Photolithography Application Booklet - Entegris · Photolithography, or “photo”, processes are among the most technologically sophisticated manufacturing operations. To enable

photolithography

photolithography

Photolithography, or “photo”,

processes are among the most

technologically sophisticated

manufacturing operations. To

enable the science and engineering

that drives these developments,

semiconductor engineers and

technicians demand solutions that

enable their efforts to meet their

ITRS (International Technology

Roadmap for Semiconductors)

goals. Entegris’ materials science

and process engineering expertise

continues to develop products and

services that provide solutions to:

• transport wafers and reticles

• purify photochemicals

• protect optics

Entegris does. So you can.

photolithography

ENTEGRIS, INC. «» phoTolIThoGRaphy «» 1

table of contentsSection 1: About Entegris

Purify, Protect and Transport ..................................................... 2

Global Presence ........................................................................... 3

Enabling Innovation .................................................................... 4

Close to Our Customers .............................................................. 5

Photolithography Solutions ........................................................ 6

Section 2: Product/Solutions

LENS ENVIRONMENT PURITYVaporSorb™ CSP HVAC Chemical Filters ............................ 8

DUV Scanner Minienvironment Control ............................... 10

Aeronex® Gas Purification Systems ...................................... 12

MASK/RETICLE PROTECTIONMask Package Products .......................................................... 14

Reticle Pods ............................................................................. 16

Clarilite® Reticle Haze Prevention System .......................... 18

High-Capacity Reticle Haze Prevention Solutions .............. 21

PROCESS CONTROLLiquidLens™ UPW System ..................................................... 22

IntelliGen® Dispense Technology ......................................... 24

IntelliGen® Mini Photochemical Dispense System ............. 26

IntelliGen® HV Dispense System .......................................... 27

Impact® Point-of-Use Photochemical Filters ...................... 28

Optimizer® Multiuse Photochemical Filters........................ 30

Microgard™ Bulk Photochemical Filters ............................. 32

Entegris Analytical Services .................................................. 34

«» phoTolIThoGRaphy «» ENTEGRIS, INC. 2 ENTEGRIS, INC. «» phoTolIThoGRaphy «» 3

Entegris provides products and services for applications across key semiconductor processes to help chip makers solve manufacturing challenges, enhance yield and gain sustainable competitive advantage.

purify, protect and transport

bulk chemicalAs wafer sizes continue to increase and line widths shrink, purity requirements become more stringent and precise chemical blending becomes more critical. Whether it’s transport or storage, mixing or dispense, Entegris has solutions to meet bulk chemical handling needs.

CMpFrom filtration, liquid and slurry handling, Entegris products enable the CMP process.

wet etch and cleanUltrapure liquids and gases are purified, protected and transported with Entegris filters, purifiers, valves, fittings and sensing and control products.

wafer handlingEntegris provides wafer handling products to protect and transport prime wafers, wafers being processed, finished wafers, bare die and packaged devices. Products include wafer carriers, wafer shippers, mask and reticle carriers, bare die trays, horizontal wafer shippers, chip trays and film frame shippers.

photolithographyEntegris’ broad product line enables lithography processing with gas filters and diffusers, wafer and reticle handling, liquid filtration, purification and control.

With 2,200 employees worldwide, Entegris thrives on the challenge to meet our customers’ expectations through a global network of service, technology, manufacturing and applications support teams, all built upon a tradition of product and process innovation.

global presence

lab capabilitiesAnalytical Services Product Testing Material Science• Airborne molecular contamination • Performance testing • New material development

• Surface contamination • Particle testing • Material characterization

• Applications support • Electrostatic charge • Material selection

• Root-cause analysis • Vibration • Material incoming inspection

• Flow rate optimization • Applications support

• Applied statistics

• Safety and industry standardization

• DOT and UN regulations

• CE marking

Entegris 2009Number of Employees 2,200 worldwide

Industries Served Semiconductor and other high-technology industries

Stock listing ENTG on NASDAQ

Entegris Milestones1966: Founded as Fluoroware, Inc.

2000: Begins trading under the ENTG symbol on NASDAQ

2005: Merges with Mykrolis Corporation, a leading provider of liquid filtration and gas purification products and systems

2006: Expands manufacturing facility in Kulim, Malaysia

2007: Acquires Surmet Corporation’s high-purity semiconductor coatings business

2008: Acquires Poco Graphite, an industry leader in high-performance graphite and silicon carbide


The technology roadmaps to produce the next generation of semiconductor devices and microelectronics are presenting unprecedented technological challenges, as well as ever increasing pressure to improve yields and productivity. As the leading provider of contamination control products and services to the global semiconductor and microelectronics industry, Entegris is using a wide array of analytical and materials science expertise to develop comprehensive solutions for contamination issues in the fab.

enabling innovationDirect sales and local support gives us the opportunity to achieve customer intimacy.

Customer intimacy helps us better understand our customers’ needs through direct feedback and roadmap sharing.

By aligning our material science, engineering and R&D initiatives, we can develop indispensable contamination control solutions to solve our customers’ roadmap challenges.

close to our customers

Electronics that are smaller, faster, cheaper and more functional

Leveraging our core competencies of materials science

ITRS 2006 2008 2010 2012

DRAM 1/2 Pitch (nm) 70 59 45 36

Logic (Flash) 1/2 Pitch (nm) 78 (64) 59 (45) 45 (36) 36 (28)

Critical Defect (nm) 29 30 23 18

DRAM Wafer Handling PWP 30 20 12 7

Molecular Contaminants Wafer level Molecules Molecules Molecules

Critical Metal Ions (PPT) <0.5 <0.5 <0.5 <0.5

IndustryDRAM 1/2 Pitch (nm) 70 59 45 36

193 nm Immersion Lithography Double Patterning EUV

300 mm Wafer Processing 300 mm Prime 450 mm?

Entegris TechnologiesDRAM 1/2 Pitch (nm) 70 59 45 36

Liquid & Gas Filtration Continuous Improvement and Purification Filtration products: smaller pore size, higher flow, higher retention

Purification products: volatile organics, AMC, moisture, degasification

Wafer Handling 300 mm Prime product platforms 450 mm prototypes

Mask Handling Carriers to prevent reticle haze EUV mask carriers

Liquid Systems LiquidLens™ Multi scanner systems Subsystems Process monitoring

Industry

193 nm Immersion Lithography Double Patterning EUV

300 mm Wafer Processing 300 mm Prime 450 mm?

