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Connector Products Division
Date: 2/14/2003
VHDM-HSD™
High Speed
Electrical Characterization
HDM, VHDM & VHDM-HSD are trademarks or registered trademarks of Teradyne, Inc.
Connector Products Division
Date:6/17/2004 Page 2 of 15
SCOPE 1. The scope of this document is to define the electrical performance of VHDM 5, 6 & 8 row VHDM-
HSD Series connector products. 2. Parameters measured include S parameters, reflections, multi-line crosstalk, signal delay and rise
time degradation, for all HSD connectors. All rise times in this report are based on 10-90%. 3. Test equipment used in collecting data includes Tektronix 11801C TDR and Agilent’s 8720 VNA.
Standard measurement and calibration setups were used during data collection.
Connector Products Division
Date:6/17/2004 Page 3 of 15
TEST MEASUREMENT SETUPS:
Figure’s 1, 2 & 3 show typical TDR test setups.
Figure 1: Typical TDR Test Setup
Figure 2: Typical TDR Crosstalk Setup
Connector Products Division
Date:6/17/2004 Page 4 of 15
Figure 3: Typical Propagation Delay Setup
TEST BOARDS & BOARD TEST PATTERNS: Test Boards: All test boards consists of the following construction: Daughtercard and Backplane Board Thickness
.115”
Layer Count 6 Board material Rogers 4003 on signals, all others FR4 SMA launch Molex high speed design Signal layers Layer 2 & 7 Board construction 2.5” Stripline from SMA to conn via
Connector Products Division
Date:6/17/2004 Page 5 of 15
Figures 4 & 5 show the test fixture used for high speed data collection.
Figure 4 VHDM-HSD 8 row Daughtercard
Figure 5: VHDM-HSD 8 row Backplane
Connector Products Division
Date:6/17/2004 Page 6 of 15
Each set of Backplane and Daughtercard boards were fabbed in one panel, to minimize board variations. In addition each panel included calibration traces, shown in Figure 6,defined as follows:
1). Trans – 1x path length from SMA to the first connector via launch. This defines the speed of the signal arriving at the connector. 2). Reflect1 – 2x trans line or Total path length from Backplane to Daughtercard: Defines fixture loss contribution. 3). Reflect2 – Same as reflect 1 with two press fit pin via’s added in the center to help characterize board via effects.
All board routing were non-coupled strip lines, to minimize any differential board effects
Figure 6: Typical Panel cal traces Test Equipment: Below is a list of equipment/software used to collect and post process the data: Agilent 8722ES with N4418A test box Tektronix 11801 TDR Agilent ADS and PLTS software Appropriate cal kits & high speed cables & terminations Test Fixture Electrical Characterization: Figures 7 thru 9 show TDR and VNA data for both the Trans and Reflect1 cal traces.
Connector Products Division
Date:6/17/2004 Page 7 of 15
This data shows that the test fixtures will support bandwidths of 9 Ghz @ 3 dB or has an equivalent system rise time degradation of approx. 40 ps
Figure 7: 2.5” Trans Line: TDR trace @ Tr=35 ps, 10-90%
SMA Imp 45 ohms
Trace Imp
Trans Line Imp @ Tr=35 ps
10 Ω/Div
Connector Products Division
Date:6/17/2004 Page 8 of 15
Figure 8: 5” Reflect1 Line: TDR trace @ Tr=35 ps, 10-90%
Figure 9: Reflect1 line I/L
SMA Imp 45ohms
Trace Imp
Reflect1 Line Imp @ Tr=35 ps
3dB/Div
Reflect1 Line I/L
10 Ω/Div
Connector Products Division
Date:6/17/2004 Page 9 of 15
Figure 10 shows the pin map for the 8 row or 40 pair connector patterns. Although not shown in this document, the 5 & 6 row or 20 pair follow similar patterns
Figure 10:VHDM-HSD 8 row Signal layout
Electrical Data: Impedance: Figure 11 shows typical data plots for the longest and shortest VHDM-HSD 8 row impedance performance @ 75ps 10-90%
Connector Products Division
Date:6/17/2004 Page 10 of 15
Figure 11: Molex VHDM-HSD 8 row pair A10B10 @ Tr=75 ps 10-90%
