New Semiconductor Research Corporation - SRC - 1997 SRC Annual … · 2012. 4. 11. · The annual report of the Semiconductor Research Corporation is published each year to summarize

of Innovation15 Years

T h e S e m i c o n d u c t o r R e s e a r c h C o r p o r a t i o n

SRC Annual Report 1997

of innovation15 years

MembersAdvanced Micro Devices, Inc.Digital Equipment CorporationEastman Kodak CompanyHarris CorporationHewlett-Packard CompanyIBM CorporationIntel CorporationLSI Logic CorporationLucent TechnologiesMotorola IncorporatedNational Semiconductor CorporationNorthrop Grumman CorporationTexas Instruments Incorporated

Science Area MembersCadence Design SystemsEaton CorporationEtec Systems, Inc.Mentor Graphics CorporationNovellus Systems, Inc.Shipley Company

Associate MemberThe MITRE Corporation

Affiliate MembersCVC ProductsFLIPCHIP TechnologiesMission Research CorporationNeo LinearNumerical Technologies, Inc.OMNIVIEW, Inc.PDF Solutions, Inc.SAL CorporationSILVACO Data SystemsTessera, Inc.Verity Instruments

Participating Government National Institute of Standards andTechnologyNational Science FoundationU.S.Army Research Office

Strategic Industry PartnersSEMATECHSemiconductor Industry Association

Participating Government Agencies

Table of Contents

VisionThe Semiconductor Research Corporation (SRC) will provide competitive advantage to its

members as the world’s premier research management consortium in delivering relevant researchresults and relevantly educated technical talent.

MissionThe SRC’s mission is to cost-effectively exceed members’ expectations by delivering:

• Managed, innovative, semiconductor technology research responsive to members’ needs and guided by the NTRS, focusing on universities

• Relevantly educated university graduates

• Timely transfer of research results

• Strengthened university semiconductor technology capability through partnerships with members

• Collaboration to enhance commercialization and leveraged research

The annual report of the Semiconductor Research Corporation is published each year to summarizethe directions and results of the SRC research program, present the formal financial report and provideinformation on activities and events of the SRC community for the previous calendar year. The SRC’svision and mission were revised in February, 1998, and are shown above.

A copy of this report and additional information about the SRC are accessible on the WorldWide Web at http://www.src.org.

Message from the President & CEO . . . . . .2

About the SRC . . . . . . . . . . . . . . . . . . . . . .3

Research Contributions . . . . . . . . . . . . . . . .5

Technical Excellence Award . . . . . . . . . . . . .9

Student Services . . . . . . . . . . . . . . . . . . . . .10

Aristotle Award . . . . . . . . . . . . . . . . . . . . .11

Industrial Mentor Program . . . . . . . . . . . .12

Intellectual Property Report . . . . . . . . . . .14

Financial Report . . . . . . . . . . . . . . . . . . . .15

2 Semiconductor Research Corporation

A Look Back

In December, 1981, Dr. Robert Noyce, then Chairman of the SemiconductorIndustry Association (SIA) announced the establishment of the SRC for the purposeof stimulating joint research in advanced semiconductor technology by industryand U.S. universities. He noted that “leadership in semiconductor research willdetermine market performance in the future.” Dr. Noyce was a believer thatinvestments in research and education would drive future economic growth andhe was willing to lead the youthful SIA membership forward in an experiment toprove the thesis. He shared his prescience at that moment. We are fortunate tohave his vision and leadership as elements of our legacy.

1997 Accomplishments

The Microelectronics Advanced Research Corporation (MARCO) traces itsorigins to 1994 when SRC analysis revealed a disparity between actual research being funded and the type of researchthat the National Technology Roadmap for Semiconductors (NTRS) technology requirements demanded. This‘research gap’ led the SIA and SRC to form MARCO, a research organization with an emphasis on the elimina-tion of current technological barriers by seeking more revolutionary approaches. MARCO-supported researchersare expected to seek creative options for the solution of key technology challenges so that the industry can keeppace with the cadence of Moore’s Law. MARCO, an SRC subsidiary, will invest in research universities to carryout its mission.

The SRC’s continuing commitment to providing a clear view of the industry’s technology needs was demonstratedby partnering with the SIA and SEMATECH to update the third edition of the NTRS, which was published inNovember. We strengthened our partnership in 1997 by identifying and launching new opportunities for long-termuniversity research programs responsive to strategic industry needs. We also identified projects in the SRC portfoliothat would benefit from transitioning to SEMATECH’s programs for hardening early technology outcomes.

A Look Ahead

The structure we have created to invest in research, manage it in a coordinated manner and deliver the resultsto our members will serve the SRC into the foreseeable future. We have a clear sense of the expectations ourmembers have for us. It is our responsibility to create value for them by providing advanced enabling technologiesand a relevantly educated scientific work force. We have provided our members with a very effective delivery system,our online Research Catalog, and will continue to optimize it. The strength of the university research infrastruc-ture and its continued contributions to the vitality of the semiconductor industry along with the core competenciesof the SRC and MARCO remain a viable strategic option for our industry.

