71
POWER SUPPLY FOR SOLID STATE LASERS by ZHAN MEI, B.S. A THESIS IN ELECTRICAL ENGINEERING Submitted to the Graduate Faculty of Texas Tech University in Partial Fulfillment of the Requirements for the Degree of MASTER OF SCIENCE IN ELECTRICAL ENGINEERING i^ppro^d May, 2001

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POWER SUPPLY FOR SOLID

STATE LASERS

by

ZHAN MEI, B.S.

A THESIS

IN

ELECTRICAL ENGINEERING

Submitted to the Graduate Faculty

of Texas Tech University in Partial Fulfillment of the Requirements for

the Degree of

MASTER OF SCIENCE

IN

ELECTRICAL ENGINEERING

i^ppro^d

May, 2001

TABLE OF CONTENTS

ACKNOWLEDGEMENTS ii

ABSTRACT iii

LIST OF TABLES iv

LIST OF FIGURES v

L INTRODUCTION 1

n. BASIC PRINCIPLES AND THEORY 3

2.1 Step-Down (Buck) Converter 3

2.2 Basic Constraints to Transformer 10

m. PRACTICAL SELECTION OF COMPONENTS 16

3.1 UC3827N-1 Chip 16

3.2 Power Semiconductor Devices 18

3.3 Transformer Design 21

3.4 Simulation of Circuit 27

IV. TEST PLATFORM AND RESULT 38

4.1 Buck and Push-PuU Signals Realizafion 38

4.2 Push-Pull Isolated Buck Circuit With Feedback 42

4.3 Debug and Test 45

4.4 Physical PC Board 57

V. CONCLUSIONS 59

REFERENCES 61

ACKNOWLEDGEMENTS

I would like to thank all people who have given help in this project.

I would first like to thank Dr. James C. Dickens for offering me the opportunity.

Under his guidance, this project has enriched me with some priceless experiences, which

I will cherish forever. This project would not complete without his direct and help.

I would like to thank Dr. Michael Giesselmann and Dr. Neuber for serving on my

thesis committee and reviewing my paper.

I would like to thank Mic Cevallos for valuable hours of discussion. His

continuous support was indispensable for success of this project. I would like to thank

Efren Brito for reviewing my paper. He spent a lot time to improve my language and

without his help, this paper can not be written like this. I would like to thank my

colleagues Jano Blakewall and Roberto Izquierdob in the lab.

Among the technical and secretarial staff, I would like to thank Daniel Garcia for

his friendship.

I would like to thank my friends Kaye and Raymond who helped me a lot since I

came here. They taught me and encouraged me to face difficulties.

I would like to thank my friend Tang who helped me and taught me a lot during

the past two years.

I would like to thank my parents for their support and patience since I left home.

11

ABSTRACT

A compound converter was developed to get low voltage (2.5V) out and high

current (lOA) out.

The buck converter used Pulse Width Modulation (PWM). The PWM control

funcfion was contained in the UC3827N-1 controller chip. A voltage feedback loop was

used to control the duty cycle of the buck to produce a desired output voltage. A push-

pull operation followed the buck operation for high frequency.

The design specifications were:

• Input voltage = 50V

• Output voltage = 2.5V

• Output current = lOA

• Switching frequency = 50kHz

Two PC boards were designed. One had a 175mil output trace and was tested for

5A current output. The other one had a 500mil output trace and was tested for lOA

current output. Two types of transformers were designed, one used the core of P36/22

and the other used the core of P30/19.

Ill

LIST OF TABLES

3.1 Major Rating and Characteristics of 50SQ100 19

3.2 Major Rating and Characteristics of 47CTQ020 19

3.3 P36/22 Core Transformer 26

3.4 P30/19 Core Transformer 26

4.1 Power Supply Measurements for the 175mil Trace PCB 52

4.2 Power Supply Measurements for the 500mil Trace PCB 52

IV

LIST OF HGURES

2.1 Step-Down DC-DC Converter circuit 3

2.2 Waveform of output voltage 4

2.3 Buck converter with insertion of low-pass filter 4

2.4 Buck converter when switch on 5

2.5 Bock converter when switch off 5

2.6 Buck converter continuous conduction 6

2.7 Current at the boundary of continuous-discontinuous condition 7

2.8 Discontinuous condition 8

2.9 Converter characteristics with constant Vd 9

2.10 Converter characteristics with constant Vo 10

2.11 Hysteresis curve 15

3.1 Block diagram of UC3827N-1 16

3.2 Connection diagram of UC3827N-1 17

3.3 Symbol, actual and idealized I-V characteristic of diode 18

3.4 Block diagram of MOSFETIRF2807S/L 20

3.5 Normal push-pull isolated buck circuit 22

3.6 Sub-circuit and symbol of UC3827N-1 chip 27

3.7 Simulafion of buck converter 29

3.8 Basic transformer simulation circuit 30

3.9 Simulafion circuit of transformer using a P36/22 core and a P30/19 core 31

3.10 Input and output system with feedback 32

3.11 Feedback loop Amplifier 33

3.12 Feedback loop circuit 35

3.13 Electronics power supply system 35

3.14 Simulafion circuit with a P36/22 transformer core 36

3.15 Simulafion result with a P36/22 transformer core 36

3.16 Simulafion circuit with a P30/19 transformer core 37

3.17 Simulation result with a P30/19 transformer core 37

4.1 Pulsed width modulation 40

4.2 Buck and push-pull signal realization 41

4.3 Buck signal 42

4.4 Push and Pull signals 42

4.5 Buck and push-pull circuit 43

4.6 Isolation amplifier 44

4.7 Basic feedback control loop 44

4.8 Circuit design 45

4.9 Component layer of PCB with 175mil traces 46

4.10 Solder layer of PCB with 175mil traces 47

4.11 Component layer of PCB with 500mil traces 47

4.12 Solder layer of PCB with 500mil traces 48

4.13 Output voltage without load 50

4.14 Input signals for push-pull transformer 50

4.15 Output signals for push-pull transformer 51

vi

4.16 Current waveform of M1 53

4.17 Power waveform of M2 54

4.18 Block diagram of MOSFETIRF3710S/L 56

4.19 Power waveform of M2 with MOSFETIRF3710S/L 57

4.20 Physical PCB with 175mil trace 58

4.21 Physical PCB with 500mil trace 58

Vll

CHAPTER I

INTRODUCTION

This paper will discuss the design of a low voltage and high current de power

supply. This power supply will be used for Integrated Solid State Lasers.

Two basic dc-dc converter topologies are used in switching power supplies:

1. Step-up (boost) converter,

2. Step-down (buck) converter.

The first step in selecting a topology is to decide whether the output voltage is

higher or lower than the input voltage. A step-down converter was selected in this

project due to the requirement that the output voltage must be lower than the input

voltage.

In general, the available duty cycle for a converter can not be outside the limits of

approximately 10% minimum or 80% maximum; and transformers should have a

maximum primary to secondary turns ratio of 10:1 or a minimum of 1:10 [1]. Due to the

fairly large conversion ratio desired in this situation, a compound converter was designed.

The compound converter includes two stages:

• Buck converter step down power supply input,

• Push-pull transformer step down output of buck converter.

Current and voltage control model feedback loops can be used in switching power

supplies. Current control mode has two feedback loops, one to control the instantaneous

current, and one to control the capacitor voltage. Voltage control mode just has one

feedback loop, which is used to control the capacitor voltage. In this project, voltage

control mode was used.

Power electronics is one of the broadest growth areas in electrical technology. As

voltage for power supply becomes lower and lower (3.3V for portable computer), the

most important design priorities are compact size and high efficiency. The improvements

and quick development in semiconductors make these design priorities possible to meet.

Therefore, the design of a power supply using electronics for most effective power

delivery is the focus of this paper.

CHAPTER n

BASIC PRINCIPLES AND THEORY

In this chapter, the basic circuit of a buck converter is introduced as a means of

reducing the dc voltage. The characteristics of it are presented, and, the principles of

transformers are illustrated.

2.1 Step-Down (Buck) Converter

The buck converter reduces the dc voltage using ideal switches, inductors, and

capacitors that do not dissipate power. For example, when the switch is closed, its

voltage is zero and the current is zero when the switch is open. The basic ideal switch

circuit can be seen in Figure 2.1. The instantaneous output voltage VQ waveform is

shown in Figure 2.2 [2].

The output voltage is

1 1 f

Ts Ts Ts (2.1)

y V =—^V = KV u *0 » , ^control ^^ ^ controlH-

(2.2)

Figure 2.1 Step-Down DC-DC Converter circuit

V Ol

t,

1 / . ^d

, 1

Vo

V

'on - * • * - ^ o f f - * l

T = —-• fs

Figure 2.2 Waveform of output voltage

Ideally, whenever the switch is closed the voltage drop across the switch is going

to be zero, hence the power loss (product of voltage drop across it and the current through

it) is zero. Whenever the switch is open, no current follows; and the power loss is zero.

2.1.1 Continuous-conduction

When the inductor current flows continuously, the mode is operating in

continuous conduction. To remove the switching harmonics and pass only the dc

component of input to the output, an appropriate low-pass filter was chosen. The circuit

is shown in Figure 2.3.

