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19/11/2001
2001 ITRS
Factory Integration ITWG
Jeff Pettinato, Intel
29/11/2001
Agenda
1. Scope and Factory Drivers
2. Difficult Challenges
3. Need for Integrated Solutions
4. Key Technology Requirements
5. Solutions Being Driven by Technology Requirements
6. Summary
39/11/2001
Excellent Participation from Suppliers, IC Makers, Universities, and Research Institutes
Many International members have contributed to FI
Jim Ammenheuser (ISMT) Damon Genetti (Novellus) Kunio Oishi (Ebara)Bob Bachrach (AMAT) Randy Goodall (ISMT) Mikio Otani (Shinko)Eddy Bass (Intel) Dave Gross (AMD) Richard Oechsner (Fraunhofer)Dave Bloss (Intel) Larry Hannessy (IDC) Jeff Pettinato (Intel)Ray Bunkofske (IBM) Duane Howard (IBM) Dev Pillai (Intel)Chris Burkhart (Novellus) Michio Honma (NEC) Lisa Pivin (Intel)Al Chasey (ASU) Jim Irwin (Irwin Consulting) Joe Reiss (PRIA)Hugo Chang (Winbond) Mani Janakiram (Intel) Lance Rist (ISMT) Ivan Chou (Compaq) Carl Johnson (PRI) Claus Schneider (Fraunhofer)Eric Christianson (AMD) Melvin Jung (Intel) Doug Scott (PRIA)Blaine Crandell (TI) Giichi Inoue (Toshiba) Steve Seall (Intel)Klaus Eberhardt (M+W Zandar) Junji Iwasaki (Mitsubishi) Marlin Shopbell (AMD)Anne Eldar (Intel) Shoichi Kodama, (Toshiba) Court Skinner (SRC)John Ellis (SEMI-NA) Dave Miller (IBM) Arnold Steinman (ION Systems)Rick Filippuzzi (Asyst) Mitsui-san (Matsushita) Keisuke Tanimoto (Sharp)Len Foster (TI) Mori-san (Daifuku) Toshi Uchino (Trecenti)John Fowler (ASU) Rohan Nageswaran (Intel) Brad Van Eck (ISMT)Karl Gartland (IBM) Seiichi Nakazawa (F-RIC) Hiromi Yajima (Toshiba)Bruce Gehman (SEMI) John O’Reilly (ION Systems)
49/11/2001
2001 Factory Integration Scope IncludesWafer, Chip and Product Manufacturing
WaferMfg.
ChipMfg.
ProductMfg.
Dis
trib
uti
on
Si S
ub
str
ate
Mfg
.The Factory
• FEOL• BEOL
• Probe/Test• Singulation
• Packaging• Test
The Factory is driven by Cost and Productivity:Reduce factory capital and operating costs per functionEnable efficient high-volume production with operational models for
varying product mixes (high to low) and other business strategies Increase factory and equipment reuse, reliability, and overall efficiencyQuickly enable process technology shrinks and wafer size changes
New in 2001
59/11/2001
Factory Integration Requirements and Solutions are Expressed through 6 Functional Areas
ProcessEquipment
UI
Material Handling Systems Wafer and Reticle Carriers Automated storage systems Interbay & intrabay transport systems Personnel guided vehicles Internal Software & computers
Production Equipment Process and Metrology equipment Mainframe and process chambers Wafer Handling Robots, Load Ports Internal software & computers
Facilities Cleanroom, Labs, Central Utility Building Facilities Control and Monitoring Systems Power, Plumbing, HVAC, Utilities, Pipes, UPS Life safety systems, waste treatment
AMHSEqpt
(side view)
DB
DocumentManagement
MES
MCS
Network or Bus
DSSStation
Controllers
APC Scheduling +Dispatching
DB
Factory Information & Control Data and Control systems required to run the factory Decision support Process control Plan, Schedule, Dispatch Computers, databases, software outside equipment
Factory Operations Policies and procedures used to
plan, monitor and control production
Direct factory labor
Test Manufacturing Prober, Handler, and Test
Equipment Manufacturing processes to test
wafers and chips
69/11/2001
New Elements/Focus in the 2001 Factory Integration Chapter
New Factory Operations metrics as key targets for other factory functional areas to solve in an integrated fashion
1) Factory Cycle time, 2) multiple lots per carrier and single wafer processing, 3) labor efficiency, 4) time to money
Focus on e-Factory capabilities to solve Production Equipment Overall Equipment Efficiency (OEE) through
