Building the Bridge To Future Growth

Intersil 2009 Analyst DayFebruary 12, 2009

2

Forward-Looking Statements

During the course of this presentation, we will make forward-looking statements that involve risks and uncertainties. The Company’s actual results may differ materially from those suggested here. Additional information concerning risk factors that could cause actual results to vary from these forward looking statements can be found in the Company’s SEC filings, including our most recent Form 10-K and Form 10-Q, as well as our reports on Form 8-K. These documents contain and identify important factors that could cause results to differ materially from those contained in any forward-looking statements.

3

Executives Here Today

Dave BellPresident & CEO

Pete OaklanderSVP, Power Mgmt Products Group

David LoftusSVP, WW Sales& Corp Marketing

Jonathan KennedyInterim CFO

Davin LeeVP/GM Consumer Power

Dr. Huibert VerhoevenVP/GM High Speed Products

Paul SferrazzaVP/GM Computing Power

Roger LevinsonVP/GM Precision Products

Mike AltharVP/GM Specialty Products

Susan HardmanSVP, Analog & Mixed Products Group

Sagar PushpalaSVP, WW Operations& Technology

4

Agenda

Introduction Jonathan Kennedy 7:30 - 7:35

Corporate Overview Dave Bell 7:35 - 8:10

Analog & Mixed Signal Products Susan Hardman 8:10 - 9:10

Power Management Products Pete Oaklander 9:10 - 10:10

Break 10:10 - 10:25

Worldwide Sales & Marketing David Loftus 10:25 - 10:50

Worldwide Operations & Technology Sagar Pushpala 10:50 - 11:15

Financial Overview Jonathan Kennedy 11:15 - 11:45

Conclusion and Final Q&A Dave Bell 11:45 - 12:00

Lunch 12:00

Corporate Overview

Dave Bell President & CEO

6

Goals for Today’s Meeting

• Build confidence in Intersil’s management team• Communicate our vision for Intersil

– Where Intersil is headed– What makes Intersil unique– What are Intersil’s growth drivers

• Explain Intersil’s unique operating model• Highlight Intersil’s very strong financial position• Managing through the economic downturn

7

The Building Blocks of Success

1 People

2 Strategy

3 Operations

8

Most Important: Our People

• “Getting the right people on the bus” • “Getting the wrong people off the bus”• Creating the right organization

– Allows focus on different markets with unique characteristics– Management bandwidth to address strategic and tactical issues– An organizational structure that will support Intersil beyond $1B– Management training programs to allow promotion from within

• Creating the right culture– Focused on highly-differentiated, high-performance products– Value pricing – getting fully paid for our the value we deliver– “Can-do” execution-oriented culture

9

A Revitalized Organization

President & CEODave Bell

VP/GM, PrecisionProducts

Roger Levinson

VP/GM, HighSpeed Products

Dr. Huibert Verhoeven

VP/GM, Computing Products

Paul Sferrazza

VP/GM, Consumer ProductsDavin Lee

VP/GM,Specialty Products

Mike Althar

VP/GM, Indus/Comm

ProductsPete Oaklander

(acting)

SVP, Analog &Mixed Signal

Products GroupSusan Hardman

SVP, Power Management

Products GroupPete Oaklander

SVP, WW Sales& Corporate Marketing

David Loftus

SVP, WW Operations &Technology

Sagar Pushpala

SVP, Human ResourcesVern Kelley

SVP, GeneralCounsel

Tom Tokos

Interim CFOJonathan Kennedy

10

Our Strategy

• Intersil’s successful track record

• Intersil today

• Our vision for Intersil in three years

• The highly-competitive HPA market

• Our strategy – how we plan to get there

11

A Successful Track Record

$100

$125

$150

$175

$200

$225

1Q05 2Q05 3Q05 4Q05 1Q06 2Q06 3Q06 4Q06 1Q07 2Q07 3Q07 4Q07 1Q08 2Q08 3Q08 4Q08

Rev

enue

($M

)

Intersil Has Grown Faster than the Industry

12

Intersil Today

• 2008 revenues: $770M• Gross margin: 57%*• GPPP/ASSP mix roughly 40/60%• Recent growth propelled by PC business

