Symposium on Global ICT

Environmental InitiativesBrussels Oct 27, 28

HDP User Group International Ruben Bergman, Marshall Andrews

www.hdpug.org/

• HDP User Group• Lead-free Work• Halogen-Free Work• BFR/PVC-free Cables Work• Path Forward• Summary

HDP User Group

Founded 1994 by Ruben Bergman as a joint effort

between Ericsson, Nokia and Nortel

• Completed over 60 projects

• Published over 20 conference papers

• Has worked with organizations such as: SEMI, ITRI, IPC, the US EPA, JPCA

• Founder of the GECI (Global Environmental Initiative)

• Headquarters in Arizona, USA and regional offices in Europe, Sweden and Asia, Japan

• Currently has 22 Technical Projects underway

© HDP User Group International,

Inc.

HDP User Group Project Execution

• Idea stage: Specific needs in more than one member company. Wide interest in solution and verification

• Definition stage: Industry Team develops problem statement, alternative solutions, demonstrators and reliability assessment

• Implementation stage: Limited to Members and special guests– Work and progress limited to project participants

– Final results and reports available to all Members

– Public reports on Board of Directors decision 1…1.5 years later

© HDP User Group International,

Inc.

Relation to Other Organizations

• HDP User Group focuses on technical

projects and issues not covered by other

organizations such as iNEMI, SEMI, ITRI,

IPC, the US EPA, JPCA, etc.

• Members direct all HDP efforts and

repeating work done by others would be a

waste of time and money since members

contribute all resources

© HDP User Group International,

Inc.

The Lead-free Problem

Although implemented in Consumer Electronics, serious

concerns remain in high reliability, high stress applications.

– More rigid LF alloys show better reliability than Sn/Pb in low stress

(small plastic pkg on PWB) but less reliability in high stress (Large

Pkg or ceramic pkg on PWB and in drop test)

– Aging of Lead-free assemblies shows non-linear behavior

– Lead-free solder joint microstructure and morphology is not

understood

– PWB materials are problematic under high assembly temperatures of

Lead-free and advanced design features of many high

performance/high rel applications

– There continues to be much misunderstanding and lack of knowledge

in the industry

Conversion to Lead-free is a foregone conclusion, but it is far

from being a ”done deal” in all applications

© HDP User Group International,

Inc.

Lead Free Reliability Projects

© HDP User Group International,

Inc.

Mild Acceleration Project - Performing Temp Cycle under milder

conditions (+20°C - +80°C) and normal conditions (0°C - +100°C) using a

Lead-free PWBA test vehicle to determine if the increased failure rate of

high stress Lead-free assemblies vs. lead solders is real or an artifact

caused by the extreme temperature range of the accelerated test.

• Results to-date: With some components and preconditioning,

Lead-free reliability in +20- +80 TC is better than Sn/Pb. Testing

and analysis is continuing.

SAC Aging Study - Endeavor to answer the following questions: What is

the effect of aging time (post assembly) on SAC solder joint reliability?

What is the effect of aging temperature? How does SAC305 compare to

SAC387? How does strain level interact with aging?

• Results to-date: Microstructure changes with aging have been

identified. Testing and analysis is continuing.

Microstructural Coarsening

‘Ripening’ of interdendritic Ag3Sn and Cu6Sn5 precipitates

38760C, U3-OUT, NOT BAKED 387F-11, U4-OUT, BAKED

SEM, 2000X Celestica 10 days / 125C© HDP User Group International,

Inc.

LF PWB Materials Reliability

© HDP User Group International,

Inc.

Lead-free Board Material Reliability I – Evaluating the

performance of numerous PWB materials offered as suitable for

Lead-free processing. Properties were measured both before and

after Lead-free solder assembly.

Results:

• No material passed all of the test requirements.

• Visual inspection is insufficient to determine Lead-free

compatibility

• Design factors, such as via pitch have a major role in Lead-

free assembly survivability

• Material supplier reported data does not translate directly to

material properties on an actual PWB.

This project was reported at APEX 2009

LF PWB Materials Reliability

Lead-free Board Material Reliability II – Characterize the

performance of a number of newer Lead-free compatible

materials using an updated test vehicle with a focus on thermally

robust FR4’s and better electrical performing materials.

Results: Testing is underway on 20 different commercially

available materials, including Halogen-free materials.

