PRESENT STATUS OF HIGH-POWER LPP-EUV SOURCE FOR HVM · GPI has been a main enabler of the progress of EUV light source. (Pre-pulse technology, Debris mitigation , etc.) Now, the out

Copyright © Gigaphoton Inc.

PRESENT STATUS OF HIGH-POWER LPP-EUV SOURCE FOR HVM

Dr. Akiyoshi Suzuki and Dr. Hakaru Mizoguchi

Gigaphoton Inc, JAPAN

IWAPS 2017 October 13, 2017

Agenda

∎ Introduction

∎HVM Ready System Performance Progress and Target

▸Power Scalability

▸Collector Mirror Life Extension

∎ Availability Improvement

∎ Summary


INTRODUCTION


Introduction

∎ It is expected HVM EUV lithography will be realized by 2019, but EUV source has been the No.1 critical issue for years.

▸ The output power of 250W has not been achieved, but is now within our scope.

▸ For HVM, the availability of the source has come to be taken much attention.

∎ Gigaphoton has been a main enabler of LPP EUV source since 2002, and invented many innovative technologies;

▸ Sn+CO2 Laser configuration

▸ Pre-pulse technology

▸ Debris mitigation with super conducting magnets, etc.

The status of EUV light source gives greatest influence to EUV HVM.


EUVL Concerns in 2017

Light source

Resist

Mask

Light source

Resist

Mask

In EUVL Symposium 2017, light source is still counted as No.1 issue in the short term.


2016 Lithography Source Highlights of Gigaphoton

DUV ∎ #1 Market share

In 2016, Gigaphoton achieved 60% share

∎ A new Green Innovation Roadmap

Environmentally friendly and economical

∎ Ne crisis countermeasures

Achieved 10,000 Kiloliter/Y Ne reduction

EUV ∎ Pilot system for HVM started integration.

∎ >100W average power with 5% CE on Pilot system

∎ Demonstrated 250W capabilities with 4% CE at 100KHz

2016 2015

KrF

ArF

KrF ArF

34

60

43

73

TOTAL SHIPMENTS

94 TOTAL SHIPMENTS

116 KrF

ArF ArF

KrF

ArF


The History of EUV Light Source Outputs

250W Target

100W

2011 ASML 2017 Gigaphoton

10W

1W

GPI has been a main enabler of the progress of EUV light source. (Pre-pulse technology, Debris mitigation , etc.)

Now, the out put power is getting close to the target.

Power obtained

Power desired


V.Banine: 2011 Int.WS on EUV Lithography (13-17 June 2011, Hawaii, U.S.A.)

HVM READY PERFORMANCE PROGRESS AND TARGETS


Agenda

∎ Introduction





∎ Summary

October 13, 2017 IWAPS 2017

Gigaphoton’s LPP Source Concept

October 13, 2017 IWAPS 2017

1. Dual-wavelength shooting concept

High CE attained with CO2 and pre-pulse solid-state lasers

2. EUV specific Hybrid CO2 laser system

Short pulse/High repetition rate oscillator

combined with commercial cw-amplifiers

3. Debris mitigation with Super conductive

magnets (SM3)

4. Accurate shooting system

Stable droplet generation and shooting beam control

5. Out-of-band light reduction

Grating structured collector mirror

Droplet Generator Superconductive

Magnet

Collector Mirror Droplet Catcher

CO2 Pulse Laser

Pre-pulse Laser

Ion Catcher

Intermediate Focus

Tin droplet

Shooting point

Superconductive Magnet

Ion Catcher

Pilot #1 EUV Chamber

From Proto #2 to Pilot #1 for HVM


System Specification Target

Proto#1 Proof of Concept

Proto#2 Key Technology

Pilot#1 HVM Ready

Target Performance

EUV Power 25W >100W 250W

CE 3% > 4% > 5%

Pulse Rate 100kHz 100kHz 100kHz

Output Angle Horizontal 62°upper 62°upper

Availability ~1 week ~1 week >80%

Technology Droplet diameter 20 - 25㎛ < 20㎛ < 20㎛

CO2 Laser 5kW 20kW 27kW

Pre-pulse Laser picosecond picosecond picosecond

Collector Mirror Lifetime Used as development

platform 10 days > 3 months


Key Performance Status and its Target

2015 2016 2017 Current

2018

In-band power (Average Power)

87W (83W)

113W (111W)

113W (91W)

250W

Collector lifetime*1 No data -10%/Bpls *3 -0.4%/Bpls -0.2%/Bpls

Availability*2 15% 44% 53% > 80%

*1, Collector lifetime estimation has been started from 2017 *2, Max availability in 4 week operation. *3, Main issue was capping layer performance.