I am pleased to report to you that experience has proven Dr. Noyce’s thesis and the lesson has taken root.The SRC has and continues to provide dividends for its members. In passing our fifteen year milestone, we are atonce evolving and rooted in the industry’s landscape. We appreciate the support and counsel from many, manysupporters. Thank you.

Sincerely,

Larry W. SumneyPresident & CEO

Larry W. Sumney

Message from the President & CEO

SRC’s Value

Since the founding of the SRC in 1982, theSRC staff and the member companies of the consor-tium have worked together to maximize the value

the members receive fromthe consortium. The keyelements of this value are:

• High quality univer-sity research to meet thecritical, long-term techno-logical needs of the silicon

integrated circuit industry, performed by hundredsof faculty members and students.

• Graduate students educated in and knowl-edgeable of the technological areas important forcurrent and future success of the industry.

• The combination of the proceeding two, inturn, has created a strong university infrastructurewhich not only nurtures and strengthens the advancesin the curriculum for the development of talentedpeople for the future needs, but also provides a poolof consulting resources for solving the industry’sday-to-day technical challenges.

• The natural, formal and informal networkingthat results from interactions in a variety of forumsallows the industry to shape the course of the tech-nology and affords opportunities for benchmarkingin a number of functional areas.

3Semiconductor Research Corporation

SRC is a consortium of North American companies and participating government agencies engaged inplanning and managing long term, pre-competitive university research for the semiconductor industry. The twoproducts of the consortium are research results (knowledge) and talentedpeople (students). Obviously, these are intimately coupled. In orderto carry out the highest quality of research, the best and thebrightest talent is required, complemented by a program ofcritical, challenging and meaningful research. The SRCdirects an integrated program of applied research,conducted by the faculty and graduate students atdozens of leading universities and research institu-tions across United States and Canada. This pro-gram is funded by the member organizations thatview participation as critical components of theirlong-term success. The SRC program is theresult of the vision, commitment and dedicatedstewardship of many thousands of individualsand has proven to be an excellent and enduringmodel for cooperative research.

Four key principles of research managementare practiced by SRC: 1) we know our customers’research needs, 2) we invest in and manage only excel-lent research, 3) we actively transfer research results toour members, and 4) we recognize that it is in our interestto strengthen the university research infrastructure. We striveto anticipate our customers’ research and human resource needsand to accelerate the R&D elements of their product life cycles.

About the SRC


Since the NTRS was first published in 1992,both the SRC and SEMATECH have aligned theirorganizations and programs to address the R&Dneeds articulated by the industry through theNTRS. The SRC and its role, relative to MARCOand SEMATECH, is represented below.

In collaboration with a variety of advisory boardstructures, SRC focuses on creation, delivery andextraction, evaluation, and enhancement of the valuein all these areas. In 1997, theExecutive Technical AdvisoryBoard (ETAB), consisting of rep-resentatives from the membercompanies, established a commit-tee to address measurement andenhancement of SRC value. Aconsensus view of measuring theSRC value has been developed.This measurement deals with boththe quantitative and qualitativebenefits the member companiesreceive from the consortium. Thefirst part quantifies net value interms of measurable benefitsminus costs. The benefits addressareas such as leverage (cost avoid-ance) in R&D costs, value of stu-dents hired by member companiesand other measurable benefits.Costs elements relate to theresources required to participateand extract the benefits. In addi-tion to these, and, perhaps evenmore valuable, the second partaddresses the qualitative bene-fits which are characterized as“priceless.” These include the

Development

Applied ResearchExploratory Research

Product Generation

SRC/SEMATECH/MARCO Roles

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GOAL: SEAMLESS FLOW OF TECHNOLOGY

Industry

SEMATECH & Suppliers

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• Largely company specific• Product emphasis

• Manufacturingtechnologyleadership • Narrow technology

choices• Identify path to

commercialization• Emphasize technology

transfer• Student emphasis• Customer fee allocation• Research

customization options

• Expand knowledge base• Create new choices• Fund university facilities &

equipment

About the SRC

This figure illustrates the present day commitment of R&D expenditures to ensure future generations of semiconductor devices. Thelargest investments are made by individual companies as they prepare

for their next generation of products. Additionally, significant resourcesare committed on a cooperative basis to meet the difficult challenges pre-sented by future products two generations and more from present day

practice. Each product generation represents increasing risk.

unquantifiable, long-term benefits accrued throughthe contributions made by the students as valuableresources to the member companies who hire them,as well as the specific research results which themember companies are able to use and which makesizable contribution to their business success. Morethan the simple leverage and cost avoidance, thesebenefits are the basis of the “compelling reasons”for the member companies to participate in the SRC.


