The information contained herein is, as far as we are aware, true and accurate. However, no representations or warranties, either express or implied, whether of merchantable quality, fitness for any particular purpose or of any other nature are hereby made in respect of the information contained in this presentation or the product or products which are the subject of it. In providing this material, no license or other rights, whether express or implied, are given with respect to any existing or pending patent, patent application, trademarks, or other intellectual property right.

AZ® 50XT Photoresist

Thick Positive Novolak PhotoresistFor Plating & Etch Applications

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

2

AZ® 50XT Photoresist

Positive resist for developing plating and wafer bumping applications50 to 80 micron single coat capability. Up to 120µm FTdouble coat capability3 to 1 aspect ratio. Excellent sidewall profiles. Wide process latitudeInorganic developer recommendedCompatible with existing thick film processes

Copper studsAZ® 50XT at 75µm Film Thickness

Solder studs (SnPb)AZ® 50XT at 75µm Film Thickness

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

3

AZ® 50XT Spectral Response Curve

1.45

1.5

1.55

1.6

1.65

1.7

1.75

1.8

1.85

1.9

1.95

2

242

247

252

257

262

268

274

280

287

293

301

308

316

324

333

342

352

362

373

385

397

410

424

439

455

472

491

Wavelength

Inde

x of

Ref

ract

ion

'n'

0

0.02

0.04

0.06

0.08

0.1

0.12

Extic

tion

Coe

ffici

ent '

k'

nk

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

4

2400 mJ 2600 mJ2500 mJ 2700 mJ 2800 mJ

2900 mJ 3100 mJ3000 mJ 3200 mJ 3300 mJ

AZ® 50XT on CopperExpose on Ultratech-Saturn, 75µm FT, 100µm CH,

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

5

AZ® 50XT on Cu – Plating PerformanceExpose on Ultratech-Saturn, 75µm FT, 100µm CH,

2400 mJ 2600 mJ2500 mJ 2700 mJ 2800 mJ

2900 mJ 3100 mJ3000 mJ 3200 mJ 3300 mJ

Post Copper Plating and Strip

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

6

AZ® 50XT PhotoresistExposure Latitude on Si, 20µm Contact Holes, FT = 25µm

2100 mJ/cm2 2200 mJ/cm2 2300 mJ/cm2

2500 mJ/cm2

2400 mJ/cm2

2600 mJ/cm2 2700 mJ/cm2 2800 mJ/cm2

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

7

AZ® 50XT PhotoresistCopper Plating - ~20µm High Bumps

CD = 20µm CD = 30µm CD = 50µm