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Wafer/Panel Level Package Flowability and Warpage Project
Call for Sign-up WebinarProject Chair:
Renn Chan Ooi, Intel Corporation
Tanja Braun, Fraunhofer IZM
iNEMI Staff: Haley Fu
Session 2:
Thursday, March 15, 2018
China Time: 9:00-10:00 pm
US EDT: 9:00-10:00 pm
Recording (available for up to 6 months after webinar):https://inemi.webex.com/inemi/lsr.php?RCID=a8301aeda03c4712a2bd62bd9324b29d
Agenda
• Introduction of Project Chairs
• iNEMI Project Development Process
• Project Briefing– Companies Involved in Planning
– Background & Objectives
– Project Scope• Project IS/IS Not
• Work Plan
– Schedule
• How to Join
• Q&A
Note: All phones will be on mute until the end of the presentation
Introduction of Project Chairs
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Renn Chan Ooi, Intel Corporation
✓ Renn Chan joined Intel Corp since 2005 and
is Senior Assembly & Packaging Analyst
focusing on encapsulation and assembly
technology challenges.
✓ Received doctorate degree in Mechanical
Engineering from University of Sheffield, UK
in 2004.
✓ Field of interest includes thermo-fluids
analysis for assembly processes, imaging
processing and assembly flow visualization.
Tanja Braun, Fraunhofer IZM
✓ Tanja joined Fraunhofer IZM in 1999. Recent
research is focused on wafer and panel
level packaging technologies. She is head
of the group Assembly & Encapsulation
Technologies since 2016. Lead the Fan-out
Panel Level Packaging Consortium at
Fraunhofer IZM Berlin.
✓ Received Dr. degree from Technical
University of Berlin in 2013.
✓ Holds several patents in the field of
advanced packaging.
• Address knowledge gap(s) of industry:– Common problem
– Best solved by working together
– Timed success that aligns to business needs
– Best manifested on complex far reaching issues
– Often includes reliability testing & verification
• Requires teamwork across multiple levels of the
supply chain:– Ensures efficient alignment of goals and investments of the varied
team players;
– Supports the company’s commercial interests.
• Delivers a coordinated industry wide response and
capability set. – OEM/ODM/EMS/OSATs/Suppliers at multiple levels.
Successful iNEMI Projects
INPUT
SELECTION
DEFINITION
PLANNING
EXECUTION / REVIEW
CLOSURE
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iNEMI Project Development Process - 5 Steps
“ Project”
Limited to committed Members
“ Initiative”
Open for Industry input
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------------------- iNEMI Technical Committee (TC) Approval Required for ExecutionWe are here
iNEMI Project Management Policy
• Two governing documents for projects
– Statement of work (SOW): sets out project scope,
background, purpose, benefits, and outlines required
resources, materials, processes, project schedule, etc.
– Project Statement (PS): signed by participating
companies to secure commitment on resource and
time contributions.
• iNEMI Project requires iNEMI membership
– Signed membership agreement
– Commitment to follow iNEMI By-laws and IP policy
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Project Briefing
Companies Contributed to Project Formation
Background & Objectives
• Industry adaptation of wafer size > Φ300mm or panel >
300x300mm2.
• Flowability of mold impacts the quality and potentially
warpage of the wafer/panel for subsequent processes:
– Need to identify key processing factors that impacts
followability.
– Establish factors from flowability that impacts
warpage.
– Establish other material factors that impact post mold
warpage.
Scope 1 - Flowability: Focus and Strategy
• Granular powder:– Low flowability risk from initial members’ discussion,
considered for warpage study.
– Challenges of the keep out zone (KOZ) at wafer/panel
peripherals and the impact to flow and warpage.
• Liquid dispense:– Dispense pattern dictates knit lines/weld lines.
– Identify risk of flying dies from molding pressure.
– Understand material behavior of selected candidates.
– Identify working window and the cliff of failure.
– Explore opportunities from process parameters to
mitigate flow issues.
– Challenges of the KOZ at wafer/panel peripherals and
the impact to flow and warpage.
• Sheet lamination:– Challenges of the KOZ at wafer/panel peripherals and
the impact to flow and warpage.
– Issue of die displacement.
– Understand material behavior of selected candidates,
identify working window and the cliff of failure.
– Explore opportunities from process parameters to
mitigate flow issues.
KOZ
Scope 2 - Warpage: Focus and Strategy
• Simulation & Experimental Approach:
– Understand warpage related material property from material candidates.
– Prelim warpage simulation to identify feasible range of sample dimensions.
– Conduct actual molding for model validation and process understanding.
– Failure analysis (cross section) of mold material behavior.
– Final simulation DOEs for warpage optimization from process and material aspect.
• Chemical Shrinkage:
– Methodology in measuring mold material chemical shrinkage.
– Capability of incorporating it in warpage modeling – explore readiness of simulation software.
– The need for benchmark material with minimum or almost zero chemical shrinkage.
Project Scope: Is/Is Not Analysis
This Project IS: This Project IS NOT:
To conduct mold material property measurements.
To conduct solder joint reliability.
To conduct mold flow and warpage simulation to understand key modulating factors.
To evaluate RDL processes before/aftermold.
To conduct molding experiments on test vehicles based on simulation results.
