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wet etch and clean
wet etch and clean
Wet Etch and Clean (WEC) processes
touch wafers more than any single
application in the semiconductor
fab. WEC processes modify and clean
the wafer surface with a critical
influence to meet the demanding
yield requirements of an effective
fab. These processes utilize the most
aggressive chemistries: strong acids,
oxidizers, solvents, high temperatures
and highly concentrated substances.
The process materials and parameters
must be controlled to levels other
industries cannot achieve in terms
of repeatability and consistency.
Entegris provides the solutions
to succeed under these extreme
conditions.
wet etch and clean
ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 1
table of contentsSection 1: About Entegris
Purify, Protect and Transport ..................................................... 2
Global Presence ........................................................................... 3
Enabling Innovation .................................................................... 4
Close to Our Customers .............................................................. 5
WEC Solutions ............................................................................. 6
Section 2: Product/Solutions
PURITYOverview ................................................................................... 8
Chemical Compatibility Chart ............................................... 9
Torrento® Filter Family .......................................................... 10
QuickChange® ATM and ATE Filters .................................... 12
QuickChange Plus 1500/3000 Filters .................................... 14
Intercept® Plus HPM Filters ................................................. 16
Guardian™ ECD Cartridge Filters ....................................... 18
Microgard™ Plus LE Cartridge Filters ................................. 20
Protego® IPA and LTX/HTX Purifiers ................................... 22
Wafergard® MAX In-line Teflon® Gas Filters ...................... 24
AMC Tool Top Filters .............................................................. 26
MATERIALS MANAGEMENTMicroenvironment Protection Solution ................................ 28
¾", 1" and 1¼" Integra® Valves ............................................. 30
CR4, CR8 and CH8 Manual and Pneumatic Valves.............. 32
Flaretek® 90° Sweep Elbows ................................................. 34
PrimeLock® Fittings .............................................................. 36
Microenvironment Transport Solutions ................................ 38
PROCESS CONTROLNT® Conductivity Sensor, Model 8800 and NT Conductivity Analyzer, Model 8850 ................................. 40
NT High-Temperature Flowmeter, Model 4401 ................... 42
NT Integrated Flow controller, Model 6510 and 6520 ......... 44
pHasor® X Heat Exchanger ................................................... 46
NT Pressure Transducers ....................................................... 48
Dymension® Manifolds ........................................................... 50 Entegris Analytical Services .................................................. 52
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 32
Entegris provides innovative materials science-enabled solutions for applications across key semiconductor processes to help chip makers solve manufacturing challenges, enhance yield and gain sustainable competitive advantage.
purify, protect and transport
bulk chemicalAs wafer sizes continue to increase and line widths shrink, purity requirements become more stringent and precise chemical blending becomes more critical. Whether it’s transport or storage, mixing or dispense, Entegris has solutions to meet bulk chemical handling needs.
chemical mechanical planarizationFrom filtration, liquid and slurry handling, Entegris products enable the CMP process.
wet etch and cleanUltrapure liquids and gases are purified, protected and transported with Entegris filters, purifiers, valves, fittings and sensing and control products.
wafer handlingEntegris provides wafer handling products to protect and transport prime wafers, wafers being processed, finished wafers, bare die and packaged devices. Products include wafer carriers, wafer shippers, mask and reticle carriers, bare die trays, horizontal wafer shippers, chip trays and film frame shippers.
photolithographyEntegris’ broad product line enables lithography processing with gas filters and diffusers, purifiers and purifier systems, wafer and reticle handling, liquid filtration, purification and control.
With 2,800 employees worldwide, Entegris thrives on the challenge to meet our customers’ expectations through a global network of service, technology, manufacturing and applications support teams, all built upon a tradition of product and process innovation.
global presence
lab capabilities
North America
Colorado Springs
San DiegoDecatur
FranklinBurlington
BillericaChaskaMinneapolis
Europe and Israel
Dresden
Moirans
Kiryat-Gat
Montpellier
Lyon
Asia and Japan
SingaporePenang
Kulim
Osaka
Tokyo
YonezawaSeongnam-si
Beijing
FukuokaShanghai
Tainan
TaoyuanHsinchu
Wonju-si
Analytical Services Product Testing Material Science• Airborne molecular contamination • Performance testing • New material development
• Surface contamination • Particle testing • Material characterization
• Applications support • Electrostatic charge • Material selection
• Root-cause analysis • Vibration • Material incoming inspection
• Flow rate optimization • Applications support
• Applied statistics
• Safety and industry standardization
• DOT and UN regulations
• CE marking
Entegris 2012Industries Served
Semiconductor, Compound Semi/LED, Data Storage, Flat Panel, PV Solar, Energy Storage, Life Sciences
Sales $716 million
Patents Holds 288 U.S. patents
and 568 patents in other countries
Number of Employees 2,800 worldwide
Stock listing ENTG on NASDAQ
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 54
The technology roadmaps to produce the next generation of semiconductor devices and microelectronics are presenting unprecedented technological challenges, as well as ever increasing pressure to improve yields and productivity. As the leading provider of contamination control products and services to the global semiconductor and microelectronics industry, Entegris is using a wide array of analytical and materials science expertise to develop comprehensive solutions to contamination issues in the fab.
enabling innovation
Electronics that are smaller, faster, cheaper and more functional
Leveraging our materials science expertise
ITRS 2010 2012 2014 2016
Node 32 22 14 10
DRAM 1/2 Pitch (nm) 45 32 25 20
Critical Particle Size (nm) 20 15 10 5
Critical Metal Ions (ppt) 1000 1000 100 TBD
Molecular Contaminants Surface Airborne Airborne Airborne
Industry
Lithography 193 nm Immersion Lithography EUV
Wafer Size 300 mm 450 mm
Entegris TechnologiesLiquid and Gas Filtration Continuous Improvement and Purification Filtration products: smaller pore size, higher flow, higher retention
Purification products: volatile organics, AMC, moisture
Wafer Handling Advanced 300 mm Microenvironment Control 450 mm prototypes
Mask Handling Carriers to prevent reticle haze EUV mask carriers
Fluid Handling Components for a wider range of process conditions, precise real-time sensing and control
Coatings New coating technologies for components used in next generation semiconductor processing
Direct sales and local support gives us the opportunity to achieve customer intimacy.
Customer intimacy helps us better understand our customers’ needs through direct feedback and roadmap sharing.
By aligning our material science, engineering and R&D initiatives, we can develop indispensable contamination control solutions to solve our customers’ roadmap challenges.
close to our customers
Application and Process�Knowledge
We Respond�Quickly with Prototypes
We Develop Relevant Final Solution
Relevant,Trusted,
TechnologyPartner
We Listen
Customer�views Entegris as solutions provider
Customer shares sensitive product
roadmap information
Customer enters� problem-solving�
relationship
Customer provides feedback
on prototype performance
Pilot Capability�at Most Sites
Expand Applications�Excellence
Direct Engagement�
by Engineering Teams
Faster New Product
Development
Entegris Milestones1966: Founded as Fluoroware, Inc.
2000: Begins trading under the ENTG symbol on NASDAQ
2005: Merges with Mykrolis Corporation, a leading provider of liquid filtration and gas purification products and systems
2006: Expands manufacturing facility in Kulim, Malaysia
2007: Acquires Surmet Corporation’s high-purity semiconductor coatings business
2008: Acquires Poco Graphite, an industry leader in high-performance graphite and silicon carbide
2009: Acquires PureLine Co., a fluid handling component manufacturer, in Kangwon-do, Korea
2011: Opens manufacturing facility in Hsinchu, Taiwan
2012: Opens the Advanced Technology Center, manufacturing for 450 mm and EUV, in Colorado Springs, CO
Acquires Entegris Precision Technology, a HDPE drum blowmolding facility, in Yangmei, Taiwan
Opens new facility to provide specialized silicon and diamond- like coatings in Lyon, France
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 76
Immersion/Batch Wafer Processing
Chemical delivery
aMC
Valve Manifold Box
Chemical Mixing System
Spray/Single Wafer Processing
For over 40 years, Entegris has been at the forefront of providing comprehensive microcontamination control solutions – with products and services that surround key processes such as wet etch and clean, lithography, CMP and wafer handling.
Our expertise in material science and contamination control enables our customers to meet the demands of the market by reducing costs, enhancing yields, increasing productivity, and improving process control.