© HDP User Group International,

Inc.

Lead Free Solder Ball Reliability

© HDP User Group International,

Inc.

Thermo-Electro Migration in Lead Free Solder Balls – develop a deeper

understanding of the thermo/electromigration reliability problems in Lead-free

solder joints by a systematic study to investigate the effect of low Ag solders with

different dopants on thermo-electromigration induced failures using a Wafer Level -

Chip Scale Package test vehicle. Calculate a MTTF for the phenomena.

Results: Pancake void formation identified and characterized for different Lead-free

solders and conditions of temperature and current density. This project is working with

Professor King-Ning Tu of UCLA

Increasing Industry Knowledge Base

© HDP User Group International,

Inc.

Lead-free Guideline – Assemble a team of experts from

companies in the process of converting, to capture and report the

status and current industry knowledge base.

Results:• Version 1.0 completed and published to the industry in 2004.

33 pages written by 5 people from 4 different companies.

• Version 2.0 completed and published end of 2005. 37 pages

written by 12 people from 9 different companies.

• Assembly Optimization Study published end of 2008. 225 meg

of report, data, results, photographs, etc, all hyperlinked.

• Version 3.0 to be published late 2009. 49 pages edited by 11

people from 9 different companies and contributed to by over

30 people.

Halogen-free Problem

Although not currently required by legislation, many major

OEMs have committed to become Halogen-free

– Many different components and structures must be changed.

Just converting to a Halogen-free PWB does not result in a

Halogen-free final product.

– Changing flame retardant results in a completely different

polymer with different properties

– Like the early days of Lead-free, there is little knowledge and

much misunderstanding in the industry.

By working together, solutions can be found and knowledge

gained quicker and cheaper than by each company doing it

alone

© HDP User Group International,

Inc.

Halogen-free Guideline

Halogen-free Guideline – Assemble a team of experts from

companies in the process of converting, to capture and report

the status and current industry knowledge base.

Results:

• Published and made available to the industry late

2008

• 68 pages written by over 40 people from 25 different

companies, including OEMs, assembly companies,

and material suppliers

• Intended to educate and provide information

necessary for implementers to make sound

business decisions, does not take a position

© HDP User Group International,

Inc.

The Halogen-free Database

User Domain HDP User Group Domain Supplier Domain

Access Controlled Area

• Halogen-free Guideline

• Halogen-free Property Database

• List of Suppliers

• List of Products

• Property Search Function

Supplier

Supplier

WebsiteSupplier

Supplier

WebsiteSupplier

Website

OEM

ODM

EMS

Designer

Bureaus

Members Non-Members

OEM

ODM

EMS

Designer

Bureaus

Independent

DesignersIndependent

Designers

Introduction Page

• What DB is all about

• Disclaimer

• How to use etc.

• Options with links

Secure Sign Up

Shopping Cart

Access

Control

Product Property Information

Members Members

Subscribing

Non-Members

© HDP User Group International,

Inc.

The Database System

BFR/PVC-free Cables Project

BFR/PVC-free Cables – A coordinated activity within the

Materials/cable manufacturers/OEMs supply chain to quickly

and thoroughly evaluate PVC/phthalate-free/BFR-free

cable/wire options.

Results:

• Teams have been assembled and are beginning to build

and test evaluation runs of:• Ribbon Cables

• HDMI Cables

• Mini SAS Cables

• Desktop Power Cord Sets

• Notebook Power Cord Sets

Using the best available BFR/PVC free alternative

materials

• Testing to be complete and report published mid 2010

© HDP User Group International,

Inc.

Path Forward

• HDP User Group will continue work in understanding Lead-

free and Halogen-free materials and reliability, and will strive

to increase the industry knowledge base.

• New projects are underway to explore emerging technologies

such as:

– Polymer Ball Interconnect

– Optical interconnect

– SIP and 3D Packaging

• Our goal is to maximize the value to our Members and the

industry through cooperation with all interested parties,

together with technical project management and facilitation

support

© HDP User Group International,

Inc.

Summary

• Much work remains to be done in Lead Free and

Halogen Free implementation

• In today's global environment, working together to

share resources and results is by far the most efficient

way to resolve industry technical challenges

• HDP User group has been at the forefront of

addressing the many challenges of environmental

compliance, and will continue to work with all parties

for the benefit of our members and the industry

© HDP User Group International,

Inc.