Use of Internet, process control, rich data sources, and standards
Refinement of Direct transport solutions for 300mm
Expanded facilities section with revised technology requirement and potential solutions
New Test section to address equipment & manufacturing
Introduction of a Fab factory Cost Model based on 300mm, 20k wspw, high volume factory (key focus to extend in 2002)
Discussion on 450mm wafer size timing and Mfg Paradigms
79/11/2001
2001 Difficult Challenges
Managing Complexity Quickly and effectively integrating
rapid changes in semiconductor technologies and market conditions
Factory Optimization Productivity increases are not
keeping pace with needs
Flexibility, Extendibility, Scalability Ability to quickly convert to new
semiconductor technologies while reusing equipment, facilities, and skills
Post CMOS Manufacturing Uncertainty Inability to predict factory
requirements associated with post CMOS novel devices
450mm Wafer Size Conversion Timing and manufacturing
paradigm for this wafer size conversion
< 65nm after 2007> 65nm through 2007
89/11/2001
Integrated Solutions are Essential to Meet NeedsIntegrated Solutions
Agile Manufacturing- Equipment Engineering
Systems - EES
- Single wafer control
- e-Diagnostics
Process Control- Fault Detection &
Classification
- Run to Run & Wafer to Wafer control
- Integrated Metrology
- Machine to machine matching
Material Handling- Direct Transport AMHS
- AMHS to support Send-Ahead, gating monitors, and very hot lots
- Integrated Sorters, Stockers, Metrology
Integrated Factory
Technology Requirements
New disruptive process technologies
157nm litho
High K gate stack
Low k dielectrics
Copper processing
+Operational Productivity &
Business drivers Decreased Factory Cycle
Time (QTAT) and time to market
Improved Equipment OEE
Reduction in non-product (I.e. test) wafer usage
More efficient direct labor
Faster factory conversion at technology nodes
Goal = Meet Factory Challenges and
Technology Requirements
99/11/2001
Key Factory Operations, Production Equipment, and Facilities Technology Requirements
YEAR TECHNOLOGY NODE
WAFER DIAMETER
2001 130 NM
300 MM
2002 115 NM
300 MM
2003 100 NM
300 MM
2004 90 NM
300 MM
2005 80 NM
300 MM
2006 70 NM
300 MM
2007 65 NM
300 MM
2010 45 NM
300 MM
2013 32 NM
450 MM
2016 22 NM
450 MM Factory cycle time per mask layer (non-hot lot for High Volume High Mix) (days)
1.2 1.2 1.2 1.1 1.1 1.1 1 0.9 0.95 0.8
Wafer layers/day/head count
55 55 55 61 61 61 67 73 81 89
Lots per carrier (lot) Multiple Multiple Multiple Multiple Multiple Multiple Multiple Multiple Multiple Multiple Groundbreaking to first tool move-in (months)
9 9 9 8 8 8 7 6 5.5 5
First tool move-in to first full loop wafer out (months)
4 3.5 3.5 3 3 2.5 2.5 2 1.5 1
Bottleneck production equipment OEE 75% 78% 80% 82% 84% 87% 88% 90% 91% 92%
Average production equipment OEE 55% 58% 60% 63% 65% 67% 70% 72% 74% 75%
% capital equipment reused from previous node
Limited reuse
>90% >90% >90% >90% >90% >90% >70% Limited
reuse >70%
Production Equipment Install as a % of capital cost
10% 8% 8% 6% 6% 6% 6% 6% 8% 6%
Pro
du
ctio
nE
qu
ipm
ent
Fac
tory
Op
erat
ion
sF
acil
itie
s
109/11/2001
Key Material Handling, Factory Info and Control Systems, and Test Mfg Technology Requirements
YEAR TECHNOLOGY NODE
WAFER DIAMETER
2001 130 NM
300 MM
2002 115 NM
300 MM
2003 100 NM
300 MM
2004 90 NM
300 MM
2005 80 NM
300 MM
2006 70 NM
300 MM
2007 65 NM
300 MM
2010 45 NM
300 MM
2013 32 NM
450 MM
2016 22 NM
450 MM
# of AMHS transport system types in a factory
2 2 2 Some 1 and
some 2 1 1 1 1 1 1
System throughput (moves/hour) - Interbay transport
1200
1300
1400
1500
- Intrabay transport 170 180 190 200
1625 1750 1875 2000 2000 2000
MTBF for mission critical applications (months)
>6 >7 >8 >8 >9 >9 >10 >12 >12 >24
