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Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project
Phase 2 End-of-Project / Phase 3 Call-for-ParticipationMarch 5, 2020
Public version
Listen to webinar recording (good for six months following event):https://inemi.webex.com/inemi/lsr.php?RCID=74a9df5720b841db92120fbce4498a85
Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project, Phase 2
End-of-Project WebinarMarch 5, 2020
Public version
Project Leaders: Feng Xue – IBMCharles Woychik – i3 Electronics Charles Reynolds - IBM
iNEMI Staff: M. Tsuriya
Contents
• Introduction
• Background and Project Purpose
• Test Vehicle Design
• Test Vehicle Fabrication
• Results
• SEM/CMM
• AOI Defects Inspection (5 Inspection Sites)
• Trace Width Measurement
• Conclusion
• Next Step
2
Project Introduction
Project Chairs & Members
4
Project Leader:Feng Xue
IBM
Project Leader:Charlie Reynolds
IBM
Project Leader:Charles Woychik
i3 Electronics, Inc.
Background
• Integrated packages are becoming more popular as an electronic packaging solution. This package type requires finer circuit patterns designs.
• Fine line and space requirements provide high density interconnects which supports the high I/O high bandwidth memory and other component integration of fine pitch memory, and other fine pitch devices.
• iNEMI started Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project in 2016. Phase One, which included an industry-wide survey to assess the measurement and inspection capability and readiness for fine circuit pattern substrates, was completed in Feb 2017 with the following key findings and recommendations
• The limited manufacturing experience with fine pitch technology results in an environment of uncertainty
• The capabilities of today’s toolsets allow for development investigation and evaluations but are not designed for manufacturing volumes
• The development timeline indicates fine feature inspection and measurement must be available within the next 3-5 years.
• Team decided to move to Phase 2 to conduct an inspection capability study on fine pitch patterns which are less than 10um lines and spaces with various defect patterns based on the key recommendations from Phase One.
5
The Purpose of Project Phase 2
• This project is a continuation from Phase One.
• The purpose of this project is to further characterize and quantify industry capability by conducting an inspection capability study and analysis using TV with fine line space features and defect patterns.
• Design and fabrication of a glass test vehicle and a Silicon test vehicle fabrication.
• A defect pattern design with 6 different line widths is fabricated in Test Vehicles.
• Defect patterns includes a) Line width violations; b) Spacing violations; c) Excess copper or missing copper; d) Short or open circuits; e) Cuts and other features.
• Line widths are designed with 10um, 8um, 6um, 4um, 2um, and 1um features.
6
Dark Field Illumination
Bright Field Illumination
Wafer
Multiple Resolution
Camera
Key Element for AOI Measurement
• Optics:
• Right Resolution
• Seeing enough, but not too much
• Selectable Magnification is needed
• Light:
• Right Light for different geometries and materials
• Bright Field and Dark Field is needed
• Free adjustable combination
• Color filter to enhance contrast
• Alignment:
• Perfect merged images
• Smart algorithm to stich all taken image to one perfect picture. Any small mistake results in false alarm or missing a defect.
• Detection:
• Multiple Algorithms
• Different designs and different materials needs different algorithms.
• A combination of different types of algorithms gives best flexibility and highest detection.
• Filter:
• Automatic defect characterization
• In order to separate the defects, a smart filtering is needed which categorizes the defects into predefined groups automatically.
• Type of Analyses:
• Inspection: Detection of any variation based on given requirement.
• Comparing against Reference (CAD or Golden Ref. Image)
• Comparing against Fixed Values (Absolute Reflection Values)
• Comparing against Neighborhood
• Metrology: Measuring of defined Objects
• Absolute Measuring (Measuring the dimension of a defined Object)
• Overlay Measuring (Position of defined Objects to each other or Ref. Point)
• Post Processing:
• Analyzing data based on given Models (coplanarity for Bumps)
• Process Control based on feedback of variations over Lots/Time
• Generating Maps and Reports
7
Test Vehicle Design
• Key features of the design include:
• line width, line spacing, line geometry, and defect detection
• The range of 10 μm to 1 μm line width and spacing
• Incorporated design features that simulated manufacturing defects
• locally removed 10, 30, 40, 60, 80% of the trace width (known as mouse bites)
• simulated extraneous metal by adding protrusions which bridged 10, 30,40, 60, 80, 100% of the gap between traces
• The design implements arrays that include the following equal line widths and spacings: 10, 8, 6, 4, 2, 1 μm.