U—'-' ('

Vd

O , H O ^

")

7

h i

\D

k

L

C

d

- Vo

'-0

Figure 2.3 Buck converter with insertion of low-pass filter

In Figure 2.4, the switch is closed with the diode reverse biased, the source

provides energy to the load as well as to the inductor. The inductor voltage is given by

4

Vi = Vout - Vin . (2.3)

Figure 2.4 Buck converter when switch on

In Figure 2.5, the switch is open. The inductor now acts as a source and switches

polarity forward biasing the diode. Inductor current flows though the diode and energy is

transferred to the load. Inductor current keeps flowing due to the inductive energy

storage. The inductor voltage represented by

V, = -Vout (2.4)

Figure 2.5 Buck converter when switch off

Ideally, the output capacitor is assumed to be very large so the load can get a

constant output voltage.

In steady-state operation, the inductor current waveform must repeat itself from

one period to the other one. Therefore, the integral of the inductor voltage v, o\er a time

period must be zero:

T. 1 s ton Ts

\vid^=\vidt+\vidt = 0 (2.5) ton

{V,-V^)ton = V^{Ts-ton) (2.6)

D = ton (2.7)

y. = 'fv.=Dv,. (2.8)

Assuming the input power equals the output power, then

Pin = Pout (2.9)

yoh=yj, (2.10)

h n D (2.11)

Figure 2.6 shows continuous operafion of step-down circuit [2].

Figure 2.6 Buck converter continuous conduction

The switch period, T^, depends on the switching speed of the semiconductor

devices.

r = ^ =ton + toff (2.12)

The complement of the duty rafio is defined as (1-D). By varying the duty ratio D

in a range of 0 to 1, VQ can be controlled.

2.1.2 Boundary between confinuous and discontinuous conduction

The current at the boundary of continuous-current-conduction is shown in Figure

2.7 [2]. The inductor current goes to zero at the end of the off interval. The average

inductor current is

7 ,^ = {Vin-Vout) -i LB

( DTs^

,2L , = /

OB (2.13)

where the subscript B refers to the boundary. Therefore, if the average inductor current

becomes smaller than ^^^, the converter will operate in the discontinuous conduction

mode.

h M ih)

Figure 2.7 Current at the boundary of continuous-discontinuous condition

2.1.3 Disconfinuous-Conducfion

First, discontinuous conduction with constant V^ is discussed.

In this application, Vj remains constant and VQ is controlled by varying the duty

cycle D. The average inductor current at the edge of the continuous-conduction mode is

r hs = D(^-D)

2L (2.14)

Equafion 2.14 shows that the output current required for a continuous-conduction

mode is maximum at D=0.5:

LB,max

TsV,

SL (2.15)

/ . . = 4 /^^_Z)( l -Z) ) (2.16)

Figure 2.8 indicates voltage and current [2].

*L. peak

Figure 2.8 Discontinuous conduction

The voltage ratio is calculated by equation 2.17

Vout

~vin~ D

D~-¥-{IoutlIi^_^) 4

(2.17)

The voltage rafio is plotted as a function of out. for various values of duty LB,max

ratio keeping V constant and is shown in Figure 2.9 [2].

1.0 D = 1.0

Vj = Constant

0.9

0.75

0.50

0.25

0

r\ ^^ " ^^^

\ ^^"^"v^ '

V ..-'-'

0.7

0.5

0.3

0.1

— — 1 1 1 1 .

0.5 1.0 1.5 2.0 ^ i m mat'

'LB,m»x

LB. max

8L

Figure 2.9 Converter characteristics with constant Vj

Second, discontinuous conduction with constant Vo is discussed.

In this section, input voltage will fluctuate, but the output voltage will remain

constant by adjusting the duty ratio D.

The average inductor current at the edge of continuous-conduction mode is

fTsVA hs = (^-D^ 2L

(2.18)

D=0:

Maximum output current required for a continuous-conduction mode occurs at

LB,max

TsV,

2L (2.19)

T =T {\-D), 1 LB 1 LB.max ^ '

(2.20)

The voltage rafio is calculated by equation 2.21,

^^VQ loutll^^^^^,,^

V. l - \ (2.21)

The duty ratio as a function of "jA is plotted for various values of ^ LB,max

keeping v^ constant and is shown in Figure 2.10 [2].

D

1.0

0.75

0.50

0.25

Vg = Constant

\ \

\ \

Discontini

\ \

wus \

\

^ = 2.0 Vo

^ = 5.0 Vo

0.25 0.50 0.75 1.0 1.25 (—Li—)

fLB.

^iJB, max T V

— ' o 2L

Figure 2.10 Converter characteristics with constant VQ

2.2 Basic Constraints to Transformer

The transformer does not store energy and is used to transfer energy from the

primary side to the secondary side without a time delay.

2.2.1 Basic Magnetic theory

The force of attraction or repulsion between two magnetic poles of strength /?zj

and m2 is directly proportional to the product of their strength and is inversely

proportional to the square of the distance between them.

10

Magnefizing force is defined as the force per unit pole strength or

H= — = ^ (2.22)

where F is the force of attracfion or repulsion depending on the polarity.

r is the distance between the magnetic poles,

fi is the constant of proportionality, called permeability.

Flux density is obtained by multiplying both sides of equafion 2.22 by ji

m B = iuH=^. (2.23)

The relationship between B and H is determined by the core characteristics. For

free space or air,

B = iHoH (2.24)

where |Uo is the permeability of the free space.

The core permeability \i is expressed as a product of relative permeability: fir and

Mo-

M=MoM. (2.25)

If a total magnetic flux O is passing through a surface S having an area A, then

the total flux O is equal to the integral of the normal component of the flux density over

the surface.

0 = JB.dA (2.26) surfaces

where dA is the vector area element and its direction is normal to the surface.

11

In magnetic circuits, the proportionality constant is called reluctance R. It is

directly proportional to the length of the magnetic path and is inversely proportional to

the area through which the flux flows.

R = — (2.27)

2.2.2 Faraday's Law

The flux induces a voltage V(t) given by

JO v{t) = -— . (2.28)

dt For a uniform flux distribution, V(t) can be rewritten as

m = A , ^ . (2.29) dt

2.2.3 Ampere's Law

If a uniform strength passes through an element of length in the magnetic field, a

force is generated and is given by

F = Hl. (2.30)

The ideal transformer is essentially a two-winding inductor. One is used for

storing energy in the transformer, and the other is used for dumping the core energy into

the output. The first coil is called the primary winding and the second coil is called the

secondary winding. The voltage and current equations are given by

N » i secondary -.j /'") '2 1 \

secondary «T primary ^ ^ / primary

12

J _ primary j , ^ ^^s secondary j.j ^ nrimnr\ • \^"^^/

secondary

where Vprtmary is the voltage applied to the primary winding,

^primary is the uumbcr of turns in the primary winding,

Iprimary IS the currcut flowlug in the primary winding,

ysecondary is the voltagc iuduccd iu the secondary winding,

^secondary is the uumbcr of turns in the secondary winding,

hecondary is the currcnt fiowing in the secondary winding.

Multiplying equation2.31 by equation 2.32

V I =V I (2 33) secondary secondary primary primary ' v • /

Dividing equation 2.32 by equafion 2.33 V

secondary r^ J secondary

secondary

(N \ sec ondary

N • primary

2

.z (2.34)

primary

In the ideal transformer, the core reluctance R approaches zero. Equations 2.35,

2.36 and 2.37 are given by

0 = njii + n2i2 (2.35)

JO V, = / 2 ,

^^ (2.36) JO

V2 = « 2 dt

n, «2 . (2.37)

13

2.2.4 Hysteresis Curve

Hysteresis is a characterisfic of a magnetic material describing how a change in

magnetization lags the application of a magnetizing force. During an interval of one

traverse of the hysteresis loop, the energy delivered to a coil containing a ferromagnetic

core is

E = jvidt (2.38)

where v is in volts,

/ is in amperes,

t is in seconds, and

Eis in joules.

V and H can be expressed as

v = A^-^xlO"' (2.39) dt

H = ^ . (2.40)

As the magnetizing fore H is increased from zero, the fiux density B increases

proportionally. When H reaches a certain value, B begins to level off. As H continues to

increase, B reaches a saturation value B^. Once saturation is reached, a further increase

in H will not increase B. If / / is decreased to zero, B will fall back along a different path

to residual value B2. This indicates that the material continues to be magnetized even

without the magnetizing force. The ability of a material to maintain a magnetized state

14

without the presence of a magnetizing force is called retentivity. The retentivity of a

material is indicated by the ratio of B^ to 5, .

Reversal of the magnetizing force is represented by negative values of H on the

curve and is achieved by reversing the current in the coil of wire. An increase in H in the

negative direction causes saturation to occur at a value - //^^, where the flux density is at

its maximum negative value B3. When H is zero, the flux density goes to its negative

residual value B^. From this value, the flux density follows the curve back to its

maximum positive value 5, where the magnetizing forces equal in the positive direction.