Time to create FICS interface Standard (months)
<12 <12 <6 <6 <6 <6 <6 <6 <6 4
Lead time for software to conform to standards
>18 <9 <9 <6 <6 <6 <6 <4 <4 <4
1st Article Test Equipment integration time improvement from previous year
0% 0% 30% 20% 20% 10% 10% 10% 10% 10%
Fac
tory
In
foA
nd
Co
ntr
ol
Mat
eria
lH
and
lin
gT
est
Mfg
119/11/2001
Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality
Metric Potential Solution it is drivingHot-Lot and regular lot cycle time per mask layer (days)
a) Direct transport systems integrated with schedulers for tool to tool moves, b) Agile manufacturing leveraging internet technologies, c) Innovative carrier and wafer level control
Wafer Layers / Day / Headcount a) Fully automated material handling & data sys
Multiple lots per carrier a) Embedded controller standards
Groundbreaking to first tool move in
a) Standardized design concepts, b) Design tools including e-tools, d) More off-site fabrication
First tool move-in to first full loop out
a) Standard equipment interfaces to reduce integration time
Overall Equipment Efficiency (OEE)
a) Minimize MTTR by e-Diagnostics, b) Advanced Process Control, c) Equipment Engineering Systems, e) Optimized Wafer and Low movement
Capital Reuse from one node to the next
a) Common main-frame and chamber interfaces, b) High exchangeability of chamber modules / parts
Production Equipment Install & Qualification cost as a % of capital cost
a) Earlier involvement with new technology tool designers, b) Design for tool install emphasis, c) Standard / consistent equipment connections
129/11/2001
Under FloorFull DirectTransport
Central Stocker(Large Capacity)(High Throughput) Upper Ceiling
OHT
Branch
Direct Transport Concepts for Tool to Tool Delivery – Production Need date is 2005
Concept #1: Integrated Overhead Hoist Transport (OHT) systems
Concept #2: Integrated Overhead Hoist Transport (OHT) systems
Conveyorizedtransport
Back
139/11/2001
Agile Manufacturing Means… Quick turn around [*faster cycle] time for production
Quick turn around time without productivity deterioration No productivity reduction even if many lots production formed with few wafers
Quick capability to product, scale and technology change Quick ramp-up of equipment installation and product Assure high productivity even if low production volume
Which can be Realized by… Internet technologies for B2B, Factory to Factory, Internal
factory connectivity and communications Supply Chain Management (SCM) Integrated Planning, Scheduling, and Real Time Dispatching
Flexible Material Handling and Data Automation Systems Single Wafer Control and Tracking
Multiple lots/single wafer control in equipment module (group)
149/11/2001
Carrier and Wafer Level Control Concepts for Rapid Material Movement and Processing
Process Tools
Process Tools
Sto
cker
s
OH
T L
oop
SorterMetro
MetroTools
Stocker robot interfaces directly with Sorters and Metro equip
Concept #1: Sorter and Metrology linked with Stockers
Back
Concept #2: Connected Equipment Front End Modules for Rapid Wafer processing and Inspection
Wafer Staging
Carrier Staging
EquipmentSupplier A
EquipmentSupplier B
EquipmentSupplier C
159/11/2001
Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality
Metric Potential Solution it is drivingHot-Lot and regular lot cycle time per mask layer
a) Direct transport systems integrated with schedulers for tool to tool moves, b) Agile manufacturing leveraging internet technologies, c) Innovative carrier and wafer level control
Wafer Layers / Day / Headcount a) Fully automated material handling & data sys
Multiple lots per carrier a) Embedded controller standards
Groundbreaking to first tool move in
a) Standardized design concepts, b) Design tools including e-tools, d) More off-site fabrication