wet etch and clean solutions
The following pages highlight 22 products designed to solve your fab challenges by providing best-in-class purification, materials management and process control solutions.>>>
Challenge
Purity Materials Management Process Control
Torr
ento
® 20
nm
& 1
5 nm
Liq
uid
Filte
rs
Quic
kCha
nge®
ATM
and
ATE
Filt
ers
Quic
kCha
nge
Plus
150
0/30
00 F
ilter
s
Inte
rcep
t® P
lus
HPM
Filt
ers
Guar
dian
™ EC
D Ca
rtrid
ge F
ilter
s
Mic
roga
rd™
Plus
LE
Cart
ridge
Filt
ers
Prot
ego®
IPA
& L
TX/H
TX P
urifi
ers
Waf
erga
rd®
MAX
In-l
ine
Teflo
n® G
as F
ilter
s
AMC
Tool
Top
Filt
ers
Spec
tra™
FOU
P
¾”,
1" a
nd 1
¼"
Inte
gra®
Val
ves
CR4/
CR8/
CH8
Man
ual &
Pne
umat
ic V
alve
s
Flar
etek
® 90
° Sw
eep
Elbo
ws
Prim
eLoc
k® F
ittin
gs
Proc
ess
Carr
iers
NT® 8
800
Noni
ntru
sive
Cond
uctiv
ity S
enso
r NT
885
0 Co
nduc
tivity
Ana
lyze
r
NT 4
401
High
-Tem
pera
ture
Flo
wm
eter
NT 6
510/
6520
Inte
grat
ed F
low
Con
trol
lers
pHas
or®
X He
at E
xcha
nger
NT
Pres
sure
Tra
nsdu
cers
Dym
ensio
n® M
anifo
lds
Anal
ytic
al S
ervi
ces
Customer Challenges
Proc
ess
Improve yield • • • • • • • • • • • • • • • •
Fast time-to-yield with new products • • • • • • • • • • • • •
Process flexibility • • • • • • • • •
Man
ufac
turin
g
Improve wafer throughput
• • • • • • • • • • • • •
Improve tool uptime • • • • • • • • • • • • •
Maintain and control operating conditions and process parameters
• • • • • • • • •
Maintain clean wafer environment • • • • • • • • • • • •
Equi
pmen
t Reduce calibration of sensors and equipment
• • •
Reduce scheduled and unscheduled maintenance
• • • • • • • • • • • • • • •
Cost
Chemicals and gases • • • • • • • • • • • •Filters • • • • • • • • •Energy (Electricity / Air) • • • • • • •Components • • • • •
ENTEGRIS, INC. «» WET ETCh aNd ClEaN «» 9
PUR
ITY
« » WET ETCh aNd ClEaN «» ENTEGRIS, INC.8
Good Compatiblity Possible : Usage is Application Specific Not Compatible
chemical compatibility guide
Developed from Mykrolis® microcontamination technologies, Entegris liquid contamination control solutions are specifically designed for filtration of chemicals used in data storage
processes and ensure higher flow rate, particle retention and longer lifetime, leading to higher productivity and lower cost of ownership.
liquid contamination control solutions
ChEMICal NaME Mic
roga
rd
Guar
dian
dE
V/Pl
us
Inte
rcep
t
Guar
dian
ECd
Fluo
roga
rd a
T
Qui
ckCh
ange
To
rren
to
Met
al Io
n Pu
rifie
r
ChEMICal dISTRIBUTION
Acetic Acid (glacial)
Ammonium Hydroxide
Hydrochloric Acid
Hydrogen Peroxide
Sulfuric Acid (96%)
Acetone
Ethyl Lactate Ethylene Glycol
Mineral Spirits
PGMEA (Propylene Glycol Monomethyl Ether Acetate)
Tetramethylammonium Hydroxide (TMAH) 25%
TMAH 2.5%
WaFER ClEaNING
DHF (Dilute Hydrofluoric Acid) SPM (Sulfuric Acid 96% + Hydrogen Peroxide @120°C) SC1 (@ 40-90°C) SC2 (@ 25-90°C) DI Water Rinse @ 20°C *1
DI Water Rinse @ 80°C *2
IPA (Isopropyl Alcohol) @ 20°C *3
ETChING
Silicon Etch (HF + Acetic Acid + HNO3)Buffered Oxyde Etch (HF + NH4F + H2O)
Nitride Etch (Phosphoric Acid 85% @120-160°C)
Aluminium Etch (H3PO4 + HNO3 + Acetic + H2O)
CU PlaTING
Copper Sulfate + Sulfuric AcidCitric Acid
Recommended product *1 Protego LTX *2 Protego HTX *3 Protego Plus IPA
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 1110
PUR
ITY
20 nm and 15 nm retention with ultra-high flow rate performance. The new standard for nondewetting Teflon®* filters.
• Torrento filters provide high-yield, rapid bath cleanup cycles, extended filter life, fast changeouts and cleanliness - all in a prewet package for ease-of-use.
• Torrento ATE/AT3 cartridges and disposable filters are designed for recirculation bath applications, while Torrento 1500/3000 disposable are useful for single wafer processing.
• Torrento 1500/3000 are only available in 15 nm retention with maximum operating temperature to 95°C.
Optimized for leading-edge recirculated bath processes like SPM, SC1, SC2, DHF, etc. in process technology nodes 45 nm.
FEaTURE adVaNTaGE BENEFITGround breaking new high-flow Teflon membrane technology
• 20 nm and 15 nm particle removal with highest retention efficiency
• Exceptional flow performance without compromising retention
• Highly uniform pore size distribution insures high retention of small particles and long life
• Minimized particle-related wafer defects through optimal bath cleanup
• Increased OEE through reduced process cycle time
• Lower COO and increased OEE through extended filter lifetime
New device construction with more surface area in each filter
• Lower flow resistance• Higher flow• Extended lifetime
• Lifetime exceeds closest competitor by 20 percent in SPM process chemistry
• Reduced overall maintenance and replacement costs related to wet bench pumps as the low filter resistance design reduces pump strokes—reducing wear and tear
Maintains industry proven and reliable nondewetting technology
• No risk related to membrane technology
• Maintains advantages of QuickChange technology
• Fast qualification and rapid ROI• Low COO and high OEE through
fast installation/qualification, stable performance, long life
Available in cartridge and disposable formats
• Maximize installation flexibility • Seamless installation in existing tools
Torrento Filter Family
performanceTorrento’s revolutionary membrane technology provides improved retention at exceptional flow rates.
• High-flux membrane for high-flow recirculating applications
• Advanced particle retention to 15 nm
• High cleanliness performance during startup and product use
3X nm
5X nm
6X nm
<2X nm
<1X nm
Critical Feature / Pitch Size
Critical particle size: single digit nm
Critical particle size: 16 nm
Critical particle size: 22.5 nm
Critical particle size: 31.8 nm
Critical particle size: 45 nm
HigherFlow Rate
Part
icle
Ret
entio
nH
ighe
r Next Generation Technology
Filter Performance Guide
0.000
0
0.125
0
0.187
5
0.250
0
0.312
5
0.375
0
1.000
0
0.000
0
0.125
0
0.187
5
0.250
0
0.312
5
0.375
0
1.000
0
41 m
m L
LS (a
.u.)
1.0
0.8
0.6
0.4
0.2
0
Torrento ATE 20 nm QuickChange ATE 30 nm
4036322824201612840
QuickChange 3000 0.03 µm Torrento 3000 15 nm
@ 0.088 µm particle by SP2
41 nm llS versus Filter Rating and Bath life Torrento Plus 3000 15 nm in SC1 (Nh4Oh/h2O2) on dNS SU 3100
Product
Torrento aTE 20 nm
Torrento aT3 15 nm
Torrento Plus aT3 15 nm
Application Recirculation, bulk, viscous chemistries
Single pass, recirculation, bulk Recirculation, viscous chemistries
Membrane material Advanced PTFE - modified Advanced PTFE - modified Advanced PTFE - modified
Support materials Standard PFA Standard PFA Improved PFA
Media area 2 m² 3 m² 3 m²
Filter footprint Standard cartridge and disposable
Standard cartridge and disposable
Standard disposable only
Flow rate 0.2 KgF/cm² 23 L/min 22 L/min 17 L/min
Temperature rating 180°C 180°C 180°C
Metal cleanliness options
<10 µg/device STD, <3 µg/device UCM
Cartridge <25 ug/device STD,Disposable <10 ug/device STD,
Cartridge <10 ug/device UCM,Disposable <3 ug/device UCM
<3 µg/device UCM
* For Industrial Use Only. Not for use in food, drug, cosmetic or medical devices manufacturing, processing or packaging operations.
Tailored by application needs
Proven performance
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 1312
PUR
ITY
FEaTURE adVaNTaGE BENEFIT
Nondewetting PTFE* membrane with prewet packaging
• Eliminates prewetting and flushing cycles
• High purity, ultra-clean, ready-to-use filter
• Consistent flow performance in outgassing chemistries
• Higher yields and longer life through consistent filter performance
• Increased tool time and decreased COO through longer filter life
• Decreased COO through reduced work/chemical consumption
High membrane surface area • ATE design incorporates 35% more membrane than ATM
• Lower flow resistance• Higher flow• Extended lifetime
• Minimized particle-related wafer defects through optimal bath cleanup
• Increased OEE through reduced process cycle time
• Lower COO and increases OEE through extended filter lifetime
• Reduced overall maintenance• Reduced replacement costs related to wet
bench pumps through reducing wear and tear
High retention • Smaller particle removal, 30 nm • Cleaner device, higher yield needed for advanced technology nodes
Industry proven and reliable nondewetting technology
• No risk related to membrane technology • Fast, risk-free qualification and rapid ROI
Low metal extractables • Reduction in qualification time, ensures ultra-clean processing, low risks of metallic contamination of wafer
• Higher yield and wafer throughput
QuickChange aTM and aTE Filters
QuickChange ATE chemical filters enable rapid nano-particle removal via low pressure drop and high chemical flow rates.
• High flow, long-life prewet filter that delivers yield enabling particle protection, ease-of-use and rapid changeouts
• Reliable nondewetting membrane technology
Optimized for aqueous low and high temperature applications like SC1, SC2, SPM, aggressive acids and bases.
performanceQuickChange does not lose performance due to dewetting.
• QuickChange nondewetting filters do not dewet
• Entegris’ nondewetting filter membrane delivers yield enabling performance by providing consistent retention and flow properties
Customer Evaluation: QuickChange ATM reduces wafer defects
• RCA cleaning station (SC1 and SC2) at a device maker
• QuickChange ATX 100 nm and ATM 50 nm were installed on both a SC1 and SC2 baths
• Graph indicates a significant reduction of defects on wafers together with an improved flow rate after the installation of a QuickChange ATM 50 nm
QuickChange ATX 100 nm QuickChange ATM 50 nm
Defe
ct n
umbe
r
defect Counting Improvement at RCa Cleaning Step Following The Installation of QuickChange aTM 50 nm
frequently asked questionsHow long does my filter remain wet?QuickChange filters stay wet even when exposed to air or outgassing chemicals. This assures stable performance and long life even in strongly out-gassing applications.
