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May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

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Page 1: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation
Page 2: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 2

USB 2.0 Technical Overview

USB 2.0 Technical Overview

Brad HoslerBrad Hosler

USB Engineering ManagerUSB Engineering Manager

Intel CorporationIntel Corporation

Page 3: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 3

Conference GoalConference Goal

Provide you with the information youProvide you with the information youneed to build USB 2.0 productsneed to build USB 2.0 products– USB 2.0 technical detailsUSB 2.0 technical details– USB 2.0 InfrastructureUSB 2.0 Infrastructure– Building USB 2.0 devicesBuilding USB 2.0 devices– USB 2.0 Building BlocksUSB 2.0 Building Blocks

Page 4: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 4

USB 2.0: Conference AgendaUSB 2.0: Conference Agenda

Architecture OverviewArchitecture Overview– Peripheral Development EnablingPeripheral Development Enabling– Hi-speed powerHi-speed power– Hi-speed performanceHi-speed performance

Microsoft SW UpdateMicrosoft SW Update USB 2.0 Compliance and Logo ProgramUSB 2.0 Compliance and Logo Program USB 2.0 Compliance TestingUSB 2.0 Compliance Testing

Single Track: Topics for EveryoneSingle Track: Topics for Everyone

Page 5: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 5

Split Track: Focused TopicsSplit Track: Focused TopicsUSB 2.0: Technical AgendaUSB 2.0: Technical Agenda

USB2 SpecificationsUSB2 Specifications– ElectricalsElectricals– ProtocolProtocol– HubsHubs

Power ManagementPower Management Host Controller SpecHost Controller Spec

– Compliance testingCompliance testing Cable TestingCable Testing USB “On the Go”USB “On the Go”

USB2 SoftwareUSB2 Software– Writing Quality DriversWriting Quality Drivers– HS Isoch InterfaceHS Isoch Interface

Building USB2 DevicesBuilding USB2 Devices Design OptionsDesign Options Transceiver MacrocellTransceiver Macrocell AnalyzersAnalyzers

Platform DesignPlatform Design BIOS considerationsBIOS considerations

Page 6: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 6

ArchitectureOverview

ArchitectureOverview

Page 7: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 7

USB 2.0: What Changed??USB 2.0: What Changed??

Low level electricals for High Speed (HS) Low level electricals for High Speed (HS) signalingsignaling– Much higher bit rate (480Mb/s) requires new Much higher bit rate (480Mb/s) requires new

transmitter/receiver transmitter/receiver Hub changes for backward compatibilityHub changes for backward compatibility

– Features limit bandwidth impact of Full Speed (FS)Features limit bandwidth impact of Full Speed (FS)and Low Speed (LS) devices on HS devicesand Low Speed (LS) devices on HS devices

– FS/LS devices consume a bit-rate equivalentFS/LS devices consume a bit-rate equivalentof HS bandwidthof HS bandwidth

Architecture OverviewArchitecture Overview

Page 8: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 8

USB 2.0: What Didn’t Change?USB 2.0: What Didn’t Change?

Same host/device modelSame host/device model– Host is in chargeHost is in charge– Devices are inexpensiveDevices are inexpensive

Same basic protocolSame basic protocol– Token, data, handshakeToken, data, handshake

Same device frameworkSame device framework– DescriptorsDescriptors

Same software interfacesSame software interfaces– USBDIUSBDI

Architecture OverviewArchitecture Overview

Page 9: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 9

Same power distribution and consumptionSame power distribution and consumption– 500ua suspend, 100ma unconfigured,500ua suspend, 100ma unconfigured,

500ma configured500ma configured Same power management featuresSame power management features

– Suspend/resume model unchangedSuspend/resume model unchanged Same topology managementSame topology management

– Hub features to handle connect, disconnect,Hub features to handle connect, disconnect,enable, disable, …enable, disable, …

Same cables and connectorsSame cables and connectors

ContinuedContinued

Architecture OverviewArchitecture Overview

USB 2.0: What Didn’t Change?USB 2.0: What Didn’t Change?

