From Nanoscience to Nanomanufacturing

STM manipulation of atoms 1989

AFM1986 AFM manipulation

of a SWNT 1999

Source: IBM

Molecular logic gate

2002

Manipulation of few atoms and SWNTsPast and present:

2004

2006

2007

Informed public and workforce

Environmentally benign processes

STM 1981

TemplatesReliability

and AcceleratedTest

Manipulation of billions of atoms and SWNTsFuture: Biosensor

Memory device

High rateHigh volume

Reliability, Accelerated Test, Properties

SiO2 (2um)

Si Substrate

Si (2um)

Si Contacts

SiO2

Nanowire Contacts

N an ow ire

• Monitor reliability of materials, interfaces, and systems to ensure manufacturing readiness.

– Changes in material or contact properties with environmental exposure, stress, temperature …

• Accelerated testing for reduced manufacturing risk.

– Rapid mechanical, electrical, and thermal cycling with measurement capability.

– Example: MEMS devices to rapidly cycle strain or temperature while measuring resistance and imaging in SEM or STM. UHV compatible.

• Nanoscale material and interface property monitoring.

– Example: Measure adherance force and friction between functionalized nanoelements and functionalized substrates.

– Example: Measure Young’s modulus and yield strength of nanoelements.

MEMS Device for Accelerated Test

Interaction of AFM Cantilever with Suspended Nanotube

MEMS Testbed for Accelerated Testand Properties Measurement

Test Devices

Tensile Test

Bend Test

Horizontal Resonator

MicroHotPlate

Angular Resonator

Test Devices

Tensile Test

Bend Test

Horizontal Resonator

MicroHotPlate

Angular Resonator

Innovative MEMS devices characterize nanowires (also nanotubes, nanorods and nanofibers) and conduct accelerated lifetime testing allowing rapid mechanical, electrical, and thermal cycling during AFM/SEM/UHV SPM observation.

MEMS Nanoscale Accelerated Testing, Hot Plate with Nanowire

Au, Ru, and RuO2

nanowires tested.

MEMS Nanoscale Accelerated Testing, Hot Plate with Nanowire

MEMS Hotplate

Contacts to Nanowires

Contacts to hotplate

Nanowire

Ru, before testing. Ru, after testing. RuOx, after testing.

•Ru lasts longer in N2.•RuOx fails more quickly than Ru.

•RuOx shows more pronounced surface diffusion.

MEMS Nanoscale Material Properties Measurements, Nanoscale Pull Test

Process Test Mask for Characterization of Reliability and Interface Properties

Purpose: Monitoring of nanoelement assembly processes.

Type II CHN Nanotube Switch for Non-Volatile Memory

Schematic of state I and II.

• Type II Switch has two symmetric non-volatile states.• Simple process.• CNTs assembled directly on chip using

dielectrophoresis or using template transfer.• Measurements in progress.• CNT/Surface interaction critical, measurements in

progress.

Directed Assembly of a Single SWCNT by Dielectrophoresis

AFM Measurement of CNT-Surface Interaction

RMS and A-B Data Plotted for a 100 nm Z-Piezo Displacement Below the Substrate

F/d On Suspended CNT

F/d On neighboring Substrate

• What: Development of technique for measurement of interactions between functionalized nanotubes and functionalized surfaces.

• Purpose: Process control for single nanotube switch process.

Goal and Desired Outcome

• Develop Generally Applicable Tools and Testbeds for:

1. Accelerated test of Nanoelements, Interfaces, and Systems. 2. Measurements of Reliability of Nanoelements, Interfaces,

and Systems. 3. Measurements of properties of nanoscale elements.

• These tools will help to ensure manufacturing readiness and will help to reduce the time for technology transition to manufacturing.