Research Contributions

The SRC’s research community yielded critical contributions to member companies in 1997. A distinguishingfeature of these advanced, enabling technologies is that they are provided through the voice of the customer.The E-TAB Advocacy and Value Committee compiled this subset of SRC-sponsored research contributions andshare them by science area. The SRC also launched a new research initiative in operational methods in semicon-ductor manufacturing, described in the Factory Sciences section below.

FormalCheck® is a trademark of Lucent Technologies.

Members also utilize products from EDA ven-dors which in turn have their roots in SRC-spon-sored research, the indirect benefit SRC provides toits members mentioned earlier. These ‘productized’tools enable a wider range of SRC members to takeadvantage of Design Sciences research results. Forexample, Lucent Technologies’ FormalCheck® verifi-cation tool benefits from SRC-sponsored research atthe University of Colorado at Boulder and CarnegieMellon University.

Factory Sciences

The cost per function for semiconductordevices has historically followed a 30% per year costimprovement. This pattern is fueled by four keycontributors: reduced feature size, increased wafersize, improved yield and increased equipment andfactory productivity. The direction for reducing min-imum feature size is set for the next decade, and isdescribed in the NTRS. The projected contributionin cost improvement from reducing feature sizeremains fairly constant. Unfortunately, the same isnot so for contributions from yield improvement andwafer size increase. Wafer yields have improveddramatically over the past decade due, in part, tosuccessful research efforts, reducing the remainingpotential for contributions from improved yield.The cost return on increased wafer size is also pro-jected to diminish. Therefore, the productivity andefficiency of the factory and the utilization of pro-cessing equipment are critical if the historic costtrend is to be maintained.

In 1997, the SRC and the National ScienceFoundation (NSF) launched a research initiativedirected at the development of innovative new opera-tional methods that will enable factory performanceto keep pace with ongoing improvements in equip-ment and processes. The major theme of this initia-

Design Sciences

The SRC provides benefits to members directlywhen external research results connect with theirown in-house capabilities, and indirectly when theyuse commercial products having roots in SRC efforts.An example of receiving direct benefit is the formalverification tool, Verdict, developed by Motorola andused on commercial designs. Formal verification isplaying an increasingly important role in assuringthat electronic design implementations functioncorrectly, and SRC members and SRC-supportedfaculty and students are in the forefront of thiswork. Two SRC-supported students, one eachfrom the University of California at Berkeley andthe University of Colorado, worked with Motorolaresearchers and uncovered two functional errors inan automotive safety feature control chip. This workwas later reported as a case study at the 1997 DesignAutomation Conference. The Verdict tool, usedextensively by Motorola incorporates elements ofSRC-sponsored research at Carnegie MellonUniversity, The University of Colorado and theUniversity of California at Berkeley. This experienceillustrates that:

1. Pre-competitive research results from theuniversity community form a key part of the base onwhich SRC members build their tools and designs.

2. The work of several participating universitiescan be integrated and incorporated for successfulapplications.

3. Students play a key role in transfer of universityresults for application to member needs.

4. The university researchers in a particulararea are strengthened by becoming a collaborativecommunity under SRC auspices.


tive is the development of modeling, analysis, andoptimization techniques based on fundamental prin-ciples leading to factory-level models that allow foreffective control of semiconductor manufacturingoperations. While the individual process and equip-ment performance are important elements of thisinitiative, the focus is on the system (or factory)level. The development of this capability will have aprofound impact on the performance of currentand future fabrication facilities.

Interconnect Sciences

Cu Metallization and Low K Dielectrics atRensselaer Polytechnic Institute. Professor ShyhamMurarka and his research team in the Center forAdvanced Interconnect Science and Technology,(CAIST), led by RPI, have been developing novelprocesses and materials to address the fundamentalissue of the lag of the on-chip interconnect perfor-mance with respect todevice performance.These researchershave provided semi-nal information onthe physics and technology of Cuprocesses (includingdeposition and CMP)and their integrationwith various lowdielectric constant (K)insulators. Membercompanies, along

with SEMATECH, have drawn from the output ofthis research to develop process modules using Cumetallization and/or low K dielectrics for theirfuture interconnect process technologies.

Lithography Sciences

Advanced Mask Research at the University ofWisconsin-Madison. Mask modeling research led byProfessor Roxanne Engelstad has become an integraltool for the development of the NIST X-ray maskstandard and process used by Motorola. In 1997,this research expanded its scope to explore the per-formance, potential and limitations of all five masktechnology options identified as potential solutionsin the 1997 edition of the NTRS. SEMATECH isaugmenting SRC’s program by awarding approxi-mately $1.5 million to support and accelerate thiswork to facilitate next generation lithographydevelopment and prototype decisions.

Research Contributions

Collaborative efforts are underway between the UW-ComputationalMechanics Lab and Lucent Technologies to use finite elements (FE)

simulations to analyze and optimize the design of the SCALPELmask. A photo of a mask blank is shown with the corresponding FE

model (quarter symmetry). The 3D model is used to predict IPD and OPD during specified fabrication procedures.