Entegris patents2005: 39 new U.S. patents

2006: 44 new U.S. patents




For over 40 years, Entegris has been at the forefront of providing comprehensive microcontamination control solutions – with products and services that surround key processes such as wet etch and clean, lithography, CMP, wafer and reticle handling.

photolithography solutions

Stocker

High ViscosityDispense System

Optimizer® STDEV and DI POU Filters

Impact® Plus Duoand Impact® 2 Duo

POU Filters

Extraction™ Chemical Air Filters

for Track

Extraction™ Chemical Air Filters

for HVAC

GateKeeper®Gas Purifiers

GateKeeper®Gas Purifiers

QuickChange® ATM Filters

Wafergard®Gas Filters

Valves and Fittings

Spectra™ FOUP

Reticle SMIF Pod

LiquidLens™ UPWPurification System

Chemical Air Filter for

Track Coater Cup

Valves andFittings

Chemical Air FilterHousing for Scanner

Aeronex® Gas PurificationSystem for Optics

Chemical Air Samplingat Housing Inlet,

Interstack or Outlet

pHasor® X Heat Exchanger

IntelliGen® MiniPhotochemical Dispense System

pHasor® XHeat Exchanger

Provide air free of airborne molecular contaminants

(AMC) to Track

Protect andtransport wafers

Use lesschemistry

Provide air free of AMC to ambient clean room space

Protect critical opticallithographic lens

Clarilite® Reticle HazePrevention System

Provide air free of AMC to exposure tool

(stepper/scanner), RSPX and/or stocker

Protect and transport from maskshop to stocker and stepper

Remove particles andpolymeric contaminants

Control and assure integrityof immersion lithography

fluid medium

Photolithography Solutions

The following pages highlight products designed to solve your

fab challenges by providing best-in-class purification, materials

management and process control solutions.>>>

Challenge

lens Environment purity

Mask/Reticle protection process Control

Vapo

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VAC

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P-32

Aero

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XCDA

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stem

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Retic

le P

ods

and

Mas

k Pa

cks

Clar

ilite

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yste

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(imm

ersi

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Inte

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ini

Inte

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V

Impa

ct F

ilter

s

Opt

imiz

er F

ilter

s

Mic

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ilter

s

Anal

ytic

al S

ervi

ces

Customer Challenges

proc

ess

CD shift • • • • • • • •

Equi

pmen

t

Lens aberration - Scattering light • • •

Lens warranty • • • • •Proof of filter performance (Retention/Lifetime) • • • •

Filter lifetime optimization • • • • •

Reduce and optimize maintenance • • • • • • • • • • • •

Increase overall equipment effi ciency • • • • • • • • • • •

Maintain clean wafer environment • • • • • • • •

ope

rati

ons

Improve tool uptime • • • • • • • • • • • •

Maintain/control operating conditions • • • • • • • • • • •

Maintain clean mask environment • •

Improve mask lifetime • •

Mon

itorin

g an

d Da

ta C

olle

ctio

n Global AMC control • •

Filter lifetime policy • •

Diagnostics and trouble shooting • • •

Our expertise in material science and contamination control enables our customers to meet the demands of the market by reducing costs, enhancing yields, increasing productivity and improving process control.


lENS EN

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FEaTuRE aDvaNTaGE BENEFITHigh removal efficiency (>95%) • Better control of Airborne Molecular

Contaminants (AMC)• T-Topping avoidance, lens protection, less

maintenance, enable longer filter lifetime at tool level

Custom blends available • Meet a specific list of target AMCs • Secure each fab specific environment and particular process constraints

High surface area • Low pressure drop • Reduces energy requirements and cost

Can be installed in built-up front/rear access frame banks or side access housings or in ceiling-mounted fan units

• Field tested and proven • Easy to implement and install

Analysis and local service support, postmortem analysis

• Enables diagnostics and troubleshooting• Problem solving approach

• Optimize filter changeouts, preventive maintenance

Removes critical acids, bases and organics from the fab ambient to reduce contamination risk, for instance during scanner maintenance.

• Proprietary chemistry developed with scanner manufacturers and qualified by leading fabs to protect optics and process

• Customized chemical formulations maximize filter lifetime and reduce cost of operation

• On-site sampling and dedicated team of analytical experts for fab-specific filter adjustments if AMC needs change

Optimized for HVAC, high flow, make-up air, photolithobay Airborne Molecular Contamination control.

vaporSorb™ CSp hvaC Chemical Filters

performance• In-field and end-of-life filter validation

sampling for performance monitoring

• Only Entegris offers reliable performance monitoring and data driven adjustments when AMC needs changes.

2 4 6 8

frequently asked questionsHow do I choose the correct filter for my application?

Our recommendation is based on different parameters such as: AMC targeted, flow rate, maximum pressure drop acceptance, mechanical dimension and expected lifetime.

How do we determine filter lifetime?

Entegris provides on-site and postmortem analysis to optimize filter changeouts.

*Actual field data from a fab installation

performance continued

pressure Drop Single layer Filter

FFu Installation Single Filter Captures acids, Bases and organics*


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FEaTuRE aDvaNTaGE BENEFIT

Combination of polymeric media with activated carbon and media using smaller particles at high removal efficiency

• Better filter removal efficiency • Longer lifetime

• Better removal of airborne acids, bases and organics with larger capacity and better efficiency

Filters installed in series with Interstack port

• Utilization of filters to full capacity• Intelligent filter change-out plan

• Enables early warning before breakthrough.

• 33, 66 and 100 percent life control

Cabinet design • Compact design that maximizes the number of filters and media load

• Reduced footprint• Better efficiency

Adaptive cabinet performances

• Increase cabinet performances • Lower COO without investing in new

cabinets

• New generations filter medias designed for existing cabinets

Analysis and local service support

• Active support on AMC issues and trouble shooting

• Strong local presence and AMC analysis service

Duv Scanner Minienvironment Control

VaporSorb™ CSP-32 hybrid technology contains a unique combination of carbon and polymeric chemical media that removes acids, bases and condensable organics critical for the process and the lifetime of the optics.