What are the membrane areas of QuickChange ATM and ATE?QuickChange ATE provides 35 percent more flow at 30 nm single pass retention when compared to the industry standard ATM configuration under equivalent pressure conditions.
average Pressure drop in SC2 at 80°C (due to drain and Refill Cycles of New Membranes
with and without QuickChange Modification)
* For Industrial Use Only. Not for use in food, drug, cosmetic or medical devices manufacturing, processing or packaging operations.
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 1514
PUR
ITY
Nondewetting membrane technology in a low-profile prewet disposable filter that delivers protection, ease-of-use, rapid change out and safety for smaller volume applications.
• Superior filtration efficiency and flow rate provided by a nondewetting pleated membrane
• Highest retention rating with capability down to 30 nm
• Unmatched purity and safety ideal for critical applications
Optimized for aggressive chemicals like SC1, SC2, SPM and all hot temperature chemicals.
QuickChange Plus 1500/3000 Filters
The QuickChange Plus is the next generation of the QuickChange 1500 and 3000 filters.
• QuickChange ATM membrane
• New membrane improves retention and flow rate
performance
FEaTURE adVaNTaGE BENEFITNondewetting PTFE* membrane filter prewet and packaged in high-purity DI water
• Eliminates prewetting and flushing cycles. Eliminates chemical usage while reducing system downtime during filter changeouts. Saves time, greatly increases equipment uptime
• Higher yields and increased overall equipment efficiency
• Increased OEE through reduced process cycle time
O-ring free design • High-purity connections avoid potential sources of contamination
• Minimized particle-related wafer defects through optimal bath temperature control
• Both fluid streams remain separate
Available in retention ratings of 30 nm, 50 nm and 100 nm
• Provides excellent small particle retention to ensure minimal particles remain on wafer surface
• Safe and ultra clean, higher yield, needed for advanced technology nodes
• Increase OEE through reduced particle contamination
Compact, easy-to-install design • Allows quick installation and minimizes downtime while limiting the handling of hazardous chemicals during installation and disposal
• Requires less space for changeout. Minimizes downtime and simplifies changeout.
frequently asked questionsWhat are the chemical compatibility recommendations?
QuickChange Plus disposable filters are recommended for use with aqueous-based chemicals at ambient temperatures (including H2SO4, H3PO4, HNO3, HF, HCl, BOE, NH4F, H2O2, TMAH, NH4OH, and ozonated water) and elevated temperature applications (including SC1, SC2, piranha etch, and metal etch).
What are the available retention ratings?
100 nm, 50 nm and 30 nm
What connection types are available?
Flaretek Super Pillar® Super type 300 Pillar
Liquid Flow Rate (L/min)
0 1 2 3 4 5 60
0 .1
0 .2
0 .3
0 .4
0 .5
0 .6
0
2
4
6
8
Diff
eren
tial P
ress
ure
(bar
)
Diff
eren
tial P
ress
ure
(PSI
)
200 nm
100 nm
50 nm
Liquid Flow Rate (L/min)
0 1 2 3 4 5 60
0 .1
0 .2
0 .3
0 .4
0 .5
0 .6
0
2
4
6
8
Diff
eren
tial P
ress
ure
(bar
)
Diff
eren
tial P
ress
ure
(PSI
)
30 nm
100 nm
50 nm
QuickChange 1500/3000
QuickChange Plus 1500/3000
30 nm NA 3.6
50 nm 3.2 4.9
100 nm 2.5 3.8
Retention Rating (LRV)
QuickChange 3000 disposable Filter (1/2” Fitting)
Liquid Flow Rate (L/min)
0 1 2 3 4 5 60
0 .1
0 .2
0 .3
0 .4
0 .5
0 .6
0
2
4
6
8
Diff
eren
tial P
ress
ure
(bar
)
Diff
eren
tial P
ress
ure
(PSI
)
30 nm 100 nm
50 nm
Liquid Flow Rate (L/min)
Diff
eren
tial P
ress
ure
(bar
)
Diff
eren
tial P
ress
ure
(PSI
)
QuickChange 3000 disposable Filters (Typical 8 mm and 3/8” Fitting)
QuickChange Plus 3000 disposable Filters (Typical 8 mm and 3/8” Fitting)
Note: QuickChange Plus 1500 and 3000 will replace QuickChange 1500 and 3000.
Flow Rate Improvement Up to 38%QuickChange Plus 3000 disposable Filter
(1/2” Fitting)
* For Industrial Use Only. Not for use in food, drug, cosmetic or medical devices manufacturing, processing or packaging operations.
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 1716
PUR
ITY
Highest flow hydrophilic UPE membranes with the greatest particle removal for submicron batch baths and single wafer tools.
Intercept is the most advanced UPE liquid microcontamination platform available from Entegris:
• Highest single pass retention
• Dual particle capture mechanism
• The fastest bath cleanup time
• Longest filter lifetime
• Lowest COO
Optimized for acid based process chemicals such as DHF, DHCl, BOE and critical DHF final processes.
Intercept Plus hPM Filters
• Intercept removes particles in typical DHF applications by an additional mechanism to sieving: Physisorption
• Particle retention below rated pore size is achieved, enhancing process capability
performance
Customer Evaluation
Intercept 200 nm vs. PTFE* filter 100 nm in DHF
• Intercept reaches much lower particle level in bath and reaches low particle levels immediately after bath changeoutsFEaTURE adVaNTaGE BENEFIT
Advanced membrane technology
• Dual particle capture can improve process performance and reduce on-wafer particle defects
• Higher yield and throughput through efficient nanoparticle removal
High flow rate • Reduced bath cleanup time • Increase wafer throughput and yield through faster bath cleanup
Hydrophilic membrane • No prewetting or flush-up required for rapid start-up
• Eliminates IPA prewet and the risk of chemistry interactions
• Increase tool up-time through fast filter installation/qualification
Universal filter design • One filter fits many applications• Recommended for batch or single
wafer tools• All polyethylene cartridge provides clean
drop-in replacement for existing filters
• Fast ROI through easy implementation
10 nm, 20 nm and 30 nm sieving retention ratings available
• Highest single pass retention at rated pore size
• Higher yield and throughput through efficient nanoparticle removal
by Nonsieving
by Sieving by CakePore
Pore
dual Particle Capture Technology = Process Insurance
0
10
20
30
40
50
60
70
80
Part
icle
s pe
r mL
(65–
100
nm)
10 per. Mov. Avg. (PTFE filter 100 nm)
10 per. Mov. Avg. (Intercept HP filter)
Comparison of Particle Counts in 0.46% hF(One Bath lifetime)
“Particle Control for Advanced Wet Process”, Parekh et al., European Semiconductor May 2004
* For Industrial Use Only. Not for use in food, drug, cosmetic or medical devices manufacturing, processing or packaging operations.
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 1918
PUR
ITY
Guardian ECD (Etch-Clean-Deposition) is constructed of hydrophilic, high-flow polysulfone membrane with high purity HDPE supports.
• high flow and bath recirculation performance
• excellent particle removal in single pass and recirculating applications
• retention range from 30 nm to 0.1 µm
• membrane is non-interactive with typical metal deposition additives
Ideal for dilute and low temperature acids and bases used in WEC processes. Highly effective in nickel & copper plating applications.
Guardian ECd Cartridge Filters
FEaTURE adVaNTaGE BENEFITAsymmetric membrane M Pleat design for more surface area
• High flow • Fast bath cleanup• Prefiltration layer included
• Higher throughput• Extended filter life time
Hydrophilic membrane • Eliminates microbubbles• Self wetting: no solvent for
prewetting or flushing
• Increaseed yield• Lower COO
Low particle shedding
Low extractable level
30 nm retention
• Improved chemistry cleanliness • Increased yield
Proprietary non-interactive polysulfone membrane
• Stable additives concentration over time
• Metal Plating specific: — Enhanced process consistency
performance
frequently asked questions
Asymmetric membraneMore stable flow/Longer life
Asymmetric membraneMore stable flow/Longer life
Larger pore size upstream
Smaller pore size downstream
Larger pore size upstream
Smaller pore size downstream
Larger pore size upstream
Smaller pore size downstream
Recirculation Time
0 hour 1 hour 2 hours 3 hours
CVS
Resu
lt (m
L/L)
Accelerator Suppressor Leveler
How does Guardian ECD help improve process performance for electrolytic deposition applications?• Enhanced additives concentration stability over
time due to low adsorption of plating additives by the membrane
• Improved process stability• Longer life time due to assymetric membrane
design
What are the wet etch and wet clean chemicals compatible with Guardia ECD?
Guardian ECD is recommended for dilute acids and bases like DHF, BOE and certain photoresist strip processes.
asymmetric Membrane More stable flow/longer life
Asymmetric PS membrane:
• longer life time
• more stable flow in high loading applications like copper plating and post CMP cleans
Inert surface modification:
• Concentrations of additives in Cu ECP processes do not change over time
Cleaned Guardian ECd 0.03µm
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 2120
PUR
ITY
Microgard Plus patented UPE membrane shows the highest retention efficiency of any membrane. It offers low surfactant binding and spontaneous wettability in solvents.
• High retention efficiency of up to 99.999% at rated particle size
• Removal of microbubbles and gels
• Low pressure drop
• Low leaching of ionic/metallic contamination from filter
Optimized for solvent filtration, filtration of photochemicals, photoresist stripping at temperatures below 60°C.
Microgard Plus lE Cartridge Filters
FEaTURE adVaNTaGE BENEFIT3 nm and 5 nm asymmetric UPE
High retention efficiency (≥99.9%)
• 3 nm retention for the tightest membrane technology available in the industry
• Asymmetric membrane increases flow and reduces pressure drop
• Reduce defects • Increase throughput
All-polyethylene construction special cleaning
• Entegris’ proprietary cleaning technology insures the lowest levels of organic and metal extractables
• Eliminate the potential for the filter to be a source of contamination to your process
Superior wettability with solvents • Eliminates prewetting • Provides more consistent filtration
• Stable performance• Reduces chemical usage while
reducing system downtime
performance
frequently asked questions
Why does Microgard Plus provide superior downstream cleanliness?