First tool move-in to first full loop out
a) Standard equipment interfaces to reduce integration time
Overall Equipment Efficiency (OEE)
a) Minimize MTTR by e-Diagnostics, b) Advanced Process Control, c) Equipment Engineering Systems, e) Optimized Wafer and Low movement
Capital Reuse from one node to the next
a) Common main-frame and chamber interfaces, b) High exchangeability of chamber modules / parts
Production Equipment Install & Qualification cost as a % of capital cost
a) Earlier involvement with new technology tool designers, b) Design for tool install emphasis, c) Standard / consistent equipment connections
169/11/2001
Back
Factory Information and Control Systems
FactoryNetwork
SECS-IIGEMHSMS
Utilization trackingstandard
Enhanced parallelI/O standards
Carrier mgtstandard
Process Job,Control Jobstandards
Wafer level tracking &control standards
CarrierID standard
Mainstream Computer Communications stds
ManufacturingExecutionSystems
DecisionSupportSystems
Productionequipment
ProcessControlstandards
User Interfaces
OtherSystems
Standard for dataformats, data access, and inter applicationinterfaces
APC, Fault Detection & Classification,Integrated metrology,EES, e-Diagnostics
Equip Eng I/F
-> Standards Exist-> Standards Are Under Development-> Standards Are Needed
-> Standards Exist-> Standards Are Under Development-> Standards Are Needed
Utility, fluids,exhaust, drains hook-upstandards
Facilities Systems
Rear of productionequipment
Fab levels
Maximummove-in size stds
Sub-fab standards
Raised floorheight standards
Wall interfacestandards
RearU/I
Maxweightstandard
Standards for facilities systems safety counter-measures
Materials supplycontainer standards
Standards for installpedestals, jigs/fixturefor alignment
Work accessstandards to eliminateErgo issues
Cleanroom NoiseCriteria standards
Vibration stds
Global ConstructionCodes
Facility electrostaticlevels stds
Sub-fab level
Cleanroom heightstandards
CleanroomTemperature& RH ranges
Environment/stds
Ceiling level
Continued Standardization is needed to Reduce Integration Time, Cost, and Complexity
Legend:
179/11/2001
Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality
Metric Potential Solution it is drivingHot-Lot and regular lot cycle time per mask layer
a) Direct transport systems integrated with schedulers for tool to tool moves, b) Agile manufacturing leveraging internet technologies, c) Innovative carrier and wafer level control
Wafer Layers / Day / Headcount a) Fully automated material handling & data sys
Multiple lots per carrier a) Embedded controller standards
Groundbreaking to first tool move in
a) Standardized design concepts, b) Design tools including e-tools, d) More off-site fabrication
First tool move-in to first full loop out
a) Standard equipment interfaces to reduce integration time
Capital Reuse from one node to the next
a) Common main-frame and chamber interfaces, b) High exchangeability of chamber modules / parts
Production Equipment Install & Qualification cost as a % of capital cost
a) Earlier involvement with new technology tool designers, b) Design for tool install emphasis, c) Standard / consistent equipment connections
Overall Equipment Efficiency (OEE)
a) Minimize MTTR by e-Diagnostics, b) Advanced Process Control, c) Equipment Engineering Systems, e) Optimized Wafer and Low movement
189/11/2001
ITRS and Adv. Process Control
ITRS Process Control discussion is divided into 3 basic high level Capabilities
Fault Detection and Classification• ITRS Problem: Prevent scrap or equipment damage
Run to Run Control (lot to lot, and wafer to wafer)
• ITRS Problem: Optimize performance to processing spec
Integrated Metrology• ITRS Problem: Reduce module level TPT + AMHS
moves
Fault Detection and Classification
ProcessEquipment
Step N
UI
ProcessEquipment
Step N
UI