Page 10: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 10

System SWSystem SW

Client DriverClient Driver Client DriverClient Driver

USB 1.1 HubUSB 1.1 Hub

USB 1.1 USB 1.1 DeviceDevice

USB 1.1 USB 1.1 DeviceDevice

HS HubHS HubHS HubHS Hub

USB 1.1 HubUSB 1.1 Hub

USB 1.1 USB 1.1 DeviceDevice

USB 1.1 USB 1.1 DeviceDevice

HS DeviceHS DeviceHS DeviceHS Device

USB 2.0 HostUSB 2.0 HostControllerController

USB 2.0 HostUSB 2.0 HostControllerController

Full/Low SpeedFull/Low Speed

High Speed OnlyHigh Speed Only

(2 x 12Mb/s(2 x 12Mb/sCapacity)Capacity)

Sample USB 2.0 TopologySample USB 2.0 Topology

Hub provides high-speed expansion (ala USB 1.1 hub)Hub provides high-speed expansion (ala USB 1.1 hub) Hub provides additional Full/Low speed bus(es)Hub provides additional Full/Low speed bus(es)

Architecture OverviewArchitecture Overview

Page 11: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 11

USB 2.0 Host ControllerUSB 2.0 Host Controller

Allows port functionality regardless of OS versionAllows port functionality regardless of OS version– USB 1.1 OS will ‘just work’ as USB 1.1 portsUSB 1.1 OS will ‘just work’ as USB 1.1 ports

USB 1.1 HCs can go away over timeUSB 1.1 HCs can go away over time– Replaced with integrated USB 2.0 HubReplaced with integrated USB 2.0 Hub

Architecture OverviewArchitecture Overview

USB 2.0 Host Controller (HC)

Port 1

USB 1.1 USB 1.1 HCsHCsHigh-Speed ModeHigh-Speed Mode

(Enhanced Interface) USB HC(Enhanced Interface) USB HC

Port 1 Port 2

Port OwnerPort OwnerControl(s)Control(s)

Port 1 Port 2

Port Routing Logic

Port N

HC Control Logic/Data BufferingEnhanced HC Control Logic

Enhanced Data Buffering

Port 2 Port N

Port N

Page 12: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 12

USB 2.0 HubUSB 2.0 Hub

Hub controller same as USB1.1Hub controller same as USB1.1 Routing logic connects device to appropriate pathRouting logic connects device to appropriate path

TransactionTransactionTranslatorTranslator

TransactionTransactionTranslatorTranslator

PortPortPortPortRouting LogicRouting LogicRouting LogicRouting Logic

HS SignalHS SignalRepeaterRepeater

HS SignalHS SignalRepeaterRepeater

HubHubControllerController

HubHubControllerController

PortPortPortPortPortPortPortPort PortPortPortPort

High Speed onlyHigh Speed only

Full/LowFull/LowSpeedSpeed

Architecture OverviewArchitecture Overview

Page 13: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 13

Transaction Translator (TT)Transaction Translator (TT)

TT handles low/full speed transactionsTT handles low/full speed transactions– Driven with split transactionsDriven with split transactions

Start-SplitStart-Split– Host tells Hub to initiate full/low speed transactionHost tells Hub to initiate full/low speed transaction

Complete-SplitComplete-Split– Host asks Hub for results of previous full/lowHost asks Hub for results of previous full/low

speed transactionspeed transaction

Architecture OverviewArchitecture Overview

Page 14: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 14

Bandwidth UsageBandwidth Usage

Low/full speed devices use bit-rate equivalent of Low/full speed devices use bit-rate equivalent of USB2.0 bandwidthUSB2.0 bandwidth– 6Mbps classic camera (50% of classic) uses less than 6Mbps classic camera (50% of classic) uses less than

2% of USB2.0 bandwidth (6Mbps/480Mbps)2% of USB2.0 bandwidth (6Mbps/480Mbps)

Architecture OverviewArchitecture Overview

Page 15: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 15

ISOCH IN through a TTISOCH IN through a TT

HS Bus

Full Speed Bus

uSOF

1ms

uSOF uSOF uSOF uSOF uSOF uSOF uSOF uSOF

SOF SOF

SS

SS = Start Split

CS CS CS CS

125us

CS = Complete Split

Architecture OverviewArchitecture Overview

Page 16: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 16

SummarySummary

Two major changes for USB 2.0Two major changes for USB 2.0– Higher speed electricalsHigher speed electricals– Transaction translator in USB2.0 hubTransaction translator in USB2.0 hub

Backward compatibilityBackward compatibility– All Full/Low-speed devices continue to workAll Full/Low-speed devices continue to work– Has little impact on HS bandwidthHas little impact on HS bandwidth

Architecture OverviewArchitecture Overview

Page 17: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 17

Enabling Peripheral Development

Enabling Peripheral Development

Page 18: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 18

USB 2.0 HC CardsUSB 2.0 HC Cards

PCI and PCCard versionsPCI and PCCard versions– Use NEC siliconUse NEC silicon– Full EHCI implementationFull EHCI implementation