– Grew to 36% of sales in Q3– Gross margin pressures due to mix change largely offset by

manufacturing cost reductions– Steep decline in Q4 due to PC volatility and channel inventory

reduction

• Heavy R&D investment in recent years to diversify– SAM expansion through new products and markets

*GAAP excluding one time expenses

13

Strategic Acquisitions in 2008

• Acquired July 28• Located in Austin, TX • Part of Consumer Power Product Line

• Developer of world’s only Intelligent Digital Audio Power Amplifiers

• Acquired December 18• Located in Austin, TX • Part of Industrial & Comm Product Line

• Differentiated products for Infrastructure market (Wireless, Networking)

• Acquired September 30• Located in Woburn, MA & Austin, TX

• Part of Analog & Mixed Signal Products Group

• Providing industry’s lowest power, high-speed ADCs

14

Our Vision: Intersil in 3 Years

• Exit 2011 with >$1B revenue run rate• Diverse product portfolio with roughly even mix of

GPPP/ASSP– Strong share in PCs, but smaller percentage of overall sales– Greatly expanded general-purpose product portfolio– Steady growth in Industrial, Infrastructure and Automotive

• Continuation of our Asset-Lite operations model• Stable gross margins of approximately 58%*• Steadily increasing leverage results in operating income

of >26%* by Q4’11

*GAAP

15

Driving Toward Balance

2008Communications

22%

Computing 31% Industrial 22%

Consumer 25%

2011E

Communications 25%

Computing 25% Industrial 24%

Consumer 26%

16

The Analog Business Today

Slowing Growth

Increasing Competition

Profit Pressures

GrowingCustomer

Expectations

Innovation Challenges

Time to Market Pressure

17

The Right Gross Margins

• High enough to allow excellent operating profit• Low enough to participate in high-growth markets

Aiming at the ‘Sweet Spot’

20% 57%80%

FCS

MXIM ADI

LLTC

MPWR

NSM

SLABMCRL

SMTCPOWITXN

AATI CRUS

Richtek

ONNNISIL

18

Intersil is Uniquely Positioned

LLTC

ADI

NSM

MXIM

ISIL

POWI

MPWR

CRUS

MCRL

SMTC

SLAB

19

Intersil’s Growth Strategy

• Continued strong R&D investment– Maintain R&D spending at 2008 levels to fuel future growth– Focus R&D dollars where we have a decisive advantage– Expand SAM: new markets, new product families

• Grow organically and by acquisition– Acquire companies that bring key new technologies, products,

markets– Larger acquisitions considered only if accretive within one year

• Expand breadth and depth of customer engagements– “Moving to the left” - becoming more strategic with our key customers– Selling our entire portfolio - getting fully paid for the value we deliver

• Disciplined financial performance– Focus on stable, industry-leading EPS growth and cash flow– Emphasize GAAP financials for 2009

20

SAM Expansion Drives Growth

• 2% market share today many SAM expansion opportunities

• Examples:– ASSPs for consumer, industrial and automotive applications– Leveraging existing core technologies into emerging markets such

as pico-projectors, alternative energy, LED lighting and gaming– Expanding signal path portfolio with data converters, precision

amplifiers and voltage references - addressing the entire signal chain

– Expanding general purpose power portfolio with linear regulators, high-density switchers and hot-plug controllers

– Module level solutions, initially in power, later in signal conditioning• Intersil’s new GPPP product families are state-of-the-art,

unlike competitors’ products that are often decades old

21

Operational Excellence

• Continuous quality improvement– Reduced field failure rate by 10X– Improved first-pass qual success rate– Improved Reliability department’s

testing & modeling capabilities• Careful inventory control

– Manage buffer builds on fab and foundry closures – Actively manage aged inventory– Improve forecasting and product flow

• A culture of continuous cost reduction– Many new product releases on new 0.25µm BCD process– Transitioning to from gold to copper bond wire– Multi-sourced assembly & test– Dozens of cost reduction efforts throughout Operations

1Q07 2Q07 3Q07 4Q07 1Q08 2Q08 3Q08 4Q08

Greatly Reduced CustomerReported Failure Rate

22

Managing Through the Downturn

• Balancing near-term and long-term goals– Acting responsibly to reduce expenses and maximize cash-flow– Investing for the future – success is defined by strong EPS and

share price growth in coming years• Rapid expense controls implemented

– Responded rapidly with a 9% RIF in early November– No management bonuses or profit sharing paid for 2H’08

and 1H’09– Mandatory vacation for all employees (10 days in Q1’09)– Very tight hiring and expense controls– Significant channel inventory reduction in Q4’08– First to revise Q4’08 guidance in early December

• Restructuring for future earnings growth• Building an even stronger company!