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Materials & Bulk Process Sciences

0.1 µm CMOS Device Design at North CarolinaState University (NCSU). Researchers at NCSU havebeen concentrating their efforts on single-wafer man-ufacturing for submicron technologies. They havedeveloped a comprehensive program on low-thermalbudget, in-situ, single-wafer processing with facilitiesthat include plasma processing, rapid thermal pro-cessing and cluster tools for stacked-gate structuresand raised source-drain configurations. In the arenaof gate dielectric scaling, fundamental studies havebeen conducted on various gate insulators for scaledMOSFETs led by Professor Carlton Osburn. TheNCSU researchers have completed the design andoptimization of 0.1 µm CMOS devices using conven-tional and alternate gate stack dielectrics also devel-oped at NCSU. Dielectrics explored were furnacethermal oxide (used as a reference), rapid thermal oxide(RT oxide), rapid thermal chemical vapor depositedoxide (RTCVD oxide) and remote plasma enhancedchemical vapor deposited oxide (RPECVD). A designmanual is available that shows the results of a statisticaldevice design methodology and response surfaceanalysis that optimizes the key process parameters.A key accomplishment was the identification of con-ditions for each gate dielectric, that yielded the bestperformance as given by the saturation drive currentand met the 1997 NTRS off-state current specifica-tion. This work will serve as a guide for SRC mem-bers as they implement device designs for the 0.1µm technology node and beyond.

Packaging Sciences

Microminiature Thermal Management Research atStanford University. The NTRS projects that heatgenerated by most classes of devices will increase sub-stantially between 1998 and 2012. The rate for hand-held products will increase from 1.2 to 3.2 W on aper chip basis and the rate for the cost performancesegment will increase from 28 to 109 W per chip. Toprevent a dramatic increase in the temperatures andassociated failure rates of these systems, packagingdevelopment must proceed aggressively to identifyand alleviate sources of thermal resistance. Researchat Stanford University lead by Professor KenGoodson contributes to this effort by developingunique tools for mapping temperature, strain, andthermal resistance distributions in packaging, and bymeasuring packaging materials properties needed for

simulations. The core capability is high resolution(1ns/50nm) optical thermometry, which was originallydeveloped to map hot spots in interconnects duringESD stressing. Near field optical thermometry(NFOT) using a scanning fiber extended the spatialdistribution of die-attach thermal resistance andcaptures cross-sectional strain and temperatures dis-tribution in flip-chip structures. Thermal propertymeasurements yielded data for metal-filled epoxy dieattachments and for the aniostropic thermal conduc-tivity’s of novel polymer on-chip passivation. Thisresearch is conducted in close collaboration withmentors at Texas Instruments and Intel, where it isaiding in the simulation and design of reliablepackaging structures.

Process Integration & Device Sciences

BSIM3 at the University of California at Berkeley.A research team led by Professor Chenming Hu isexploring the extension of the Berkeley Short-channelIGFET Model (BSIM3) to support the circuitrequirements down to the 0.1 µm technology node.BSIM3 is different from earlier versions in that it isphysically based, scalable and ready for digital oranalog applications. Over 60 copies of the BSIM3codes and documentation have been shipped to orrequested from SRC members. All major commercialSPICE vendors have already released or plan torelease BSIM3. In its current formulation, BSIM3has been designed and verified for devices witheffective dimensions of 0.25 microns or above. Theformulation of BSIM3 is based on a coherent quasi-2Danalysis of device structures, taking into account theeffects of device geometry and process parameters.As such, scalability is inherently built-in. Currently,there are several challenges in the process of extend-ing the model from 0.25 µm to 0.1 µm. Some phe-nomena that we consider insignificant may becomeimportant, and this research will collect experimentalresults on silicon devices to validate the scaled model.The results of this research will continue to be verysignificant for SRC members.


Rewarding Outstanding Research Accomplishments


The SRC Technical Excellence Award was established by the SRC in 1991 as an incentive and recognitionprogram for research of exceptional value to SRC members. The awards are presented annually for research thatsignificantly enhances the productivity and competitiveness of the North American semiconductor industry.Award criteria include creativity and innovation; relevance to the research objectives of the SRC and the semi-conductor industry (as reflected by the NTRS); value or impact on industry in relation to internal roadmaps;cost reduction; and technology transfer success. This year’s recipients bring the number of researchers who havebeen recognized with the Technical Excellence Award to 45.

Technical Excellence Award

In 1997, thirteen Technical Excellence Awardnominations were accepted, most of them fromindustry, indicating the extent to which results fromSRC-funded programs are utilized by the industry.One was selected to receive the 1996 TechnicalExcellence Award and was recognized at an awardsbanquet and poster session held in conjunction withthe SRC’s June Board of Directors meeting and oper-ations review in Research Triangle Park, NC.