The net energy absorbed by the core due to hysteresis is proportional to the area

enclosed by the hysteresis loop. The energy loss per cycle is almost constant and is equal

to the area of the B-H loop. Figure 2.11 illustrates the hysteresis curve [3].

Figure 2.11 Hysteresis curve

CHAPTER in

PRACTICAL SELECTION OF COMPONENTS

Every component used in a power supply circuit should be chosen carefully. This

chapter describes semiconductors, their properties, and their applications. It also covers

the theory of feedback and circuit computer simulation.

3.1 UC3827N-1 Chip

To get a pulse width modulator (PWM), Unitrode's UC3827N-1 buck voltage fed

push-pull PWM controller IC was used. Its block diagram is shown in Figure 3.1 [4].

BLOCK DIAGRAM

VEA»

VEA-

CtA-

CSAO

CSA-

14

16

0 ^

6 T ;

CSA- I 9

SS

SYNC 19

CT

RT

Hl-h

18

17

15

VCC [?3]-

GM)

VEAO CEAt CEAO RAMP

10

VOLTAGE ERROR AMPLIFIER

>

12 6

CURRENT ERROR AMPLIFIER

•3V o CURRENT SENSE AMPLIFIER

ILIM COMPARATOR

OSC

500kH? MAX

^?-L

RCF &

UVLO UVLO

SS

INHBT

UV

5

0.7V

•^^t>^ PWM COMPARATOR 3>H^

f s o

FLYING DRIVER x>

OSC

> T

DELAY

PUSH PULL DRIVERS

DELAY

?0

DELAY

rv

BUCK

SRC

PGND

I - J

UOG 87172

Figure 3.1 Block diagram of UC3827N-1.

In the diagram, UC3827N-1 chip consists of a precision reference of 5V, one

voltage error amplifier, a current error amplifier, a current sense amplifier, an oscillator.

16

and a PWM comparator with latching logic. It includes an UVLO to insure sufficient

VCC presented and a soft start circuitry to clamp the output of the voltage error amplifier.

When the signal level on CS AO (the output of the current sense amplifier and the

noninverting input of the current limit comparator) exceeds 3 V, threshold of the current

limit comparator, the buck gate drive pulse is terminated. This feature is useful to

implement cycle-by-cycle current limiting for the buck converter.

UC3827N-1 was selected because it is ideally suited for multiple output

applications and it has a high current floating driver for the buck converter stage. It has

push-pull drivers with overlapping conduction periods. The push-pull outputs drive two

switches of the push-pull converter with complementary signals at 50% duty cycle. It has

wide bandwidth, low offset, differential current sense amplifier and precise short circuit

current control. Other valuable features include user programmable overlap time and bi­

directional synchronization capability. It also provides complete protection for cascaded

buck and push-pull converters. The connection pins are shown in Figure 3.2 [4].

CONNECTION DIAGRAMS

DIL-24 (Top View) N or J, DW Packages

•••'[I BUCK [ T

si»c [ T

ssH -<'kM(.' [ T

CEAO [ T

CSAO f T

CSA* [ T

CSA- r r

VEAO n ^

GND n r

C£A. [77

W It] PUSH

77] VCC

77] BUU.

77] =GNo

7c] D l - * '

77] SYNC

77] CT

77] ST

77] VEA-

77] «£F

77] vEA-

77] cfA-

Figure 3.2 Connection diagram of UC3827N-1,

17

3.2 Power Semiconductor Devices

3.2.1 Diodes

A typical diode has a forward voltage drop when it is forward biased. Its forward

voltage drop is on the order of IV. When it is reverse biased, only a negligible small

leakage current flows through it until the reverse breakdown voltage is reached. It has

reverse recovery time (after a diode has been conducting current in the forward direction,

it will be able to conduct current in the opposite direction for a short time afterwards).

Figure 3.3 shows the characteristics of diodes [5].

'/)

A o

(at

K -o

'rated

Reverse blocking regkxi

v^a)

(b)

'VD

ȣ>

(c)

-^VD

Figure 3.3 Symbol, actual and idealized I-V characteristic of diode

In high frequency 2.5V supplies, schottky diodes offer lower forward voltage at a

range of 0.3~0.4V and have no reverse recovery time. So schottky diodes can reduce

switching losses and conduction losses. As a practical limit, using schottky diode at more

than three-quarters of its rated reverse voltage will induce problems [1]. International

Recfifier's Schottky Rectifier 50SQ100 was used as the input rectifier. Table 3.1 [6]

shows its characteristics.

Table 3.1 Major rating and characteristics of 50SQ100

Ch«r«ct«r)$lic«

1AV. PWaifflUfer

V f l f * , ™ ^

'FSM • V = 5pSvfth«

Vp «&*(;•(. Tj= 126'C

Tj rango

50SQ,..

5

ao»ioa

1S00

06e

bblDl/S

umts

A

V

,4

V

-c

The secondary side of the transformer was connected to two parallel output

rectifiers. Selecting an ultra low forward voltage drop rectifier is extremely important in

improving circuit efficiency under high output current (lOA). International Rectifier's

Schottky rectifier 47CTQ02S was used as it is optimized for very low voltage output

application. Table 3.2 shows its characteristics [6].

Table 3.2 Major rating and characteristics of 47CTQ020

Characteristics

wavdorm

^flRM

'FSM 0''P-*»«S&««

Vp @20A|*,Tj»125'C

h

Values

40

20

1000

034

5510150

Units

A

V

A

V

c

3.2.2 MOSFET

The fast and efficient rectifying devices are not diodes but active devices such as

MOSFETs. A MOSFET is a majority-carrier device. It has a less forward voltage drop

than a diode. The switching times of a MOSFET are determined essentially by the time

required by the gate driver to charge these capacitances: Cgd, Cgs, and Cds. For a

19

MOSFET, the switching time can be in the range of a few nanoseconds to a few hundred

nanoseconds. In order to keep the MOSFET in the "on" state, a gate source voltage with

an appropriate magnitude shall be applied continuously. No gate current flows except

during the transition from on to off or vice versa when the gate capacitance is being

charged or discharged. Also, due to negligible drive power needed, the MOSFET is easy

to be paralleled.

The MOSFET was not selected on the basis of its rated average current. Rather,

it was selected because of its on-resistance and its influence on condition losses. The on-

resistance of MOSFET is the sum of the resistance of the n-region, channel, source, and

drain contacts. The on-state resistance between the drain and source increases rapidly

with the device blocking rating which is given by [7]

R.. = kBV, DSS • (3.1)

Equation 3.1 shows that only devices with small voltage ratings are available

with low on-state resistance.

International Rectifier's MOSFETs IRF2807S/L was used as the power switch.

It is quickly switched between the saturation and the cut-off states, and its avalanche

breakdown rating is acceptable. Figure 3.4 shows its on-state resistor is quite small,

about 0.013 Ohms [8].

HEXFET^ Power MOSFFT

VDSS = 75V

Rr = ,-.- =0.013^2

lo = a2Ai&

Figure 3.4 Block diagram of MOSFET IRF2807S/L

20

3.3 Transformer Design

In any switch-mode power supply, the high-frequency transformer is a major

contributor for size because it occupies about 25% of the volume and 50% of the overall

weight. The size of transformer decreases with frequency increasing. However,

transformer surface area available to dissipate the power loss decreases, and this

increases the stress on the insulating materials.

3.3.1 Push-Pull Circuit

The push-pull converter included two transistors across a center-tapped

transformer. The transistors are operated 180° out of phase and have the same duty

cycle. In Figure 3.5, if the upper transistor is on, the bottom transistor is off. Equation

3.2 indicates that transistors are alternatively switched on for one time period to

maximize the use of transformer core.

K=2xV,„ (3.2)

Because a center-tap push-pull transformer design allows current to fiow in the

opposite direction in the primary winding of the transformer during each switching

period, current inside the core materials is driven in both positive and negative flux

polarities. The reversing current alternately resets the core. This prevents core saturation

and reduces the transformer core size. Since the two transistors are on for the same

amount of time, if the voltage supply is constant during a switching period, the volt-

seconds across the transformer ideally sum up to zero and the core operates

symmetrically around zero.

21

i

J — w — 1 " d '

Q2N2222 ^ '

Q2N2222 ^ \

'—tfJ d

N1 ) J

+ J J

1 — W - i

' 1 — r ^ d

L

I

Figure 3.5 Normal Push-Pull isolated buck circuit

3.3.2 Determine Core Size

Choosing a core material with lower loss is the first step to optimum design.

Equation 3.3 is used to select core size and is given by

K^.^ pXiilXl"' 4K„P„ ((P+2)/p)

(3.3)

-6 where p is the effective value of the wire resistivity: 1.724x 10 ,

K^ is the winding fill factor.

K f is a constant of proportionality. fe

P is determined from the core manufacturer's published data.

ti

Ai = jv,(0^r (3.4)

X, = DTsV (3.5)

where A, is the voltage seconds applied during the positive portion of the waveform.