23

Key Takeaways

1 Intersil has a revitalized management team, continues to attract top talent, and is organized to grow sales past $1B

2 Building on a great track record, and uniquely positioned for future growth, even in this very competitive market

3 Executing a strategy of product diversification and SAM expansion; aiming for balance between GPPP and ASSP products

4 Pursuing both organic growth and strategic acquisitions, but maintaining very high standards for ROI

5 An asset-lite model, combined with operational excellence, will result in continuous quality and manufacturing cost improvements

6 Management is taking appropriate measures for expense control, but remains focused on building an even stronger company for the long-term

Analog &Mixed Signal

Susan HardmanSenior Vice President

25

Broadening GPPP & ASSP Portfolio

High-End Consumer

Computing Industrial Comms

5V Precision Amps40V Precision Amps

HS Op AmpsADC Buffers

Delay Line Filters

Switches/MUXesCrosspoint Switches

HS AD ConvertersHS DA Converters

Prec AD ConvertersPrec DA Converters

Voltage ReferencesAFEs

Real-Time ClocksClock ModulesLight Sensors

Proximity Sensors

InterfaceDCPs

NVM DCPsPrecision DCPs

ComparatorsLevel Shifters

ASS

PG

PPP

Solve Customers’ Challenges Through Innovation and Integration

xDSLKVM/VideoTest Equipment

LCD DisplaysHandheld

Optical StorageLaser Printers

Pico-Projectors

26

Building the Bridge

• Key talent• LDDs

– Optical– Printers and pico-

projectors• Light and proximity

sensors• Data converters• Precision

27

Key Talent Additions and Transitions

BackgroundRoger Levinson (VP/GM) MSEE; VP Design, Xicor, API, 20 yrs

Dr. Huibert Verhoeven (VP/GM) PhD; NSM, 12 yrs

Phill LoPresti (Director) MSEE; Kenet, NEC, 25 yrs

Kenet Engineering Team Four PhDs in technical leadership roles, 20+ yrs

High Speed Sr Applications Manager MBA/BSEE; TI, Burr Brown,30 yrs

Sensor Sr Applications Manager MSEE; Maxim, Teradyne, 16 yrs

Technical Marketing Managers MS/BSEE; ADI, TI, NSM, Fairchild, Maxim, 18+ yrs

Position

28

Changing Landscape Creates Opportunity

Printer LDD

RGB Laser Driver Power Monitoring IC Sensor Light Sensor (Many other ISIL products)

Blu-Ray Laser Driver Power Monitoring IC Sensor

29

Delivering OPU Architectural Solutions

ConventionalWaveform Timing

Control Inside DSP

Laser Power ControlInside DSP

(+) Low cost(+) Low power consumption(-) Low design flexibility(-) High flex signal count(-) Large package(-) Difficult to achieve 12X BD

Write StrategyWaveform Timing

Control Inside LDD

Laser Power ControlInside LDD

(-) Expensive(-) High power consumption(+) High design flexibility(+) Low flex signal count(•) Medium package(+) Definitely achieve 12X BD

HybridWaveform Timing

Control Inside DSP

Laser Power ControlInside LDD

(+) Low cost (longer term)(+) Low power consumption(•) Good design flexibility(+) Low flex signal count(+) Smallest possible package(+) Easier to achieve 12X BD

30

How a Laser Printer Works

There are four lasers for each of the four toner colors.

Each color goes through same printing process. Four to eight lasers can be added to

increase print speed for each color.