8
Test Vehicle Design
9
Test Vehicle Pattern (10um shown) Test Vehicle Cell - One Instantiation Test Vehicle Cell Matrix
Matrix 12 x 21
Glass TV wafer Appearance Silicon TV wafer Appearance
Test Vehicle Fabrication
10
Glass TV Fabrication Si TV Fabrication
Cu thickness: Si Cu 0.1um thick
Measurement Results
- TV Verification (SEM & CMM)- AOI Defects Inspection Results- AOI L/S Width Measurement
Measurement Results SummaryTV V
erification (
Lab T
ooling) -CMM
(Coordinated Measurement Machine)
- SEM
AO
I In
spection &
M
easure
ment
by A
OI
Com
panie
s
AOI Company
Tool Type Si TV Glass TV
AOI Image
Defect Detection
L/S Meas. AOI Image
Defect Detection
L/S Meas.
A Production Y Y Y Y Y Y
B Production Y Y Y N N N
C Production Y Y N N N N
D R&D Y N N N N N
E R&D Y N N N N N
F R&D Pending Pending Pending N N N
All studies used front-side illumination and image
taking
TV Verification Data
14
SEM
• The fabrication variations in trace widths and spacing were evaluated by SEM measurement
• Used as baseline value for the comparison with any AOI measurement data
• The SEM measurements show that the feature widths are slightly oversized relative to their design point and the spaces are slightly undersized.
• The SEM images are attached in Annex
SEM Results
Defect Measurements
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CMM Measurement Data Set A: Lab Tooling
• CMM (Coordinate Measurement Machine) is an optical tool that uses contrast / pixilation to capture line edges (XY stage accuracy is 1.5um, Zoom of optics: 280x; Pixel size: 1.019um x 1.029um)
• The optical CMM is used for engineering analysis, and only has the capability of line/space measurement. Defect detection capability is not evaluated
• The measurement on the glass TV shows good accuracy with respect to SEM measurement data, as the edge measurement with back lighting enhances the accuracy.
• Greater deviation of measurement data on the silicon TV is observed, as back lighting technique cannot be used on silicon
CMM Results
AOI Defects Inspection Results
AOI Inspection Comparison
• The inter-company inspection comparison is only done on Si TV (as most of the companies only performed inspection on Si TV)
• Key Observations
• Company B commercial equipment with highest magnification (image contrast is not as good as Company D & E) shows the capability of detecting mouse-bite defects for 1um design.
• The other two commercial equipment (Company A and C) has good capability down to 6um
• This study shows Optical tools with higher magnification and enough power can still be applied for 1um feature inspection/measurement for flat objectives. But run rate is currently a challenge for both production and R&D tools
• The impact by warpage and trace aspect ratio (trace thickness by trace space) will be studied in Phase 317
Si TV: 10um Defects
Company A Company B Company C
Type Production Production Production
Pixel 2um 0.42um 1.4um
Company D Company E Company F
Type R&D R&D R&D
Pixel Less than 1um Less than 1um Less than 1um
Pending
Si TV: 8um Defects
Company A Company B Company C
Type Production Production Production
Pixel 2um 0.42um 1.4um
Company D Company E Company F
Type R&D R&D R&D
Pixel Less than 1um Less than 1um Less than 1um
Pending
Si TV: 6um Defects
Company A Company B Company C
Type Production Production Production
Pixel 2um 0.42um 1.4um
Company D Company E Company F
Type R&D R&D R&D
Pixel Less than 1um Less than 1um Less than 1um
Pending
Si TV: 4um Defects
Company A Company B Company C
Type Production Production Production
Pixel 2um 0.42um 1.4um
NA
Company D Company E Company F
Type R&D R&D R&D
Pixel Less than 1um Less than 1um Less than 1um
Pending
Si TV: 2um Defects
Company A Company B Company C
Type Production Production Production
Pixel 2um 0.42um 1.4um
NA NA
Company D Company E Company F
Type R&D R&D R&D
Pixel Less than 1um Less than 1um Less than 1um
Pending
Si TV: 1um Defects
Company A Company B Company C
Type Production Production Production
Pixel 2um 0.42um 1.4um
NA NA
Company D Company E Company F
Type R&D R&D R&D
Pixel Less than 1um Less than 1um Less than 1um
Pending
AOI Trace Width Measurement Results
AOI Trace Width Measurement Results
• Only Company A performed extensive trace width measurement (down to 4um pattern) on one Si TV and one Glass TV
• Company B also demonstrated trace width measurement down to 4um pattern.
• The project team will focus on the verification of the following items in Phase 3, on top of defect detection.