A. =27,-^2^^/,, (3.6)

22

I^=l,=^IyfD , (3.7) m

h=L=-N\-^D 4 - 2 - x . ^ . (3.8)

We set n2:nl = 1/5.

A soft ferrite P style core was chosen. The system was tested with both a P30/19

core and a P36/22 core. For the core material, the 3C6A was poorly characterized and

had very high losses; and the 3C80 is used only for the most cost-sensitive applications

[9]. As the converter switching frequency continued to rise, the core losses grew faster.

The recommended material is 3F3 for a frequency of 50kHz.

3.3.3 Optimum Flux Density

Magnetic materials exhibit core loss due to the hysteresis of the B-H loop seen in

the Figure 2.11 and eddy currents flowing in the core materials. The core loss depends

on the peak flux density, the operating frequency, and the volume of the core [101.

P„ = K,, B l 4 / „ (3.9)

where P^^ is the total core loss,

K^^ is a constant of proportionality which depends on the operating frequency,

max is the peak value of the ac component of the flux density,

j3 is determined from the core manufacture's published data, or p =2.6,

A , is the core cross-sectional area, and

/^ is the core mean magnetic path length, hence A^l^ is the volume of the core.

23

From Faraday's Law, peak flux density is given by

2«,A,

When the core window area is allocated to the various winding, the total copper

loss can be expressed in the form [10]

p{MLT)nfl^, Pcu=— -L-i2L (3,11)

where P „ is the total copper loss,

p is the effective value of the wire resistivity,

MLT is the winding mean-length-per-tum,

W^ is the core window area, and

K^ is the winding fill factor.

From

the primary turns can be calculated out.

Substituting equation 3.12 in equation 3.11, the total copper loss is

, PJMmm, '" W K A^B^

**A^^u^c -"max

Total power loss is P,,,: P,,, = P , + P,„. (3.14)

Equation 3.9 indicates that reducing peak flux density B^^ can decrease the core

loss. However, the copper loss varies with the inverse square of B^^ according to

24

equation 3.13. Therefore, the optimum flux density B^ for minimum losses of

transformer can be calculated and is given by [10]

p^ll {MLT) 1 max

2K, W.AXPK m r fe

^ 2 . (3.15)

3.3.4 Evaluation of Wire Size

The number of turns for the primary and secondary sides can be computed using

the desired turns ratios. The fraction of window area allocated to each winding is

""''"' . (3.16) nj^ nJtot

Awi and Aw2 are pure copper cross-sectional areas of the primary and secondary

windings

K^^ ' I - ^ - M " / !

n, (3.17)

, ,MZ^ V2

« 2 (3.18)

In testing, Litz wire 50/40 was used on the primary side, and Litz wire 100/40 was

used on the secondary side. To make the current density in each wire match, two wires

were used to parallel on the primary side and two wires were used in parallel on the

secondary side. The transformer simulations can be seen in Table 3.3 and Table 3.4.

Different core types, P36/22 and P30/1, were used.

25

Table 3.3 P36/22 core transformer

B

Delta B

100

Input Voltage Maximum

50

Vout

2,5

Frequency

500E-HD4

Area of femte

202

Outer Core Diameter 2.96E-02

Inner Core Diameter 1.79E-02

H

Delta t

120EW ^

9

10

Calculated Number of Primary Turns

Input Voltage Minimum

Output Cun-ent

45

Integer Number of Primary Turns Input Current

Core Circumference

Primary Wire Length

Core Height Primary Wire

Resistance per 1000 feet

Secondary Wire Resistance per

1000 feet

1.44E-02 21.58 10.79

Secondary Wire Length

Integer Number of Secondary Turns

Total Power Lost in I Windings

Percent Total Power Lost in

Windings

Primary Winding

Resistance

Output Power

Power Lost in Primary Winding

Secondary Winding

Resistance

0003

Power Lost in Secondary Winding

Core Loss Percent Core

Loss Total Percent

Loss

007 06% 125 aoo4 0066 1.7 13.6%

Power Lost in Switches

Percent Power Lost in

Switches

Switch Resistance

Diode Drop Times 2

Diode Losses Percent Diode Losses

0.013 0.34 138%

27 8%

Table 3.4 P30/19 core transformer

1

2

3

L_ A B Delta B

100

Calculated Number of Primary Tums

n 5

6

7

e

9

10

11

12 13

Integer Number of Primary Turns

M . 5.00

Integer Number of Secondary Turns

yt^Twgys,'-

Total Power Lost in Windings

M 0.03

Power Lost in Switches

0.0

Input Voltage Maximum

50

Input Voltage Minimum

45

Input Current

O i _ ^ M

Percent Total Power Lost in

Windings

0.3%

Percent Power Lost in

Switches

0.0%

C D E F G H

Vout

2.5

Output Current

5

Output Power

12.5

Switch Resistance

0.013

Frequency

5.00E4O4

Core Circumference

0.062

Primary Wire Length

1,019 Primary Winding

Resistance

^^HHw** . Power Lost in

Primary Winding

0.004

Diode Drop Times 2

0.34

Area of ferrite

138

Secondary Wire Length

Outer Core Diameter 2.47E-02

Core Height

1.28E-02

0.204 i Secondary Winding

Resistance

0.001 I Power Lost in

Secondary Winding

0031

Diode Losses

1.7

Core Loss

1.6

Percent Diode Losses

^ . .13-6% 1 „ ,

Inner Core Diameter 1.50E-02

Primary Wire Resistance per

1000 feet

Delta t

1.20E-07 1 Secondary Wire Resistance per

1000 feet

21.58 10.79

Percent Core Loss

12.8%

Total Percent Loss

267% ^

26

3.4 Simulation of Circuit

This section describes how to realize the computer simulation of this power

electronics system using Pspice from MicroSim. The simulation process contains a buck

converter simulation, transformer simulation and feedback simulation.

3.4.1 Simulation of Buck Converter

The UC3827N-1 chip is changed into a sub-circuit that can be used to provide

regular PWM to push-pull power switches. The sub-circuit has two input interface ports

and four output interface ports. D and RAMP are input ports, and PWM-i-, PWM-, PUSH

and PULL are output ports. HS1 is the symbol of UC3827 in the simulation circuit. The

sub-circuit is shown in the Figure 3.6 [11].

<3I> •O

5 1

<pamp>-

l l t El

VI =0 TR=(3!Period J y i V2=1 TF=1n W TD=0 PW=@Blanf ng | PER=@TR-KgBlanking ^

TD=((a)Penod-K5)Blani4naJ

V I = 1 ^ ^ ' ^ TR=2n

V7=n " ^ TF=2n

1 <r

PFR=(7'fr?7)Pprinrt-w?7)FllankinnU

PW=@Period

TD=(5)Period

V9=l

±V3 V 1 = 0 / ^ TR=2n

^

Ik

TF=2n

PER={2*(@Penod-Kgaanking))

PW=@Penod+7@Blankng

(5 EWM EPOLY

5M

EPOL

<PiJsK> A I RdHiy

HS1 MUC3827

E3

^ •<rpnir>

EPOLY

Figure 3.6 Sub-circuit and Symbol of UC3827N-1 chip

27

A subsequent low-pass filter is required to average the dc level and to remove the

frequency and its harmonics. The practical low-pass filter is not perfect and must allow a

small amount of the high frequency harmonics, generated by the switch, to reach the

output. Therefore, the inductor current ripple is created. The peak inductor current is

equal to the sum of dc component and the peak-to-average ripple. The peak current flows

through both the inductor and the semiconductor devices that comprise the switch. The

inductor current waveform is symmetrical about the dc component, and hence the peak-

to-peak ripple is two times that of A/,.

M, zz ^^ ~ 0 DTs (3.19) ' 2L

Typical values of the current ripple are in the range of 10% to 20% of the full-

load value of the dc component current. Too large of a ripple would increase the peak

current ratings of the inductor and that of the semiconductor switching devices, which

would increase their size and cost. Therefore, 20% of the full-load value of dc current

was used as the current ripple.

V -V L= ' » DTs (3.20)

2Ai,

where V, =50V,D = 30%,

yo= 2.5x5 = 12.5 V,

Ts = — = = 20us , and / 50k

A/ = 20%A:10 = 2A, which

leads to L = 56.25x10"^ H.

28

Due to the charging and discharging of the filter capacitor, a ripple voltage is

generated. An output capacitor was used to prevent oscillafion and to provide low

impedance to the high frequencies.

The current is the flow rate of the voltage charge. Therefore, instantaneous

current can be expressed as the instantaneous rate of voltage change with respect to time.

i=C du^

dt (3.21)

AM = li^dt (3.22)

The switching ripple is normally required to be less than 2% of the dc output

component and is calculated to be

AM, < 2%jc2.5 = 0.05 V.

Then, the output capacitor can be calculated by [12]

TsAi C> ^(1-D),

4AM„

(3.23)

or C = 140^:10"'F.

The simulation circuit of the buck converter is shown in Figure 3.7.

