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Dr. Ana Gonzalez, Project Leader at EPICDissemination manager of PIXAPP and MIRPHAB Pilot Lines
Photonic Integrated Circuits and Mid Infrared Sensors in Marine Applications
Photonics4BlueGrowth12 July 2017Santiago de Compostela
+300 members companieswww.epic-assoc.com
The European Commission identifies photonics as one of the key enabling technology, fundamental for the industrial development of Europe.
EPIC AS DISSEMINATION PARTERN IN EUROPEAN PROJECTS
TERABOARD: High density scalable
optically interconnected Tb/s Board
Pilot Lines in PHOTONICS
Pics4All: Photonic Integrated circuit Accessible
to Everyone
A Pilot Line produces small series of prototypes allowing the companies to test
the technology before the mass-production. Maintain the production of photonic
technologies in Europe.
1. Marine environmental monitoring2. PIXAPP Pilot Line3. The Braavoo Project4. MIRPHAB Pilot Line5. Conclusion
SUMMARY
MARINE ENVIRONMENTAL MONITORING
Actual detection techniques (such as HPLC) are slow, require sampling and are not real-time. New tools able to detect
contaminants in the sea are required.
ADVANTAGES OF USING PHOTONICS
Simplicity
Fast Analysis
Low cost
On-Line detection
Ideal candidates tobe integrated intoexisting equipment
Small Size
5
https://www.pixapp.eu/
- Overcoming the existing bottleneck in packaging for developing photonic based devices
“The objective is to set-up a pilot line for
the assembly and packaging of integrated
photonic components. The pilot line should
offer generic solutions for a wide class of
PICs (Photonic Integrated Circuits)”
“A credible strategy to future full-scale
manufacturing is expected”
Prototyping Medium Volumes
European Plan for PIC Manufacture
European Packaging Pilot Line (linking the ecosystem)
Medium Volume
Manufacturing
Materials
Devices
ApplicationsEquipment
Design
Packaging
PIC Applications
(Users)
Photonic Integrated Circuits
(Si, InP, Si3N4)
CommunicationsHealthcare
Sensors
PICs for Mass Markets
1. Custom Solutions through Standard Packaging Technologies
2. Training & Educating the Future Workforce
3. Linking the PIC Ecosystem through Standards and Roadmaps
PilotScalePackaging
1. 2. 3.
Training&Education
Standards&Roadmaps
3 Pillars of PIXAPP
• PIC Design for Packaging
• PIC Fabrication Fundamentals (lab-based training)
• PIC Packaging Processes (lab-based training)
• Application Examples (telecom, medical, sensors)
PIXAPP Advanced Training Programme
PIXAPP, Europe’s Photonic Integrated Circuit (PIC) Packaging Pilot Line, is
pleased to announce roll-out of its advanced PIC design, fabrication and
packaging training programme. This unique programme provides attendees
with access to state-of-the-art facilities and equipment, and a comprehensive
set of dedicated lectures and technical mentoring. The programme is
delivered by leading international experts, ensuring attendees gain a deep
understanding of PIC technologies and critical PIC manufacturing processes.
First Training Course, November 2017 - Tyndall Institute, Ireland
1. PIC Device & Package Design (lectures and design software training)
2. Laser and PIC Fabrication (lectures and lab based training)
3. Laser and PIC Packaging (lectures and lab based training)
Target Audience
1. Industry developing PIC products and using PIC technologies
2. Researchers in PIC technologies (both industrial and academic)
3. Postgraduate students interested in learning about PIC manufacturing
Experts: The p rogra mme p rovides a ttendees with tra ining in PIC design and
fab rica tion in sta te-of-the-a rt semic onduc tor c leanrooms delivered by experts.
Facilities: Attendees rec eive hands-on tra ining in a state-of-the-a rt PIC
pac kaging fac ility. The essentia l aspec ts of PIC pac kaging will be add ressed .
Further Information: Contact the PIXAPP Gateway ([email protected])
PIXAPP Training
PHOTONICS INTEGRATED CIRCUITS FOR THE OCEAN
Mid-IR sensors and Applications
Mid Infrared (MIR) light interacts strongly with molecular vibrations. In MIR, eachmolecule gives a unique adsorption spectrum providing a simple solution for sensing
Monitoring the quality ofgas or oil during theextraction process.
On-line warning detectionsystems for leaks in gasdistribution networks.
Protecting transport systemsrequire new sensing tools todetect explosives or drugs.
More stringent environmentalregulations will require costefficient detection tools.
The future of diagnosis; non-invasive blood test, breathanalysis and in-vivo imaging.
Vehicle embedded sensors willeffectively control engineemissions.
Mid-IR sensors and Applications
Objectives of MIRPHAB
To deploy new products swiftly in themarket and achieve prompt take up in theenvironmental and chemical sensing
areas.
To be a single-access platform for the prototyping andproduction of Mid-IR devices in Europe.
The final objective is become a sustainable source of keycomponents for MIR sensors.
The MIR Sensor System
The MIR Sensor System proposed by MIRPHAB consist of light sources, passivecomponents and IR detectors.
Laser (QC/IC)
Detector(type2/InAsSb/QCD)
Packaging(SOC & SIP approach)
Optics(PIC SOI/SiGe&Si/SiGe&Ge)
The wavelength at which the moleculeto detect is absorbing will define thesource, the PIC and the detection to beintegrated in the sensor system.