• Encourage participants to perform extensive trace measurement
• Roadmap for high volume manufacturing of Line/Space measurement and defect detection
Summary
Conclusion
• Both Glass and Silicon test vehicles were verified “compliance to design” by CMM and SEM.
• This study shows Optical tools with higher magnification and enough power can still be applied for 1um feature inspection/measurement for flat objectives. Run rate is currently a challenge for both production and R&D tools, but Optical tools seems feasible for high-volume manufacturing for 1um feature.
• Line/space trace measurement was not performed extensively by participating AOI companies in Phase 2. It will be a focus item in Phase 3.
• This study confirms the gaps between current AOI equipment capability and the requirement of high-volume manufacturing of 2/2 and 1/1 um design. In Phase 3 of this project, the team will further characterize the impact by warpage and trace aspect ratio on AOI capability for fine line/space designs.
27
Acknowledgement
• The authors acknowledge the great contributions of the project team Phase 2 members: IBM, i3 Electronics, Wistron, and Intel. Dr. Kamal Sikka from IBM Research was instrumental in providing test vehicle hardware. We also appreciate the support of the AOI company participants
28
Wafer/Panel Level Fine Pitch SubstrateInspection/Metrology Project, Phase 3
Call-for-Participation Webinar March 5, 2020
Project Leaders: Feng Xue – IBMJoe Zou Zhihua – Intel Charles Reynolds – IBM
iNEMI Staff: M. Tsuriya
Agenda
• Introduction of Project Chairs and Facilitators
• iNEMI Project Development Process
• Project Briefing
– Background & Objectives
– Project Scope
• Project IS/IS Not
– Timeline
• How to Join
• Q&A
Note: All phones will be on mute until the end of the presentation
2
Introduction of Project Chairs & Facilitators
3
Project Leader:Feng Xue
IBM
Co Leader:Charlie Reynolds
IBM
iNEMI Staff:M. Tsuriya
Joe Jou ZhihuaIntel
INPUT
SELECTION
DEFINITION
PLANNING
EXECUTION / REVIEW
CLOSURE
1
2
3
4
5
iNEMI Project Development Process - 5 Steps
“ Project”
Limited to committed Members
“ Initiative”
Open for Industry input
0
------------------- iNEMI Technical Committee (TC) Approval Required for Execution
4
Project Briefing
Background
• Heterogeneous SiP packages are becoming popular as an electronic packaging solution. In addition, circuit boards are also
incorporating high-dense circuit patches and layers to support increase signal requirements. These packages require finer
circuitry patterns designs. However, it is difficult to validate the designed line width and spaces to be measured, and to detect the
defect features.
• Inspection limitations are likely to impact yield assessment and quality validation on the substrate/interposers which will be used
for heterogeneous SiP packages.
• Measurement capability on fine line (<10um) and space (<10um) on the panel size substrates/interposer impacts both yield and
performance capability. Fine line and space requirements provide high density interconnects which supports the advanced
package technologies for multiple components integration.
• iNEMI started the project Fine Pitch Circuit Pattern Inspection Metrology in 2016. In Phase 1 of the project, the team conducted
an industry-wide survey to assess the readiness of measurement and inspection capability for fine circuit pattern substrates. The
survey was completed in February 2017.
• The team continued to Phase 2, in which an inspection capability study on a glass based test vehicle and a
silicon wafer based test vehicle was conducted. The test vehicles (TV) were designed with fine pitch pattern
trace widths from 10um nominal down to 1um nominal, and associated defect design such as excess copper
and missing copper. The sizes of these defects’ sizes are varied from 10, 30, 40, 60, 80% from the nominal
values. The phase 2 project was completed in February 2020.
• The team agrees to continue the work an organic substrate as a test vehicle since current
heterogenous SiP substrate and interposers are mainly used with organic substrate. A similar
test vehicle design used in Phase 2 will be used for fabricating an organic substrate TV for
inspection and measurement capability study in Phase 3.
6
The Purpose of Project
• This project is a continuation from Phase 2. The purpose of this project is to further characterize and quantify optical inspection equipment capability by conducting inspection capability study and analysis using an organic panel test vehicle.
– There is greater impact in organic substrate and board yield due to defects from fine-featured line width and spacing violations as well as foreign material.
– The Phase 3 organic test vehicle is designed with known defective fine-featured wiring to comprehensively examine AOI capability to handle differences in organic material properties such as color, reflectivity, and surface roughness as well as substrate warpage and shape deformation.
• Validate the design rule of organic substrate fabrication using the same design rules used in phase 2.
