bench

Take the Petri dishes to the glassware oven for drying

Return the dried Petri dishes to their storage location, a labeled and separate box on the shelf

in the Organic Bench Room

62



D.5 Forms

Spill Record

Who was involved? When did it happen? Where did it happen? Why did it happen? How it was cleaned up?

63



4D LABS Clean Room

Approval of New Chemicals

user information name

telephone ( ) email

supervisor information

name

telephone ( ) email

chemical information

chemical name

manufacturer

MSDS

storage location

container type/size

physical state (gas, liquid, or solid) physical properties (corrosive, combustible, flammable, etc.)

purpose (provide a brief explanation)

chemical application/conditions

tool / equipment name

process

introduction date estimated end date

waste produced

by-products produced

chemical handling procedures

safety instructions (include details on protective materials required)

waste control

emergency protocol

office use only

approved by (name, title)

date

comments or restrictions

64



Appendix E: Evacuation Routes

Red arrows: Primary evacuation pathway.

Blue arrows: Alternative evacuation pathway in the event that the primary evacuation pathway is obstruct-

ed.

65



Appendix F – Glove Selection Table

66



67



Appendix G – Hazard Identification

The following documents outline hazards associated with process equipment and tooling within the 4D

LABS Nanofabrication Facility at Simon Fraser University.

68



Analytical Surface Analysis Instrument (Kratos XPS/SIMS)

Safety Information

1. Mechanical

• Pinch hazard on load lock door.

• Only open the load lock when it is vented. Do not attempt to open the load lock when under full or

partial vacuum.

• Rotating fans behind the main instrument panel.

• Rotating motors/turbines on vacuum pumps and water pumps.

• Fans, motors, and turbines should be turned off during instrument servicing.

2. Electrical

• The Kratos Analytical instrument has power racks supplying 230VAC , 50 Amp,

60Hz.

• Dangerous voltages are present in the system. High voltages up to 15 kV are

present within the circuitry of the instruments.

• Before beginning any maintenance or service work disconnect the machine from all power sources

and follow lock-out/tag-out procedures.

3. Radiation

• Risk of ionizing radiation (X-ray) from Aluminum and Magnesium

sources.

• This instrument contains a magnetic lens that produces

electromagnetic fields.

• Alternating electromagnetic fields can have an unwanted, damaging effect on active and passive

health aids (e.g., pacemakers, and implants).

• Persons with active and passive health aids must not be in the proximity of these instruments.

69



4. Chemical

• The instrument uses nitrogen gas (N2) at 15 psi for venting vacuum chamber.

• Argon (Ar) gas at 7.5 psi is used in ion etching of samples.

• Helium (He) gas at 7.5 psi is used in ion-scattering spectroscopy.

• Inert gases can cause rapid suffocation.

• Compressed air at 80 psi is used to operate pneumatic valves.

5. Thermal

• X-ray sources and ion gun become hot during operation.

• Sample transfer mechanism can be cooled by liquid nitrogen to temperatures approaching -196◦C

or heated to 120◦C.

• Users must avoid touching the hot/cold area to avoid injury. Appropriate time must be allowed for

these parts to return to ambient temperature prior to servicing or handling.

6. Safety Interlocks

• Several safety interlocks are in place to protect users from harmful radiation and high voltages.

Never attempt to override any interlocks.

• Shields are in place to protect users from rotating parts.

70



Acid Wet Bench Safety Information

1. Electrical

• The system is supplied with 208 VAC, 60 Hz, 30 A, 4 wire power. Touching the power supply may

result in serious injury or death.

2. Ventilation

• When the photohelic exhaust monitor alarm sounds, the bench cannot be used. The alarm indi-

cates a low exhaust draw. It is dangerous to work with a low exhaust flow, since you may be ex-

posed to chemical vapours. In the event of an exhaust monitor alarm sounding, the user will notify

other personnel in the immediate area, all personnel will exit the room closing the door to isolate

the area, and will post a No Access sign to prevent re-entry. Then the user will notify staff of the

alarm situation so corrective steps may be taken. Clean Room staff will determine whether further

evacuation measures are warranted and will act accordingly.

3. Chemical

• The chemicals used at this bench are listed in the following table:

Chemical Name Composition

BOE HF/ NH4F

RCA-1 NH4OH/ H2O2

Oxide Strip HF solution

RCA-2 HCl/ H2O2

Nanostrip H2SO4/ H2O2

Au etch HNO3/HCl

Al etch (H3PO4)/HNO3/ CH3COOH

Cr etch H2SO4/HNO3/Ce(SO4)2

Ti etch HF/Surfactant/wetting

HF HF

HCl HCl

HNO3 HNO3

H2SO4 H2SO4

71



• HF is a poison and is corrosive in both its liquid and vapour phase. Exposure to hydrofluoric acid

can produce harmful health effects that may not be immediately apparent. The liquid and vapour

can burn skin, eyes, and the respiratory tract. These burns are extremely serious and may result in

tissue dam-age. For full information on HF hazards, refer to Section 6.6 of this Safety Manual.