Training for Platform users
•Why is training important?
• Bringing the developed processes and tools to a wider audience
• Improve pick-up of project outcome by 3rd parties
• Lowering access barriers for novice designers / users of the technology
•What training is needed?
• Introduction for interested engineers, engineering managers (2 day)
• “How to use” course for interested engineers (3 day)
• In depth training for experienced engineers (5 day)
The MIRPHAB Consortium
Leading European industrial suppliers of MIR photonics components and first-class EuropeanR&D institutes with processing facilities capable of carrying out pilot line production.
LASER TECH DETECTORS DISSEMINATION AND TRAINING
DEMONSTRATION ACTIONS
PIC CIRCUITS
- Design- Fabrication- Test of MIR sources: ICL, QCL in EC
or DFB configuration.
- Design- Fabrication- Test of passive photonics
components on Si, includingintegration of ICL and QCL sources.
Development of novelgenerations of uncooled III-Vbased high performancedetectors.
The whole prototyping andfabrication activity is supportedby dissemination and trainingactions.
HIGH LEVEL DESIGNPDK tools for automated designof novel system concepts
Demonstration actions are carried out by industrial partners and driven byend-users’s needs. Its functions is to validate the effectiveness of the fullfabrication and supply chain.
BUSSINES DEVELOPMENTCoordination of the exploitationactivities of the project.
Impact of the MIRPHAB Project
Economic impacts
• Meet the increasing demand forsecurity of people, properties,infrastructures and goods
• Accelerating the deployment ofMIR-based technologies alongthe entire value chain
• Opening a set of newapplications bringing a responseto the user requirements
• Increasing the competitivenessof European industry in thisfield
• Helping MIR sensors to become amass market technology by theminiaturization at chip/device level
• Design of medical “Points of Care”systems for non-invasiveanalysis of blood, breath…
• Analyzers enabling safety andquality of food assessment fromfarms to consumers
• Environmental monitoring:greenhouse gases, air qualityand water quality
Social impacts
20
How MIRPHAB works?
Full info at www.mirphab.eu
You can apply for matching funding to develop your prototype
Open Access to MIRPHAB Services
Call Opening Evaluation Calendar
Call 1 1/09/2016 31/01/17
Call 2
Continuous Submission
Scheme
Continuous Evaluation Scheme
(within 3 months from the reception of the proposal)
Call 3
Call 4
Call 5
Full access procedure available on www.MIRPHAB.eu
• Catalogue of the Technologies offered
• Access to “Expression of Interest”
• Access to Templates & guidelines
• Electronic submission
Submit a Proposal
Single Access Point
Full access procedure available on
www.MIRPHAB.eu
• Catalogue of the Technologies
offered
• Access to “Expression of Interest”
• Access to Templates & Guidelines
• Electronic submission
MIRPHAB Market Positioning
The MIRPHAB Model:
• The Role of MIRPHAB is to:
➢ Promote MIR applications development
➢ Provide FastTrack access to novel devices development
➢ Establish the leadership of EU Industry in MIR Sensing
➢ Generate New Business Opportunities for European Industry
• Added value of MIRPHAB:
• High level of miniaturization
• Standardization
• Full Supply Chain
Technology Offer
Application Driven
Market EvolutionToday Tomorrow
Executing a Project
Partial support of MIRPHAB
• Prototyping
• 10-50%/90-50% ratio
MIRPHABProject Activity Record
Fully funded by the customer
• Prototyping
• 100% Budget from the customer
Internal Projects • Technology Test Vehicles ;
• Technology Transfer; • Prototyping
100% MIRPHAB Budget
We have presented the PIXAPP and MIRPHAB Pilot Lines as single-access points in Europe for PIC packaging and MID-IR Sensor development respectively. These Pilot Lines open the door for photonics sensor to enter the market addressing different applications such as marine environmental monitoring.
CONCLUSION
Dr. Ana Gonzalez, Project Leader at EPIC
Photonic Integrated Circuits and Mid Infrared Sensors in Marine Applications
Photonics4BlueGrowth12 July 2017Santiago de Compostela
3. The MIR Sensor System: LASERS
QCL based sources
• Single DFB emitters • DFB arrays• Devices for extended tuning • Gain chips for µ-EC modules
ICL based sources
• Laterally coupled DFB emitters• Mode matched Devices for
integration• Gain chips for µ-EC modules• Monolithic DFB arrays
Laser Sources for the 3 - 12 µm wavelength range
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3. The MIR Sensor System: PICs
Integrated photonics based on
• SOI waveguide platform (between 2 and 4.5 µm)
• SiGe/Si waveguide platform (between 3.5 and 7.4 µm)
• Ge/SiGe waveguide platform (between 7.4 and 11 µm)
Including functionalities like - wavelength multiplexers- spectrometers- wavelength locker- on-chip gas cell- optical interfaces for laser / detector
30
Of general importance for all MIRPHAB components: • Industrialization of fabrication• Packaging and integration challenges of laser and detector chips• µ-assembly of optical components• Reliability testing in standardized fashion
Detector Structures for the 3 - 12 µm wavelength range
Various concepts based on
InAsSb Detectors
Type-II Superlattice (T2SL) Detectors
Quantum Cascade Detectors (QCD)
• uncooled / TE cooled operation• packaging and integration routes
e.g. direct combination of QCD / QCL • optically immersion
3. The MIR Sensor System: DETECTORS
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