Fast FDCModule
Host SystemFDC Signal / Data
FDC Control
Outside of Tool• Host determines actions based on type of fault
• Host issues control command
Inside the Tool• FDC Models defined / configured
• FDC host signals configured• FDC actions may be configured
EESEESEE
Interface
• Historical and Summary data storage and analysis
• Detailed wafer and chamber data tracked
External FDCModule
GEMInterface
DetailedHistorical Data
Run to Run Control
MetrologyEquipment
UI
MetrologyEquipment
UI
ProcessEquipment
UI
MetrologyEquipment
UIUI
MetrologyEquipment
Step N-1Step N+1Step N
UI
Feedback Control - Use post metrology feedback data to adjust processing for the next lot
Feed Forward Control - Use preprocess metrology data to adjust processing for that lot
Ru
n t
o R
un
Co
ntr
ol
GE
MGE
M
GE
M
Recipe Adjustment
Control
Parameterized recipes required
Metrology data collected via EE interface
Host SystemEquip
ControllerEquip
ControllerEquip
Controller
Factory Network
EE
EE
EE
EEDatabase
EES
Recipe Adjustment Models and Calculations
Recipe Recommendations
Detailed wafer and chamber data required
Modular apps with open interfaces
EE Network
EE Data to be used by any authorized app
Integrated Metrology
IntegratedProcess andMetro Equip.
UI
GE
M
Parameterized recipes required
Host System
EquipController
Factory Network
EE
Metrology data and detailed wafer and
chamber data collected via EE interface
Integrated MetrologyModule (not Bolt on)
EE Network
Recipe and Model
Selection and Download via
GEM Interface
EESEES Integrated GEM Interface for Process
and Metrology
Integrated EE Interface for Process and
Metrology
1
2 3
Back
199/11/2001
ManufacturingExecution System - MES
Equipment/AMHS
Within a Factory (E-Factory)
Factory to Factory (E-Factory)
Company to Company (E-Commerce)
Factory A
Company A
Factory B
Company BSuppliers
Equipment Engineering
System
e-diagnosticscapability
Process or MetrologyEquipment
(side view)
ControlSystem
Station Controller
AMHSEqpt
(side view)
Material ControlSystem - MCS
Eth
erne
t
EESEES
e-Manufacturing Hierarchy for Connectivity
firewall
Semiconductor industry must continue to rapidly leverage mainstream technologies to reduce cost/complexity/integration time
209/11/2001
Translating Material Handling, FICS, and Test Manufacturing Metrics to Reality
Metric Potential Solution it is driving
AMHS system throughput for interbay and intrabay
a) Fundamental capability that permits AMHS system to transport hot lots, gating send-aheads and hand carry
MTBF/MTTR for mission critical applications
a) Equipment Engineering Systems, b) E-Diagnostic and c) E-manufacturing capabilities
Time to create industry standards
a) Improved business processes to speed up standard cycle time, b) Use Internet for balloting/approval
Lead time for solutions to conform with standards
a) Supplier/IC Maker collaboration to develop standards and solutions in parallel, b) Automated test tools for systematic interface testing
1st Article Test Equipment integration time change from previous year
a) Standard interfaces for equipment control, b) Standards for test programs, c) Standard data formats for test results
219/11/2001
Summary of Key Potential Solutions
Material Handling using Direct Transport To improve factory cycle time and fab space efficiency
Agile Manufacturing Leveraging Internet capabilities E-Factory to delivery product more quickly (cycle time)
Equipment Engineering System (EES) including E-Diagnostics capabilities Improve Overall Equipment Efficiency, cycle time, & factory output
Advance Process Control (APC) Improve Overall Equipment Efficiency, cycle time, & factory output
Continued Need for Standards to reduce integration time, cost, and complexity Reduce integration time and complexity, enable pervasive
implementation of capabilities above at lower cost