• Removal of bases, acids and organic Airborne Molecular Contamination (AMC)

• Maintain AMC levels in scanner minienvironment to OEM specifications

• Protect scanner lens contamination and degradation

• Enhance yield by preventing process drift due to AMC contamination

Optimized for photolithography bay, DUV lithography, and 200/300 mm scanner platform.

performanceFilter lifetime estimate:

• Actual filter life is determined by measuring the fab’s chemical challenge concentration, downstream quality and testing of returned filters

• Our Entegris Analytical Services provides: • OEM certified analysis • On-site sampling

Filterset life performance chart (E1250 – CSP 32):

• Filter housing contains three chemical filters in series, one connected to the Interstack sampling port

• Serial filter configuration provides multiple levels of process and optic protection

• Interstack sampling ports provide the means for intelligent decision making: users can employ interstack to predict when to change filters before breakthrough can result in photoresist or optics contamination

hybrid Filter Test: Condensable organic performance

Target Species Challenge Concentration (typical fab)

Filter Life at 99% Removal Efficiency

NH3, Amines, NMP

10 ppbv >66 months

Acids/SO2 1ppbv >1,000 months

Condensable Organics

20 ppbv >36 months

frequently asked questionsHow do you control particle emission?Internal HEPA filters insure particle control.

Can I put the latest generations filters in my cabinet in order to improve performance and lifetime?Yes, new media release includes retrofit plans for existing cabinets.

How can I control the filter efficiency?Entegris provides outlet and interstack sampling in order to help our customer optimize filter life time and predictive change out plan.


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Fully automatic removal of gaseous contaminants to prevent deposits on optical surfaces

• Remove gaseous contaminants to sub-ppb levels in CDA (air) gas

• Deliver continuous XCDA® purge gas up to 20000 SLPM at low cost of ownership

• Offer improved safety – all regenerable purifiers in a single location

Optimized for 193 nm technology, dry and immersion lithography, single and multi-tool purification, facility purification.

aeronex® Gas purification Systems

Contaminants removal:

• Delivers better outlet specifications on airborne molecular contaminants to sub-ppt levels.

performance

FEaTuRE aDvaNTaGE BENEFITRemoval of gaseous contaminants in CDA to sub-ppt levels

• Prevents optical surfaces/lens from damage through deposits

• Reduced downtime• Higher throughput• Less maintenance

Self-regenerating, fully automatic system

• Guarantees constant flow of pure gas, no disturbance through manual interference

• Prevents downtime• Increases reliability• Low cost of ownership

Ambient temperature purification

• Lower energy consumption • Lower energy costs, resource conservation

Automatic or manual bypass – plus bypass purifier offered as option

• No interruption of process gas flow in case of power failure

• Protection of process• Reduction of rejects

Particle filtration included as a standard

• ISO class 1 (<10 particles/m3 at 0.1 µm, <2 particles/m3 at 0.2 µm)

• Defect reduction• Yield improvement

frequently asked questions

How can I be sure the gas downstream of the system is really pure?Entegris offers gas sampling on request. Entegris also offers a moisture sensor installed downstream of the system as an option.

What installation assistance is available?The purchase price includes assistance and training by an Entegris engineer during start-up.

Is there a limit as to how often the purifiers inside can be regenerated?Entegris has completed intensive testing and found no limitations as regards to repetition of regeneration cycles.

performance continued

Multi-bed design:

• Guarantees a continuous supply of pure gas so there is no need to send a purifier back for regeneration or to install a replacement purifier

A B

Online Bed: Purifier (A) is Purifying Process Gas

unpurified gas enters system

purified gas exits system

REGENINPUT PROC

INPROCOUT

VENT

A B

REGENINPUT PROC

INPROCOUT

VENT

SWAP

A B

Regenerating Bed: Purifier (B) is Being Regenerated

contaminants flushed out

vent line

hot regeneration gasses run backwards

through purifier

REGENINPUT PROC

INPROCOUT

VENT

A B

REGENINPUT PROC

INPROCOUT

VENT

SWAP

• The pre-programmed controller knows when to switch to the fresh purifier and when to regenerate the depleted purifier

New design to purify large volumes of purge gases:

• Available in 5000 SLPM to 20000 SLPM

• Each 5000 SLPM module uses 5 purifier beds to maintain a continuous flow: while one purification bed is in regeneration, the remaining beds are online


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Mask package products

Standard Mask Packages

Entegris offers a broad array of standard packages for safe handling during transport of masks and reticles with pellicles. Products offer the following features:

• Easy to open and close

• Minimal contact

• Easy removal

• Compact and stackable

• Designed to minimize particle contamination

FEaTuRE aDvaNTaGE BENEFITAdvanced reticle retainer system • Secure reticle contact – reduces reticle

movement during transport• Reduces particle generation – improves

ESD protection – better yields

No metal components • No reticle scratching, no metal contamination, less maintenance

• Reduces particle generation – improves ESD protection – better yields

Positive latching mechanism • Eliminates taping done to prevent accidental opening

• Improved mask security and overall productivity

Retractable latches • Allow complete automation compatibility • Improves productivity

Compact, stackable • Saves space • Improves productivity

Designed for reuse – can be cleaned and dried in automated tools

• Reduce operator involvement • Improves productivity

Gasket (optional) • Seals mask environment and eliminates taping

• Reduces contamination potential• Improves productivity

SMP625 Advanced Single Mask Pack For maximum reticle protection

The SMP625 is an advanced, next generation mask pack from Entegris, the world leader in mask packs and shipping boxes. The SMP625 provides the superior protection fabs need to stay competitive. It is fully automation compatible and will protect reticles from shock events and vibration seen in shipping applications.


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Reticle pods

RSP150 (DiRP) Advanced Reticle SMIF Pod Direct Replacement for SRP150 Pods

The RSP150 is an advanced, next generation pod designed as a drop-in replacement for Single Reticle Pod (SRP) applications. The pod addresses the requirements for improved reticle safety and protection against harmful contaminants. This simple, reliable design reduces costs, increases productivity and is qualified on all major stepper platforms.