Vin, 50V J ^ V 1 ^

3V

x

CI HI-1n

HS2 MUC3827

PARAMETEFK Blar*lng 50r>S Period 10uS

IRF150 M3

R4l 1k5

IRF150

M-l

lOOciF

I O U F T J C3

D2

1 Mesas'^

L1 56LH

C4

rr d3 IRF150

M2

Figure 3.7 Simulation of buck converter

29

3.4.2 Simulation of Transformer

The center-tap transformer was represented to be four inductors. Figure 3.8

shows the basic simulation circuit of the transformer.

E K3 K Unei r

COUPLINGS .99 L1 L2 L3 LA:

Lf. L3

L4

Figure 3.8 Basic transformer simulation circuit

Although a 100% coupling is assumed in ideal transformers, a small amount of

leakage flux exits in actual transformers. It is shown in the failure of inductance devices.

the failure of voltage transformation, and the existence of small inductance delectable in

the primary side when the secondary side is shorted. These factors suggest a leakage

inductance represented by L/y and L/2/n*'.

The effective tums ratio is defined in equation 3.24.

n^ = A-'O'?

11

(3.24)

The coupling coefficient is

k= ^'' V l l 22

(3.25)

The coupling coefficient K lies in the range 0<k< I. and is a measurement of the

degree of magnetic coupling between the primary and secondary windings. In a

transformer with perfect coupling, the leakage inductances Ln and L12 are zero. The

30

coupling coefficient k is then equal to 1. Construcfion of low-voltage transformers with

coupling coefficients of 0.99 is quite feasible. When the coupling coefficient is close to

1, the effective tums ratio ng is approximately equal to the physical tums ratio n2/ni.

The values of inductances Ll, L2, L3, and L4 were calculated using the

relafionship in equation 3.26 and equation 3.27 [13].

L = N-xAi^ (3.26)

A,=M4l^(nH) K/.)

(3.27)

For a P36/22 core, A = 7350 ± 25% (nH),

L, =L2 =5^^:7350 = 183.7M//. and

L3 = L, = 1X7350 = 7.35M// .

For a P30/19 core, A^ = 5750 ± 25% (nH),

L=L,= 5'x5750 = l43.1uH . and

L, =L, =1X5750 = 5.75M//.

The simulation circuits for a transformer using a P36/22 core and a P30/19 core

are shown in the Figure 3.9.

L1 163uH

0 K 3 • • ' : • •

K LIneaf COUPLINO=99

L1 i_2 : ; : : : : L3 L4

. . . . : : 7.35uH

7.36uH C

183uH

12

L4

L1 143uH

O l<4 K Linear

C0'uPLmG=9S Ll L2 L3 L4

5.75 uH ' L3

6.75uH

143uH (' L4

Figure 3.9 Simulation circuit of transformer using core P36/22 and P30/19

31

3.4.3 Simulation of Feedback

It is wrong to simply set the dc-dc converter duty cycle to a single value, and

obtain a given constant output voltage under all conditions. The negative feedback must

be used to build a circuit that automatically adjusts the duty cycle to obtain a desired

output value. This relationship of input and output is in Figure 3.10 [1].

In ^ / ^ In-Out G{s)

+ ^

Out G{s) G{s)

*' His) Oiit^

Figure 3.10 Input and output system with feedback

T{s) = Out H{s)

In \ + H{s)G{s) (3.28)

Equation 3.28 indicates that the transfer function can become infinite if HG = -1.

So the design criterion that HG ^ -1 can be replaced by the criterion that gain = OdB and

phase = 0° can not exist at the same time.

If H(s) is known, G(s) is selected in such a way that IHGI = 1 and the phase ^

180° exist. The amount of phase at OdB gain is called phase margin [7]. The phase

margin serves two separate purposes:

1. It relates to the damping of output transients.

2. It guarantees stability.

A system with a very small phase margin would ring for a very long time after a

transient. To select an adequate phase margin is extremely critical in feedback design.

32

The loop here has a phase margin of 45°at room temperature with nominal values and

nominal load.

Gain margin is approximately the inverse of the phase margin. The gain margin

measures how much gain the system has when the phase reaches 0°. The minimum gain

margin is 12 dB. However the gain margin is not very important in a buck converter

design [7].

One isolated amplifier and one error amplifier are needed for feedback loop and

are shown in Figure 3.11.

Figure 3.11 Feedback loop Amplifier

To design feedback compensation for a voltage control loop, two steps were

discussed:

1. Measuring open-loop response.

Consider a hypothetical increase in the DC control voltage of lOOmV. The

oscillator ramp for the PWM used is 1.6 V^p [4], so the lOOmV causes a change in duty

cycle of 100mV/1.6V = 6.25%. The maximum duty cycle = 50%. The real increasing

duty cycle is only 3.125%. Due to V^^ = 15V, the output voltage increases by

33

15Vx3.125% =470mV.

Since this is caused by a control voltage increase of lOOmV, the gain is

470m y Gain =-^^^^^^ = 4.1 = 13.4dB.

\00mV

As the frequency increases, the gain increases and the phase decreases, which is

caused by the LC tank resonance. The resonant frequency is given by

/ = ]= , (3.29) 2;rVLC

and is calculated to be / = 2538//z.

2. Designing a compensafion that ensures stability.

The requirement for system stability is that there are positive phase when the gain

= 1. A bandwidth of 500Hz was chosen which is well below the resonant frequency.

The open loop gain here is OdB, and the phase is -5°. So the gain necessary for

the error amplifier will reduce the gain by 13dB to get OdB at 500Hz. The error amplifier

gain should be G = -13dB at 500Hz.

To compute how much phase boost is needed from compensation is given by

Boost = M - P - 90

where M = 45° is the desired phase margin, and

P = -5° is measured open loop phase shift.

The result is -40° indicating no phase boost is required. /?,, = 2.2kQ. was chosen.

The capacitor value was computed by

C = —, (3.30) 27rfGR,

34

where / = 500Hz ,G = l3dB, and/?, = 2.2AQ lead to C = 260nF.

The resulting feedback circuit is shown in Figure 3.12.

Figure 3.12 Feedback loop circuit

3.4.4 Simulation Circuit and Results

A block diagram of the electronic power supply system is shown in Figure 3.13

[14].

Power input

I; * I

Power processor

1 Cont sign*

Controller

Power output

— * •

rol lis

< 1 < — Refen

Vo ^

Measure

;nce

Load

Figure 3.13 Electronics power supply system

Using this diagram, a converter circuit was built with a negative voltage feedback loop.

The difference between the output voltage and reference voltage influences the duty cycle

D. When this difference is larger, D is smaller, and the difference between the output and

reference would be smaller. The objective is to make the output voltage following the

35

reference voltage accurately, regardless of disturbances or component variations in the

system.

The circuits with different transformers are shown in Figure 3.14 and Figure

3.16. The results of simulations are shown in Figure 3.15 and Figure 3.17.

:± Vin_ 50V i - V 1 ^

3V

3 K3

COUPLINO'.M L2

C1

Ki'i ra HS2 MUC3827

IRF150 M3

1k> iT

IRF150

' ^

"ric3 1 0 u F | _ ,

D2 CN

1N6392

L1 SauH

Blanking SOnS Period 10uS

CIO H l -26

15V 1'

TL072/30VTI

U8A

8

R12

- W v -

I I Vre(

2 5V

.183.7uH

•4

L3 L4 L5

7.36uH ' .

R7 1 N63a2

-vw-!-W^-f-01 05 j RoutkJ

I C4

I " a Ha""'

^ l83 7uH

•Vv\-10 Re

LS 735uH

Re

.01 - ^ + ^

P« %10

R11 -Vv\-

* T

rL072/301/TI RS

2.2k

R9 - M V -

2.2k 2.2k

RIO

t^

Figure 3.14. Simulation circuit with a P36/22 transformer core

iwmfiffTinH"!'mffffli tflteial I IKI'S^lsalcxIoilfcMBlPKItfMI I i I I I I I I I I I

JUJiJ

glsmij 1 3 0 i J 8 " »v«'»«"'» I CM»i»3a I pD^gut |;gMo.s»s ||aiii-«s»~ B * " * * " ^ <JW4>*U " »»"

Figure 3.15 Simulation result with a P36/22 transformer core

36

3 K3 K_Ljn«jr

C0UPUNO.9S L2

Figure 3.16 Simulation circuit with a P30/19 transformer core

i^l&W 1 1 jQ.ic^lttlQ.lMliTtMBlU'Zl'^l-fl I I I F F H J J

l - l a l x l U£JJ<J

j |s.»| j j s y S " .i-)y*-<M« Ix iowi idJBowt* |H»te.s-s |Bi«a.s.M i gps . - ^ ||aM«~s~.. i34iD»oX"««M

Figure 3.17 Simulation resuU with a P30/19 transformer core

Since the value of V . is exactly 2.5V, the simulation result of the output voltage ref

must be about 2.5V.

37

CHAPTER IV

TEST PLATFORM AND RESULT

Though the simulation circuit shows good result, the PC board must be built for

researching how practical circuit works.

4.1 Buck and Push-Pull Signals Realization

4.1.1 Frequency

In the UC3827 chip, RT programs the charge current of the timing capacitor. The

charge current should be less than 500uA to keep the CT peak discharge current less than

20mA. The peak discharge current is the CT's maximum practical discharge current

value [4]. The charge current influences the charge time, which intemally sets the

maximum duty cycle.