• BOE consists of HF acid at high concentration levels (about 10X greater than the oxide strip in the

RCA clean).

• Hydrogen peroxide (H2O2) is a highly reactive oxygen species. Contact with combustibles may

cause fire. It decomposes yielding oxygen, which supports combustion of organic materials and

can cause overpressure if confined. It is corrosive to eyes, nose, throat, lungs and the gastrointes-

tinal tract.

• Sulfuric acid (H2SO4) is a strong and very dangerous acid. It causes eye and skin burns. It may also

cause severe digestive tract irritation with possible burns. It is a cancer hazard and may cause fetal

defects based upon animal studies. It may cause kidney damage. Sulfuric acid is hygroscopic and a

strong oxidizer. Contact with other material may cause a fire.

• Nitric acid (HNO3) is a strong acid. Heat, shock, friction, or contact with other materials may cause

fire or explosion. It is harmful if swallowed. Avoid breathing its vapour or dust. Concentrated ni-

tric acid dyes human skin yellow due to a reaction with the keratin.

• Hydrochloric acid (HCl) is a highly corrosive, strong mineral acid. Concentrated hydrochloric acid

(fuming hydrochloric acid) forms acidic mists. Both the mist and the solution have a corrosive ef-

fect on human tissue, with the potential to damage respiratory organs, eyes, skin, and intestines.

• Ammonium hydroxide (NH4OH) is a strong base. Contact with liquid or vapour causes severe

burns and possible irreversible eye damage (it is a lachrymator - a substance which increases the

flow of tears).

• The etchants contain strong acids, and may cause skin, eye and respiratory tract irritation.

72



Acid Waste Neutralization System (BOC Edwards)

Safety Information

1. Chemical

• The acid waste neutralization (AWN) system uses between 30 and 40% sodium hydroxide and be-

tween 30 and 50% sulfuric acid as the neutralizer for acid waste discharged from wet scrubber on

the thermal processing unit (TPU). Both of these neutralizing solutions are toxic and corrosive.

• Sulfuric acid (H2SO4) is a strong and very dangerous acid. It causes eye and skin burns. It may also

cause severe digestive tract irritation with possible burns. It is a cancer hazard and may cause fa-

tal defects based upon animal studies. It may also cause kidney damage. Sulfuric acid is hygro-

scopic and a strong oxidizer. Contact with other material may cause a fire.

• Sodium hydroxide (NaOH) is a strong caustic solution. This base is very hazardous in case of skin

contact (corrosive, irritant, permeator), eye contact (irritant, corrosive), or ingestion. It is also haz-

ardous in case of inhalation (lung sensitizer). Exposure to this liquid or a spray mist from this liq-

uid may produce tissue damage particularly to the mucous membranes of the eyes, mouth and

respiratory tract. Skin contact may produce burns. Inhalation of a spray mist from this liquid may

produce severe irritation of respiratory tract, characterized by coughing, choking, or shortness of

breath. Severe over-exposure can result in death. Inflammation of the eye is characterized by red-

ness, watering, and itching. Skin inflammation is characterized by itching, scaling, reddening, or

occasionally blistering.

73



Developer Wet Bench Safety Information

1. Electrical

• The system is supplied with 110 VAC, 60 Hz, 20 A power. Touching the power supply may result

in serious injury or death.

2. Ventilation



posed to chemical vapours. In the event of an exhaust monitor alarm sounding, the user will notify

other personnel in the immediate area, all personnel will exit the room, closing the door to isolate

the area, and post a No Access sign to prevent re-entry. Then the user will notify staff of the alarm

situation so corrective steps may be taken. Clean Room staff will determine whether further

evacuation measures are warranted and will act accordingly.

3. Chemical

• The chemicals used at this bench are listed in the following table:

Chemicals

AZ 300 MIF PPD-455

AZ Diluted 1:1 AZ MIR 703 Positive

Resist

AZ 917 MIF 950 PMMA, 7%, 3%,

2%

Micro Dev SU-8

Microchem Nano

PGMI 101

SU-8 Developer

(PGMEA)

MIBK/IPA 1:1

• TMAH solution is a strong base contained in many of the developers. The tetramethylammonium

ion can damage nerves and muscles, causing difficulties in breathing and possibly death in a short

period of time after exposure by contact, even with a small amount.