Microgard Plus filters are extensively cleaned during manufacturing and are entirely constructed from high-density and ultrahigh molecular weight polyethylene, providing them better initial cleanliness and lower extractables than filters constructed from polypropylene, polysulfone, polyethersulfone or nylon.
Why does Microgard Plus hold back gels more effectively than PTFE filters?
The string and node structure of PTFE allows gels to pass through easily. The sponge-like structure of UPE prevents gels from passing through the membrane and additionally provides higher loading capacity.
1.4
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18
16
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0 1 2 3 4 5 6 7
5 10 15 20 3025Typical Flow Rate (L/min) – 1 cP @ 20°C (68°F)
GPM
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Microgard Plus 10” Filters
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3 nm
Flow Rate (L/min) — 1 cP @ 20°C (68°F)
5 nm
10 nm
Microgard Plus lE 10” asymmetric UPE Filters
Pleated 0.05 µm PTFE filter
UPE 0.1 µm filter
10,000
1,000
100
10
12 3 4 5 6 87 9 10 11 12 13 1514 16 17 18 19 2120
Dispense Number
Part
icle
s/w
afer
>0.
15 µ
m
UPE vs. PTFE Membrane Particle Count Comparison
Filter Type
Tota
l Def
ects
20 nm 10 nm 5 nmAsymmetric
First run
Confirmation run
Total defectivity Comparison by Filter
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 2322
PUR
ITY
Protego Plus metal ion purifiers deliver ultimate protection from metal ion contamination in critical cleaning applications.
• Multi-metal ion removal in a single pass
• Available in a variety of purifier designs
• Protego IPA Purifiers are specially designed to remove metal ions for IPA Dryer process with 15 nm particle retention.
• Protego Plus LTX products are designed for low-temperature DI water applications from ambient to 60°C; while HTX products for critical application to 80°C.
Optimized for solvent filtration, filtration of photochemicals, photoresist stripping at temperatures below 60°C.
Protego IPa and lTX/hTX Purifiers
FEaTURE adVaNTaGE BENEFITPurifier technology with PES and UPE membrane filtration
• Single device for ease of use • Metal purification and >99.9% particle retention efficiency
Exceptional coverage of ion exchange groups
• High multi-element removal rate • Excellent removal of broad spectrum of metals for improved device yield performance in DI Water
New Grafted Membrane technology • Greater stability at higher temperatures
• Extended service life
Improved product cleanliness • Faster resistivity/TOC flush-up • Fast tool start up and less tool idle time
Cross-linked Ion Exchange technology • Improved stability of IEC technology • Increased process lifetime
performance
How do Protego Plus purifiers remove metal ions?
Protego Plus purifiers utilize ion exchange functional groups that are cross-link grafted on to a substrate membrane. These ion exchange groups reduce metal cations by up to 99.9% efficiency and the cross-linking ensures lower extractables and shedding in the process.
Are Protego Plus purifiers also filters?
Yes. Protego Plus purifiers have capability to remove metals cations while also having tight filter retention as an all-in-one purifier/filter. Different retentions are available for DIW to meet all fab process needs.
20 nm
0.05 µm
50 10 15 20 25 30
10 2 3 4 5 6 7
0.1 µm
Purifier
Typical Flow Rate (L/min) — 1 cP @ 25°C (77°F)
Protego Plus LTX 10” FiltersGPM
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4.5
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0
Protego Plus lTX 10" Filters
ProductProtego Plus lT/lTX Protego
Protego Plus hT/hTX
Protego Plus IPa
Application DI Water DI Water IPA
Purifier Only Option Yes No No
Pore Size Rating 0.1, 0.05 µm & 20 nm 0.10 & 0.05 µm 15 nm
Membrane Material Hydrophilic UPE (0.05, 0.1µm), Hydrophilic PS (0.02 µm)
Hydrophilic PES PTFE
Ion Exchange Media X-LINK PE-IX Media X-LINK PE-IX Media IX Media
Ion removal Cation Cation Cation
Ion Exchange Capacity 10" type 82/105 meq/10" unit 16 meq/POU
74/110 meq/10" Unit 480 meq/P1500 POU 1.2 meq/P3000 POU
Supports, Materials of Construction HDPE HDPP PFA
Optional POU Materials HDPE N/A N/A
Membrane Area 0.54 / 0.68 m2 10", 0.12 m2 POU
0.48 / 0.77 m2 10" 0.20 m2 P1500 0.49 m2 P3000
Max. Forward Differential Pressure 0.27 MPa @ 25°C 0.27 MPa @ 25°C 0.39 MPa @ 25°C
Max. Backward Differential Pressure 0.27 MPa @ 25°C 0.27 MPa @ 25°C 0.26 MPa @ 25°C
Max. Operating Temperature 60°C 80°C 70°C
Tailored by application needs
frequently asked questions
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PUR
ITY
A superior particulate filtration for ultrapure gas applications.
• Targets a wide flow range up to at least 1000 slpm
• Exceptionally low pressure differential
• Ozone compatibility
• Attractive pricing
• Multiple performance options
• Small footprint for on-tool efficiency
• Increased warranty (dependent on performance option)
Optimized for high flow and low delta pressure applications.
Wafergard MaX In-line Teflon Gas Filters
FEaTURE adVaNTaGE BENEFITHigh flow • Lower pressure drop • Efficiently save time and costs
Smaller footprint • Easier implementation • Easy to implement and install
Incoming gas minimizes process defects
• Higher removal efficiency • Remove particles greater than 0.003 µm (99.9999999%)
• Downstream cleanliness
All PTFE*/PFA filter cartridge • Excellent compatibility with high-purity gases, including nitrogen and CDA
• High corrosive tolerance for o-ring seal less
• Possible high temp. baking until 120° C
Pre-conditioned • Fast startup (Silver only) • Fast dry down (Silver only)• Low out gases (Silver only)
Available in VCR, Swagelok and butt weld fittings
• Many kind of fitting variation • Meet a variety of needs
* For Industrial Use Only. Not for use in food, drug, cosmetic or medical devices manufacturing, processing or packaging operations.
performance
frequently asked questions
What are the key critical design that constitute a good and clean filter?
Good filter design should avoid the moving parts in its flow path, e.g. springs fitting, dead trap, O-ring seals as such design will induce or generate particular indirectly. Good surface finish help to increase the through put by having the quick start-up (lower dry down time) and pro-long filter life cycle (prevention of residual gas entrapment).
How do you determine flow rate and pressure drop in gas filter?
Good filter should be able to strike a balance between good filtration efficiency (high retention value, e.g. 9 LRV) and a good range of flow rate that still retain its good differential pressure value (e.g. lower pressure drop) and clean in the way that it does not out-gas particulate and molecular contaminants.
Wafergard MaX In-line 1⁄2" FittingsWafergard MaX In-line 1⁄4" Fittings
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SLPM Flow Rate @ 23°C (73°F)
Wafergard MAX In-line 1⁄2” Fittings
1.03 bar inlet(15 psig)
2.06 bar inlet(30 psig)
6.2 bar inlet(90 psig)
4.12 bar inlet(60 psig)
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SLPM Flow Rate @ 23°C (73°F)
1.03 bar inlet(15 psig)
2.06 bar inlet(30 psig)
6.2 bar inlet(90 psig)
4.12 bar inlet(60 psig)
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Wafergard MAX In-line 1⁄4” Fittings
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SLPM Flow Rate @ 23°C (73°F)
Wafergard MAX In-line 1⁄2” Fittings
1.03 bar inlet(15 psig)
2.06 bar inlet(30 psig)
6.2 bar inlet(90 psig)
4.12 bar inlet(60 psig)
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6.2 bar inlet(90 psig)
4.12 bar inlet(60 psig)
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 2726
PUR
ITY
aMC Tool Top Filters
performance
FEaTURE adVaNTaGE BENEFITHigh removal efficiency (>95%) • Removes critical acids, bases and organics
from the fab ambient• Reduces contamination risk
Proprietary chemistry developed with key scanner manufacturers
• Protects optics and process • Qualified by leading fabs
High surface area • Low pressure drop • Reduces energy requirements and cost
Optimized blend of treated, untreated activated carbons and ion-exchange media
• Balanced mix to match lifetimes for all contaminant classes
• Provides targeted contaminant removal
Data driven See it. Control it. methodology
• Clearly identifies critical AMC levels in customer’s facility
• Provides tailored, application specific filtration solutions
Product backed by Entegris OEM certified, ISO 17025 accredited laboratory services
• Product performance windows are clearly defined
• Provides assurance that all performance claims are verified with supporting data
Available in a range of sizes to satisfy various installation requirements, including tool-top, fan filter unit, tool interface or in-tool housing in all equipment front-end modules (EFEM) and process modules
• Field tested and proven • Easy to implement and install
Filter lifetime estimate: actual filter life is determined by measuring the fab’s chemical challenge concentration, downstream quality and testing of returned filters.
Pressure Loss vs. Velocity
Velocity (ft/min)
Pres
sure
Los
s (P
a +/
- 25
%)
120
100
80
60
40
20
00 50 100 150 200
100
95
90
85
80
75
70
Typical Lifetime
Lifetime (ppb-hrs ±25%)
Rem
oval
Eff
icie
ncy
(%)
0 100,000 200,000 300,000 400,000 500,000
Acids
Organics
Bases
A unique chemistry removes critical contaminants at a low pressure drop for the production tools.