Mr. David Medeiros, Mr. Kyle Patterson, Mr.Uzodinma Okoroanyanwu, Dr. Tsutomu Shimokawa andProfessor Grant Willson, pictured below with SRCChairman Donald Wollesen (L to R) received theTechnical Excellence Award for their outstandingresearch at the University of Texas on “AdvancedResists.” This research involved the investigationof new chemical platforms for the design of highperformance 193-nm photoresists. What makes the

SRC Chairman Donald Wollesen, third from right, is pictured with the TechnicalExcellence Award winners from the University of Texas at Austin.

researchers’ contributions especially noteworthy arethe radical departure from “conventional” resistdesign, the breadth of detail in the investigation ofall potential cyclic olefin polymerization routes, thedetailed structure/ property studies performed onmaterials from all polymerization routes, and theunusually rapid success at gaining a degree of imagingperformance on new polymer materials which bore noresemblance to any resist materials yet to be employed.

As an industry we see an accelerating push forthe introduction of 193-nm lithography into manufac-turing before the turn of the century. As such, thedevelopment of 193-nm lithography (tools and resistprocesses) is highly compressed. Never before has

there been more of a need for the contribution ofthe academic research community in the research of new (193-nm) resist materials.

Professor Willson and his students have, per-haps for the first time in the history of the develop-ment of photoresist materials and processes, led theindustry in pursuit of new, high-performance pho-toresist. In February, 1998, Professor Willson andhis team used their resist design expertise to formu-late a resist that produced a dense array of 80-nmfeatures (see photos below). It is almost certain thatthrough the pioneering work of these researchers, acyclic olefin-based 193-nm photoresist will be acommercial reality.


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University of Texas at Austin193 Resist/Phase Mask Results

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Student ServicesRelevantly Educated Scientific Work Force

750 Students Supported

These young men and women conductedresearch under SRC contracts and were an outstandingsource of technology transfer through internshipsand permanent hire. SRC members continue toreport high satisfaction with the SRC students anddesignated them as the “most valuable SRC product”in 1997.

104 Graduates (at 1/98)

Of the SRC graduates in 1997, 55% joinedmember companies, 8% joined university faculties,3% joined government agencies, 20% joined NorthAmerican non-member companies; only 2% joinedforeign companies.

40 Graduate Fellows

At the beginning of the fall 1997 term, 30SRC-supported fellowships were in place includingthe Robert M. Burger Fellowship. Ten company-named fellowships were in place including 2 forAMD, 2 for IBM, 3 for Motorola, 1 for NationalSemiconductor, 1 for Texas Instruments, and theNIST/SRC Fellowship. The Fellows continue torepresent the brightest and best our universities haveto offer and to show great promise as the next gener-ation of leaders for the semiconductor industry.

The GFP Conference was co-sponsored byIntel Corporation in Santa Clara, CA. One hundredGraduate Fellows, Master’s Scholars and industrypersonnel attended this event. Nine invited studentpapers and 37 poster sessions werepresented. The highlight of the two-day conference was the keynote address by Dr. Gordon Moore.

4 Master’s Scholars

The Master’s Scholarship Program was createdin 1997 to attract qualified students in under-repre-sented minority categories to disciplines of interestto the semiconductor industry. The Master’s Scholarsare performing research under SRC contracts atLehigh University, Stanford University, the Universityof Illinois and the University of Washington.

Member Access to Students

The move to electronic distribution of studentresumes was accomplished in the second quarter of1997. Resumes for about 50% of the SRC studentscan be accessed via the Graduate Student Directoryon the SRC restricted Web site; resumes are alsolinked to the Research Catalog through the GraduateStudent Directory. Company staffing personnelhave the ability to download resumes to internalresume distribution systems.

Student Services Technical Advisory Board (TAB)

1997 was the first full year for the StudentServices TAB. This advisory group is different thanother SRC TABs in that it includes company recruit-ing personnel as well as technologists and scientists.Accomplishments for this TAB in 1997 includedconvening a planning workshop in July hosted byTexas Instruments. The TAB also provided guidancein improving the resume distribution service andactively recruited for the Master’s ScholarshipProgram.

At the GFP Conference, Alumni (L to R) RobertSocha and MatthewHankinson, bothemployed by NationalSemiconductor, discussresearch done by currentGFP Fellows (L to R)Brad Shutzberg, JeanKelsey and SimonKarecki.


Aristotle Award Presented at GFP Conference

Professor Kensall Wise, University of Michigan, was the recipient of the 1997 Aristotle Award, presented atthe Graduate Fellowship Program Annual Conference in Santa Clara, CA. in September. The Aristotle Awardrecognizes excellence in teaching through the research process. In their nomination, Professor Wise’s formerstudents spoke of him as a teacher ahead of his time, emphasizing quality tools, customer interaction and inter-disciplinary research before these were popular methods. He was also referred to as a “learned man, a seeker ofknowledge, a teacher, a mentor, an advisor, a colleague, and above all, a very good friend.” During his tenure atthe University of Michigan, ProfessorWise has graduated over 30 doctoralstudents and has taught several thou-sand more the art of circuit analysis anddesign, integrated circuit fabrication,sensor design, micromaching andmicrofabrication technology, and semi-conductor manufacturing techniques.