74



• MIBK/IPA is a flammable liquid. It can be irritating to the skin causing a burning sensation, red-

ness and/or swelling. The vapours may be irritating to the eyes, causing a burning sensation, red-

ness, swelling and/or blurred vision. The vapours may also be irritating to the respiratory system.

• PGMEA reacts with strong oxidants. The substance irritates the eyes and the respiratory tract. Ex-

posure at high level may result in central nervous system depression.

• Ethyl lactate solvents are contained in many resists. It is a flammable liquid and vapour. It is also

harmful if swallowed or inhaled and can affect the central nervous system. Ethyl lactate causes ir-

ritation to the skin, eyes and respiratory tract.

• Anisole is a flammable liquid found in the PMMA resist. Contact may cause skin irritation. The

vapour or mist is irritating to the eyes.

Prior to using any of the chemicals listed in the table above, refer to the MSDS sheets on-line or found

within the Clean Room for further details on the hazards of these chemicals and the required personal pro-

tective equipment. If you have any questions, consult the Nanofabrication Facility staff.

75



Direct Write Laser (Heidelberg 66FS) Safety Information

1. Electrical

• The DWL 66FS Mask Writer contains high voltage electronics running at 240V, 16A.

• Except when loading media, never push objects of any kind through openings in the equipment. Dan-

gerous voltage levels may be present. Conductive foreign objects could produce a short circuit result-

ing in a fire, electric shock, or permanent damage to the equipment.

2. Laser Radiation

• The DWL 66FS Mask Writer employs a Diode laser (~405nm) with a laser output power of 110 mW.

Laser light exhibits many characteristics that are different from those found in conventional light

sources. Safe use depends on awareness of these characteristics and proper treatment of the laser in-

strument. If a beam passes directly into the eye, serious damage may occur, including vision loss. In

addition, a beam remains coherent even when reflected, and it may cause eye damage even when

contacted indirectly from reflective surfaces.


• The DWL 66FS protects operators from exposure to moving parts and laser energy while operating the

equipment. All moving parts, lasers and their associated optics are enclosed within the laminar flow-

box. During operation, opening the flowbox window will automatically stop an exposure. Users should

never attempt to access the internal optics, electronics, or try to bypass the safety interlocks.

4. Servicing

The following does not apply to users.

• When conditions require the removal of the sidewalls from the flowbox (such as for servicing or trou-

bleshooting by trained service personnel), the accessible energy of the laser is of the class III b cate-

gory. In such a case, personnel should observe all normal electrical and mechanical safety precautions

as well as those applicable to lasers of this class.

76



• Both the laser head and power supplies contain electrical circuits operating at high voltages. If access

to the laser interior or any power supply is necessary, exercise extreme caution to avoid contact with

lethal high voltages.

77



Electron Beam Lithography (Raith e_LiNE) Safety Infor-

mation

1. Electrical

• The Raith e-LiNE system uses lethal high voltages up to 30 kV. Touching the power supply may result

in death or serious injury.

• Line voltage up to 240 VAC may be present in various locations within the system, even when the

system is turned off.

2. Laser Radiation

• The Raith e-LiNE uses a laser inside the main chamber. In order to avoid damaging your eyes, never

look into the laser beam.

3. X-ray Radiation

• The system produces X-rays when the high voltage is switched on. Under no mode of operation does

the measured X-ray radiation exceed 1 μSv/h at a distance of 0.1 m from any surface of the system.


• Several safety interlocks are in place to protect users from harmful radiation and high voltages. Never

attempt to override any interlocks.

• Never attempt to remove any covers from the instrument as this may also expose the user to harmful

voltages and/or radiation.

4. Hot Surface


• While performing a bake out of the column, its surface becomes hot. Never touch the column while

performing a bake out. Be careful not to place any flammable objects on the protection grid behind

the electron-optic column.

78



5. Servicing


• Most servicing is restricted to Raith service engineers. Be sure to completely read the manual before

performing any in-house servicing.

79



Ellipsometer (Horiba Jobin YVon) Safety Information

1. Electrical

UVISEL System

• The Electrical connections on the HR 460 Spectrometer are clustered in UVISEL system. The line volt-

age up to 240 VAC may be present in various locations within the system, even when the system is

turned off.

MM-16 System

• The MM-16 system uses 110 VAC power source

2. Servicing


Lamp replacement for UVISEL System

• The UVISEL system uses a 75 W Xe lamp. Only qualified person can perform the lamp replacement. It

includes potential danger of contact with high voltage power line and hot surface and requires ex-

treme caution.