FEaTuRE aDvaNTaGE BENEFITAdvanced reticle retainer system, i.e., no closed pockets

• Reduces particle generation and provides ESD path to ground

• Increases yields

ESD safe perimeter door seal • Reduces field-induced charge potential while providing a sealed environment

No metal components • No reticle scratching, no metal contamination, less maintenance

• Increases yields• Improves productivity

Designed to be cleaned and dried in industry standard automated tools

• Reduces operator involvement • Improves productivity

Simplified snap-fit construction • Reduces manufacturing and assembly errors

• Improves reliability

RSP150 Reticle SMIF Pod

The RSP150 is designed to significantly reduce particles, protect from ESD and ensure equipment interoperability. The goal of the RSP150 is give fabs the productivity gains they need to stay competitive.

FEaTuRE aDvaNTaGE BENEFITPrecise reticle positioning • Repeatability – faster setup • Improves tool uptime – improves

productivity

Tight dimensional tolerance • Reliable reticle access • Higher device yields – greater fab productivity

Simple latch mechanism • Less particle generation • Higher device yields – greater fab productivity

.1 µ breather filter • Effective barrier to contamination • Higher device yields – greater fab productivity

Designed for cleanability • Effective particle removal and reduced drying time

• Higher device yields – greater fab productivity

Materials of construction designed for low outgassing – dimensionally stable – metal-free design

• Fewer contaminants • Higher device yields – greater fab productivity

RSP200 Peek™ Dome Reticle SMIF Pod

The RSP200 is an advanced, next generation pod designed to safely ship reticles from the mask shop to the fab. The unit provides mask shops and reticle users with a standard mechanical interface (SMIF) for safely handling, storing and transporting 150 mm and 200 mm masks and reticles with or without pellicles.

The RSP PEEK Dome provides both static protection and ultraviolet light protection for masks and reticles, provides inert gas purge capability and has info pads to protect from improper placement on process equipment.

FEaTuRE aDvaNTaGE BENEFITMaterials of construction offer low outgassing, ESD path to ground

• Reduces particle generation – provides effective static dissipative protection

• Reduces defects • Increases yields

Surface Resistivity Ohms/sq

Competitor A Competitor A Competitor B Competitor B RSP1-1082 RSP1-1073 Sample 1 Sample 2 Sample 1 Sample 2 Dome Material Dome Material Material (ABS) Material (PEI)

14

12

10

8

6

4

2

0

Little to NoESD Protection

GoodESD Protection

SuperiorESD Protection

Total Outgassing µg

Competitor A Competitor B Competitor B RSP1-1082 RSP1-1073 Background Sample 1 Sample 1 Sample 2 Dome Material Dome Material Material (ABS) Material (PEI)

12

10

8

6

4

2

0


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FEaTuRE aDvaNTaGE BENEFITRSP3 Pod with Purge + Passive purifi er

• Purge functionality reduces moisture in the pod environment

• Removes contaminants (amines, sulfi tes, organics and moisture) and prevents particles from reaching the mask

• Bi-directional reticle protection: • From inside to outside: trapping potential

contaminants coming from either the mask itself or the reticle pod.

• From outside to inside: Protecting the reticle environment by eliminating/ reducing contaminants which may infi ltrate from outside the pod (i.e., the fab environment)

• Designed and optimized for automation

• Reduced microcontamination and reticle haze

• 4-5x improvement in reticle lifetime• Lower overall costs• Less handling damage• Easy replacement of purifi er during

regular PM schedule • Reliable equipment interface

ensures optimum automation throughput and interoperability

RSPX Manual purge station • Multiple capacity confi gurations: 10 pods, 20 pods, up to 150 pod potential

• High density, “portable” design• Integrated XCDA air plumbing• Designed with ergonomic shelf height

and easy pod access • Optional RFID capability

• Optimized location near scanner eliminates need to transfer pod back to stocker

• Flexible architecture to fi t varying fab layouts/requirements

• Saves cleanroom space• Simple connection and hook-up• Fast and effi cient pod loading

and unloading • Comprehensive component

identifi cation, monitoring and system event tracking

Low-fl ow XCDA Purge • 3 SLPM fl ow of XCDA is all that is required per pod to maintain the correct moisture levels

• Use of a critical orifi ce for purge interfaces allows less complex and costly plumbing to multiple locations

• Low cracking pressures on the inlet valves means no complex clamping features are required to fl ow gas into the pod

• Purging extends life of purifi er

• Lower upfront equipment costs – stocker shelves, controllers, plumbing and software

• Fewer maintenance issues over time• Less chance for particle issues

caused by high fl ow and moving parts

• No safety issues with the use of XCDA

• XCDA operating costs are 10x lower than nitrogen purifi ed to the same levels

High-capacity options • Scalable product family • Confi gurable to meet unique architecture and volume requirements of a given fab

The Clarilite system is a comprehensive haze prevention solution that isolates the reticle from the fab environment and continuously controls and purifi es the microenvironment around the reticle while in storage or during transport between stocker and lithography tool.

The Clarilite solution can dramatically increase meantime-between-cleans of reticles due to haze formation in 193 nm lithography processes.

• Users can expect a 4-5 times increase in meantime between cleanings for reticles, saving signifi cant costs and greatly increasing yields

• XCDA air provides a safe, simple alternative to nitrogen while reducing overall costs

Clarilite® Reticle haze prevention System

RSPX ManualPurge Station

RSP3 Reticle Pod

Aeronex XCDA System


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performance high-Capacity Reticle haze prevention Solutions

MRP3 Reticle PodCertified for use with the Clarilite system

Optimized for 193 nm technology, the MRP3 is the central element in the Clarilite Reticle haze Prevention System when a multiple reticle pod is required. The MRP3 reticle pod comes with integrated purifier and purge capability and can store up to six, 6-inch reticles. The pod is purged in the stocker and again near the scanner where the reticle will be used. The purifier works both ways to trap contaminants inside and outside the pod to prevent fab air from contacting the reticle.