• High removal efficiency >95%
• Removes critical acids, bases and organics from the fab ambient to reduce contamination risk
• Long life
• Removes a comprehensive array of AMCs in a single filter cell
Optimized for process tool Airborne Molecular Contamination control.
Entegris AMC tool-top filters provide AMC protection for all semiconductor process tools including: wafer metrology, reticle inspection, ALD, EPI, diffusion, CVD, PVD, wet etch, wafer clean, dry etch and CMP.
frequently asked questionsHow do I choose the correct filter for my application?
Our recommendation is based on different parameters such as: AMC targeted, flow rate, maximum pressure drop acceptance, mechanical dimension and expected lifetime.
How do we determine filter lifetime?
Entegris provides on site and post mortem analysis to optimize filter changeouts.
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Microenvironment control: a system approach
• Entegris Barrier Material (EBM) to improve purge duration, quicker purge down time and less absorption/desorption of outgassing from wafers
• Snorkel purge option to rapidly purge down to low moisture and oxygen levels while directing airflow between the wafers
• Clarilite® Wafer for maintaining low moisture or oxygen conditions for extensive time frames
Microenvironment Protection Solution
The Spectra™ FOUP is a 25+1 capacity front opening unified pod (FOUP) that provides high-performance wafer transport, optimum automation integration and low cost of ownership for your facility.
• High-strength assembly
• Wafers retained against shock and vibration
• Meets all applicable SEMI® standards
• Uses STAT-PRO® 3000 carbon-filled PEEK material at all wafer contact points
• One piece molded shell
• Optional configuration available for a conductive shell to increase protection
• Microenvironment control
Optimized for below 45 nm processing.
frequently asked questions
What kind of identification options are offered?• Various shell colors for segregation• Colored inserts on handles• License plate• Molded-in bar code• Print-on-demand labels• Laser marking
Why 25+1 slots instead of 25?• One slot can be used for a test or
monitor wafer
FEaTURE adVaNTaGE BENEFIT
• New latch mechanism• Dual action wafer retainer• Wafer contacts are all PEEK• Wafer edge contact only• Purge capable
• Increases FOUP sealing and conductance• Increases ESD protection• Reduces airborne molecular
contamination (AMC) and backside particles
• Improves yields
• Molded one-piece carbon-filled PEEK wafer supports integrated with shell
• Greatly reduced tolerance issues• Precise wafer plane performance
• Increases tool uptime• Improves reliability and
interoperability on loadports• Improves tracking through
molded-in barcodes and RF tags
• Simple, reliable POD assembly • Has minimum part count and no metal parts
• Snap fit parts
• Improves COO• Improves cleaning and drying
cycle time• Field replaceable units for FOUP
refurbishing
• EBM configuration • Allows significant extension of purged environment (low moisture)
• Quicker purge down time
• Protects wafers longer from conditions that allow corrosion or hazing due to moisture
• Snorkel purge • Higher airflow• Directs airflow between wafers
• More effective purge than traditional techniques
Purging with inert gas will remove moisture and oxygen during or between critical process steps. Etching and deposition steps are prime examples.
• Reduces corrosion and hazing issues
• Improve yield
• Improve queue processing time
• Helps control environmental contamination due to:
- Outside contamination (atmosphere) - Outgassing of the wafers - Outgassing of the FOUP (humidity)
performance
Challenges in wafer microenvironment control - O2 & h2O control -
0
5
10
15
20
25
30
35
40
45
0 10 20 30 40 50 60 70 80 90
Standard PC FOUP
EBM FOUP
100 110 120 130 140
Time (min)
Hum
idity
(% R
H)
Relative humidity (h2O) recovery over time after a FOUP purge
EBM Spectra-S
Process acid Base Organic O2 h2O dopant
Gate Oxide • • •Ultra Shallow Junction • • • •Copper seed to plate interface •Exposed Copper Corrosion • •Reticle Storage • •HSG (hemispherical glass) Poly • • •Salicide contact formation • • • •SiGe • • •EPI/Pre-EPI • • •Lithography (photoresist sensitivity)
•
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FEaTURE adVaNTaGE BENEFITAll wetted material in PFA and PTFE
• Extremely robust and reliable• Excellent chemical resistance
• Increases tool and valve uptime
¾” Integra has unique internal radius
• Enables a fully swept flow path• Reduces shear
• Increases flow efficiency
Innovative diaphragm design • Maximizes stroke, enabling a high flow rate in a small footprint
• Saves valuable equipment space
No external metal parts • Maintains chemical integrity• Offers high reliability
• Higher yields and wafer throughput
Repair kits available • Field serviceable • Increases equipment uptime
1" and 1¼" Integra valves have no touch bellows diaphragm design
• Minimizes particle generation • Increases cleanliness and valve reliability
Design provides reliable service for UHP applications where space is limited and high flow is required.
• Designed for high flow chemical distribution applications
• Unique design allows for higher flow in a small footprint
• Wide range of repair kits available
• Available with a variety of connection options including PrimeLock, Flaretek, PureBond®, and Super 300 Type Pillar.
• Vacuum rated
Optimized for wet etch and clean applications: SC1, SC2, SPM, H2SO4 and H3PO4.
¾˝, 1˝ and 1¼˝ Integra Valves
Internal radius for ¾” Integra:
• Eliminates sharp inside corners
• Optimizes the outer radius of the swept flow path
• Eliminates dead spots
• Decreases pressure drop, thereby increasing flow with a smaller footprint
What configurations are available?2-way and sampling configurations• Pneumatic valve with normally open and normally
closed designs available with remote sensing option• Multi-turn manual valve with optional safety lock
out tag out
What are the pressure and temperature ratings for Integra 3/4" and 1" valves?• ¾” DS12 valves
— Forward and backward pressure rating up to 552 kPa (80 PSIG) at room temperature
— Forward and backward pressure rating up to 207 kPa (30 PSIG) at 165°C
• ¾” DH12 valves — Forward and backward pressure rating up to 552 kPa (80 PSIG) at room temperature — Forward and backward pressure rating up to 207 kPa (30 PSIG) at 180°C
• 1" DS16 and 1¼" DS20 valves — Forward and backward pressure rating up to 552 kPa (80 PSIG) at room temperature — Forward and backward pressure rating up to 276 kPa (40 PSIG) at 93°C
frequently asked questions
performance
Port Connection
FlowFactor CV
FlowFactor KV
3⁄4" Flaretek, PrimeLock 6.7 95.73⁄4" PureBond 8.2 117.1
1" Flaretek, PrimeLock 9.8 140.0
1" PureBond 10.9 155.7
¾” Integra Valve:
Port Connection
FlowFactor CV
FlowFactor KV
3⁄4" Flaretek, PrimeLock 7.2 1033⁄4" PureBond 10.4 149
1" Flaretek, PrimeLock 12.4 177.1
1" PureBond 13.6 194.2
1” Integra Valve:
Port Connection
FlowFactor CV
FlowFactor KV
1" PureBond 15.0 214.2
1¼" PrimeLock 16.5 235.6
1¼” Integra Valve:
The ¾ Integra valve's fully swept flow path increases flow capacity, decreases pressure drop and reduces shear, thereby improving overall fab efficiency
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FEaTURE adVaNTaGE BENEFITModular design • Ease of assembly
• Easily configured into custom manifolds• Compact footprint
• Improves serviceability• Allows tool manufacturer to
optimize space
High-temperature capability • Solves variety of critical issues including photoresist stripping
• Improves yield
Vented actuator design • Able to withstand corrosive environments • Improves realibility• Extends product lifetime
Variety of end connections • Versatility and ease in system design • Improves cost of ownership
Available in 3-way configurations
• Three-ported directional valve design • Enables simplification of system design
Corrosion Resistant (CR4, CR8 and CH8) is the next generation valve specifically designed for corrosive environments.
• Modular design – manifoldable
• Small footprint
• High-temperature capability
• High-purity corrosive chemical handling
CR4 is ideal for low flow wet etch and clean applications and high temperature corrosive chemical handling.
CR8/CH8 is ideal for mid flow wet etch and clean, low volume bulk chemical delivery and high-temperature applications.
CR4, CR8 and Ch8 Manual and Pneumatic Valves
• Sealed actuator with separate actuator vent port
• Ability to vent the actuator through a separate vent line to a controlled environment
What configurations are available?• Pneumatic, toggle or multi-turn actuators• ¼’’ to ¾’’ ports size• Flaretek, PureBond, Pillar S300 or PrimeLock
connections • Options for position indicators, restricted open
and close, LOTO etc…
Is there a 3-way CR valve available?Yes, it is available ¼’’ to ¾” pneumatically actuated.
Are all CR valves actuators manifoldable?Yes, all 2-way and 3-way valve types with all actuator configurations can be manifolded.
When should I choose CH8 vs CR8?When temperature exceeds 130°C (226°F), CH8 should be selected. CH8 can support up to 180°C (365°F).
Why should I use CR4 instead of SG4? • CR4 has no exposed metal hardware and will be
more resistant to corrosive environments. • Higher temperature capabilities compared to SG4
series• Improve ease of field reparability • CR4 is a direct replacement for SG4
frequently asked questions
performanceCR8 cut view
performance continuedCR4 CR8/Ch8
Orifice 1⁄4” 1⁄2”
Media temperature range 21°C - 160°C CR8: 21°C - 130°C CH8: 21°C - 180°C
Inlet/outlet pressure rating at RT CR4: 80 PSIG / 40 PSIG CR4 HP: 80 PSIG
80 PSIG
Cv 0.29 - 0.84 2.4 - 3.4
Reliability Tested over 2.1 million cycles Tested over 4 million cycles
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FEaTURE adVaNTaGE BENEFIT
Optimized 90° radius • Reduces total system pressure drop • Increases overall equipment lifetime
• Increases flow• Reduces fluid shear
• Improves yield
• Reduces dead volume • Improves yield by reducing large particles on wafers
• Decreases turbulence • Maintains chemical integrity
Flaretek 90° Sweep Elbows
Flaretek 90° elbow with optimized radius eliminates sharp corners to dramatically reduce pressure drop and increase flow. Manufactured from 100% virgin HP PFA material.