• Be sure to completely read the manual and follow the safety protective procedure before performing

the lamp replacement.

• The lamp box contains high-pressure gas inside. If dropped and broken, it may scatter glass frag-

ments, causing personal injuries.

Lamp replacement for MM-16 System

• The system uses a 15 W Halogen lamp. Only qualified person can perform the lamp mounting or re-

placement. It includes potential danger of contact with high voltage power line and hot surface and

requires extreme caution.

• The Halogen lamp is hot (approximately 300 ºC) when the power is ON. To perform the lamp re-

placement only when the lamp is cooled down completely.

80



Furnace System (Tystar Mini Tytan) Safety Information

1. Electrical

• The incoming power to the furnace system is 480 VAC, 3 phase, 60 Hz.

• Dangerous voltages are present in this system. Before beginning any maintenance or service work,

properly disconnect the machine from all power sources.

2. Thermal

• The furnace system contains four process tubes. The highest operating temperature of each tube

is 1150C, which poses a risk for severe burns.

• The front door of each furnace tube is not allowed (by safety interlocks) to open when the system

is in a “Run” condition. However, take all necessary precautions when working with items re-

cently removed from any of the tubes as they may contain residual heat that can easily burn skin

upon contact.

3. Chemical

• Furnace tube#1 is for dry and wet growth of silicon dioxide. The process gases for this tube are ni-

trogen, hydrogen and oxygen.

• Furnace tube#2 is for N-type doping of semiconductors. The process chemicals for this tube are ni-

trogen gas and solid phosphorous diffusion sources.

• Furnace tube#3 is for growth of silicon nitride. The process gases for this tube are nitrogen, am-

monia and dichlorosilane.

• Furnace tube#4 is for growth of phosphorous doped poly-silicon. The process gases for this tube

are nitrogen, silane and phosphine.

• Ammonia and dichlorosilane are flammable, corrosive and toxic. Silane is pyrophoric. Phosphine

is very poisonous and flammable.

• Please refer to MSDS for full details on all the process gases and liquid chemicals noted above.

81




• Safety interlocks for temperature control, gas flow, gas leak detection, appropriate gas abatement,

and boat loading procedures (e.g., robotic loading of wafers and opening of the doors to each

tube) are designed specifically for each process tube.

82



Mask Laser Writer (Heidelberg µPG 101) Safety Information

1. Electrical

• The μPG 101 is fused for 10A. Electrical voltages of up to 230VAC and 120V DC are present within

the system when it is connected and turned on.

• Except when loading media, never push objects of any kind through openings in the equipment. Dan-

gerous voltage levels may be present. Conductive foreign objects could produce a short circuit result-

ing in a fire, electric shock, or permanent damage to the equipment.

2. Laser Radiation

• The μPG 101 Mask Writer employs a UV Diode laser (~375 nm) with a laser output power of 18 mW.

Laser light exhibits many characteristics that are different from those found in conventional light

sources. Safe use depends on awareness of these characteristics and proper treatment of the laser in-

strument. If a beam passes directly into the eye, serious damage may occur, including vision loss. In

addition, a beam remains coherent even when reflected, and it may cause eye damage even when

contacted indirectly from reflective surfaces.


• The μPG 101 protects operators from exposure to moving parts and laser energy while operating the

equipment. All moving parts, lasers and their associated optics are enclosed within the lithography

system. During operation, opening the cover lid will automatically stop an exposure. Users should

never attempt to access the internal optics, electronics, or try to bypass the safety interlocks.

4. Servicing


• When conditions require internal access to the lithography system (such as for servicing or trouble-

shooting by trained service personnel), the accessible energy of the laser is of the class 3B category. In

such a case, personnel should observe all normal electrical and mechanical safety precautions as well

as those applicable to lasers of this class.

83



• Both the laser head and power supplies contain electrical circuits operating at high voltages. If access

to the laser interior or any power supply is necessary, exercise extreme caution to avoid contact with

lethal high voltages.

84



Mask Aligner (Kasper) Safety Information

1. Electrical

• The Kasper MODEL 2001 Mask Aligner is powered at 120 VAC, 5 A. The system also contains a

500 Watt Mercury (Hg) lamp which is supplied with 120 VAC, 4 A.

2. UV Radiation

• The high intensity energy produced by mercury arc lamp can cause several major hazards to per-

sonnel.

• The light emanating from the light source can burn the eyes. Do not look into the beam of the UV

lamp. Do not look at the mask area during exposure.

• A few seconds of exposure to the UV light can cause UV skin burns or burns to the outer layers of

the eye.