For use with the MRP3, Entegris now offers a Multi-Reticle Purge Station (MRPx) analagous to the Clarilite RSPX for single reticle pods. The MRPx has a capacity of 8 MRP2/3 and is able to support up to 48 reticles in the current configuration.

Note: the MRP3 is offered as an MRP2 version without purifier.

FEaTuRE aDvaNTaGE BENEFITPurge port and integrated purifier

• Filters air in the pod environment, removing harmful contaminants and preventing particles from reaching the mask

• Reduced microcontamination and reticle haze

• 4-5x improvement in reticle lifetime• Significant cost savings• Lower overall costs• Less handling damage

Meets SEMI® standard E112 • Precise and predictable reticle access • Maximizes tool uptime and reduces interoperability errors/aborts

Plastic reticle contact surfaces • Reduces abrasion and the risk of damage due to mechanical shocks

• Improved yields

All metal external shell body • Creates a robust electrostatic shield around the reticles

• High level of protection from field-induced reticle damage

Clarilite Reticle Performance

Accu

mul

ated

Dos

age

Weeks

140,000

120,000

100,000

80,000

60,000

40,000

20,000

01 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

No reticle haze found on any of the reticles during 25 weeks of usage

Reticle 6

Reticle 5

Reticle 4Reticle 3

Reticle 2

Reticle 1

Reticle 5

Reticle 6

Reticle 2

Reticle 3Reticle 4

Reticle 1

Clarilite Reticle Performance

Waf

ers

Proc

esse

d

Weeks Purged

80,000

70,000

60,000

50,000

40,000

30,000

20,000

10,000

01 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

No reticle haze found on any of the reticles during 25 weeks of usage

Reticle 6

Reticle 5

Reticle 3

Reticle 4 Reticle 2Reticle 1

Micro Bridge

Resulting defects on wafers may look like this.

Customer data showing accumulated

dosages with no haze defects found over

a 25-week period while using the Clarilite

reticle haze solution.

Customer data showing number of wafers

processed with no haze defects found over

25-week period while using the Clarilite

reticle haze solution.


pRoCESS Co

NTRo

l

The LiquidLens system purifies and controls fab water to meet the performance requirements for 193 nm immersion lithography.

The LiquidLens system improves water quality to compensate for normal, geographical and seasonal variability in ionic and particulate contamination.

• Provide purified water to immersion scanner

• Stabilize temperature, control pressure and provide programmed pressure output

• Compensate for any Fab DI water quality changes

Optimized for liquid immersion lithography and advanced 193 nm photolithography users.

liquidlens™ upW System

FEaTuRE aDvaNTaGE BENEFITpHasor® II fully PFA degassers • Ensure optimized degassed water

• Removes dissolved oxygen from water without adding TOC

• Eliminates microbubble defects

UV lamps and ion exchange purifiers

• Ensure ultra low TOC and metals, removed to below detection limits

• Break-down TOC and ensure retention to very low level

• Provide optimal optics life and image clarity

pHasor X PFA heat exchangers • Control water temperature to <0.01°C limit

• Provide optimzed heat transfer while preserving absolute purity

• Control refractive index to optimize image clarity

QuickChange® ATM 30 nm in Chemlock® housing

• Achieve maximum particle retention with the cleanest membrane available

• Ensure final water filtration

• Eliminate particle induced defects

Embedded metrology • Online measurement of TOC and all process control parameters

• Ensure all inlet water quality is maintained

Entegris controller software • Advanced process control by on time measurement of various parameters: temperatures, inlet/outlet pressures, TOC, DO and resistivity

• Ability to serve information via ethernet port

• Configurable alarms and 48 hours parameters trend data available

• Maintain and control process parameters

• SCADA PLC oversees system operation for process confidence

• Maintain all data events into history log for process investigation and optimization

frequently asked questionsWhy would I need the LiquidLens system?Fab DI water quality is not always constant. Seasonal variation and pressure and temperature spikes might affect the stability.

The LiquidLens will ensure constant and pure DI water supply to the immersion scanner based on inlet requirements.

performance

liquidlens purification performances liquidlens ToC performances

liquidlens Resistivity performances liquidlens ToX performances

House DI water condition

System outlet DI water condition

Average TOC (ppb)

2.245 0.433

Average Tox (ppb)

0.336 0.238

Resistivity 17.7 18.1

LiquidLens TOC Performances

0 200 400 600 800 1,000 1,200 1,400

3.0

2.5

2.0

1.5

1.0

0.5

0

TOC

(ppb

)

Time (min)

House DI Water

Purified Water

LiquidLens Resistivity Performances

0 200 400 600 800 1,000 1,200 1,400

18.2

18.1

18.0

17.9

17.8

17.7

17.6

Resi

stiv

ity (M

-Ohm

)

Time (min)

Purified Water

House DI Water

LiquidLens TOX Performances

0 200 400 600 800 1,000 1,200 1,400

0.4

0.3

0.2

0.1

0

TOX

(ppb

)

Time (min)

House DI Water

Purified Water


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IntelliGen® Dispense Technology

The fill chamber pushes a small amount of fluid and air through the vent port to eliminate any bubbles. Optional and automated.

Real-Time Pump StatusThe real-time status feature allows the user to monitor fluid movement and valve state (open or closed) in real time during the entire two-stage dispense process. The graphs you see here represent the live-action view of the real-time status page during particular segments of the dispense process. It is also possible to open and close the valves manually through this screen.

The system can dispense while the inlet valve is open to draw fluid into the inlet chamber.

READY

INLET OUTLET

ISOLATE BARRIER

PURGE

VENT

FILTRATION

INLET OUTLET

ISOLATE BARRIER

PURGE

VENT

A pressure profile is captured real time during each dispense cycle and can be viewed on the real-time status page. Pressure profiles for each dispense can be saved locally or to a factory database.

The dispense chamber is full of fluid and ready to dispense.

1 The external valve opens and fluid is pushed through the outlet and onto the wafer. Simultaneously during the dispense, the inlet valve can open and begin filling the inlet chamber.

2 At the programmed filtration rate, the filtered fluid is pushed into the dispense chamber.

3

4

A small amount of liquid is pushed internally out of the dispense chamber and back to the inlet source to ensure the dispense fluid contains no bubbles.