RFP Charge current = < 5x10"" (4.1)

where REF = -i-5V is the on board reference, which

leads to RT > 5kQ.

The oscillator frequency is set by a capacitor, connected between pin CT and

GND, and a resistor, connected between pin RT and GND. The frequency of the

oscillator is given by [4]

0 77 fosc = ' (4-2)

OSC j^j ^ ^j

where the frequency is 50kHz.

38

According equation 4.1, RT = S.lkQ. was set and from

CT = ^J1~. ,4.3) RT*f

CT = 2.7nF was calculated out.

OSC

4.1.2 Overlapping Conduction Period

The UC3827 chip has push-pull drivers with a overlapping conduction period.

The push and pull switches are driven with the guaranteed overlap period to prevent

shorting of the energy storage capacitor in the push-pull transformer and to prohibit

excessive currents flowing through the transformer.

The DELAY pin can be used to program the overlap time of pin PUSH and

PULL outputs with a resistor connected to GND. The overlap time is given by

J = ^DELAY » 1 Q - 9 s e p (A A\ ^o.erlap ^^^^ ^^ SCC , (4.4)

where the minimum value of the resistor is R^ELAY - 18kQ, which leads to

7-.../.,= 0.12x10-^ sec.

4.1.3 RAMP and SYNC

The difference between a desired voltage and the actual voltage creates the control

voltage shown in Figure 4.1 [15]. This control signal is then sent to a comparator, where

it is compared with RAMP, which is a saw-tooth repetitive waveform. If the control

signal amplitude is greater than saw-tooth waveform, the switch control signal becomes

high, causing the switch to turn on. Otherwise the switch is off. So, the RAMP output

39

value can influence the duty cycle when T^ is constant. The control signal was adjusted

by changing the duration of the tum-on time.

Vo(desired)^

Vo(actual)—) >Vconitrol>^

r5l Repetitive Waveform

Comparator Switch Control Signal

Vcontrol (amplified error)

Switch Control Signal

Figure 4.1 Pulsed width modulation

In voltage mode control, RAMP voltage is fed to the noninverting input of the

buck PWM comparator after an intemal level shift. A resistor connected from pin VCC to

RAMP and a capacitor connected from pin RAMP to GND provided an input voltage

feedforward signal for the buck controller by setting [4]

Ri^AMP = 4 7 0 / : Q , C „ . w p =lnF.

SYNC is a bi-directional pin for the oscillator. The voltage is 3.6V when the

oscillator capacitor is discharged. Otherwise, the voltage is zero. Since a synchronization

circuit is not used, a IkQ or lower value resistor connected from SYNC to GND can

increase the fall time of the signal at SYNC. RSYNC ^^^ ^^^ ^°

^SYNC - 1 5 0 ^

40

4.1.4 Circuit and Signal Waveforms

The soft start was realized by attaching C12 from pin REF to CEA-i- in Figure 4.2.

Soft start has a delay period starting when power is applied to the converter. When a

control IC first receives power, the output voltage is zero. This causes the duty cycle to

be the maximum value, and very high current is drawn from the input and the power

devices. After a capacitor is attached, the duty cycle is limited to a maximum value

controlled by the charging of the capacitor. Once the capacitor is fully charged, the duty

cycle will be whatever it needs to be to regulate output voltage.

vfcc i:~v

gnd

O- 4 »

X9 4.74n Ih

Ul UC3827

^BUCK •3.SRC

4SS 5. Rj -IP

2. CSAO ^ C S A f ^ CSA Ui!x/EA.O

J J GND - l^CEAf

l 4.74n ± . i R8 CIO T > 470

1

PULLP^

DELAYKI SYNC T5

CT RT

•vEA REF

VEAf CEA

vr 16

W T7

RQ y . .•• 18k '

^:^:LM ih £LLL. ..sAZk. VvV

C12 ||1u

Figure 4.2 Buck and Push-Pull signal realization

The buck and push-pull signals were measured by Agilent's infiniium

oscilloscope. The waveforms are shown Figure 4.3 and Figure 4.4.

41

Measuiernerils Mdfkeis I Scales

Fr«Quencgll») Dutg c g c l e l l " )

current rosari std csv 33.1931 ii»z •? 53.15612 kHz ? 3.59';83£ kHz ^ . D Z '; iLSi/: ? 2.S9y 5.6787 V 5.522-'l i/ 952.'^CS nV

1 2 . 6 H 8 2 kHz • i 2? .033 kHz 0.0/: V ^2.?Z

Figure 4.3 Buck signal waveform

^ [oplQ|#| E| l i Markers I Scales 1 Measuremen^s |

Frequency(1»J Ffequenci4(2»)

i T i P i e ( l ' l - i i - ) Cutu cucU il'.i

current 26.523115 kHz 26.52622 kHz 161.7 ns SO.AY.

fie an 26.53837 kHz 26.53811 kHz 153.017 ns 50 .A)'.

std dev 11.53731 10.25731 31.587 ns 0.0193;;

min 26.51176 kH: 25.99701 kH2

-2.1039 jis 50 .Ay.

[lax 27.53509 kHz 26.56261 kHz 180.6 ns 50.5]^

Figure 4.4 Push and pull signals

4.2 Push-Pull Isolated Buck Circuit With Feedback

The simulafion circuit can not be copied exactiy to the PC board, so some changes

must be done to make the circuit work on the PC board.

42

4.2.1 Push-Pull Isolated Buck Circuit

The buck, the push, and the pull signals will be sent to three MOSFETs. An

individual gate resistor was needed for each MOSFET, because MOSFETs have both

capacitance and inductance. This potentially forms an underdamped resonant tank. Due

to this, MOSFETs can be observed to oscillate at lOOMHz [7]. The gate resistor damps

the oscillations. At the same time, the resistor can limit the source current.

In output circuit, the parallel diode rectifiers were connected at the secondary

side of the transformer. These diodes work as power switches in Figure 4.5. The

inductor value was 56uH and the output capacitor value was 140uF. This was previously

done in the simulation circuit.

pouierjn

O-

\*c O-

pjgnd

TXI 1 S

R6 470k'

In

DtNSOTJ ?^r] Ul uc

c7/-"^^ l a

f BUCK 5RC SS

i lv Re

•\K-

-ST^&T

T F 1h 474(1

4.74n J_ C10

P U L L » -

HmP OSlAllO R9 y , / . , ^ _aCEAD S'NC

2. CSAO CT 19

CSA* CSA

X J J CN flCEA*

RT \/EA REF

•vEA* CEA

• R8 : 470

R3

2 IRF3710S

'ITP

j:^

iRF3710S

m

_I5 M .

Ml

lOOuT m, " ' r - ^

WE^ -au./J1 .7,9i< ZH C12 ,, lu

buck_sat«

sk34

^5 3^6 '''^''»!^^ )PIO

4- • f ' l i ' T ' "

4=C3 In

1

7DuF Dower out

r ' |u«IRF37IDS ' te | M3

R4 J 1 0

powtr_out_gnd

Figure 4.5 Buck and Push-Pull circuit

4.2.2 Practical Feedback Loop

An isolation operational amplifier shown in Figure 4.6 was used to keep the

negative voltage from being applied directly to the IC pin. Input points 2 and 3 were

43

connected with circuit output points V- and V+. R = lOkH was chosen due to power loss

given by P. = ^ R

'vb

R23

tOk

• , \ * e

LD74/^01/TI I I

T

U3A -i 10k

R22

R20

10k

R21

10k

I Figure 4.6 Isolafion amplifier

lOk

VQ=0.5V^-Ix\0k=V^-V_

From the calculation, the isolation amplifier gain is one.

The UC3827 chip has three error amplifiers, the current error, the current sense

error and the voltage error amplifiers. They are all connected to the PWM comparator.

The current error amplifier (CEA) was used as a compensated error amplifier shown in

Figure 4.7 [2].

Compensated error amplifier

PWM Controller

Va

i Power stage Including the Output Filter

f » t n

Figure 4.7 Basic feedback control loop

44

In circuit shown in Figure 4.8, the output voltage was pushed to CEA- through an

isolation operational amplifier. The feedback reference voltage is at the REF pin of the

IC chip. The reference voltage value is 5V, but the output desired voltage value is 2.5V.

Normally, a resistor was used to divide reference voltage to get the desired output

voltage. So R^ was used to parallel with R^. When R.^ value is equal to R^ value, the

desired output voltage value was half of reference voltage value (2.5V). A RC series

with a parallel capacitor were connected from CEA- to CEAO to increase phase boost.