3. Hot Surface

• When the UV lamp is on, the lamp heat sink and other metal pieces near the lamp get very hot.

These parts may cause burns if touched.


• Several safety interlocks are in place to protect users from harmful UV radiation and high voltages.


85



Mask Aligner (OAI) Safety Information

1. Electrical

• OAI Mask Aligner electrical ratings are 120VAC, 60Hz, 20A. The system also contains a 500 Watt

Mercury (Hg) lamp. The lamp operates at 67 VAC, 7.5 A.

2. UV Radiation


sonnel.


lamp. Do not look at the mask area during exposure.

• A few seconds of exposure to the UV light can cause UV skin burns or burns to the outer layers of

the eye.

3. Hot Surface

• When the UV lamp is on, the lamp heat sink and other metal pieces near the lamp get very hot.

These parts may cause burns if touched.


• Several safety interlocks are in place to protect users from harmful UV radiation and high voltages.


86



Organic Wet Bench Safety Information

1. Electrical

• The system is supplied with 208 VAC, 60 Hz, 30 A, 4 wire power. Touching the power supply may

result in serious injury or death.

• The sweepSONIK oltage electrical device. Proper pre-

cautions and procedures should be followed to avoid serious personal injury. Avoid all contact be-

tween liquids and the controller. Short circuits can result in electrical shock.

2. Ventilation



posed to chemical vapours.

3. Chemical

• The chemicals used at this bench are listed in table below:

Chemicals

Acetone

IPA

Ethylene Glycol (1SR)

AZ EBR

Microstripper 2001

AZ KWIK Strip Remover

Mircroposit remover 1165

• The most common hazard for those products is extreme flammability. They may ignite if exposed

to a spark or flame.

87



• Acetone is the most dangerous solvent at this bench. It is extremely flammable and the vapour

may cause a flash fire. It is harmful if swallowed or inhaled. Acetone causes irritation to skin, eyes

and respiratory tract. It also can affect the central nervous system.

Prior to using any of the chemicals listed in the table above, refer to the MSDS sheets on-line or found

within the Clean Room for further details on the hazards of these chemicals and the required personal pro-

tective equipment. If you have any questions, consult the Nanofabrication Facility staff.

88



PECVD (Nexx Cirrus 150) Safety Information

1. Electrical

• High voltages of up to 5000 V are generated by and located in the microwave power supply. These

voltages are also located in high voltage lines and in the magnetron head. Only authorized trained

personnel may work on the high voltage power supply. Touching the power supply may result in

serious injury or death.

• The system is supplied with 208 VAC, 3 phase, 60Hz power. Line voltages may be present in vari-

ous locations within the system, even when the system is turned off.

2. Chemical

• The system makes use of the following hazardous pressurized gases:

• Silane (SiH4): pyrophoric, may ignite on contact with air, may form explosive mixtures with air,

does not need a source of ignition, harmful if inhaled.

• Gas delivery is under pressure to the mass flow controller (MFC), which controls gas delivery within

the instrument. The MFC cabinets are vented and alarmed to provide reliable safeguards against

gas leakage at the instrument

• Hazardous gases may remain in the reactor chamber if an electrical failure occurs while gases are

flowing. The chamber should be evacuated before opening.

• Refer to the Toxic Gas Safety Information document provided by 4D LABS for further information.

3. Microwave Radiation

• The Microwave radiation falls into the frequency spectrum between 3 x 109 to 3 x 1011 Hz. The mi-

crowave generator provides adjustable power up to 1500W. Exposure to microwave radiation can

lead to localized skin heating and burns.

89



4. Mechanical

• Chamber has a heavy, hinged, pneumatically lifted top. Operators should be wary of pinch hazards

when near and/or operating the chamber top.


• Several safety interlocks are in place to protect users from harmful radiation, high voltages, and

hazardous gases. Never attempt to override any interlocks.

90



Probe Station (M150 and B1500 Parameter Analyzer)

Safety Information

1. Electrical

• Chuck bias voltage may cause injury. Remove chuck bias voltage before the changing wafer.

• The bias voltage through probe tip may be higher to 100 VDC and +/- 100 mA. Do not touch the

probe tip during measurement.

2. Servicing


• Service is restricted to Clean Room Engineering Staff only. The manual is available for reference for

staff prior to any service.

91



PVD 1 (Bestec PVD System) Safety Information

1. Electrical

• High voltages of up to 10 kV are generated by and located in the electron beam high voltage

power supply. These voltages are also located in high voltage lines, the filament power supply and

in the electron beam source. Only authorized trained personnel may work on the high voltage

power supply. Touching the power supply may result in serious injury or death.