– A defect pattern design with 6 different line widths is fabricated in panel form to create the Test Vehicle.
– Defect patterns include a) Line width violations, b) Spacing violations and c) Excess copper or missing.
– Line widths are designed with 10um, 8um, 6um, 4um, 2um, 1um. These line widths might be changed due to fabrication techniques.
• Test vehicle of organic panel was fabricated as panel (250mmx 250mm size)
• Measure the line width and inspect the defects per the designated location.
• Collect data and analyze the inspection data.
7
Trace Width Measurement GuidelineFor AOI Partners
8
6 Nominal Width Design in a Cell
7 Measurement Location in one Width Design
4.9 mm
Organic Panel Layout iNEMI final layout unit cell
250mm
250mm
Panel Unit cell quantity : 20 x 25 = 500 X pitch : 11.15mmY pitch : 9mm
7.5mm
Layer structure
Cu pattern : thickness 3-7μm
Core：thickness 180-220μm
Insulator：thickness 12-18μm
Insulator：thickness 12-18μm
Cu pattern : thickness 3-7μm
Organic TV Layout
The metrology TV will be diced from the panel.
The size of the TV will be decided by project team prior to dicing.9
Milestone
Task 0 – Kick-off phase 3 project by forming the project team
Task 1 – Fabricate Organic panel TV (2 months)
Task 2 – Verify the dimensions of retuned organic unit cells by SEM and CMM (2 months)
Task 3 – Inspection & Measurement of Organic Test Vehicles. (5 months)
Resources:
o In-kind contribution for the inspection/measurement services
Materials and Processes:
o Follow the measurement/ inspection guide for all sites
o Measure inspection accuracy and efficiency in terms of defect rate and inspection capability with fine lines and space designs
o Inspection report will be submitted to the project manager which contains line width for all designated location and traces and the defects images with the recess rate from the line width.
o The inspection site will bear the incurred cost in their country/site and will bear the shipping cost when the TVs will be shipped back to IBM.
Task 4 – Summarize and analyze the data (3 months)
Task 5 – Publish the project summary report and conduct the webinar (2 months)
Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8Phase 3Task 0Task 1Task 2Task 3Task 4Task 5
10
IS / IS NOT Analysis
This Project IS: This Project IS NOT:
Phase 3
Evaluate defects at intermediate level (in build at organic laminate material)
Develop new inspection and measuring equipment machine/systems
Review the measurement capabilities by different equipment and test vehicle.
Conduct the qualification efforts on specific metrologies at a specific company
Provide the technology readiness statement for fine pattern inspection on substrates and circuit boards
Develop a specific standard(s)
Create recommendation for the metrology Repeat prior or existing work
Biased towards specific suppliers, geographies, or market segments
Involve any devices/assembly process and not involve any reliability test
11
Outcome of Project
• List issues that are expected to be addressed and/or resolved, e.g., identify gaps, report(s) on results of any testing, etc.
• Inspection results are shared among the project members, which include the metrology options, technical gaps and technical plans on the metrology and inspection systems.
• Comparison and assessment of the inspection results, and recommendations are provided for the metrology option in selection.
• A summary report is available to all iNEMI members in reports from this project.
12
How to Join
iNEMI Project Management Policy
• Two governing documents for projects
– SOW (statement of work): sets out project scope, background,
purpose, benefits, and outlines required resources, materials,
processes, project schedule, etc.
– Project Statement (PS): signed by participating companies to
secure commitment on resource and time contributions.
• iNEMI Project requires iNEMI membership
– Signed membership agreement
– Commitment to follow iNEMI By-laws and IP policy
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Sign-Up Due on March 19, 2020
• iNEMI membership is required to join the project
• Download SOW and PS from iNEMI web:
https://community.inemi.org/content.asp?admin=Y&contentid=643
• Process to participate this project:
– Sign the PS
– Send scanned PS to [email protected]
– iNEMI VP of Operations will approve your participation and send you back the completed PS with
acceptance
• Join iNEMI membership, or questions, contact M. Tsuriya ([email protected])
15
Path to Kick-off Meeting
• Call for Participation Webinar: March 6, 2020
• Sign-up Due: by March 19, 2020
• Kick-off Meeting:
March 27, 2020 from 10:00AM Japan time
(March 20, 2020 from 10:00AM Japan time for the chairs’ meeting)
Note:
Meeting time might be changed due to the participants’ preference and availability
16
Questions?
Project web page:
https://community.inemi.org/content.asp?admin=Y&contentid=643