• No dead spots
• Increases flow rate in same footprint as standard elbows
• Decreases fluid turbulence for CMP chemical health
Optimized for high volume bulk chemical distribution and CMP slurry applications.
performance• 60% lower pressure drop through
the fitting compared to the standard 90° elbow
• Smallest footprint sweep available, making it practical for OEM tools
• Reduced footprint design saves assembly time
Achieve better results than standard 90° elbows
• Standard 90° elbow burst pressure: 644 PSIG (average)
• Sweep 90° elbow burst pressure: 825 PSIG (average)
Standard vs. Sweep Elbow
frequently asked questionsWhat fitting sizes and accessories are available?• Fitting sizes: ½”, ¾” and 1”• Spacesaver or PureBond connections available• FlareLock® II, PVDF, PFA, CPFA nut availableWhat are the pressure and temperature ratings?
Pressure and temperature ratings are the same as a standard 3⁄4” 90° elbow fitting. Visit www.entegrisfluidhandling.com for additional information.
How can I find the appropriate fitting?
You can generate fitting part numbers based on your specifications and search the extensive online catalog on: • The web at www.entegrisfluidhandling.com• The mobile selection tool at:
m.entegrisfluidhandling.com
Flow Pattern Comparison Standard vs. Sweep Elbow at 5 GPM
¾” P/N USE12FN-3
2 x 2.20” 2 x 2.20”
Scan QR Code
Fittings mobile selection tool
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Primelock Fittings
The simplest, cleanest and most robust PFA fitting on the market.
• PrimeLock fittings ensure leak-free performance in the most demanding chemical applications
• Easy to assemble, heat is not required
• The audible and visible indicator allows users to verify the proper makeup of the connection
• Broad range of sizes and configurations: ¼” to 1¼" elbows, unions, reducers, caps, tees, minimum tube unions and adapters
• Expanded on a wide range of Entegris products: Chemlock® filter housing, Torrento 15 nm liquid filter, NT pressure transducers, CR4 ¼" and CR8 ½” series valves and Integra ¾”, 1” and 1¼” series valves.
Ideal for high purity, corrosive chemical handling, low surface tension chemistries and high-temperature applications.
FEaTURE adVaNTaGE BENEFITEase of assembly • Audible and visual indication of proper
fitting makeup • Consistent and repeatable fitting
makeup
PFA wetted surfaces • Broad chemical compatibility • Simplifies product selection
Robust thread design • Three backup seals• No cross threading• Quick makeup• Increased sealing forces
• Consistent leak-free connection
Unique seal design • Nonwetted insert eliminates multiple entrapment, leak points and flow interruptions
• Improved process
Capable of 200°C (392°F) temperature rating, all sizes
• Simplifies product selection • Lower design cost
No heat required to flare tubing • Reduces operator variability • Saves time and money
performanceThe unique seal design removes the insert from the flow stream
• Reduces entrapment
• Reduces leak points
• Eliminates flow interruptions
Primelock Cross-section 3 Backup Seals
PrimeLock fittings are compatible with high-temperature chemical processes:
• At temperatures up to 200°C at 40 psi
• At room temperatures it is rated to 120 psi
Pressure vs. Temperature Rating
frequently asked questionsWhen should I use PrimeLock fittings?PrimeLock fittings can be used in high-purity, corrosive chemical handling, semiconductor applications, solar, LED, flat panel display and with low surface tension chemistries. Also, used in high- temperature applications up to 200°C.
Is the pressure vs. temperature rating depend on the size?No, same specification for all sizes ¼” through 1¼”
How can I find the appropriate fitting?
You can generate fitting part numbers based on your specifications and search the extensive online catalog on: • The web at www.entegrisfluidhandling.com• The mobile selection tool at:
m.entegrisfluidhandling.comScan QR Code
Fittings mobile selection tool
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 3938
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Wide range of microenvironment products for transport and protection of critical wafers during wet applications.
• Designed to fit your equipment needs
• Wide range of materials to allow chemical compatibility
• Strong technical support to enable customized solutions
• Large variety of optional products (tweezers, lab products, etc.)
Optimized for WEC, hot temperature applications.
Microenvironment Transport Solutions
frequently asked questionsWhat materials are available for these solutions?• High-purity process wafer carrier material• Translucent perfluoroalkoxy (PFA)
What are the temperature limits? — Continuous use (process enhancement): 165°C — Continuous use (traditional): 180°C — Wafer insertion: 250°C
What identification options are available?• Laser marking• Hot stamping• Barcoding• Alphanumeric ID tag• RF ID tag
FEaTURE BENEFIT• Chemical resistant PFA material• Industry standard equipment
interface (H-bar)• Quick and even solution coverage
and drainage
• Enables high purity during wet processing
• Enables automation during processing
• Easy interface with existing tools• Higher yields and wafer
throughput
• Reduced surface area, volume and mass enables smaller tank sizes
• Design minimizes chemical carry over and reduces wafer masking
• Reduces PFA wafer supports• Rail features (notches) for
accurate location on equipment
• Increases yield and process purity• Maintains wafer integrity during
wet processes• Enables more repeatable wafer
access, higher temperature processing and longer useful lifetime
• Enables easy interfacing with tools
a200 a192
PEC* 300 mm
200
mm
300
mm
*Process enhancement cassette
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 4140
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High-purity flow-through conductivity sensor for highly accurate measurement of chemical conductivity in wet applications.
• All PFA electrodeless conductivity sensor – rated up 140°C
• High sensitivity, wide rangeability
• On-Line sensor and analyzer diagnostics communicate real-time measurement faults with history event log
• Selection of tubing line sizes: 1⁄2“, 3⁄4“, or 1”
• Rapid temperature compensation
Optimized for aggressive chemicals used during wet etch and clean (HF, HCI, NaOH, KOH, NH4OH, TMAH) and for diluted to high concentration binary process solutions.
NT Conductivity Sensor, Model 8800 and NT Conductivity analyzer, Model 8850
FEaTURE adVaNTaGE BENEFITThe only all PFA material flow-through electrodeless conductivity sensor
• Compatible with typical semiconductor process chemistries
• Decreases particle contamination and improves yield
The NT model 8800 uses multiple Toroid sensors
• Reduces signal to noise with a better signal resolution
— Highly accurate — Expanded measurement range
• Increases measurement accuracy
Temperature compensating • Real-time conductivity measurement corrected for temperature
• Increases lab efficiency for process verification
Unique in-situ precision calibration method
• Isolates personnel from aggressive process solutions during calibration
• Increases tool uptime with maintenance safety and process accuracy
performance
application overview
The NT nonintrusive conductivity sensor, model 8800:
• Allows in-situ chemical measurement
• Conductivity monitoring for wet benches and chemical delivery systems
• Supports up to 3 sets of application configurations. Remote range and application switching using PLC compatible contact inputs
• Simple to use, calibration plug and in-line calibration method eliminates personnel safety issues
a typical semiconductor application
PPM µS Wt. %
100 630 0.01
300 1490 0.03
1000 2420 0.1
3000 5100 0.3
11700 1
34700 3
62000 5
118000 20
Process Tool
140001200010000
8000
6000
4000
2000
0
PPM
Mic
ro S
iem
ens
0 2000 4000 6000 8000 10000 12000
µShydrofluoric acid Conductivity
Works with typical semiconductor etching solutions such as hydrofluoric acid (HF), hydrochloric acid (HCL), nitric acid (HNO3), sulfuric acid (H2SO4), etc.
Conductivity of hF concentration by weight
Bath
NT 8800
NT 8850 Conductivity and temperature output
Pump
Monitors the depletion of hydrofluoric acid (HF) in a bath
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 4342
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NT high-temperature flowmeter, model 4401 is designed for use in ultrapure, high-temperature applications. Incorporates same pressure sensor technology as the NT electronic flowmeter, model 4400.
• Effectively handles process temperatures up to 180°C (365°F)
• No moving part to generate particles
• Nonmetallic sensing technology for reliable measurement
• Flow ranges up to 0 - 120 l/min
• Easy installation in any orientation
• Same response time as proven NT model 4400
Ideal to obtain valuable and critical diagnostic information which is used to monitor and control high-temperature, aggressive chemical processes in wet etch and clean applications, precision blending and metering.
FEaTURE adVaNTaGE BENEFITPFA, PTFE and other high-purity fluoropolymer wetted surfaces
• Compatible with highly corrosive wet etch and clean processes
• Resistant to harsh chemical environments and external spraydowns
• Improves yield• Lower cost of ownership through
increased tool uptime
No moving parts • Does not generate particles• Provides repeatable and reliable
measurements
• Improves yields • Improves thoughput
Nonmetallic sensing technology • Does not generate contamination • Improves yields• Lower cost of ownership through
extended service time
Pressure output included • Eliminate needs for additional instrumentation
• Lower overall tool cost• Improves process control
Easy to retrofit and upgrade existing applications
• Adds flow and pressure measurement capability for high-temperature applications
• Improves process control on existing platforms
performance
Process temperature 10° - 180°C (50° - 356°F) (consult factory for specific application support and expanded capabilities)
Operating pressure 0 - 414 kPa (0-60 PSIG)
Flow measurement accuracy
±1% full scale > 20-100% of full scale flow range
± 2.5% full scale 10-20% of full scale flow range
Pressure measurement accuracy
±1% of full scale includes combined effects of linearity, hysteresis and repeatability
Pres
sure
Dro
p ∆
(PSI
)
Pres
sure
Dro
p (k
Pa)
% Full Scale Flow Rate(Standard Flowmeter Using Deionized Water)
6.0
4.0
2.0
0.0
0.45
0.30
0.15
0.00
0% 20% 40% 60% 80% 100%
Pressure drop vs. Flow Rate
frequently asked questionsWhen should I use NT high-temperature flowmeter, model 4401 vs. NT electronic flowmeter model 4400?NT model 4401 is recommended when process temperature is above 65°C (149°F).