• The system is supplied with 480 VAC, 3 phase, 60Hz power. Line voltages may be present in vari-

ous locations within the system, even when the system is turned off.

2. Thermal

• The two thermal power supplies provide adjustable power up to 1000W each. Caution must be

exercised when handling, heating and cooling the thermal source filaments.

3. Radio Frequency (RF) Radiation

• Two RF generators provide adjustable power up to 600W each at 13.56 MHz. Exposure to high

levels of radio frequency radiation can lead to localized skin heating and burns.

4. Mechanical

• The system includes a long protruding load-lock transfer arm. Users should take care to not bump

into and misalign/damage the transfer arm and/or potentially hurt themselves.

• The chamber door is subject to compressive forces when the chamber is under vacuum. Users

should exercise caution when vacuum is drawn on the chamber.

92



PVD 2 (Lesker Thermal Evaporator) Safety Information

1. Electrical

• The system is supplied with 110 - 208 VAC, 3 phase, 60 Hz power. Line voltages may be present

in various locations within the system, even when the system is turned off.

2. Thermal

• The thermal power supply provides adjustable power up to 2000 W. Caution must be exercised

when handling, heating and cooling the filaments.

3. Mechanical

• Chamber has a heavy user- controlled motor- driven lid. Operators should be wary of pinch haz-

ards when near and/or operating the chamber lid.

• This chamber lid is under strong compressive force when the chamber is under vacuum. Users must

exercise caution when opening and closing the chamber lid to avoid any crushing hazard or uncon-

trolled movement of the lid.


• The system is manually operated and makes no use of any software/hardware safety interlocks.

Users must exercise caution when operating this system.

93



PVD 3 (Lesker PVD 75) Safety Information

1. Electrical

• High voltages of up to 10 kV are generated by and located in the electron beam high voltage power

supply. These voltages are also located in high voltage lines, the filament power supply and in the

electron beam source. Only authorized trained personnel may work on the high voltage power supply.

Touching the power supply may result in serious injury or death.

• The system is supplied with 208 VAC, 1 and 3 phase, 60 Hz power. Line voltages may be present in

various locations within the system, even when the system is turned off.

2. Thermal

• The thermal power supply provides adjustable power up to 2000W. Caution must be exercised when

handling, heating and cooling the thermal source filaments.

3. Radio Frequency (RF) Radiation

• The RF generator provides adjustable power up to 100W at 13.56 MHz. Exposure to high levels of

radio frequency radiation can lead to localized skin heating and burns.


• Several safety interlocks are in place to protect users from harmful radiation and high voltages. Never

attempt to override any interlocks.

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Rapid Thermal Process (ANNEALSYS As-One System) Safety

Information

1. Mechanical

• Pinch hazards are present when closing the chamber door.

• When you raise the chamber door, be sure it reaches the proper position or it may close without

warning.

2. Electrical

• Power for RTP is 220 V, 60 Hz, 79 amps.

• Dangerous voltages are present in the system. Before beginning any maintenance or service work,

appropriately disconnect the instrument from all power supplies and follow lock-out/tag-out pro-

cedures.

3. Thermal

• The operating temperature range for the RTP is from room temperature to 1250 °C.

• There are hazards within this instrument for severe burns. Substrate (e.g., silicon wafers) and

quartz windows may be at high temperatures. After a heating cycle, both the substrate and quartz

windows may still contain residual heat at a high temperature. Wait for a sufficient period of time

to allow the system to cool down prior to unloading the substrate.

4. Radiation

• There is a potential for eye damage from radiation emitted from the RTP. The lamps within the

RTP emit strong visible and infrared light during standard processes. Exposure to this light can

cause eye damage.

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5. Chemical

• The RTP uses argon, nitrogen and oxygen as process gases. Refer to the Material Safety Data

Sheets for further information regarding precautions to be taken when using these gases.


• The RTP has system safety interlocks to protect the operator from exposure to hot surfaces and ra-

diation hazards. Never attempt to override any interlocks.

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Reactive Ion Etchers (Chlorine-based and Fluorine-based)

Safety Information

1. Mechanical

• Pinch hazard on load lock door and chamber door.

• Only open the load lock or the reactor chamber when it is vented. Do not attempt to open load

lock when under full or partial vacuum.

2. Electrical

• The RIE1 (used for chlorine-based gases) and RIE2 (used for fluorine-based gases) both have pow-

er racks supplying 400V , 16A, 50Hz.

• Dangerous voltages are present in the system. Before beginning with any maintenance or service

work disconnect the machine from all power supplies and following lock-out/tag-out procedures

3. Radiation

• Both RIE systems use a 13.56 MHz, 600 W radio frequency generator.