56

INLET OUTLET

ISOLATE BARRIER

PURGE

VENT

DISPENSE/FILL

INLET OUTLET

ISOLATE BARRIER

PURGE

VENT

PURGE

INLET OUTLET

ISOLATE BARRIER

PURGE

VENT

READY/FILL

INLET OUTLET

ISOLATE BARRIER

PURGE

VENT

VENT

Real-Time Pressure Profile20

15

10

5

0

-5

Pres

sure

(PSI

)

Time (seconds)

IntelliGen dispense technologies provide a measurable performance advantage to photochemical applications. The innovative two-stage technology, network connectivity and dispense confirmation capabilities have created a family of dispense systems that enable new opportunities in process performance. The IntelliGen Mini and HV dispense systems each incorporate Entegris’ best-in-class features tested extensively globally.


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IntelliGen® Mini photochemical Dispense System

FEaTuRE aDvaNTaGE BENEFITPatented two-stage technology with constant pressure filtration

• Separation of filtration rate from dispense rate

• Prevents microbubble formation and allows ultrafiltration of the most sensitive photochemicals

Compact, modular design • Perfect for in-field retrofits and easy in-field maintenance

• Dramatic size reduction from previous generation (>50% size reduction)

Closed-loop motor control provides smooth and highly repeatable dispense for low rates and volumes

• Significantly reduces resist amounts, enabling production use of low volume dispense recipe

• Reduces operating costs

Use of Impact Mini 10 nm and 20 nm filters

• Cleanest, most efficient filtration media available

• Reduces opportunities for nucleation sites that can lead to microbubble formation

IntelliGen Mini dispense system provides the industry’s best filtration and dispense solution.

• Network connectivity to monitor dispense performance through LAN or factory databases

• Dispense confirmation to prevent scrap events

• Compact, modular design for easy in-field retrofit and field maintenance

• Two-stage technology separates filtration rate from dispense rate to prevent microbubble formation and ensure ultrafiltration of even the most sensitive photochemicals

• Designed for use with Impact® family of photochemical filters and manifolds

IntelliGen® hv Dispense System

FEaTuRE aDvaNTaGE BENEFITPatented two-stage technology with constant pressure filtration

• Separation of filtration rate from dispense rate

• Prevents microbubble formation and allows ultrafiltration of the most sensitive photochemicals

Active software controls • Eliminates filtration settings • Prevents recipe-related errors

Network interface • Connects to LAN or Factory database • Enables remote access to system

Dispense confirmation • Ensures dispense accuracy • Prevents scrap events

Use of Impact HV filters with Connectology®

• Cleanest, most efficient filtration media available

• Rapid and easy filter changeout

• Reduces opportunities for nucleation sites that can lead to microbubble formation

• Improves tool uptime and reduces chemical exposure

next generation dispense system for Polyamide and high viscosity photoresists

• Network connectivity to monitor dispense performance through LAN or factory databases

• Dispense confirmation to prevent scrap events

• Two-stage technology separates filtration rate from dispense rate to prevent microbubble formation and ensure ultrafiltration of polyimides and highly viscous photochemicals

• Fits existing footprint


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Impact Mini performance Data

Impact® point-of-use (pou) photochemical Filters

FEaTuRE aDvaNTaGE BENEFITUPE (ultra high molecular weight polyethylene) membrane

• Chemically inert• Low extractables

• Removes hard and soft particles without disturbing the complex formulation of process chemistry

5 and 10 nm particle retention rated membranes

• Tightest rated membrane available • Superior removal of particles for the most demanding applications

Connectology design • Rapid filter change-out• Spill-proof seals photochemical

inside the capsule during change-out

• Improves tool uptime• Reduce chemical exposure to operators

Available as Duo (polyamide/UPE composite filtration membrane)

• Allows use of affinity retention as well as sieving

• Removal of polar materials coupled with the hard particle efficiency of UPE

performance

Effect of Impact Duo Filter on Bridge Defect Reduction in arF Resist

Designed for ultrafiltration of photochemicals, such as BARC, Resist and TARC materials.

• Remove hard particles and gels from photochemicals

• Compact design provides easy installation

• Low hold-up volume to minimize chemical waste and filter priming time

• Utilizes Entegris’ UPE (ultra high molecular weight polyethylene) membranes for chemical compatibility

• Available in asymmetric and symmetric membrane

• Designed for use with IntelliGen Dispense Systems and Impact Manifolds

asymmetric Membrane performance

num

ber

of B

otto

m B

ridge

Def

ects

1 2 3 4 5 6 7 8 9 10 11 12

ArF Resist: UPE 50 nmArF BARC: UPE 50 nm

12 Weeks

2 Weeks

8 Weeks

ArF Resist: UPE 50 nmArF BARC: UPE 10 nm

ArF Resist: Duo 10 nmArF BARC: UPE 10 nm


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Multiuse Point-of-Use Photochemical Filters and Manifolds

• Ideal for controlling particles in a wide variety of photochemicals, including: BARC, TARC, photoresist and solvents

• Available in sizes from lab-scale use to point-of-use applications

• Wide variety of membrane technologies available, including UPE and surface- modified UPE

optimizer® Multiuse photochemical Filters

FEaTuRE aDvaNTaGE BENEFITUPE (ultra high molecular weight polyethylene) membrane

• Chemically inert• Low extractables

• Compatibility with a wide range of photochemicals

Surface modified UPE (DEV and DI products)

• Instantly wets in aqueous chemistries • Quick startup in DI water and developer

Connectology (ST configuration) • Rapid filter change-out• Spill-proof seals photochemical inside

the capsule during change-out

• Improves tool uptime• Reduces chemical exposure

to operators

Available in multiple port configurations

• Compatible with many different tool configurations

• Flexible design allows use of a standard product across different tools

• Capability for chemical scale-up

Available in 10 nm and 20 nm retention ratings

• Tightest retention rating available • Superior removal of particles for the most demanding applications

performance

Optimizer® DI and DEV Filters8 mm Super Type Pillar® Fittings

Diff

eren

tial P

ress

ure

(bar

)

Flow Rate for 1 cP Fluid (L/min.)