When should I use a PFA vs. CTFE sensor interface? • PFA should be used for solvents, select chemicals or
if sensor module temperature could go above 40°C during purging.
• CTFE should be used for most aqueous chemical solutions and select solvents. The sensor module temperature must be maintained below 40°C during purging.
Please refer to chemical compatibility chart for sensing and control products: http://www.entegris.com/Resources/assets/3960-2602-0912.pdf
How do I select a suitable flow range for a given chemical?Please use our web based calculator to apply viscosity and density correction for all NT flowmetershttp://www.entegrisfluidhandling.com/VDT/
NT high-Temperature Flowmeter, Model 4401
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 4544
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NT Integrated Flow Controller, Model 6510 and 6520
FEaTURE adVaNTaGE BENEFITPTFE and other high-purity fluoropolymer wetted surfaces
• Corrosion resistant • Maintains high purity process
Pressure output included • Eliminates needs for additionnal instrumentation
• Improves metrology • Improves process control• Lowers cost
Compact footprint • Easy for field installs and OEM designs with limited space
• Upgrades older equipment• Allows tool manufacturers to
optimize space
Discrete alarm output • Improved diagnostics • Increases tool uptime by improved systems troubleshooting
frequently asked questions
6510 6520
Sensor interface CTFE, PFA CTFE, PFA
Flow range 0-15 mL/min to 0-1250 mL/min 0-2.5 L/min to 0-40 L/min
Flow measurement accuracy
±1% full scale >20-100% of full scale flow range ±2.5% full scale 10-20% of full scale flow range
Repeatibility ±0.5% full scale >20-100% of full scale flow range ±1% full scale 10-20% of full scale flow range
Pressure measurement 0-414 Kpa (0-60 PSIG)
Pressure accuracy ±1% of full scale
Process temperature 10 – 65°C (50 -149°F)
Size 852 cm3 (smallest IFC on the market)
1744 cm3
NT integrated flow controllers, model 6510 and 6520 are designed for critical dispense applications, chemical blending, on-demand chemical mixing applications.
• PTFE wetted surface for high-purity applications
• No moving parts offers reduced contamination potential
• Nonmetallic sensing technology based on differential pressure provides reliable measurement
• Compact design
NT model 6510 is ideal for aggressive chemical applications where accurate dispense or dosing is needed.
NT model 6520 is ideal for high-flow applications such as bulk delivery or tool liquid dispense.
performance
Enhancements to valve motor and diaphragm provide improved flow control, added safety and contamination protection.
What are the NT Integrated Flow Controller requirements?• Line pressure must be at least 10 PSIG• Sizing for flow control: target flow (nominal flow)
should be within 35 - 90% of a flow controller's flow range
• Maximum working pressure: 60 PSIG
Do bubbles affect pressure/flow measurement?No, NT Integrated flow controllers combine differential pressure based flowmeter and leading edge control valve to create a closed loop flow controller.
What types of sensor interfaces are available?CTFE, PFA or CTFE (hydrofluoric acid compatible).
How do I choose the right interface for my application?• CTFE should be used for most aqueous chemical
solutions and select solvents• PFA should be used for solvents, select chemicals
and process temperatures above 40°C• CTFE (Hydrofluoric acid compatible) should be used
for HF applicationsPlease refer to chemical compatibility chart for sensing and control products: http://www.entegris.com/Resources/assets/3960-2602-0912.pdf
«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 4746
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Preserves absolute fluid purity with maximum heat control and transfer
• Ideal where fluid temperature control is desired
• The device is fully bonded without o-rings
• Constructed from 100% PFA
• Very low trace ionic metals: <10 µg/unit
Optimized for low and high temperature aqueous applications like SC1, SC2, SPM, aggressive acids and bases.
phasor X heat Exchanger
FEaTURE adVaNTaGE BENEFITLarge contact surface area from 0.3 m² to 0.8 m²
• Maximizes heat transfer and heat control during critical etching steps
• Higher yields and increased overall equipment efficiency
• Increased OEE through reduced process cycle time
O-ring free design • Eliminates maintenance and material compatibility concerns while maintaining seal integrity and fluid purity
• Minimized particle-related wafer defects through optimal bath temperature control
• Both fluid streams remain separate
All PFA shell construction • Provides excellent chemical compatibility and ensures chemical cleanliness and ultimate safety
• Safe and ultraclean, higher yield, needed for advanced technology nodes
• Increases OEE through reduced particle contamination
Compact, easy-to-install design • Allows a controlled process fluid temperature with a low pressure drop over the fluid paths
• Increases equipment space savings
performance
frequently asked questionsWhat configurations are offered?PHX03 (0.3 m2) and PHX08 (0.8m2) are offered to meet a variety of needs.
phasor X PhX 03 Flow vs. Pressure drop at 22°C
phasor X PhX 08 Flow vs. Pressure drop at 22°C
0.0 4.5 9.0 13.6 18.2 22.70.00
0.40
0.80
1.20
1.60
2.000 1 2 3 4 5
12.0
10.0
8.0
6.0
4.0
2.0
0.0
Flow Rate (GPM)
Flow Rate (L/min)
Pres
sure
Dro
p (P
SID)
Pres
sure
dro
p (k
Pa)
Tube
Shell
0.0 4.5 9.0 13.6 18.2 22.70.00
0.20
0.60
0.40
0.80
1.20
1.00
1.400 1 2 3 4 5
9.0
8.0
7.0
6.0
5.0
4.0
3.02.0
1.0
0.0
Flow Rate (GPM)
Flow Rate (L/min)
Pres
sure
Dro
p (P
SID)
Pres
sure
dro
p (k
Pa)
TubeTube
ShellShell
S-line Flow Path Configuration U-line Flow Path Configuration99.1 mm (3.90”)
317.5 mm (12.50”)
99.1 mm (3.90”)
515.6 mm (20.30”)
170.2 mm (6.70”)
101.6 mm (4.00”)
119.4 mm (4.70”)
101.6 mm (4.00”)
121.9 mm (4.8”)
322.6 mm (12.70”)
What is the maximum heat transfer efficiency?• This efficiency has been rated between 4–12 L/min
at 20 PSI line pressure• The maximum heat transfer has been measured at
620–800 w/m2, °K (110–140 BTU/hr. f2, °F)
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Provide accurate and reliable inert pressure measurements.
Measure gas or liquid pressure, allowing you to monitor process conditions for increased safety and system performance.
• No moving parts or fill fluids help reduce contamination potential
• Nonmetallic sensing technology provides reliable measurement
• Compact design
• Dymension manifold mountable
• Kalrez®, PTFE, Sapphire, PFA and CTFE
Optimized for aggressive chemical applications.
NT Pressure Transducers
FEaTURE adVaNTaGE BENEFITAll wetted parts are constructed of PTFE, sapphire and other high-purity polymers for corrosion resistance
• Compatible with typical semiconductor process chemistries
• Improves yields by increasing particle performance
Provides compatibility and easy integration with electronic displays and monitoring systems
• Enables tool interaction with pressure transducer and offers increased accuracy in pressure measurements
• Increases overall equipment efficiency
Single port and flow through styles offered in industry standard Flaretek and Pillar Super 300 fittings
• Compact design enables easy installation
• Improves system design flexibility
No moving parts or fill fluids • Reduces contamination potential • Increases tool uptime
performance• Provides reliable pressure
measurement where manual gauges only provide approximate pressure results
• Pressure transducers can help determine filter lifetime where critical contamination control is needed
frequently asked questionsWhere can I use NT pressure transducers?• System diagnostics• System pressure monitoring for tool queuing• Pressure at chemical distribution modules, valve
manifold boxes and point-of-use• Differential pressure in filtration systems• Integrated into custom valve manifoldsCan NT pressure transducers, model 4100 be used in high-temperature applications?Yes, contact Entegris for more information.
How long can model 4150 and 4250 survive 49% Hydrofluoric acid (HF) at 23°C?Estimated 10 years.
How do I choose the right interface material for my application on pressure transducers, model 4100 and 4210?• CTFE should be used for most aqueous chemical
solutions and select solvents• PFA should be used for solvents, select chemicals
and process temperatures above 40°C.• For hydrofluoric acid applications, contact Entegris
for more information.Please refer to chemical compatibility chart for sensing and control products:http://www.entegris.com/Resources/assets/3960-2602-0912.pdf
Monitor Pre-, Post- and Differential Pressure
NT Model Pressure Transducer(for inlet pressure)
NT Model Pressure Transducer(for outlet pressure)
NT Dual Channel Display
Filter Housing
Flow
Differential pressure set-point for filter replacement
Monitoring differential Pressure To Schedule Filter Replacement
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Customized fluid control that optimizes space saving inside equipment, provides low cost of ownership and allows a wide range of valve types.