VHDM-HSD 5 Row Electrical Data: All data shown below was measured driving the closed 5 pair contributors. VHDM-HSD 5 row data NEXT:
Measured Near-End Crosstalk @ various rise times
Tr @ 10-90% Tr @ 20-80% AB DE 50ps 38ps 4.15% 3.43% 75ps 56ps 3.64% 3.01%
100ps 75ps 3.34% 2.65% 200ps 150ps 2.13%% 1.51% 300ps 225ps 1.88% 1.32%
Data duplicated from Teradyne Electrical Characterization report,TB-2082
110 Ω PCB
110 Ω conn interface
68 Ω Backplane via
84 Ω Daughtercard via
Blue: Longest row Green: Shortest Row
Connector Products Division
Date:6/17/2004 Page 11 of 15
VHDM-HSD 5 row data FEXT:
Measured Far-End Crosstalk @ various rise times Tr @ 10-90% Tr @ 20-80% AB DE
50ps 38ps -4.23% -4.73% 75ps 56ps -3.68% -4.3%
100ps 75ps -3.34% -3.89% 200ps 150ps -2.08% -2.72% 300ps 225ps -2.04% -2.59%
Data duplicated from Teradyne Electrical Characterization report,TB-2082 VHDM-HSD 5 Propagation Delay:
HSD 5 row Prop Delay Pin Electrical Length E–E’ 146ps D-D’ 136ps B-B’ 104ps A-A’ 96ps
These numbers do not include any board effects VHDM-HSD 6 Row Electrical Data: All data shown below was measured driving the closed 5 pair contributors. VHDM-HSD 6 row data NEXT:
Measured Near-End Crosstalk @ various rise times Tr @ 10-90% Tr @ 20-80% AB DE
50ps 38ps 2.195% -2.50% 75ps 56ps 2.01% -2.15%
100ps 75ps 1.91% -1.8% 200ps 150ps 1.64% -1.06% 300ps 225ps 1.29% -0.87%
Data duplicated from Teradyne Electrical Characterization report,TB-2082 VHDM-HSD 6 row data FEXT:
Measured Far-End Crosstalk @ various rise times Tr @ 10-90% Tr @ 20-80% AB DE
50ps 38ps -4.38% -3.58% 75ps 56ps -4.18% -3.26%
100ps 75ps -3.71% -2.78% 200ps 150ps -2.51% -1.46% 300ps 225ps -1.53% -0.92%
Data duplicated from Teradyne Electrical Characterization report,TB-2082
Connector Products Division
Date:6/17/2004 Page 12 of 15
VHDM-HSD 6 Propagation Delay: VHDM-HSD 6 row Prop Delay
Pin Electrical Length E–E’ 145ps D-D’ 138ps B-B’ 85ps A-A’ 96ps
These numbers do not include any board effects VHDM-HSD 8 Row Electrical Data: All data shown below was measured driving the closed 8 pair contributors. VHDM-HSD 8 row data NEXT:
Measured Near-End Crosstalk @ various rise times
Tr @ 10-90% Tr @ 20-80% AB DE GH 50ps 38ps 3.95% 2.32% 2.76% 75ps 56ps 3.33% 2.08% 2.65%
100ps 75ps 2.85% 1.69% 2.18% 200ps 150ps 1.56% 0.85% 1.24% 300ps 225ps 1.30% 0.62% 1.06%
Data duplicated from Teradyne Electrical Characterization report,TB-2082 VHDM-HSD 8 row data FEXT:
Measured Near-End Crosstalk @ various rise times Tr @ 10-90% Tr @ 20-80% AB DE GH
50ps 38ps -4.18% -2.99% -4.01% 75ps 56ps -3.8% -2.48% -3.51%
100ps 75ps -3.2% -2.16% -3.10% 200ps 150ps -1.9% -1.21% -1.77% 300ps 225ps -1.36% -0.80% -1.26%
Data duplicated from Teradyne Electrical Characterization report,TB-2082 VHDM-HSD 8 Propagation Delay:
VHDM-HSD 8 row Prop Delay Pin Electrical Length H-H’ 200ps G-G’ 194ps E–E’ 151ps D-D’ 145ps B-B’ 108ps A-A’ 99ps
These numbers do not include any board effects
Connector Products Division
Date:6/17/2004 Page 13 of 15
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 -0.2 2.0
-0.5 0.0 0.5 1.0 1.5 2.0 2.5
-1.0
3.0
Time, ns
% NEXT
Molex VHDM-HSD 8 row A 10B10
Figure 12: VHDM-HSD 8 row pair A10B10 NEXT, all other lines driven @ Tr=75 ps 10-90%
VHDM-HSD 8 Row Frequency Domain Data: Figures 13 thru 16 show typical differential I/L and R/L data for the longest and shorted row on theVHDM-HSD 8 connector. Please note that board effects have not been de-embedded from this data
Figure 13: VHDM-HSD 8 row R/L for differential pair A10-B10
10db/div
Connector Products Division
Date:6/17/2004 Page 14 of 15
Figure 14: VHDM-HSD 8 row I/L for differential pair A10-B10
Figure 15:VHDM-HSD 8 row R/L for differential pair G8H8
3db/div
3 db @ 2.7 Ghz
10db/div
Connector Products Division
Date:6/17/2004 Page 15 of 15
Figure 16: VHDM-HSD 8 row I/L for differential pair G8-H8
3db/div
3 db @ 2.47 Ghz