• Alternating electromagnetic fields can have an unwanted, damaging effect on active and passive

health aids (e.g., pacemakers, and implants).

• Persons with active and passive health aids must not be present in the proximity of these instru-

ments.

4. Chemical

• RIE1 uses both chlorine (Cl2) and boron trichloride (BCl3) as process gas. Both gases are toxic

and/or cor-rosive. Please refer to the Toxic Gas Safety Information document and MSDSs for more

details. Gas delivery is under pressure to the Mass Flow Controller (MFC) on RIE1, which controls

gas flow within the instru-ment. MFC cabinets are vented and alarmed to provide reliable safe-

guards against gas leakage at the in-strument.

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• These gases are harmful if inhaled and cause eye and skin burns. Oxidizing gases vigorously ac-

celerate combustion.

• RIE2 uses halocarbon-14 (CF4), halocarbon-23 (CHF3) and sulfur hexafluoride (SF6) as process

gases. Those are non-flammable, non-corrosive, low toxicity and relatively inert gases. Gas delivery

is under pres-sure to the Mass Flow Controller (MFC) on RIE2, which controls gas flow within the

instrument. MFC cabinets are vented and alarmed to provide reliable safeguards against gas leak-

age at the instrument. Inert gases can cause rapid suffocation.

• Both RIEs use nitrogen, oxygen, and argon. These gases all have hazards as described in Section

7.4.


• Several safety interlocks are in place to protect users from harmful radiation and high voltages.


98



Robotic Processor Safety Information

(SSEC Model 3305 Robotic Coat/Bake/Chill/Expose Tool)

1. Electrical

• The M3300 uses high voltage (208 VAC) within several sub-systems to operate and thus contains

hazardous, dangerous electrical energy. The system also contains a 500 watt Mercury (Hg) lamp.

The lamp operates at 67 volts/7.5 amperes.

2. UV Radiation


sonnel.


lamp. A few seconds of exposure to the UV light can cause UV skin burns or burns to the outer

layers of the eye.


• Several safety interlocks are in place to protect users from hazard and to protect equipment from

damage. Never attempt to override any interlocks.

4. Chemical

• The system uses acid, solvents and other chemicals that may be corrosive and flammable. Only au-

thorized Clean Room Technicians should handle wet chemistry being provided to the M3300. The-

se technicians must use all appropriate PPE (personal protective equipment).

• Please refer to MSDS for full details on the chemicals used on this process tool.

99



5. Other

• System Hazards: Personnel using the M3300 should familiarize themselves with the content of

the system drawings. It illustrates the locations of hazards, safety interlocks, EMO button, utility

panel and chemical drain along with basic system features.

• High Pressure Hazards:

- Air, Nitrogen Pressure: The M3300 requires 60-100 psig of Clean Dry Air (CDA), and requires 50-

60 psig of Nitrogen. Those are high-pressure gases and dangerous. If a fitting blows, the airline (or

nitrogen line) could swing about which could cause severe personnel harm.

- Water Pressure: The M3305 utilizes 45-55 psig of water for the system. A blown fitting can lead

to a dangerous condition where the water line is spraying operators, and a loose waterline can

swing about which may cause severe injury.

6. Mechanical

• Chamber Door Hazard: No person’s hands should be in the chamber when chamber door is closed

as this may lead to personnel harm.

• Hazard from Robotic System: Be away from the robotic handler when the system is running. The

moving handler may cause serious injury.

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Thermal Processing Unit (BOC Edwards) Safety Information

1. Mechanical

• Do not attempt to open the doors to the thermal processing unit (TPU) when a process is running;

system interlocks will prevent normal operation of the device.

2. Electrical

• The TPU is powered by 120 VAC, 60 Hz, 20 amps.

• Before beginning any maintenance or service work, disconnect the machine from building power.

All maintenance work will be performed only by authorized Nanofabrication Facility staff members;

in addition to power disconnect procedures, staff will use lockout/tagout procedures before under-

taking any service on this tool

3. Thermal

• The TPU uses natural gas to burn the waste gases from process equipment. The operating tem-

perature of the TPU is between 400 C to 1150 C. These temperatures pose a severe risk for skin

burns. Allow for sufficient time to cool down the system prior to any maintenance. In addition, all

exterior doors to the TPU are to be kept closed during operation of this equipment to prevent ex-

posure to high heat.

4. Chemical

• The waste gas inlet to the TPU is fed from the exhaust pipelines of four different process tools.

Please refer to the Toxic Gas Safety Information document for further details on the appropriate

process gases and the systems in place for handling these gases.