Available in retailAvailable in retail– Frys, Circuit City, …Frys, Circuit City, …– www.orangemicro.com,www.orangemicro.com,

www.adaptec.com, …www.adaptec.com, …

Peripheral EnablingPeripheral Enabling

Page 19: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 19

Driver SoftwareDriver Software

HC driver for Windows 2000 and Windows XPHC driver for Windows 2000 and Windows XP– Available at www.usb.org for member companiesAvailable at www.usb.org for member companies

Drivers provide full functionalityDrivers provide full functionality– All high-speed transfer typesAll high-speed transfer types– Full support for USB 2.0 hub transaction translatorFull support for USB 2.0 hub transaction translator

Drivers are for development use onlyDrivers are for development use only– Cannot be shipped with productsCannot be shipped with products

Peripheral EnablingPeripheral Enabling

Page 20: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 20

Single Transaction ToolSingle Transaction Tool

Software application for generating individual Software application for generating individual high-speed transactionshigh-speed transactions

Very useful for early device debugVery useful for early device debug Doesn’t require a device to enumerateDoesn’t require a device to enumerate Any type of transaction can be generatedAny type of transaction can be generated

– Including individual parts of Control transfersIncluding individual parts of Control transfers Available at www.usb.orgAvailable at www.usb.org

Peripheral EnablingPeripheral Enabling

Page 21: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 21

Transceiver MacrocellTransceiver Macrocell

ASICASICASICASIC

Serial Interface EngineSerial Interface EngineSerial Interface EngineSerial Interface Engine

DeviceDeviceSpecificSpecific

LogicLogic

DeviceDeviceSpecificSpecific

LogicLogic

Endpoint Logic

Endpoint Logic

…SIE

Control Logic

USB 2.0USB 2.0Endpoint Logic

Device Device HardwareHardware

USB 2.0 USB 2.0 TransceiverTransceiver

USB 2.0 USB 2.0 TransceiverTransceiver

Defines Standard Interfacefor Transceiver Macrocell

Defines Standard Interfacefor Transceiver Macrocell

USB 2.0 Transceiver Macrocell Interface (UTMI) USB 2.0 Transceiver Macrocell Interface (UTMI) http://developer.intel.com/technology/usb/spec.htmhttp://developer.intel.com/technology/usb/spec.htm

Broad Industry supportBroad Industry support Discrete versions availableDiscrete versions available

Peripheral EnablingPeripheral Enabling

Page 22: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 22

VHDL (IP) CoresVHDL (IP) Cores

ASICASICASICASIC

Serial Interface EngineSerial Interface EngineSerial Interface EngineSerial Interface Engine

DeviceDeviceSpecificSpecific

LogicLogic

DeviceDeviceSpecificSpecific

LogicLogic

Endpoint Logic

Endpoint Logic

…SIE

Control Logic

USB 2.0USB 2.0Endpoint Logic

Device Device HardwareHardware

USB 2.0 USB 2.0 TransceiverTransceiver

USB 2.0 USB 2.0 TransceiverTransceiver

Tran-Tran-sceiversceiver

ProductProductFunctionFunction

USB 2.0USB 2.0

3rd Party VHDL3rd Party VHDL

Peripheral EnablingPeripheral Enabling

Page 23: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 23

Building BlocksBuilding Blocks

MicrocontrollersMicrocontrollers– CypressCypress

Interface chipsInterface chips– NetchipNetchip

IDE/ATAPI bridgesIDE/ATAPI bridges– In-System Design, NECIn-System Design, NEC

ENET 10/100 BridgeENET 10/100 Bridge– Kawasaki LSIKawasaki LSI

UTMI macro cellsUTMI macro cells– Seiko-Epson, Kawasaki LSISeiko-Epson, Kawasaki LSI