Master’s ScholarsPaul AmpadauUniversity of Washington

Adreanne KellyLehigh University

Ronald KinderUniversity of Illinois

Francisco MachucaStanford University

GFP FellowsAndrew AboUniversity of California at Berkeley

Peter AbramowitzUniversity of Texas at Austin

Daniel Bergstrom*University of Illinois

Nicholas Bollen,* Robert M.Burger Fellow

Duke University

Michael BoothCornell University

Christopher BorstRensselaer Polytechnic Institute

Arthur BradleyAuburn University

Scott BukofskyYale University

Jir-Shyr Chen, IBM/SRC FellowCornell University

Roawen ChenUniversity of California at Berkeley

Paul DentingerUniversity of Wisconsin

Jonathan DoanStanford University

Cheryl Faltermeier*State University of New York at Albany

Joel Fenner, Robert M. Burger FellowNorth Carolina State University

Timothy FisherCornell University

David Fryer, TI/SRC FellowUniversity of Wisconsin

Glenn Glass, Motorola/SRC FellowUniversity of Illinois

Lawrence Goodby*University of California at San Diego

Matthew Hankinson*University of Michigan

Jennifer Havard, AMD/SRC FellowCornell University

Brian Hornung*North Carolina State University

Gregg HoyerUniversity of Washington

Fredrick Huang*University of Illinois

Anna Ison, Motorola/SRC FellowUniversity of California at Berkeley

Simon Karecki, Motorola/SRC FellowMassachusetts Institute of Technology

Jean KelseyState University of New York at Albany

Steven LevineCornell University

Marline ManassianUniversity of Texas at Austin

Derek MartinUniversity of Florida

Bruce McGaughyUniversity of California at Berkeley

George McMurrayUniversity of California at Berkeley

Katherine MuellerUniversity of Texas at Austin

Shipra Panda, NSC/SRC FellowCarnegie Mellon University

Michael Perkins, NIST/SRC FellowStanford University

William Pinello*University of Arizona

Lance Robertson, IBM/SRC FellowUniversity of Florida

Eric SheroUniversity of Arizona

Brad ShutzbergCornell University

Jeffrey SnodgrassStanford University

Robert Socha*, NSC/SRC FellowUniversity of California at Berkeley

Robert Sumners, AMD/SRC FellowUniversity of Texas at Austin

Ronald Sutcliffe*University of North Texas

Dennis SylvesterUniversity of California at Berkeley

Bassam TabbaraUniversity of California at Berkeley

Todd E. Takken*Stanford University

Martin TannerUniversity of California at Los Angeles

Nerissa TaylorUniversity of Illinois

Shawn ThomasUniversity of California at Los Angeles

Steven Walstra*University of Florida

Peter J. VanDerVoornCornell University

Xin Yi ZhangStanford University

*Graduated in 1997

Dr. Gordon Moore (L),Chairman of the Board ofDirectors of Intel Corporationand keynote speaker for theGraduate Fellowship ProgramAnnual Conference with ProfessorKensall Wise, recipient of the1997 Aristotle Award.


The SRC Industrial Mentor Program, created by the SRC in 1983, is one of the most effective methodsdeveloped by the SRC to provide its members with early access to key technologies, substantial leverage in theexplicit direction of technology development, and ultimate transfer of semiconductor technology from theresearch base to the supporting industry. This program enables industry’s best technicalpeople to guide, shape and support the SRC research efforts. Like most endeavors,mentoring requires dedication and willingness to work as a team long enough tocreate a more valuable research outcome. Each mentor and research teambuilds their own unique relationship based upon the particular needs of thepersonnel and the research project.

During 1997, 481 individual mentors from 26 SRC member companiesand organizations were involved in SRC research tasks. To recognize their sig-nificant contributions, the SRC presents its annual Outstanding IndustrialMentor Award. Seven mentors have been chosen to receive this award for 1997.

Dr. Martin Giles of Intel Corporation: Dr. Giles has been a mentor to Profs. Robert Duttonand Jim Plummer and their graduate students atStanford University. As a mentor to this program, hebrought experience with software development and thehierarchy of models for diffusion and knowledge ofshort-and long-term industrial needs to define devel-opment in the ALAMODE (A Layered ModelDevelopment Environment) project. Dr. Giles hasshared valuable advice on the issues of representationfor materials and interfaces, and how to map systemsof diffusion equations and boundary conditions ontothese representations. His understanding of the hier-archy of diffusion models has been a benefit both tohelp refine the model specification paradigm used inALAMODE and to help bridge the gap betweenresearchers who concentrate on a single level of thehierarchy

Dr. Ted Kamins of Hewlett-Packard: Dr.Kamins has been mentoring Prof. Dieter Ast and hisstudents at Cornell University, and has shown dili-gence and strategic foresight in providing guidanceand resources. In working with a student on the studyof polycrystalline silicon-germanium films, Dr.Kamins supplied films needed for the experimentalwork being conducted. In another instance, Dr.Kamins was asked a question on the ability to use Geto put down crystalline seeds on glass at any tempera-

ture between 400 and 580˚C, and instead of merelyanswering the question, he ran his own experimenton three wafers and shipped the results and wafersto the research team.

