ECAL Monitoring System

ECAL Monitoring System

Ivan Korolko (ITEP Moscow)

PRR, September 2004

Outline

Finalized light splitter

Fiber bundles configuration

Light distribution boxes

LED drivers and PIN diode boards

Planning

Light splitters

1) Very simple construction

2) Good uniformity of light yield for all fibers

3) Good reproducibility

4) High light yield

Produced and tested this summer

Light splitters uniformity

● central fiber

● 1st circle

● 2nd circle

● 1.2 mm fibers

Light splitters – LED housing

Fiber bundles

Fibers in bundle have different length to lighten the connection to optical contacts. (max ~50cm)

Corresponding number of fibers is grouped in bundle and molded with epoxy resin.

High temperature bending of fibers – technology optimization

• requires quite some man power (now)

• dangerous to break a fiber

• HERA-B experience (curved fibers forming bundle)

Fiber bundles configuration (1)

3.01 3.02 3.03 3.04

3.05 3.06 3.07 3.08

3.09 3.11

3.12 3.143.13

3.15 3.16 3.17 3.18

3.19 3.20 3.21 3.22

2.01 2.02 2.03 2.04

2.05 2.06

2.07 2.08

2.09 2.10

2.11 2.12 2.13 2.14

1.02 1.03 1.04

1.08 1.09

1.13

1.16 1.17

1.20 1.21

1.25 1.26 1.27

1.01

1.05

1.06

1.10

1.07

1.11

1.14 1.15

1.18 1.19

1.22

1.24

1.28

1.23

1.12

3.10

Outer and Middle sections:

Splitters 1 → 16+3

Inner section:

Splitters 1 → 9+3

Fiber bundles configuration (2)

Inner section:

reduced number of LEDs (factor 1.5)

3.01 3.02 3.03 3.04

3.05 3.06 3.07 3.08

3.09 3.11

3.12 3.143.13

3.15 3.16 3.17 3.18

3.19 3.20 3.21 3.22

3.10

Components of monitoring system

LEDs PiN diodes Trigger signals

Outer 84 28 84

Middle 56 14 56

Inner 88 22 88

Routing of bundles (1)

25 mm trays for inner ECAL section

1) 8-inner 2-middle bundles

2) 6-inner 4-outer bundles


4) 6-inner bundles


6) 6-inner 4-outer bundles


1st LDB (lower and upper)


37 mm trays for middle ECAL section

1) 10-middle bundles

2) 8-outer bundles



6) 8-outer bundles


2nd LDB (lower)


45 mm trays for outer ECAL section

2) 13-outer bundles

6) 13-outer bundles

3rd and 4th LDB (lower)

Light distribution boxes (1)

Light distribution boxes (2)

1st lower box60 LEDs17 PiNs

2nd lower box56 LEDs16 PiNs

3rd lower box26 LEDs7 PiNs

4th lower box26 LEDs7 PiNs

LDBs for one half of ECAL

XYZ size # of LEDs # of PiNs

Upper box 720x880x120 60 17

lower box 1 720x880x120 60 17

lower box 2 720x880x120 56 16

lower box 3 624x500x120 26 7

lower box 4 624x500x120 26 7

Light distribution box (fragment)

LED driverLEDSplitterPiN diodePiN diode board

LED-PiN fiber

Bundles

1st lower box

3.15.1

3.15.2

3.15.3

3.15.4

3.16.1

3.16.2

3.16.3

3.16.4

2.11.1

2.11.2

2.11.3

2.11.4

2.12.1

2.12.2

2.12.3

2.12.4

1.18.1

1.18.2

3.12.1

3.12.2

3.12.3

3.12.4

3.13.1

3.13.2

3.13.3

3.13.4

3.14.1

3.14.2

3.14.3

3.14.4

3.19.1

3.19.2

3.19.3

3.19.4

1.22.1

1.22.2

3.20.1

3.20.2

2.20.3

2.20.4

1.24.1

1.24.2

3.17.1

3.17.2

3.17.3

3.17.4

1.28.1

1.28.2

3.18.1

3.18.2

3.18.3

3.18.4

3.21.1

3.21.2

3.21.3

3.21.4

3.22.1

3.22.2

3.22.3

3.22.4

Box size 720x880x120

Led driver 15x100 mm2

PIN diode board 40x100 mm2

Power for LEDs +5V, +25V

Power for PINs +/-6V, +25V

Trigger signals

LED amplitude control voltages

LED drivers (1)

Several LED drivers produced and tested during this summer beam tests

Dedicated ECAL version of LED driver (produced in IHEP)

LED drivers (2)

DS0026 became obsolete (still available from distributors)

PCB design and prototypes exist for:

pin-to-pin compatible EL7212, ICL7667

EL7104

SN75372

DC isolation of the triggering signals requires individual triggering for each LED driver.

PIN diode boards (1)

Dedicated ECAL version of PIN diode board (produced in IHEP)

PIN diode boards produced and tested during this summer beam tests

PIN diode boards (2)

Charge gain ~300

ENC ~5000 electrons

δ function response ~10 ns.

Dynamic range 12 bits

The same clipping line as for PMTs is used

Amplifiers are based on LMH6624 or EL5133

Planning (1)

Many changes during last months

ECAL installation should be finished on 31 of July

The whole planning is quite tense

Planning (2)

Production of bundles starting on 04/10/2004

special “long” room with shelves is ready

Cutting of bundles starting on 25/10/2004

need to prepare cutting tools

Should be finished in March

Installation of bundles : 15/04/2005 – 15/05/2005

Planning (3)

Detailed design of LDBs : 15/12/2004

meeting in Moscow or at CERN (Stas)

Production of LDBs starting on 15/01/2005

Installation of LDBs starting on 15/05/2005

Final connection of all components

01/06/2005 – 01/07/2005

Planning (4) Production of LED housings 01/11/2004 – 1/03/2005

should be delivered to CERN in March

LED drivers and PIN diode boards

purchase of components – ASAP

mass production 01/01/2005 – 01/03/2005

should be delivered to CERN in March

temporary readout system to check the work of LEDs and PMTs

??? Seems to be useful ???

Documents

ECAL Monitoring System