• The waste gases coming into the TPU include silane (SiH4), phosphine/silane mixture (PH3/SiH4),

ammonia (NH3), dichlosilane (SiHCl3), phosphorus and by-products from these gases following their

respective processes.

• These gases and their by-products are flammable, corrosive and/or toxic.

101



• These gases are harmful if inhaled, and can cause eye and skin burns. Note that oxidizing gases

vigorously accelerate combustion of other materials.


• The TPU uses both system safety interlocks and process interlocks to protect the operator from ex-

posure to hot surfaces, toxic gases and their by-products, and acidic liquids. Never attempt to

override any interlocks.

102



Wet Scrubber for Chlorine Gas Exhaust (ABATECH RPM-12)

Safety Information

1. Electrical

• This Abatech unit is powered at 120 VAC, 10 Amps, 60 Hz.

2. Chemical

• Chlorine gas is delivered to the scrubber unit from the reactive ion etch process tool (RIE1) in the

Clean Room. Chlorine gas is classified as toxic; nitrogen purging of the scrubber unit is recom-

mended prior to servicing the unit. Refer to MSDS for full information on hazards and precautions

associated with both chlorine and nitrogen.

3. Thermal

• High temperatures of 260 degrees Fahrenheit may be present at this unit. Exercise caution when

working on or around this unit after it has been running.

4. Mechanical

• The scrubber uses a drive belt running on pulleys; there is a significant pinch/crush hazard present

when the unit is running.

103



Wire Bonder (K&S Model 4700) Safety Information

1. Electrical

• The Model 4700 Manual Wire Bonder operates on 120 VAC, 60Hz. The bonder is connected to

the AC wall outlet by a 3-wire power cable. The two main power leads (active and neutral) are

connected to the power switch.

• The Negative Electric Flame Off (N.E.F.O.) produces high voltage within the N.E.F.O. box, in the

electrode and on the high voltage cable. Do not touch the electrode or wire during bonding or

when manually firing the N.E.F.O. The system produces a spark between the N.E.F.O. electrode

and the wire, which can cause an electric shock if contacted during N.E.F.O. firing.

2. Mechanical

• Always keep your hands out of the working area while the Bonding Head is in operation.

• Never touch the heated workholders with your hands or with any material having a low melting

point.

104



X-Ray Diffractometer (Bruker and Rigaku Systems) Safety

Information

1. Equipment

• 4D LABS is equipped with two X-Ray Diffractometers (XRD). One is a Rigaku Rapid Axis system (XRD

1) and the other is a Bruker D8 Discover system (XRD 2).

• Always sign in with the log book located next to each piece of equipment. Be sure to record any

problems or irregularities with the equipment.

2. X-Ray Radiation

• Both XRD systems employ a strong X-ray source. Shielding and safety equipment guarantee that the

emitted radiation does not exceed 3.0 µSv/h during normal operation. X-ray radiation can be ex-

tremely dangerous with exposure leading to serious injury or death. A user should never try to access

the active beam or bypass any of the safety interlocks.

3. Electrical

• The Rigaku Rapid Axis XRD contains high voltage electronics running at 200 VAC, 50 Amps and 100

VAC, 15 Amps. In addition, inside the system voltages are generated up to 60 kV DC.

• The Bruker D8 Discover XRD contains high voltage electronics running at 208 VAC, 30 Amps. In addi-

tion, inside the system voltages are generated up to 60 kV DC.

• After turning off the system, high voltages are still present. Be sure that the system is discharged be-

fore performing any maintenance on the equipment.

• Except when loading media into the sample holders, never push objects of any kind through openings

in the equipment. Dangerous voltage levels may be present. Conductive foreign objects could produce

a short circuit resulting in a fire, electric shock, or permanent damage to the equipment.

105




• Safety interlocks and shields on the XRD systems protect operators from exposure to X-ray radiation

and moving parts while operating the equipment. All X-ray radiation sources and moving parts are lo-

cated within the system enclosures. During operation, opening the enclosure window will automati-

cally stop an experiment and turn off the X-ray beam. Users should never attempt to access the inter-

nal electronics or try to bypass the safety interlocks.

5. Emergency Stops

• The emergency stop buttons on the XRD systems (lower-right – XRD 1, lower-left – XRD 2) will imme-

diately shut down all power to the system, including to the X-ray radiation source. The emergency

stop button should only be used in case of emergency, not for normal equipment shut down.

Documents

4D LABS Nanofabrication Facility · 2013-08-29 · 4D LABS, Simon Fraser University 8888 University Drive, Burnaby, B.C. V5A 1S6 E [email protected] T 778.782.8084 F 778.782.3765