Cmos Latchup

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    CMOS Latchup Simulation

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    CMOS Latchup Simulati on

    Introduction

    Triggering of parasitic pnpn structure acrossCMOS well boundary

    Evaluation of different well dopings and depthsEvaluation of different epi thicknessesOptimize p+/n+ spacing

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    CMOS Latchup Simulati on

    Process Simulation Requirements

    Accurate process and device simulation of large structuresEasy way to adjust p+/n+ spacingConsistent mesh with different p+/n+ spacingInterface whole structure to device simulator

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    CMOS Latchup Simulati on

    Device Simulation Requirements

    Ability to handle large structuresAbility to trigger latchup in DC and transient modeTracing of complex I-V curvesAppropriate physical models for pnpn devices

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    CMOS Latchup Simul ation

    Case Study

    Use MaskViews layout interface to construct a pn well boundarywith mesh spacing tied to mask edge locations

    Use ATHENA process simulation to simulate structureATLAS simulation of latchup by:

    positive DC ramp on Vddnegative DC ramp on Vsstransient pulse on Vss

    Post processing analysis

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    CMOS Latchup Simul ation

    Layout of P+/N+ Well Boundary

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    CMOS Latchup Simul ation

    Mask Edges and Grid for 2D Cross Section

    of Layout

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    Final Process Structure with Junctions

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    Final Process Structure with Doping and

    Depletion Regions

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    Device Simulation Model Requirements

    CMOS latchup is a bipolar phenomenaRequires bipolar model set including accurate recombinationmodelsRequires band gap narrowing for accurate prediction of parasitic

    device gain

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    CMOS Latchup Simulati on

    Transient Device Simulation Setup

    1/ bias Vdd and Nwell to 5V2/ apply -1V pulse to Vss for several nanoseconds3/ return Vss to zero continue simulation for 1us4/ Analyze current-time plot to analyze trigger point

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    Current vs. Time During Transient latchup

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    Comparison of 1ns and 3ns Duration Pulses

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    Flowlines in Structure During Vss Pulse

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    Flowlines in Latched Structure

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    DC Latchup Simulation Setup

    1/ bias Vdd and Nwell to 5V

    2a/ apply positive bias ramp to Vdd, trace curveuntil Idd=1mA/um

    2b/ apply negative bias ramp to Vss, trace curveuntil Iss=1mA/um

    3/ analyze curve to measure trigger voltage andholding current

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    Positive DC bias on Vdd

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    Parasitic Vertical pnp Bipolar Characteristic

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    CMOS Latchup Simul ation

    Negative DC Bias on Vss

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    CMOS Latchup Simulati on

    Parasitic Lateral npn Bipolar Characteristic

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    P+/N+ Spacing

    To evaluate the effect of p+/n+ spacing the simulations need to berepeated with different structures

    Changes to the p+/n+ spacing can be done in MaskViews. A newcutline for each spacing is required.

    Mesh spacing follows mask edges to ensure consistent simulationgrid

    No changes to ATHENA or ATLAS input files required

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    CMOS Latchup Simul ation

    Overlay of two Structures with Different p+/n+

    Spacings

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    Comparison of Positive DC Latchup Characteristics

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    Conclusion

    ATHENA and ATLAS are able to simulate CMOS latchup

    For DC latchup the CURVETRACE feature an excellent tool forextracting complex I-V characteristics

    In transient mode ATLAS can evaluate the length of pulse requiredfor latchup

    Different p+/n+ spacings can be evaluated by using MaskViewsMore complex p+/n+ layouts can be evaluated using ATLAS/

    Device3D

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