GPM

0 2 4 6 8 10 12

0 0.5 1.0 1.5 2.0 2.5 3.0

1.2

1.0

0.8

0.6

0.4

0.2

0

16

14

12

10

8

6

4

2

0

Diff

eren

tial P

ress

ure

(PSI

D)

0.05 µm

0.1 µm

0.2 µm

UPE membrane: water or developer wets within ten seconds

optimizer DEv and DEv-l Filters 8 mm Super Type pillar® Fittings

PTFE membrane: resists instantaneous wetting

Optimizer DEV and DEV-L Filters½” Tube Connection Fitting

Diff

eren

tial P

ress

ure

(bar

)

Water Flow Rate (L/min.)

0 4 8 12 16 20

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0

15.0

12.0

9.0

6.0

3.0

0

Diff

eren

tial P

ress

ure

(PSI

D)

0.05 DEV

0.10 DEV

0.10 DEV-L

0.05 DEV-L

optimizer DEv and DEv-l Filters 8 mm Super Type pillar Fittings


pRoCESS Co

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UPe liquid filters for bulk photochemical applications

• Exceptional retention efficiency with a patented ultra-high molecular weight polyethylene (UPE) membrane

• Low surfactant binding, excellent wettability and superior downstream cleanliness

• Ideal for high-purity chemical and photochemical filtration

• Hydrophobic membrane does not require prewetting with solvent-based photochemicals

Microgard™ Bulk photochemical Filters

FEaTuRES aDvaNTaGE BENEFITUPE (ultra high molecular weight polyethylene) membrane

• Chemically inert• Low extractables• Superior downstream cleanliness• Excellent wettability

• Removes hard and soft particles without disturbing the complex formulation of process chemistry

• Fast startup

5 and10 nm particle retention rated membranes

• Tightest rated membrane available • Superior removal of particles for the most demanding applications

Microgard Plus 10” Filters

Diff

eren

tial P

ress

ure

(bar

)

Flow Rate (L/min.) —1 cPs @ 20°C (68°F)

GPM

0 20 40 60 80 100

0 4 8 12 16 20 24

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0

18

16

14

12

10

8

6

4

2

0

Diff

eren

tial P

ress

ure

(PSI

D)

0.05 µm

0.01 µm0.03 µm

0.02 µm

0.2 µm

0.1 µm


Diff

eren

tial P

ress

ure

(bar

)


GPM

0 20 40 60 80 100

0 4 8 12 16 20 24

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0

18

16

14

12

10

8

6

4

2

0

Diff

eren

tial P

ress

ure

(PSI

D)

0.05 µm

0.01 µm

0.02 µm

0.03 µm

0.2 µm

0.1 µm


Diff

eren

tial P

ress

ure

(bar

)


GPM

0 20 40 60 80 100

0 4 8 12 16 20 24

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0

18

16

14

12

10

8

6

4

2

0

Diff

eren

tial P

ress

ure

(PSI

D)

0.05 µm

0.2 µm

0.1 µm


Diff

eren

tial P

ress

ure

(bar

)


GPM

0 5 10 15 20 25

0 1 2 3 4 5 6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0

18

16

14

12

10

8

6

4

2

0

Diff

eren

tial P

ress

ure

(PSI

D)

0.03 µm

0.02 µm


pRoCESS Co

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FEaTuRE aDvaNTaGE BENEFIT

On-site service use impingers for cations (base) and anions (acids) and Tenax® for organics

• Easy implementation on site, customized support

• Optimization of airborne molecular control in the fab

Interstack filter sampling • Enables early warning before filter breakthrough

• 33, 66 and 100 percent life control

• Preventive maintenance• Filter lifetime optimization

OEM approved lab, 20+ years experience in the semiconductor industry

• Formatted reports in compliance with OEMs

• Data interpretation

• Secure lens protection

Postmortem filter analysis Reports: • Removal efficiency • Remaining capacity• Contaminants removed

• Filter lifetime optimization• Better understanding of the process

Measurement of low molecular weight silicon organic compounds

• Specific measurement of TMS, HMDSO and D3 levels in the photolithobay

• Secure lens protection

ISO 17025 accredited lab • Highest quality and competence standards

• Peace of mind for the customer, low failure rates, ease-of-use through trained operators

Entegris analytical Services

Air sampling and analysis

• ASML and Nikon approved lab

• Serving OEM requirements for lens and filter change compliance programs

• Trouble shooting for AMC process and environmental issues

• Assessment of filter performance on track, scanner and HVAC systems

• Baseline studies for new fabs and cleanrooms

Optimized for the detection of airborne molecular contaminants in air below 100 ppb, ambient and high pressure air analysis, photolithography applications, the validation and calibration of “online” or “continuous” monitors, and materials outgassing studies.

performance

frequently asked questionsAre the entegris labs approved by the scanner vendor serving OeM requirements for the lens compliance program?Yes, Entegris is working with the OEMs and reports ambient and filter outlet analysis of acid, base and organic compounds as per the scanner manufacturer definitions of organics.

Entegris can also perform analysis to calibrate on-line monitoring devices, or to solve specific contamination issues in the fab.

25-Jul-2006 + 16:31:31Operator: rcp

0.01 2.01 4.01 6.01 8.01 10.01 12.01 14.01 16.01 18.01 20.01 22.01 24.01Time0

100

%

0725r610 Scan EI+ TIC

5.39e9

1.37

5.09

4.91

3.22

2.02

3.84

5.57

8.02

5.637.17

6.47

10.38

9.628.55

10.5018.80

16.8712.44 20.64

(mainlib) Cyclopentasiloxane, decamethyl -10 40 70 100 130 160 190 220 250 280 310 340 370

0

50

100

28 45 59

73

154 193 223 251

267

323 339

355

O

Si

O

Si

O

Si

OSi

O

Si

Entegris®, QuickChange®, VaporSorb™, pHasor®, Chemlock®, Connectology®, XCDA®, Clarilite, LiquidLens™, Aeronex®, IntelliGen®, Impact®, Optimizer®, Microgard™ and Mykrolis® are trademarks of Entegris, Inc. Pillar® is a registered trademark of Nippon Pillar Packing Company, Ltd. PEEK™ is a trademark of Victrex PLC. SEMI® is a registered trademark of Semiconductor Equipment and Materials International. Tenax® is a registered trademark of Buchem BV.