Dr. Linda Milor of Advanced Micro Devices(AMD): Dr. Milor has mentored Profs. WojchiechMaly and Andrzej Strojwas’ research projects atCMU. With Dr. Milor’s support, MAPEX was trans-ferred to AMD and other SRC member companies.In her work with Prof. Strojwas and his students, Dr.Milor assisted in finding an application for the defectsimulation software, METROPOLE. Dr. Milor facili-tated the visit of one student to AMD for a month tocollect in-line defect data and for two other studentsto make subsequent trips to AMD to analyze and collect additional data. Working with the professorsand students, she made many improvements toMETROPOLE so that a much larger set of defectscould be correctly simulated.

Dr. John Sauber of Digital EquipmentCorporation: Dr. Sauber has been mentoring thework of Profs. Brian Harper and Vernal Kenner atThe Ohio State University. He has contributed in acritical way to two tasks of this research program.In the first task on quantifying fracture resistance of

Industrial Mentor ProgramThe Vitality in Cooperative Research

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laboratory to the members. Dr. Van Eck contactedindustry experts in optical detection and identifiedthe market sector for which PBMS (Particle BeamMass Spectroscopy), the concept developed atMinnesota, would be most appropriate. When overallSRC budget limitations threatened to preclude theconstruction of a portable demonstration vehiclewhich would allow PBMS to be taken to membercompanies, Dr. Van Eck helped to find the funds tobuild the system.

Mr. T. M. Mak of Intel Corporation:Mr. Mak has been mentoring Profs. Joel Fergusonand Tracy Larrabee of the University of California atSanta Cruz. He has played a pivotal role in havingUCSC’s inductive fault model and test generationtool suites (Carafe/Nemesis) evaluation started atIntel by starting a cross-site Carafe User-forum atIntel to promote the tool. He also managed a multiplesite evaluation of the tool. He has improved theinteractions between two faculty members and indus-try in the area of accessibility to realistic circuits andprovided the researchers a better understanding ofindustry requirements and the relevance of theirresearch to their needs. Mr. Mak arranged intern-ships at Intel for three students on the project.During their internships, Mr. Mak encouraged andarranged for the students to present their work towider audiences. These presentations gave the stu-dents opportunities to get more diverse feedbackand a feel of the dynamics of an “industry-style”interaction that is not common in an academicenvironment.

package structural elements, Dr. Sauber has beenresponsible for supplying the majority of fracturetoughness specimens tested during the program.He collaborated with a fellow mentor in procuringand then molding specimens. He “went to bat” forthe program within Digital to bring to fruition amold for the fabrication of a complicated specimen,and after completing the mold, continued hisinvolvement in refining it during initial trials andoverseeing the molding specimens. He has madecritical contributions to the task on constitutive dataacquisition and interfacing. One of the most impor-tant of these was his idea to test DMA as a meansfor reducing the time and effort required to performviscoelastic characterizations of electronic packagingpolymers.

Ms. Denise Puisto of IBM Corporation:Ms. Puisto has been a mentor to Prof. RoxanneEngelstadt at the University of Wisconsin atMadison, in mask development and design. Sheinteracted closely with the students and scientists indiscussing the results of their models and in providingsuggestions for coordinating their mask modelingwork and the experimental efforts at IBM/Lockheed.The finite element models developed at Wisconsinto simulate in-situ stress relief were benchmarkedwith experimental data provide by Ms. Puisto. In asecond area of collaboration involving predictingthe distortions due to the deposition or removal ofmultiple stressed layers during the fabrication process,it was again through Ms. Puisto’s efforts thatresearchers were able to experimentally verify theirmodels to simulate the patterntransfer process.

Dr. Bradley Van Eck ofSEMATECH: Dr. Van Eckmentored Prof. StephenCampbell and his team ofresearchers at the University ofMinnesota. Dr. Van Eck becameinvolved as a mentor to thiswork involving the detection ofsmall particles in semiconductorprocessing equipment duringthe period when the research wasbeing moved from the university

(L to R) DenisePuisto, IBM; T.M.Mak, Intel; andLinda Milor, AMDare shown withtheir outstandingIndustrial MentorAwards.


Another value of SRC membership is protectionof technology and intellectual property assets thatare developed as a result of SRC support. The SRChas a worldwide, nontransferable, royalty-free, non-exclusive license right to inventions and works ofauthorship (e.g., software) resulting from SRC-fundedresearch. The SRC sub-licenses such inventions andworks of authorship, as appropriate, to SRCMembers.

U.S. Patents which issued in 1997 includedadditions to existing technology portfolios in theareas of advanced devices (including SiGe superlat-tice quantum well devices and a self-aligned, high-speed SOI MOSFET), and in lithography (tools andwater-soluble photoresists). The reactive membranefilter patents, developed at the University of Arizonaunder SRC and SEMATECH funding for contami-nation-free manufacturing research, exemplify successful 3rd party, infrastructure organization technology transfer.