UTMI TransceiversUTMI Transceivers– Lucent, Kawasaki LSILucent, Kawasaki LSI

Peripheral EnablingPeripheral Enabling

Page 24: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 24

Bus AnalyzersBus Analyzers

Available nowAvailable now CatalystCatalyst

– http://www.catalyst-ent.comhttp://www.catalyst-ent.com CATCCATC

– http://www.catc.comhttp://www.catc.com Crescent HeartCrescent Heart

– http://www.c-h-s.comhttp://www.c-h-s.com Data TransitData Transit

– http://www.data-transit.comhttp://www.data-transit.com

Peripheral EnablingPeripheral Enabling

Page 25: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 25

Peripheral Integration LabPeripheral Integration Lab

Integration lab at Intel’s Architecture LabsIntegration lab at Intel’s Architecture Labsin Oregonin Oregon– Multiple hosts and devices (interop testing)Multiple hosts and devices (interop testing)– Test equipment (scopes, analyzers, TDRs, etc.)Test equipment (scopes, analyzers, TDRs, etc.)– Expert help from HW and SW engineersExpert help from HW and SW engineers– Compliance testingCompliance testing– Platforms and host controllers welcome tooPlatforms and host controllers welcome too

Available to anyone planning on deliveringAvailable to anyone planning on deliveringUSB 2.0 device in 2001USB 2.0 device in 2001

Peripheral EnablingPeripheral Enabling

Page 26: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 26

Hi-Speed Power Issues

Hi-Speed Power Issues

Page 27: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 27

Power RequirementsPower Requirements

Suspended - ~2.5maSuspended - ~2.5ma Configured - 500maConfigured - 500ma UnConfigured - 100maUnConfigured - 100ma

Examine each of these from a hi-speed device and Examine each of these from a hi-speed device and infrastructure (host, hub, cable) perspectiveinfrastructure (host, hub, cable) perspective

Hi-Speed PowerHi-Speed Power

Page 28: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 28

Suspend CurrentSuspend Current

Device: Device: – Device is always in FS mode, HS clocks are offDevice is always in FS mode, HS clocks are off– Implementations should be similar to current solutionsImplementations should be similar to current solutions

Host/Hub: Host/Hub: – Important for Instantly Available PCsImportant for Instantly Available PCs– Dual-mode power supplies are sized to provide power Dual-mode power supplies are sized to provide power

to USB port when machine is ‘sleeping’to USB port when machine is ‘sleeping’– ‘‘Don’t care’ for hubs and cablesDon’t care’ for hubs and cables

Hi-Speed PowerHi-Speed Power

Page 29: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 29

Configured CurrentConfigured Current

Device:Device:– Hi-speed transceivers tend to consume more powerHi-speed transceivers tend to consume more power– Less power available for device functionLess power available for device function

Host/Hub: Host/Hub: – Power supplies sized to support thisPower supplies sized to support this– Cable conductors sized for appropriate IR dropCable conductors sized for appropriate IR drop

Hi-Speed PowerHi-Speed Power

Page 30: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 30

Unconfigured CurrentUnconfigured Current

Device:Device:– Hi-speed transceiver can consume most of budgetHi-speed transceiver can consume most of budget– Difficult to build bus-powered hi-speed devicesDifficult to build bus-powered hi-speed devices

Host/Hub:Host/Hub:– Important for bus-powered hubsImportant for bus-powered hubs

Four downstream ports at 100ma eachFour downstream ports at 100ma each– ‘‘Don’t care’ for hosts, self-powered hubs, and cablesDon’t care’ for hosts, self-powered hubs, and cables

Hi-Speed PowerHi-Speed Power

Page 31: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 31

IssuesIssues

We like bus-powered devicesWe like bus-powered devices– This is an essential characteristic for productsThis is an essential characteristic for products

Is the 100ma limit really a problem?Is the 100ma limit really a problem?– Transmit/receive differencesTransmit/receive differences

Device is >99% receiving when unconfiguredDevice is >99% receiving when unconfigured Would increasing to 150ma be enough?Would increasing to 150ma be enough?

– Impacts bus-powered hubsImpacts bus-powered hubs Limited to two ports (300ma for ports, 200 for hub silicon)Limited to two ports (300ma for ports, 200 for hub silicon)

– Any other impacts?Any other impacts?

Comments/suggestions to [email protected]/suggestions to [email protected]/suggestions to [email protected]/suggestions to [email protected]

Hi-Speed PowerHi-Speed Power

Page 32: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 32

Hi-Speed Detection Handshake

Hi-Speed Detection Handshake

Page 33: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 33

Downstream PortsDownstream Ports

Port is driving Port is driving RESETRESET

Port must detect Port must detect 2.5us ChirpK 2.5us ChirpK starting from 2.5us starting from 2.5us after asserting after asserting RESET until 7ms RESET until 7ms after asserting after asserting RESETRESET

Hi-Speed HandshakeHi-Speed Handshake

Device turns onHS termination

Reset

Page 34: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 34

Upstream PortsUpstream Ports

Two cases: Reset from FS and reset from HSTwo cases: Reset from FS and reset from HS Both casesBoth cases