• Customized distribution manifold
• Modular method of mounting valves to a manifold block
• Optimized flow path
• Replaceable parts on the manifold (fittings)
• Interchangeable valves
Optimized for wet etch and clean applications and VMB replacement in chemical distribution.
dymension Manifolds
FEaTURES adVaNTaGE BENEFITSurface mounted valves • Repairable
• Interchangeable valves• Increased equipment uptime
Low dead volume designs • Reduces internal volume• Reduces cross contamination
• Efficient chemical flush out• Reduced cycle time
Complex flow path and control in a single component
• Smaller footprint• Fewer connecting points
• Lower cost of ownership (COO)
Integrated mixing • Reduces flow volume to mix point • Faster chemical mix response time
• Media temperatures up to 160°C
• Media pressures to 80 PSI
• PFA and PTFE wetted surfaces for broad chemical compatibility
performance
frequently asked questionsWhat is the process and how long does it take to create new manifold designs and prototypes?• Design system and relevant schematic together
with customer• Perform computational analysis if required• Manifold price quoted within two days of
design freeze• Drawings sent to customer for approval
within 2–5 days• Quick-turn prototypes completed in 2 weeks
What are the available valve options?• Normally open/closed actuators• Restricted actuation valves• Manual toggle valves• 3–way valves• Needle valves• Suckback valves• Integrated fixed bypass valves• 1⁄4”–1” orifice size valves
Computational Fluid dynamics
Reduced Footprint
17 cm
53 cm
Discrete component assembly (53 cm) Equivalent function in a manifold solution (17 cm)
Flow trajectory and blending analysis Mixing performance analysis
• Designed using computational fluid dynamics
- Mixing analysis - Flow velocity - Pressure drop analysis and optimization
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Air sampling and analysis
• ASML® and Nikon® approved lab ISO 17025 accredited
• Serving OEM requirements for lens and filter change compliance programs
• Trouble shooting for AMC process and environmental issues
• Assessment of filter performance on track, scanner and HVAC systems
• Baseline studies for new fabs and cleanrooms
Optimized for the detection of airborne molecular contaminants in air below 100 ppb, ambient and high pressure air analysis, photolithography applications, the validation and calibration of “online” or “continuous” monitors, and materials outgassing studies.
FEaTURE adVaNTaGE BENEFIT
On-site service use impingers for cations (base) and anions (acids) and Tenax® for organics
• Easy implementation on site, customized support
• Optimization of airborne molecular control in the fab
Interstack filter sampling • Enables early warning before filter breakthrough
• 33, 66 and 100 percent life control
• Preventive maintenance• Filter lifetime optimization
OEM approved lab, 20+ years experience in the semiconductor industry
• Formatted reports in compliance with OEMs
• Data interpretation
• Secure lens protection
Postmortem filter analysis Reports: • Removal efficiency • Remaining capacity• Contaminants removed
• Filter lifetime optimization• Better understanding of the process
Measurement of low molecular weight silicon organic compounds
• Specific measurement of TMS, HMDSO and D3 levels in the photolithobay
• Secure lens protection
ISO 17025 accredited lab • Highest quality and competence standards
• Peace of mind for the customer, low failure rates, ease-of-use through trained operators
Entegris analytical Services
performance
frequently asked questionsAre the Entegris labs approved by the scanner vendor serving OEM requirements for the lens compliance program?Yes, Entegris is working with the OEMs and reports ambient and filter outlet analysis of acid, base and organic compounds as per the scanner manufacturer definitions of organics.
Entegris can also perform analysis to calibrate on-line monitoring devices, or to solve specific contamination issues in the fab.
25-Jul-2006 + 16:31:31Operator: rcp
0.01 2.01 4.01 6.01 8.01 10.01 12.01 14.01 16.01 18.01 20.01 22.01 24.01Time0
100
%
0725r610 Scan EI+ TIC
5.39e9
1.37
5.09
4.91
3.22
2.02
3.84
5.57
8.02
5.637.17
6.47
10.38
9.628.55
10.5018.80
16.8712.44 20.64
(mainlib) Cyclopentasiloxane, decamethyl -10 40 70 100 130 160 190 220 250 280 310 340 370
0
50
100
28 45 59
73
154 193 223 251
267
323 339
355
O
Si
O
Si
O
Si
OSi
O
Si
Entegris® and the Entegris Rings Design®, Flaretek®, Torrento®, QuickChange®, Chemlock®, Intercept®, FlareLock®, Protego®, Wafergard®, PureBond®, Spectra™, Clarilite®, Integra®, NT®, Dymension®, pHasor®, PrimeLock®, Guardian™, Microgard™, Mykrolis®, STAT-PRO® are trademarks of Entegris | Teflon® is a registered trademark of E. I. du Pont de Nemours and Company | Pillar® is a registered trademark of Nippon Pillar Packing Company, Ltd. | Kalrez® is a registered trademark of DuPont Dow Elastomers, L.L.C. | SEMI® is a registered trademark of Semiconductor Equipment and Materials International Corporation | Tenax® is a registered trademark of Buchem B.V. Corporation | Nikon® is a registered trademark of Nikon Corporation | ASML® is a registered trademark of ASML Netherlands B.V. Corporation
NORTH AMERICA
Massachusetts Entegris, Inc. Corporate Headquarters 129 Concord Road Billerica, MA 01821 USA Tel. +1 978-436-6500 Fax +1 978-436-6735
MinnesotaEntegris, Inc. 101 Peavey Road Chaska, MN 55318 USA Tel. +1 952-556-3131 Fax +1 952-556-1880
Customer Service Tel. +1 952-556-4181 Tel. 800-394-4083 (toll-free within
North America)Fax +1 952-556-8022 Fax 800-763-5820 (toll-free within
North America)
EUROPE
FranceCustomer Service Center for Southern, Western and Northern Europe Entegris S.A.S. Parc Centr’ Alp Ouest 196 rue du Rocher de Lorzier 38430 Moirans France Tel. +33 (0) 4 76 35 73 50 Fax +33 (0) 4 76 35 73 80
GermanyCustomer Service Centers for Eastern and Central Europe Entegris GmbH Hugo-Junkers-ring 5 Gebaude 107 Industriegebiet Klotzsche 01109 Dresden Germany Tel. +49 (0) 351-79597-0 Fax +49 (0) 351-79597-499
IsraelEntegris Israel Limited Izmargad Street 12 Kiryat-Gat Israel Tel. +972 (0) 73 221 00 00 Fax +972 (0) 73 221 00 22
JAPAN
Nihon Entegris K.K. Regional Headquarters Mita-Kokusai Bldg. 4-28, 1-Chome Mita Minato-Ku Tokyo, Japan 108-0073 Tel. +81 3-5442-9718 Fax +81 3-5442-9738
Nihon Entegris K.K. Shin-Osaka Prime Tower Bldg. 1-1, Nishinakajima 6-Chome Yodogawa-Ku Osaka, Japan 532-0011 Tel. +81 6-6390-0594 Fax +81 6-6390-3110
Nihon Entegris K.K. Hakataekihigashi 113 Bldg. 13-9 Hakataekihigashi 1-Chome Hakata-Ku Fukuoka, Japan 812-0013 Tel. +81 92-471-8133 Fax +81 92-471-8134
ASIA/PACIFIC
ChinaEntegris (Shanghai) Microelectronics Trading Co., Ltd. Unit 606-609, Tower 1 German Centre No. 88, Ke Yuan Road Zhangjiang Hi-Tech Park Shanghai 201203 P.R. of China Tel. +86 21 2898 6710 Fax +86 21 5080 5598
Entegris (Beijing) Microelectronics Trading Co., Ltd. Room 1105, Zhaolin Mansion No. 15 Ronghua Middle Road BDA, Beijing 100176 P.R. of China Tel. +86 10 5107 8379 Tel. +86 10 5107 8300 Fax +86 10 5107 8326
ASIA/PACIFIC
KoreaEntegris Korea, Ltd. 8F, Seongok B/D 4-1, Sunae-dong Bundang-gu, Seongnam-city Kyunggi-do, Korea 463-825 Tel. +82 31 738-5300 Fax +82 31 738-5301
MalaysiaEntegris (Malaysia) Sdn Bhd Unit 14 & 15, Lower Level 5 (Executive Wing), Hotel Equatorial No. 1 Jalan Bukit Jambul 11900 Bayan Lepas, Penang MalaysiaTel. +60-4-427-4200Fax +60-4-641-3294
SingaporeEntegris Singapore Pte Ltd. 31 Kaki Bukit Road 3 Techlink, #06-08/11 Singapore 417818 Tel. +65 6745-2422 Fax +65 6745-4477
TaiwanEntegris Asia LLC, Taiwan Branch 14F, No. 120, Sec. 2, Gong Dao Wu Road Hsinchu City 30072 Taiwan R.O.C. Tel. +886-3-571-0178 Fax +886-3-572-9520
Entegris Singapore Pte Ltd. Taiwan Science Park Branch1F., No. 6-7, Duxing Road East Dist. Hsinchu City 30072 Taiwan (R.O.C.)Tel. +886 3 565 3000 Fax +886 3 565 3099
Entegris Asia LLC, Taiwan Branch Rm. 313/314, 3F., No. 6, Zhongxin Road Xinshi Dist. Tainan City 74148 Taiwan (R.O.C.)Tel. +886 6 589 6008 Fax +886 6 501 3799
Entegris regional customer service centersREGION TELEPHONE FAXNorth America 800-394-4083 800-763-5820Germany +49 (0) 351 795 97-0 +49 (0) 351 795 97-499France +33 (0) 4 76 35 73 50 +33 (0) 4 76 35 73 80United Kingdom +33 476 357 354 +33 476 357 380Italy +33 476 357 352 +33 476 357 380Israel +972 (0) 73 221 00 00 +972 (0) 73 221 00 22Japan +81 3-5442-9718 +81 3-5442-9738Malaysia +60-4-427-4200 +60-4-641-3294Korea +82-31 738-5300 +82-31 738-5302Taiwan +886-3-571-0178 +886-3-572-9520Singapore +65 6745-2422 +65 6745-4477China +86 21 2898 6710 +86 21 5080 5598
ENTEGRIS, INC.
Corporate Headquarters129 Concord RoadBillerica, MA 01821 USATel. +1 978-436-6500Fax +1 978-436-6735
www.entegris.com
©2009-2013 Entegris, Inc.All rights reserved.9000-5247ENT-0413