Overall, the SRC added 12 newly issued U.S.Patents to its intellectual property portfolio, bring-ing the SRC’s total number of issued U.S. Patentsto 150. The table on this page lists SRC U.S. Patentsissued in 1997. Eight new U.S. Patent Applicationswere filed in 1997 from invention disclosures devel-oped as a result of the SRC research program funding.

Moreover, in 1997, 86 software submissions(26 alpha releases; the remainder as upgrades) werelogged having been authored as a result of SRC sup-port. Two significant programs include the POLIS/0.2 software, developed at University of California at Berkeley, and an upgrade of VIS release 1.2, co-developed by collaborators at University of Californiaat Berkeley, the University of Colorado at Boulder,and University of Texas at Austin. POLIS is a co-design environment for the synthesis of hardware/software in embedded systems. VIS is a softwareenvironment for synthesis and formal verificationof digital circuitry.

Preserving Options for the Future

1997 U.S. Patents IssuedTitle Inventor Issued Patent No.

Method of Fabricating C-M Hu 2/4/97 5,599,728a Self-Aligned High Speed H.WannMOSFET Device (UC/Berkeley)

Process of Making Oxidation W. Landford 4/22/97 5,622,608High Conductivity Copper P. DingLayers (SUNY/Albany)

Method of Fabricating W. Lynch 5/20/97 5,630,905Quantum Bridges by K.WangSelecting Etching of M.TannerSuperlattice Structures (UCLA)

Selective Low Temperature Chemical E. Seebauer 5/27/97 5,633,036Vapor Deposition of Titanium M. MendicinoDisilicide onto Silicon Regions (UIUC)

Method and Apparatus for Dual E.Whittaker 6/3/97 5,636,035Modulation Laser Spectroscopy H. Sun

(NJSCOE)

Reactive Membrane for Filtration F. Shadman 6/3/97 5,635,148and Purification of Gases of (Arizona)Impurities and Method Utilizing the Same

Reactive Membrane for Filtration F. Shadman 6/10/97 5,635,544and Purification of Gases of (Arizona)Impurities and Method Utilizing the Same

Systems for Performing Chemical S. Murarka 6/10/97 5,637,185Mechanical Planarization and R. GutmannProcess for Conducting Same D. Duquette

J. Steigerwald(RPI)

Water-Soluble Photoinitiators J. Frechet 7/15/97 5,648,196(Cornell)

Method,Apparatus and Computer R. Saleh 9/2/97 5,663,890Program Product for Determining J. MuellerFrequency Domain Response of a B. AntaoNonlinear Microelectronic Circuit (UIUC)

Stress-Free Mount for X-Ray F. Cerrina 10/7/97 5,675,403Lithography Masks J.Wallace

(Wisconsin)

SCRAM Cell Utilizing Bistable Diode K.Wang 11/4/97 5,684,737Having SeSi Structure Therein X. Zheng

T. Carns(UCLA)

Intellectual Property Report

1997 SRC Board of Directors

Donald WollesenAdvanced Micro Devices, Inc.Chairman

George BodwayHewlett-Packard Company

Bruce C. BurkeyEastman Kodak Company

Sunlin ChouIntel Corporation

Walter ClassEaton Corporation

Michael FitzpatrickNorthrop Grumman Corporation

Thomas GannonDigital Equipment Corporation

Sherry GillespieMotorola, Incorporated (8/97 -12/97)

Richard S. HillNovellus Systems, Inc.

Dyer A. MatlockHarris Corporation

C. Mark Melliar-SmithSEMATECH

Yoshio NishiTexas Instruments Incorporated (1/97 - 10/97)

Gobi R. PadmanabhanNational Semiconductor Corporation (3/97 - 12/97)

Mark PintoLucent Technologies

Michael PolcariIBM Corporation

Richard SchinellaLSI Logic Corporation

Ashwin ShahTexas Instruments Incorporated (10/97 - 12/97)

Court SkinnerNational Semiconductor Corporation (1/97 - 3/97)

Larry SumneySemiconductor Research Corporation

Owen WilliamsMotorola, Incorporated (1/97 - 8/97)

of innovation15 years

Larry SumneyPresident & CEO

Ralph K. Cavin IIIVice President, ResearchOperations

Dinesh MehtaVice President, AdministrativeOperations and Strategic Initiatives

Peter VerhofstadtExecutive Vice President, andManaging Director, MARCO

1997 Office of the Chief Executive

The Semiconductor Research CorporationBrighton Hall, Suite 120, 1101 Slater Road

Durham, North Carolina 27703http://www.src.org

Post Office Box 12053Research Triangle Park, North Carolina 27709-2053

Documents

New Semiconductor Research Corporation - SRC - 1997 SRC Annual … · 2012. 4. 11. · The annual report of the Semiconductor Research Corporation is published each year to summarize