Positive phase boost made circuit more stable. The RAMP was compared with CEAO to

tum on the switch at a regular interval and terminate the pulse when the RAMP and the

CEAO are equal. So the CEAO can be used to adjust the duty cycle.

power r

"o-

0

o-

TXl 1 5

270k f lu 1

D1N5073

— c t -c-n 82^

"•Jr f

-'•AK—^

R710k }

R8 10k5

'^t' 4UCI SRC '"-'l-Jrr-

OELA' C£AO f^NC CSAO CT CSA» RT CSA VtA ./EAO REf

IJj CjHi) K/£M JlCEA.. CEA

I 4.7u _ 4

Ice TlOOuF R3

-^AV­ID

IRF3710S M2 1

03

Ul ;IRF37I0S

4 7 " F 1 ^ ! £ S ^

T5 ^ CS , 1 ^

^ 1

R1 10

— \*..—

100 RJ»

U 25.H ! rt S

bii

— • -I r V*-, Ri I 47ctqO20s ^ «-1 ^

fi-|i_IRF3710S

O p j n d

3

R23

10k

' W v - * r R24

10k

T - * R20

- W v -lOk R21

-VA—

a.

LDATRJJ 1 * ^lOk

470u C13

- O p i o poiii«f_oul+

- O P2C po«ef_oul-

Figure 4.8 Circuit design

4.3 Debug and Test

The power supplies, +15V Vec for the UC3827 chip and -15V Vee for the

operational amplifier, were given by TENMA, which is a triple output dc power supply

45

instmment. A XANERTX power supply was used to supply 50V dc. The Chroma's

programmable dc electronic load 6310 was used to add a load and to regulate the current

of approximately 5 A to lOA.

4.3.1 PC Board Layout

A two layered PC board was made consisting of

1. Component layer (red).

2. Solder layer (blue).

Two boards were made with different traces of

175mil traces for 5 A output current.

500mil traces for lOA output current.

ECBMmmmmim B E'" i* C ' ^ ^'°" Qori^Mt lools Uxsy ^ridon Help

3

0150,00, 2900 M

Figure 4.9 Component layer of PCB with 175mil traces

46

aamssMMmam I £ie £01 liHH yiMi Cmhgira look ^toay ^nlow M<t>

DJCg y | a l I I I I I : ^ I ^ | Q > I ^ | Q , | \ h l I 0-1 ° I ISOmil z\ iUHSolde,

• -i*l»l

3 Oitraca_50

5 J|SHrt| ' j i S : i i ^ S 6 BJCHAPTERIV IpPOTOnLabPo j aMicoSniMK | |grMooSn.Sch „ | ^MiooK^I PhoL ||BM«aoSii P „ ?g.^ (g j f i * . 11 25 AM

30oaoo. iiso.n

Figure 4.10 Solder layer of PCB with 175mil traces

M'WH!MilJ.I,MI,fl.llHkl!lBl l - l a i x l • E*! E * Eio" VBW £onl9Je loolj Ubioiv Wr«iow Uolp . | g | x |

D | c g | y | a J I M I I ^ ,K |Q . | g3 |Q , | \ h | I 0-1 o I ISOmii j j J^QC^mponent 3 ^ ( roce_50 3

240OX. 2800,M

J ) SIM I 23 i 6 ^J ® SB fi BJCHAPTERIV I ^De»iirl.abD« | gMpoSniMM | [gfMooSniSch | ^ MicrooB Phol | |^ |MiaoS»P, 13N( 9 j S i - 11 31 AM

Figure 4.11 Component layer of PCB with 500mil traces

47

• Fie im Qim yiew to^igue loob Ubory Itfndwi tJelp

• l a i i l B l a ! M l 1 1 ^ - K I Q - I ^ I Q ^ I \ h l I '>! ° I |50m.l ::J O J ^ S o l l e r

25S0X, 330300 Ready

3 OllTBCe.SO

Diow Tioce

- j g l x l

— 3

J8S>»n| 23 S ^3 S H fi BjCHAPTEBIV I ^DeagiLabDe, I ^MiaoSriMo., | ^MooSmScK „ | ^MKiixoltPhol ||g[M.cioSM P,,. tgxf 9 j f l S i 11 35AM

Figure 4.12 Solder layer of PCB with 500mil traces

4.3.2 Tesfing

Oscillations of signal waveforms indicate that the circuit is not stable. These

oscillations are influenced by the power supply filter capacitor and by the output

capacitor that follows the rectifier. To get a better signal, the value of the capacitor

following the input power supply was increased from 1 lOuF to 940uF. A large

electrolytic capacitor was used following the input power supply because it would

affectively bypass the high-frequency transients and noise spikes [9].

The PC board interface was separated into three parts:

1. Buck and push-pull signals,

2. Input power supply.

48

3. Output power supply.

Each part has its own ground trace. A signal ground is a trace that carries low; a power

ground is a trace that carries high currents. Signal ground and power ground should be

kept separate when PC board was made. However, signal ground and power ground

should be directly connected when the board was tested. Otherwise signals on each part

are either floating or distorting. When some areas like "islands" on the PC board are not

connected with main ground traces, some mistakes would happen.

Though high frequency is good for circuit performance due to the on-off

transition of semiconductor rectifiers contributing high-amplitude spikes, and wider

bandwidth converter keeping converter small, high frequencies like lOOkHz or more are

not practicable because such high frequencies would keep MOSFET on and would not

get desired buck and push-pull signals.

In dc power supply, ripple implied the residue of AC delivered to the load as the

consequence of imperfect rectification and filtering. Ripple exists due to the ESR

(effective series resistance) of the output capacitors and the switching noise, which

occurs during transition time of diodes and MOSFETs. Normally, the inductance should

be small and the capacitance should be large to decrease the converter's output

impedance. But the output voltage can not simply be adjusted by reducing the size of

inductor. A certain minimum inductor value was needed to guarantee a continuous

current. The capacitor following output rectifier was increased from 140uF to 940uF to

reduce ripple.

Aliasing occurs when the oscilloscope neither has enough sampling frequency nor

has enough memory to store the entire waveform occurring in a sweep period. The best

49

practice is to sweep over a very broad fime to catch enough samples. The testing result of

output voltage without load is shown in Figure 4.13. The chroma's programmable dc

electronic load 6310 was used to add a load. Figure 4.14 and Figure 4.15 show the input

and output signals of transformer with adding a load at output.

^ [oO|l3|#| mlMMIlBW ^kl ^ BBMAMMJIi 4l>l>l olB mHij' ISBBHHBBWll Mafkws | Scates |

curvent r-iean std 6iv win '• . jv i j i2 i 2.5b45 V 2.5S02S V 26.1SS nV 2.5111 V 2.6773 V

Figure 4.13 Output voltage without load

[oolcalal fflj Measurements Markets Scales

V avgf l ) Fr«qu«ncull»)

current 16 .1409 V 25.9J5D k-H:

nean 1 6 . 8 0 6 5 V

std dev 575.1'! nV

•? 21.369')1 kHz ? 6 .665697 kHz Duty c«cl«tl») '? 0.90/.

17.6940 V •> C.57Z

16.9400 V ? 2.43):

571.70 MV

nin 15.9999 V e.64853 kHz o.oy; 16.2720 V

Mix 17.5715 V

•? 26.0053 kHj ? 48.7/

17.7722 V

Figure 4.14 Input signals for push-pull transformer

50

fft©|l3|al l l Measuiemenl',

Fi'siquency l l • I riutij c y c l e l l ' l

Markers Scales f i i rront SA.n nV 26.0945 kH; 49.5/:

-115.21 nV

T:;.li.ilJ niV 25.9Rt!57 kH,-50.OZ

-120.375 MV

5.2244 nV 98.S3--;gi H; 0.218/; 5.4354 niV

4«.0« nV 25.7065 kH: 49.3/: -163.61 MV

lO.'.Ec! nV 26.2681 kH: 50.?)-: -100.04 nV

Figure 4.15 Output signals for push-pull transformer

4.3.3 Power Supply Efficiency

Power supply efficiency is the ratio of total output power to total input power or

1 = out (4.5)

Plo.ss=Pin^i^-V) • (4.6)

Each breadboard was tested with a current of 5A and lOA. The P36/22 and

P30/19 transformer cores were tested and a summary of the results are shown in Table

4.1 and Table 4.2.

51

Table 4.1 Power Supply Measurements for the 175mil Trace PCB.

Core Type

P36/22

P30/19

P36/22

P30/19

Input Current

(A) 0.37

0.38

0.76

0.77

Input Voltage

(V) 49.8

50.1

49.8

50.1

Output Current

(A) 5.025

5.05

10.05

9.91

Output Voltage

(V) 2.52

2.53

2.49

2.5

Efficiency (%)

68.7

67.1

65.4

64.2

Table 4.2 Power Supply Measurements for the 500mil Trace PCB.

Core Type

P36/22

P30/19

P36/22

P30/19

Input Current

(A) 0.33

0.38

0.64

0.78

Input Voltage

(V) 49.9

50.1

49.9

50.1

Output Current

(A) 5.08

5.03

10.18

10.07

Output Voltage

(V) 2.26

2.52

2.07

2.5

Efficiency (%)

69.9

66.5

66.34

64.4

From comparing the efficiency results, the highest efficiency for lOA current

output happened with a P36/22 core type transformer and a PC board with 500mil output

traces. The analysis of the power loss would depend on this condition alone.

