Electrodeposition Models

7/31/2019 Electrodeposition Models

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Model GalleryCopper Deposition In A Trenchh Model ID: 2112

ELECTRODEPOSITION: This model demonstrates the effect

of a moving boundary in the application of copper

electrodeposition on circuit boards. The model is time-

dependent and results clearly show that the mouth of the

trench narrows, due to the non-uniform deposition of the

copper.

This model demonstrates the use of moving meshes in the

application of copper electrodeposition on circuit boards. In

these environments, the presence of cavities or 'trenches'

are apparent.

The model makes use of the Tertiary, Nernst-Planck

interface for electrodeposition to keep track of the

deformation of the mesh. Furthermore, electrochemical

reaction kinetics through use of the Butler-Volmer equation

for copper deposition are freely entered at the boundaries.

The model is inherently time-dependent and results clearly

show that the mouth of the trench narrows, due to non-

uniform deposition of the copper. In addition, the simulation

shows a substantial variation in copper ion concentration

along the length of the trench. Such effects can be

detrimental to the quality of the deposition, create corrosion

possibilities, and lead to material waste.

> REQUEST FOR MODEL INFORMATION


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Secondary Current Distribution Model ID: 10188In A Zinc Electrowinning Cell

Electrolyte current density distribution for a cathode

displacement of +40 mm

This is a model of the secondary current distribution in a zinc

electrowinning cell.

The model investigates the impact on the current distribution

when changing the electrode alignment in a parametric

study. The geometry is in 2D..> REQUEST FOR MODEL INFORMATION

Electrode Growth Next To Model ID: 10212

An Insulator

Electrolyte potential (surface) and electrolyte currentdirection (arrows) at t=96 h.

This example shows how to model secondary current

distribution and electrode growth with a moving geometry.

To avoid numerical instabilities, a seed layer is introduced

in the initial geometry to obtain a right angle at the edge

between the growing electrode and the insulator.



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Decorative Plating Model ID: 10320

DECORATIVE ELECTROPLATING In this example, the anodeis planar and dissolves, while the cathode is a furniture fittingthat is to be decorated by the dissolved metal

Tutorial model of electroplating. The model uses secondary

current distribution with full Butler-Volmer kinetics for both

anode and cathode. The thickness of the deposited layer at

the cathode is computed as well as the pattern caused by

dissolution of the anode surface.


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Electrodeposition Models