Proto #2 Pilot #1


HVM READY POWER SCALABILITY


Pre-Pulse Technology

Higher CE and Power • Optimum wavelength to transform droplets into fine mist • Higher CE achievement with ideal expansion of the fine mist

Long Life Chamber • Debris mitigation by magnetic field • Ionized tin atoms are guided to tin catcher by magnetic

field

Droplet (liquid)

Fine-mist (liquid)

mist size <300µm

droplet <20µm

Magnetic Field Ion Guiding Gas Etching

Ions with low energy trapped by B field

Remaining atoms to mirror etched by gas

pre-pulse laser

main-pulse laser

Ion ~0

Plasma (gas)

300m CO2 laser

Pre-pulse enables the size matching between the size of an droplet and CO2 laser beam

KEY TECHNOLOGY 1


Pre-Pulse Optimization

main-pulse

Pre-pulseCO2 laser

pre-pulse laserDroplet generator

• The mist shape of a picosecond pre-pulse is different from that of a nanosecond

• Nano-cluster distribution could be a key factor for high CE

simulation

Pulse duration time of a pre-pulse is essential to high CE. IWAPS 2017 October 13, 2017

Latest LPP Source Systems Experiment Update

301W with 4% CE

268W with 3.5% CE

256W with 15% Dose Margin

Proto#2: 250W with 4% CE at 100KHz

With proto #2, we have already demonstrated 250W feasibility.


Pilot System Driver Laser and PPL System Improvements

OSC OSC PA1 MA1 MA2 MA3 Plasma Point

Pilot #1

Proto #2

OSC Pre-Amp AMP

Pilot#1

Proto#2

OSC Pre-Amp AMP

Due to EO isolator damage from back reflection

Proto#2

Pilot#1

Convers

ion E

ffic

iency

(%

)

Specially designed new CO2 lasers have improved beam quality to give higher CE.

AMP

AMP

AMP

AMP

AMP

AMP

Pre-Amp

Pre-Amp


Droplet Generation and Shooting System

Z Flow camera

X flow camera

DLG X-Z Stage

DLG

Laser (CO2, Fiber)

PZT device

Timing sensor

X

Z

Droplet catcher

Laser mirror Plasma sensor

Y

OSC

LPP EUV Source Shooting Control System

Proto#2 Pilot#1

Droplet Speed (㎧) 60 90

Back Pressure (MPa) 20 40

Max Repetition Rate (kHz) 80 100

High speed droplet control/shooting technology was successfully developed.

Plasma point


Dose Performance (Apr.-17) Burst pattern: 1000ms ON, 333ms OFF Dose error: including pre-exposure phase(10ms) Die yield: defined by 0.16% dose error

Performance

Average power at IF 85W

Dose error (3 sigma) 0.04%

Die yield (< 0.16%) 99.4%

Operation time 143h

Pulse Number 19Bpls

Duty cycle 75%

In-band power 113W

Dose margin 35%

CE 4.4%

Availability 4wk 32%

Collector lifetime -10%/Bpls

Repetition rate 50kHz

CO2 power 12kW

Note

Dose error was mainly due to droplet combination failure and it was improved by droplet generator improvement(but not perfect).

Droplet combination failure


Pilot #1 is now under construction, and 113W output power has already been achieved for 143h.

High Power EUV Source for High NA EUV Exposure Tool

2% 3% 4% 5% 6% 7% 8%15 1.5 0.0 0.0 0.0 0.0 0.0 0.0 0.050 5 19.1 28.7 38.2 47.8 57.3 66.9 76.4

