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North American Electronic Advanced Packaging Markets Economic Slowdown, Intense Price Competition Hinders Market Growth. "Heavy price erosion and weakened demand in the advanced packaging industry have destroyed several manufacturers’ profit margins.". Electronic Components Analyst Team - PowerPoint PPT Presentation
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© Copyright 2002 Frost & Sullivan. All Rights Reserved.
North American Electronic Advanced Packaging Markets
Economic Slowdown, Intense Price Competition Hinders Market Growth
"Heavy price erosion and weakened demand in the advanced packaging industry have destroyed several manufacturers’ profit margins."
Electronic Components Analyst Team
Frost & Sullivan
© Copyright 2002 Frost & Sullivan. All Rights Reserved.
Frost & Sullivan provides:
• Detailed insights into recent developments and trends
• Drivers, restraints, challenges, and strategic recommendations
• Analyst insights on ‘hot topics’ and emerging applications in the electronic advanced packaging market
• Market sizing and competitive analysis
• Market forecasts and opportunity analysis
• Quarterly assessments
• End user analysis within each report
Key Features
© Copyright 2002 Frost & Sullivan. All Rights Reserved.
• Coverage: North America
• Proven methodology using extensive primary and secondary data as well as research
• Focused information and strategies that cover business and technology issues
• Credible data and analyses highlighting industry dynamics
• Precise strategies to help you create winning business plans
What We Offer
© Copyright 2002 Frost & Sullivan. All Rights Reserved.
Current Market Participants• Find out how you compare with the competition• Assess current and future drivers as well as restraints• Determine and exploit new market share opportunities
New Entrants • Analyze challenges associated with the industry• Calculate time scales for strategy implementation• Position yourself to capitalize on the unmet needs of the market
Investment Community• Analyze long-term strategies of companies• Determine participants that will outperform the competition• Assess attractiveness of investing in the market
Who Will Benefit?
© Copyright 2002 Frost & Sullivan. All Rights Reserved.
Abpac, Inc.Advanced Interconnect Technology Ltd.Advanced Micro Devices, Inc.Advanced Semiconductor Engineering, Inc.Amkor Technology, Inc.Analog Devices, Inc.ASAT Ltd.Carsem Sdn BhdChipPac, Inc.Coors Electronic Package Co.Flip Chip Technologies LLCFujitsu Microelectronics America, Inc.HEI, Inc.Hitachi Cable America, Inc.Hitachi Semiconductor, Inc.Hynix Semiconductor, Inc.IBM MicroelectronicsIntel Corp.Interconnect Systems, Inc.Kingpak Technology, Inc.
Kyocera Corp.Microelectronics Modules Corp.Mitsui-High-Tec, Inc.Motorola, Inc.Multichip Assembly, Inc.NEC Electronics, Inc.NS Electronics Bangkok Ltd.NTK Technologies, Inc.Orient Semiconductor Electronics Ltd.Pantronix Corp.Polymer Flip Chip Corp.Quik-Pak/Gel Pak LLCShinko Electric Co., Ltd.Siliconware Precision Industries Co., Ltd.Sony Semiconductor Co.Tessera Technologies, Inc.Texas Instruments, Inc.Tong Hsing Electronics Ltd.Toshiba America Electronic Components, Inc.VLSI Packaging Corp.
Key Market Participants
© Copyright 2002 Frost & Sullivan. All Rights Reserved.
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