– ChirpK must be at least 1ms in duration and must be ChirpK must be at least 1ms in duration and must be complete within 7ms after RESET begancomplete within 7ms after RESET began

Reset from FSReset from FS– Device must start ChirpK sometime between 2.5us and Device must start ChirpK sometime between 2.5us and

6ms after detecting RESET6ms after detecting RESET Reset from HSReset from HS

– After device sees SE0 for 3ms and reverts to FS After device sees SE0 for 3ms and reverts to FS terminations, then does ChirpK if there is still an SE0terminations, then does ChirpK if there is still an SE0

Hi-Speed HandshakeHi-Speed Handshake

Page 35: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 35

Reset from HSReset from HSHi-Speed HandshakeHi-Speed Handshake

μSOFμSOF Device ChirpDevice Chirp Hub ChirpHub Chirp

D+

D–

3.0-3.125 ms 100-875 μs > 1.0 ms

< 7.0 ms

< 100 μs 100-500 μs

> 10 ms

Device Chirp

Start ofReset

Device EntersHS < 500 UsAfter DetectingHub Chirp

Start ofReset

End ofReset

End ofHub Chirp

Start ofHub Chirp

μSOFμSOF

Hub

Dev

ice

SE0SE0 SE0SE0SE0SE0 HS idleHS idle

Devicegoes

into FS

Devicetests for

SE0

Page 36: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 36

Hi-Speed USB Performance

Hi-Speed USB Performance

Page 37: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 37

Mass Storage PerformanceMass Storage Performance

Standard IDE drive connected through different meansStandard IDE drive connected through different means

ConnectionConnection ReadRead(MB/s)(MB/s)

WriteWrite(MB/s)(MB/s)

Seek TimeSeek Time(msec)(msec)

USB 2.0USB 2.0 12.112.1 9.99.9 13.513.5

USB 1.1USB 1.1 0.920.92 0.880.88 15.415.4

IDE same busIDE same bus 2.12.1 2.02.0 14.214.2

IDE separate busIDE separate bus 15.115.1 13.613.6 12.312.3

Data provided by In System Design.

Values measured with HD Tach 2.61, 30GB IBM drive, 333Mhz PIII system, 320MB RAM

Hi-Speed USB PerformanceHi-Speed USB Performance

Page 38: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 38

Mass Storage PerformanceMass Storage Performance

Benchmark comparison of USB 2.0 high-speed Benchmark comparison of USB 2.0 high-speed USB drive with IDE driveUSB drive with IDE drive

BenchmarkBenchmark PIO-3PIO-3 PIO-4PIO-4 UDMAUDMA USB1USB1

Business Disk Business Disk WinMark 99WinMark 99 105%105% 106%106% 90%90% 260%260%

High-End Disk High-End Disk WinMark 99WinMark 99 155%155% 154%154% 95%95% 534%534%

Data provided by Quantum Corp.

Hi-Speed USB PerformanceHi-Speed USB Performance

Page 39: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 39

USB1USB1 IDEIDE USB2USB2

‘‘Rip’ an audio CDRip’ an audio CD 15m 15m 6m 40s 6m 40s 3m 15s3m 15s

Write an audio CDWrite an audio CD 24m 24m 6m 10s6m 10s 4m 20s4m 20s

CD/RW PerformanceCD/RW Performance

Time comparison for reading and writing an audio CDTime comparison for reading and writing an audio CD

Time to copy data CD: 6m 28sTime to copy data CD: 6m 28s– USB2 to USB2USB2 to USB2

P4 system, 128MB, 1.3GHz . TDK 16/10/40 CDRW. In System IDE bridge.

Hi-Speed USB PerformanceHi-Speed USB Performance

Page 40: May 8, 20012 USB 2.0 Technical Overview Brad Hosler USB Engineering Manager Intel Corporation

May 8, 2001 40

SummarySummary

Everything you need to develop USB2 productsEverything you need to develop USB2 productsis availableis available– Tools, host controllers, building blocks, analyzersTools, host controllers, building blocks, analyzers

Building bus-powered high-speed productsBuilding bus-powered high-speed productsis difficultis difficult– Is a change to unconfigured power limit needed?Is a change to unconfigured power limit needed?

High-speed products deliver great performanceHigh-speed products deliver great performance– Comparable to ‘inside-the-box’ performanceComparable to ‘inside-the-box’ performance