100 10 46.4 69.6 92.8 116.0 139.2 162.4 185.6150 15 73.7 110.6 147.4 184.3 221.1 258.0 294.8200 20 101.0 151.5 202.0 252.5 303.0 353.5 404.0250 25 128.3 192.5 256.6 320.8 384.9 449.1 513.2300 30 155.6 233.4 311.2 389.0 466.8 544.6 622.4350 35 182.9 274.4 365.8 457.3 548.7 640.2 731.6400 40 210.2 315.3 420.4 525.5 630.6 735.7 840.8450 45 237.5 356.3 475.0 593.8 712.5 831.3 950.0500 50 264.8 397.2 529.6 662.0 794.4 926.8 1059.2550 55 292.1 438.2 584.2 730.3 876.3 1022.4 1168.4600 60 319.4 479.1 638.8 798.5 958.2 1117.9 1277.6650 65 346.7 520.1 693.4 866.8 1040.1 1213.5 1386.8700 70 374.0 561.0 748.0 935.0 1122.0 1309.0 1496.0750 75 401.3 602.0 802.6 1003.3 1203.9 1404.6 1605.2800 80 428.6 642.9 857.2 1071.5 1285.8 1500.1 1714.4850 85 455.9 683.9 911.8 1139.8 1367.7 1595.7 1823.6900 90 483.2 724.8 966.4 1208.0 1449.6 1691.2 1932.8950 95 510.5 765.8 1021.0 1276.3 1531.5 1786.8 2042.0

1000 100 537.8 806.7 1075.6 1344.5 1613.4 1882.3 2151.2

CO

2 la

ser

ave.

Pow

er [

kW]

EUV　ave.Power[W]@100kHz

CO

2 la

ser

Ene

rgy

[mJ]

Conversion Efficiency [%]

HVM1 HVM2 HVM3

EUV Power 250W 300W 500W

Pulse Rate 100kHz 100kHz 100kHz

CE 4.5% 5% 5%

CO2 Laser Power 25kW 25kW 40kW

320.8

Our LPP system has capability to give 300~500W output power.


HVM READY LONG-LIFETIME COLLECTOR MIRROR


“SM3”: Superconducting Magnet Mitigation Method

Gigaphoton’s Magnetic Debris Mitigation concept

Higher CE and Power • Optimum wavelength to transform droplets into fine mist • Higher CE achievement with ideal expansion of the fine mist

Long Life Chamber • Debris mitigation by superconducting magnetic field • Ionized tin atoms are guided to tin catcher by magnetic

field

Droplet (liquid)

Fine-mist (liquid)

Plasma (gas)

mist size <300µm 100% vaporization

to atom

droplet <20µm

CO2 laser irradiation ~100% ionization

Magnetic Field Ion Guiding Gas Etching

Ions with low energy trapped by B field

Remaining atoms to mirror etched by gas

pre-pulse laser

main-pulse laser

No Fragments Atom ~0 Ion ~0 KEY TECHNOLOGY 2

SM3 is the basis of debris mitigation system. IWAPS 2017 October 13, 2017

Difference of Deposition to the Dummy Mirror

Capping layer disappearance Blister generation

Capping layer deformation Blister generation

Capping layer survived No blister generation

Mo/Si

Capping

Sample A 124W, 7.3Bpls

Sample B 124W, 6.1Bpls

Sample C 124W, 7.3Bpls

The capping layer material has great influence on ML durability.


Etching and Dissociation of Sn on the Collector Mirror Surface

Chemical Equilibrium on the Mirror Surface

Tin ionization & magnetic guiding

▸ Effective ionization by double pulses

▸ Confinement of Sn ions with magnetic field

▸ Guidance to exhaust ports and discharge

Protection & cleaning of a collector with H2 gas

▸ Deceleration of high energy tin neutrals to prevent sputtering.

▸ Etching of deposited tin by H radical gas*.

▸ Gas flow optimization

▸ Cooling system to prevent decomposition of etched tin (SnH4)

*H2 molecules are dissociated to H radical by EUV-UV radiation from plasma.

Both physical and chemical countermeasures must work together. October 13, 2017 IWAPS 2017

Collector Lifetime Status after improvement Operation: 100W in Burst, (= 2mJ x 50kHz), 33% duty cycle, 30W in average.

Proto#2 31W Low heat load with condition C

Far field pattern in test condition C

0.1Bpls 15.8Bpls 9.6Bpls

Edge Tin deposition by H2 flow convection

Proto#2 31W low heat load with condition A

Pilot#1 85W high heat load with condition B

-0.4%/Bpls

Reflectivity loss: 0.4%/Bps was achieved with 100W burst operation.


AVAILABILITY IMPROVEMENT TOWARD HVM


Agenda

∎ Introduction





∎ Summary


Availability Analysis

∎ Downtime causes are classified into modules.