To develop specific standard(s).
To evaluate flowability of mold process through inspection of void, flow marks, etc.
Biased towards specific suppliers, geographies or market segment.
To evaluate warpage of mold process through measurement tools.
Work Plan – Step 1
Step 1 – Material characterization and preliminary simulation
• Task 1: Process & TV finalize and source dummy die, panel, and other collaterals for project
– Mold first up until de-bonding on metal carrier.
– Wafer size >300mm and panel size of 400x400~600x600mm2.
– Dummy die size of 10x10mm with 200-300um silicon thickness.
– Mold thickness range from 00 to 500um.
– Die to die spacing 1/4 ~1x die size.
– Silicon die selection: pure silicon, dummy die with bump, etc.
• Task 2: Mold compound selection
– Up to 3 or more mold materials to be studied.
• Task 3: Molding material characterization for flowability and warpage simulation
– Curing kinetics (Kamal’s model).
– Rheokinetics (Macosko model).
– TMA, DMA, modulus, Poisson’s ratio measurements, etc., for warpage.
• Task 4: Chemical shrinkage measurement
– Comparison of chemical shrinkage measurements methodology.
– Application into curing and warpage simulation (e.g., PVTc models, etc.).
• Task 5: Conduct preliminary flow simulation to gain further insight
– Preliminary flow simulation to call out potential flow related risks and aide decision in finalizing/update test vehicle attributes.
• Task 6: Conduct preliminary warpage simulation with additional focus on chemical shrinkage
– Preliminary warpage simulation to call out potential CTE mismatch and chemical shrinkage related risks and aide decision in finalizing/update test vehicle attributes.
Ack: Moldex3D
Work Plan – Step 2
Step 2 – Molding experiments
• Task 7: Conduct molding of selected test vehicles
– Assemble finalized test vehicle and conduct selected molding process.
• Task 8: Conduct flowability inspection of test vehicles
– Potential short-shot, visual inspections, post assembly failure analyses, silica particle distributions,
etc., for flowability assessment.
– Flow simulation model fine tuning for flowability prediction.
• Task 9: Conduct warpage measurements of test vehicles
– Conduct warpage measurement and post assembly failure analyses.
– Thermo-mechanical simulation model fine tuning for warpage prediction.
Work Plan – Step 3
Step 3 – Final simulation DOEs
• Task 10: Finalize flow and warpage simulation DOEs to identify key modulating factors and process optimizations
– Finalize second round of simulation DOEs based on preliminary simulation and actual unit assembly learnings.
• Task 11: Conduct final simulation DOEs
– Conduct second round of simulation DOEs to cover working range and limits of flowability and warpage behavior of test vehicle and technology.
• Task 12: Data analysis and review for final reporting
Schedule
Task 0: Literature research X X X X X X X X X X X X X
Step 1: Material characterization and
preliminary simulation
Task 1: Finalize process and TV, and source
dummy die, panel, and other collaterals X X
Task 2: Mold compound selection X
Task 3: Mold characterization X X X
Task 4: Chemical shrinkage measurement X X X
Task 5: Preliminary flow simulation X X
Task 6: Preliminary warpage simulation X X
Step 2: Molding experiment
Task 7: Molding of test vehicles X X
Task 8: Flowability inspection of test vehicles X
Task 9: Warpage measurements of test vehicles X
Step 3: Final simulation
Task 10: Finalize the 2nd round simulation DOE X
Task 11: Conduct simulation X X
Task 12: Data analysis and final reporting X X
Q1 Q2 Q3 Q4 Q5
Checkpoint 1
Checkpoint 2
Expected Project Participants
• This project looks forward to the participation of epoxy mold
compound manufacturers, component suppliers, molding tool
manufacturers, mold flow simulation software companies,
thermos-mechanical warpage simulation software companies,
PCB fabricators, OSATS, foundries, and manufacturing research
institutes.
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How to Join
Sign-Up Due on April 14, 2018
• iNEMI membership is required to join the project
• Download SOW and PS from iNEMI web:
–http://community.inemi.org/wafer-panel-level-pkg-flo
• Sign the PS
–Signature of representative of participants
–Signature of manager approval
–Send scanned PS to [email protected]
– iNEMI VP of Operations will sign and approve your participation
and send you back the completed PS with acceptance
• Join iNEMI membership, or questions, contact Haley Fu
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Resource In-kind Contribution
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Please input "Yes" for those items that your firm plans to provide in-kind support to this project. Specify in detail if
need in the bottom cell. The final experimental design and test vehicle design will be decided and agreed by the
project team.
Area Resource Needed In-kind Contribution
Materials
Mold compound
Dummy silicon die
Carrier
Substrates
Shield fence area and components for assembly
Other area of interest/components to be included in the study
Simulation Flow and warpage simulation
Test vehicle assembly Assembly facilities or services to build test vehicles
Measurement/Test
Mold material
properties
Curing kinetics (Kamal’s model)
Rheokinetics (Macosko model)
TMA
DMA
Modulus
Poisson’s ratio measurements
Chemical shrinkage
measurements
Flowability inspection
Warpage measurement
Failure analysis Failure analysis of final assembled test vehicles
Others Other suggested task with associated resource contribution
Detail description
of your in-kind
contribution
Questions?