229/11/2001
Some Key Messages1. Rapid changes in process technologies, business
requirements, market conditions, and accelerated ramps have made factories more complex and difficult to integrate
2. Future factories must be agile to meet rapid technology and business changes with cost effective solutions
3. Overall Equipment Efficiency must be drastically improved Equipment at each tech node must meet throughput and uptime metrics
Solutions to improve utilization must be developed and implemented
4. Standards have been effective in 300mm. Cycle time to create and deploy must be drastically reduced for the future
5. Integrated Solutions are essential to meet needs
6. e-Factory concepts are being developed to solve complexity, integration and OEE issues Leverages the internet and rich data sources to achieve pervasive process
control, fast lot cycle times, on-line equipment repair, and rapid lot delivery using factory wide scheduling and dispatching
239/11/2001
Backup Area
249/11/2001
Understanding & Managing Factory cost is a Key Focus for 2002+
(Fab Capital Cost Breakdown)
ProcessEquipment
UI
Material Handling Systems = 3% of Total Capital $81M for $2.7B factory Wafer and Reticle Carriers Carrier ID readers Automated storage systems Interbay & intrabay transport systems Personnel guided vehicles Software & computers within the equipment
Production Equipment = 80% of Total Capital $2,160M for $2.7B factory Process and Metrology equipment Mainframe and process chambers Wafer Handling Robots Load Ports Installation, but not qualification Software & computers within the equipment
Facilities = 15% of Total Capital $405M for $2.7B factory Cleanroom, Labs, Central Utility Building Facilities Control and Monitoring Systems Support buildings (Café, office, parking) Power, Plumbing, HVAC, Utilities, Pipes, UPS Life safety systems, waste treatment Includes site prep, but not land and off-site dev costs
AMHSEqpt
(side view)
AssumptionsTotal Capital Cost = $2.7BTotal Capacity = 40k wspm300mm wafer size130nm technology
DB
DocumentManagement
MES
MCS
Network or Bus
DSSStation
Controllers
APC Scheduling +Dispatching
DB
Factory Information & Control = 2% of Total Capital $54M for $2.7B factory Manufacturing execution systems Decision support systems Process Control systems Planning systems, Schedulers, Dispatching Material Control, document management systems Computers, databases, software outside equipment
Baseline Model from2001 Roadmap
259/11/2001
Factory Areas or Thrusts
FactoryOperations
MaterialHandling
Example: Manufacturing rules, production size, mix
Facilities
Examples: Building, cleanroom, utility systems, process fluid delivery
Examples: AMHS Transport, storage, ID Systems, interface standards
Factory Information and Control
SystemsExample: MES, Computers, Networks, AppsMCS, APC, etc
ProductionEquipment
Example: Equipment unit, real-time process control, interface standards, Embedded Control
Technology Requirements and Potential Solutions are expressed through these factory areas
ComplexityManagement
FactoryOptimization
Extendibility,Flexibility,Scalability
Dif
ficu
lt C
hal
len
ges
Reuse of building, production equipment, and factory information and control systems; Factory designs that support rapid process and technology changes/retrofits; Comprehend tighter ESH/Code requirements
Increased customer expectation to meet on time delivery; Increased urgency for improved factory effectiveness, High factory yield at startup; Reduce wafer and product cost; Satisfy all local regulations
Rapid changes to business needs & demands; Increasing process & product complexity; Larger wafers and carriers, Increased reliance on factory information & control systems
Factories Must be Better integrated to solve Difficult Challenges