North AmericA

massachusetts�Entegris,�Inc.�Corporate�Headquarters�129�Concord�Road��Billerica,�MA�01821�USA��Tel.�+1�978-436-6500��Fax�+1�978-436-6735

minnesotaEntegris,�Inc.��101�Peavey�Road��Chaska,�MN�55318�USA��Tel.�+1�952-556-3131��Fax�+1�952-556-1880

Customer Service Tel.�+1�952-556-4181�Tel.�800-394-4083��(toll-free�within��

North�America)Fax�+1�952-556-8022��Fax�800-763-5820��(toll-free�within��

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FranceCustomer Service Center for Southern, Western and Northern Europe Entegris�S.A.S.��Parc�Centr’�Alp�Ouest��196�rue�du�Rocher�de�Lorzier��38430�Moirans��France��Tel.�+33�(0)�4�76�35�73�50��Fax�+33�(0)�4�76�35�73�80

GermanyCustomer Service Centers for Eastern and Central Europe Entegris�GmbHHugo-Junkers-ring�5�Gebaude�107�Industriegebiet�Klotzsche�01109�Dresden�Germany�Tel.�+49�(0)�351-79597-0�Fax�+49�(0)�351-79597-499

israelEntegris�Israel�Limited�Izmargad�Street�12�Kiryat-Gat�Israel�Tel.�+972�(0)�73�221�00�00�Fax�+972�(0)�73�221�00�22

JAPAN

Nihon�Entegris�K.K.��Regional�Headquarters��Mita-Kokusai�Bldg.��4-28,�1-Chome�Mita�Minato-Ku��Tokyo,�Japan�108-0073��Tel.�+81�3-5442-9718��Fax�+81�3-5442-9738

Nihon�Entegris�K.K.��Shin-Osaka�Prime�Tower�Bldg.��1-1,�Nishinakajima��6-Chome�Yodogawa-Ku��Osaka,�Japan�532-0011��Tel.�+81�6-6390-0594��Fax�+81�6-6390-3110

Nihon�Entegris�K.K.��Hakataekihigashi�113�Bldg.��13-9�Hakataekihigashi��1-Chome�Hakata-Ku��Fukuoka,�Japan�812-0013��Tel.�+81�92-471-8133��Fax�+81�92-471-8134

ASiA/PAciFic

chinaEntegris�(Shanghai)�Microelectronics�Trading�Co.,�Ltd.��Unit�606-609,�Tower�1��German�Centre�No.�88,�Ke�Yuan�Road�Zhangjiang�Hi-Tech�Park�Shanghai�201203��P.R.�of�China�Tel.�+86�21�2898�6710��Fax�+86�21�5080�5598

Entegris�(Beijing)�Microelectronics�Trading�Co.,�Ltd.��Room�1105,�Zhaolin�Mansion��No.�15�Ronghua�Middle�Road��BDA,�Beijing�100176��P.R.�of�China��Tel.�+86�10�5107�8379��Tel.�+86�10�5107�8300��Fax�+86�10�5107�8326

ASiA/PAciFic

KoreaEntegris�Korea,�Ltd.�8F,�Seongok�B/D��4-1,�Sunae-dong��Bundang-gu,�Seongnam-city��Kyunggi-do,�Korea�463-825��Tel.�+82�31�738-5300��Fax�+82�31�738-5301

malaysiaEntegris�(Malaysia)�Sdn�Bhd�Unit�14�&�15,�Lower�Level�5��(Executive�Wing),�Hotel�Equatorial�No.�1�Jalan�Bukit�Jambul��11900�Bayan�Lepas,�Penang�MalaysiaTel.�+60-4-427-4200Fax�+60-4-641-3294

SingaporeEntegris�Singapore�Pte�Ltd.��31�Kaki�Bukit�Road�3��Techlink,�#06-08/11��Singapore�417818��Tel.�+65�6745-2422��Fax�+65�6745-4477

taiwanEntegris�Asia�LLC,�Taiwan�Branch��14F,�No.�120,�Sec.�2,��Gong�Dao�Wu�Road��Hsinchu�City�30072�Taiwan�R.O.C.��Tel.�+886-3-571-0178��Fax�+886-3-572-9520

Entegris�Asia�LLC,�Taiwan�Branch��14F-6,�No.�126,�Yung-Fu�Road��Taichung�40762�Taiwan�R.O.C.��Tel.�+886-4-2463-9939��Fax�+886-4-2463-9025

Entegris�Asia�LLC,�Taiwan�Branch��3F,�No.�322,�Chung-Cheng�Road��Hsinshih�Township��Tainan�County�74447��Taiwan�R.O.C.��Tel.�+886-6-589-6008��Fax�+886-6-501-3799

Region Telephone FaxNorth�America� 800-394-4083� 800-763-5820Germany� +49�(0)�351�795�97-0� +49�(0)�351�795�97-499France� +33�(0)�4�76�35�73�50� +33�(0)�4�76�35�73�80United�Kingdom� +33�476�357�354� +33�476�357�380Italy� +33�476�357�352� +33�476�357�380Israel� +972�(0)�73�221�00�00� +972�(0)�73�221�00�22Japan� +81�3-5442-9718� +81�3-5442-9738Malaysia� +60-4-427-4200� +60-4-641-3294Korea� +82-31�738-5300� +82-31�738-5302Taiwan� +886-3-571-0178� +886-3-572-9520Singapore� +65�6745-2422� +65�6745-4477China� +86�21�2898�6710� +86�21�5080�5598

entegris regional customer service centers

enTegRiS,inC.

Corporate Headquarters129 Concord RoadBillerica, MA 01821 USATel. +1 978-436-6500Fax +1 978-436-6735

www.entegris.com

©2009 Entegris, Inc.All rights reserved.9000-5626ENT-1209

Documents

Photolithography Application Booklet - Entegris · Photolithography, or “photo”, processes are among the most technologically sophisticated manufacturing operations. To enable