For lOA current output, the highest efficiency is 66.34%. The power loss is

p = 0.64X49.9JC(1 - 66.34%) = 10.75W .

52

Three power MOSFETs, M1-M3, were used as switches in the circuit. MOSFET

Ml, driven by a buck signal, causes power loss due to its on-resistance value of 0.013Q.

The current waveform is shown in Figure 4.16.

tP-"

^ [©0|S|3| mHIHIIfWiBl <.U ^ IWMIHII^ 4l«Ul D l ^ H m±\^ tSESSIHSB^l Maikets 1 Scales 1

currsrit nean std d«v Mir na Dutij cgc l i l2» i 50.6/ ? ^8.8/ ? 9.52/ ? O.U ? 53 .0/

Figure 4.16 Current waveform of Ml

The average current value can be calculated by

^.v..„.=l •5-^50.6% = 0.759 A

From equation 4.7

P = f R MOSFET average o n _ resis tan ce '

(4.7)

the power loss of the MOSFET was calculated to be

PMOSFET = 0.759 JC0.759X0.013 = 0 .0075W

The value of inductor voltage was 1.62V. The power loss of inductor is given by

P= U l (4.8)

and P = 1.62x0.759 = 1.23W

53

MOSFETs, M2 and M3, are in parallel in each bridge of the push-pull. They have

the same power loss. From the power waveform in Figure 4.17, the power loss of

MOSFET M2 is given by

T = 3Siis,

p=y^\pdt, (4.9)

and P = 1

38x10 -6

,60jclO-^-hlljclO-^-hlOjclO-^) , ,„ , ( = 1. IVv

^ foo|a|#| ffll Markers I Scales Measuiement

f l i l t u C i j c l y

current 19 .Al

;td dev }.(i2Ay.

Figure 4.17 Power waveform of M2

Another major cause of power loss is due to the transformer. The power loss in

transformer was calculated from the equations in 3.3.2 of Chapter III.

1. Core loss is given by equation 3.9.

Pf^ =1.16W

54

2. Copper loss is given by equation 3.13.

P „ = 0.0388W

3. Total power loss P, ^ is given by equation 3.14.

P = 1 8W transformer *••>- '"

The schottky Rectifier, 47CTQ02S, caused a considerable amount power loss in

the output circuit. From V^ = 0.34y and P^^^ = 0.34x10.18 = 3.46W , the total power

loss was calculated to be

P,„, = 1.1x2-H 0.0075-H 1.23-H 3.46-h 1.8 = 8.7\y .

Other factors contribute to the total power loss:

1. Schottky diodes often have a substantial capacitance from the anode to the cathode

that has to be charged and discharged every time the voltage across the schottky

changes.

2. Circulating currents in a conductive magnetic core cause eddy currents, which are

created by voltages induced by changing magnetic flux in the core, and tend to follow

circular paths normal to the direction of the magnetic flux. Eddy currents represent a

power loss and are independent of load current.

4.3.4. Improvements

Minimum power is lost in a magnetic structure when

A. Core Losses = Copper Losses,

B. Primary Copper Losses = Secondary Copper Losses [16].

55

From the calculation result in 4.3.3, the power loss in the core is much greater

than the copper losses. Due to this, the number of tums increased to 8:1.

Maintaining separate signal and power grounds is essential for power supply

design. Due to high frequency, the best way to attach the two grounds together only at

one point is at a bypass capacitor in the power entry point [9].

The push MOSraT M2 switching waveforms are shown in Figure 4.17. The high

voltage and high current simultaneously cause excessive power loss at turn-off. To avoid

this problem at turn-off, MOSFET IRF3710S/L was used to replace IRF2807S/L.

IRF37 lOS/L has longer turn-off delay fime than that of IRF2807S/L [8].

VDSS = 100V

Ros;cr|= 0.025a

\j = 57A

Figure 4.18 Block diagram of MOSFET IRF3710S/L

The power wave shown in Figure 4.19 is using MOSFET IRF3710S/L. The

power peak value of the new MOSraT is smaller than that of the previous MOSFET.

Though Rpsum) of IRF37 lOS/L is larger than that of IRF2807S/L, the power peak values

still became smaller due to a small amount of current flowing through it.

56

a^fPrnoiM Q^f^mam^ tp-" Or / '^v . . vpitdge aa^iise H^-^

':;*'.J'-:f. / : V-.' power losi in M.i

. > . — . . ^ . . — , r -v * -< - - \ ^ . - ^ — - • • •"-^•*^„f,r^—--^ i ,

— " ^ — ™ _ ^ . . — ^ ^ ^ ^ .current flowing M2

v..

'^ [oO|(3|#| mlliMIIW ikl t g g M a w <lflUI QlQ^BH-v^ ^ f

Figure 4.19 Power waveform of M2 with MOSFET IRF37 lOS/L

The power efficiency is given by

Input voltage = 49.8V, Input current = 0.64A,

Output voltage = 2.08V, Output current = 10.33A,

n out out

UJ^ (4.10)

„ 2.08x10.33 ^^ , ^ P = = 67.4%

49.8x0.64

4.4. Physical PC Board

Two physical PC board layouts are shown in Figure 4.20 and Figure 4.21.

57

Figure 4.20 Physical PCB with 175mil trace

Figure 4.21 Physical PCB with 500mil trace

58

CHAPTER V

CONCLUSIONS

Design of a high frequency and high current output switch-mode converter with

highest possible efficiency is the goal of this research. It is a known fact that due to the

very high output current, the power loss in any device would be large. As the operating

frequency increases, the copper losses decrease because of the lower volume of the

windings. These factors give the limit of the frequency and the efficiency in this project.

The experimental power supply setup was 50 V out at a current of lOA. A

compound buck converter topology made of two stages to step down the input voltage

was used. All activities necessary to design a power supply were taken, from architecture

definition, schematic design, simulation, physical board layout, debugging and test issue

resolutions. Additional tests were done in designing high-frequency magnetic

components designing such as transformers. The results obtained from the experiments

showed the effect of optimization on the efficiency.

A snubber circuit may be helpful to be added across the schottky diode. A

snubber network is used to reduce the voltage transient spikes and by reducing the EMI

to improve circuit performance [17]. However, snubber circuits will not improve power

efficiency.

The best way to improve efficiency is to use synchronous rectification, which is

the process of replacing the output recfifier with controlled switches. Since one of the

major causes of power losses is the output rectifier, replacing the rectifiers with

controlled switches would increase system efficiency significantly.

59

For future designs, another high-frequency magnetic component: inductor, which

is the major component in power electronics, should be designed in synchronous

rectification for the power supply.

60

REFERENCES

1. Lenk, Ron, Practical Design Of Power Supplies, Institute of Electrical and Electronics Engineers, Inc., New York, (1998) pp.18-47 pp.143

2. Mohan, Ned, Tore M. Undeland, and William P. Robbins. Power Electronics: Converters, Applications, and Design. John Wiley and Sons, Inc., (1989) pp. 164-172

3. Mohan, Ned, Tore M. Undeland, and William P. Robbins. Power Electronics: Converters, Applications, and Design. John Wiley and Sons, Inc., (1989) pp.55

4. Product data handbook, Unitrode, 7 Confinental Boulevard, Merrinack, NH 03054. 3-247,3-248

5. Mohan, Ned, Tore M. Undeland, and William P. Robbins. Power Electronics: Converters, Applications, and Design. John Wiley and Sons, Inc., (1989) pp.17

6. HEXEFT Power Schottky Rectifier Designer's Manual, publication HDM-3, 2000. International Rectifier, 233 Kansas St., EI Segundo, CA 90245.

7. Lenk, Ron, Practical Design Of Power Supplies, Institute of Electrical and Electronics Engineers, Inc., New York, (1998) pp.121-142

8. HEXEFT Power MOSFET Designer's Manual, publication HDM-3, 2000. International Rectifier, 233 Kansas St., EI Segundo, CA 90245.

9. Lenk, Ron, Practical Design Of Power Supplies, Insfitute of Electrical and Electronics Engineers, Inc., New York, (1998) pp.209-212

10. Erickson, Robert W., Fundamentals of Power Electronics. Chapman-Hall, Inc., New York, (1997) pp. 517-524

11. James C. Dickens., Pulsed Power Laboratory, Texas Tech. University.

12. Krein, Philip T., Elements of Power Electronics. Oxford University Press, Inc., New York,'(1998) pp. 150-153

13. Soft Ferrites, Data Handbook MAOl, (1998) Philips, Woodstock, New York 12498 pp. 467-489

14. Mohan, Ned, Tore M. Undeland, and William P. Robbins. Power Electronics: Converters, Applications, and Design. John Wiley and Sons, Inc., (1989) pp.61

61

15. Heumann, Klemens, Basic principles of Power Electronics. Spring-Verlag Berlin Heidelbeg, New York, (1986)

16. Lenk, Ron, Practical Design Of Power Supplies. Institute of Electrical and Electronics Engineers, Inc., New York, (1998) pp.83

17. Gottiieb, Irving M., Regulated Power Supplies. TAB Books, McGraw-Hill Inc., New York. 4* Edition, (1992)

62

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