Idling time: Time for waiting operator

Availability breakdown

Downtime breakdown

The reasons of downtime were analyzed, and the countermeasures are on-going.

Time for gas replacement in CO2 pre-amplifier


Availability Potential

The potential availability is 89%.

(Availability: 64% / Idle time: 25%)

Dose error : System stopped at > 2% dose error (3 sigma) /10kpls slit and error was not recovered by automatic function Idle time: Time for waiting operators.

There is no operator on Sat. and Sun.

24 hour x 7 days definition: Unmanned operation between 9pm thru 8am

2 week availability potential test

Day


Improvement Plan >80% availability

Current Dec-17 2018

Availability

Demonstrated 64% N/A N/A

Calculated or Target (89%)

incl. Idling time >80%

>90% Target

Vessel including Collector Lifetime 3.0 months 6 months 6 months

Droplet generator Lifetime 0.5 months <- 2 months

Maintenance time 24 hour <- 16 hours

CO2 Lase chamber Lifetime 24 months <- <-

Maintenance time 36 hours <- <-


SUMMARY


Summary


Gigaphoton will deliver the EUV source for HVM by 2019 .

∎ Pilot#1 for HVM is now under construction, and shows promising results;

▸ Demonstrated 113W in-burst power at 75% duty ( 85W average ) for 143 hours based on the preliminary results of CE 5%, 250W power with Proto#2

▸ Next target : 250W full specification operation with long term by 1H 2018.

∎ Pilot#1 Collector Mirror test shows HVM capable lifetime;

▸ Superconducting Magnet Mitigation Method “SM3” realized the reflectance degradation rate of 0.4%/Bpls at over 100W level operation (in burst mode, up to 30Bp).

∎ Pilot#1 shows HVM ready availability;

▸ Pilot#1 system achieved the potential availability of 89% (2week-average).

Layout of 250W EUV Light Source Pilot #1 EUV Exposure Tool

First HVM EUV Source

• 250W EUV source

Operational specification

(Target) HVM Source

Perform

ance

EUV Power > 250W

CE > 4.0 %

Pulse rate 100kHz

Availability > 75％

Techno

logy

Droplet

generatorDroplet size < 20mm

CO2 laser Power > 20kW

Pre-pulse

laser

Pulse

durationpsec

Debris

mitigation

Magnet,

Etching> 15 days ( >1500Mpls)

Operational specification

(Target) HVM Source

Perform

ance

EUV Power > 250W

CE > 4.0 %

Pulse rate 100kHz

Availability > 75％

Techno

logy

Droplet

generatorDroplet size < 20mm

CO2 laser Power > 20kW

Pre-pulse

laser

Pulse

durationpsec

Debris

mitigation

Magnet,

Etching> 15 days ( >1500Mpls)

> 80 %


Acknowledgements

October 13, 2017

Thank you for co-operation: Dr. Akira Endo :HiLase Project (Prague) and Prof. Masakazu Washio and others in Waseda University Dr. Kentaro Tomita, Prof. Kiichiro Uchino and others in Kyushu University Dr. Jun Sunahara, Dr. Katsunori Nishihara, Prof. Hiroaki Nishimura, and others in Osaka University

Mitsubishi electric CO2 laser amp. develop. team: Dr. Yoichi Tanino*, Dr. Junichi Nishimae, Dr. Shuichi Fujikawa and others * The authors would like to express their deepest condolences to the family of Dr. Yoichi Tanino who suddenly passed away on February 1st, 2014.

Thank you to my colleagues: EUV development team of Gigaphoton: Hiroaki Nakarai, Tamotsu Abe, Takeshi Ohta, Krzysztof M

Nowak, Yasufumi Kawasuji, Hiroshi Tanaka, Yukio Watanabe, Tsukasa Hori, Takeshi Kodama, Yutaka Shiraishi, Tatsuya Yanagida, Tsuyoshi Yamada, Taku Yamazaki, Takashi Saitou and other engineers

Thank you for funding: EUV source development funding is partially support by NEDO (New Energy and Industrial Technology Development Organization) in JAPAN

IWAPS 2017

Copyright © Gigaphoton Inc.

THANK YOU

IWAPS 2017 October 13, 2017 IWAPS 2017

Documents

PRESENT STATUS OF HIGH-POWER LPP-EUV SOURCE FOR HVM · GPI has been a main enabler of the progress of EUV light source. (Pre-pulse technology, Debris mitigation , etc.) Now, the out