System requires one or more LDDsand at least two laser sensors

31

Intersil’s LDD Advantages

• Higher print speed and resolution– Highest bandwidth and

shortest minimum pulse allows significantly faster, high resolution graphics

• Reduces BOM and space: requires no external components

• Next generation MEMS based printers will require higher power, faster laser solutions

Intersil is Well Positioned to Capture Laser Printer LDDs

32

Pico-Projectors: Large Emerging Market

Integrated in:• Mobile Phones• Portable video players• Digital cameras, camcorders• PDAs• Tablet mini-PCs

• Integrated projectors in laptops• Standalone, ultra-portable projectors• Heads-up displays and GPS systems• Head mounted displays/glasses• Consumer home theater

33

Laser: Best Solution; Most Opportunity

Pico-Projector Architecture

DLP LCoS Laser

Power Consumption Poor Acceptable Best

System Size Good (low res 480x320)Poor (higher res)

Good Good (today)Best (higher res)

Solution Cost Today/Future1

(XGA or higher)

Medium/highest Low/low(if using LED)

High/Low(Green laser cost)

Resolution Need much larger DLP (HGVA 480x320 today)

Need larger LCoS (VGA 640x480 today)

Scalable higher (SVGA 800x600 today)

System Advantages • Manual focus• Trapezoidal effect issue

• Manual focus• Trapezoidal effect issue

• Always in focus• Compensate trapezoidal effect

Time to Market Available now (MP Q408) Available now (MP Q408) Longer (2H09)

Key Notes:1Source - Insight Media Research report comparisons of different BOM cost

34

Multiple Opportunities in Pico-Projectors

AdjustableDC-DC

Regulators

VideoSource

Compensates for laser power vs temp, aging

Ambient Light Sensor +Integrated Proximity

Sensor with I2C

Adjusts display brightness for ambient light conditions for improved battery life

Lens/Optics

X-Y AxisMEMS Mirror

Scr

een/

Imag

e

Li-IonBattery

Video AFE(if VGAOutput)

LaserCalibration

PhotoSensor

Laser Driver

Laser Sensors(R, G, B lasers)

DAC LaserOutputs

MEMSDriver

ProjectorASIC/

Controller

BatteryCharger

35

Market Leadership in Proximity/Light Sensors

• High integration– ADC, interrupt function, LED

driver, dark current compensation, temperature compensation

• High sensitivity– Good proximity sensing range

up to 40-60mm– Great ambient light sensitivity

down to 0.05 Lux– Great angular sensitivity – no

need for light pipe in most cases

• Flexibility• Lowest power light sensors• Outstanding application

support

36

Proximity/Light Sensors Key Growth Driver

Many Applications Across Numerous Markets

37

Complete Signal Chain Solutions

DCP

ADC DACSignalSensor

DigitalProcessing

VoltageReference

MU

XDCP

Amp

AmpDCP

Amp

Expanding SAMExisting SAM

• Op Amps– High Speed– Precision– Rail-to-Rail– Low Power

• Analog Front Ends• DCPs• Real Time Clocks• Data Converters• Voltage References

• Interface– RS-485– RS-422– High ESD– Fractional Load

• Switch/MUX– Differential– Duals/Quads– Low Voltage

– Cable Drivers& Receivers

– Differential– Video

Analog Signal Processing

• Battery Chargers• Battery Management• PWM + MOSFET Drivers• Supervisory ICs

• Hot Swap/Hot Plug• System Management• Broadband Power

• Display Power• White LED Drivers• Fuel Gauges• DDR

Power Management• OR-ing FET Controllers• Duals/Triples/Quads• Graphics

38

Intersil Addresses Key Segments

Bits

<1 MSPS

25 MSPS

100 MSPS

250 MSPS

1 GSPS

500 MSPS

SampleRate

10 12 14 16 18 20 22 24

Lowest Power, Highest Resolution in 100MSPS+ Space

Instrumentation, Radar, SDR, Broadband Communications

Best Noise Performance Across Full BW Spectrum

Industrial Control, Power Monitoring/Control

86

ΔΣHigh Precision,Low Frequency

Ex. Audio

SAR: IndustrialControl

Flash:Instrumentation

Military

CT ΔΣRF Receivers

Pipelined: SDR, RF Receivers, Radar Arrays,

Data Acq, Video

Intersil

Intersil

39

The Lowest Power High Speed Data Converters

• At 100mW to less than 500mW total power, these data converters deliver the industry’s lowest power consumption

• No trade-offs in performance!

• Competition consumes up to 5 times more power!

Traditional

FemtoChargeTM

40

Intersil’s Solutions are Key Enablers

Medical Imaging

PET ScanMRI/CAT Scan

High Speed OscilloscopesSpectrum Analyzers

Communications Testers

Instrumentation& Test

Wireless Infrastructure

Power Amp LinearizationCellular Base Stations

Data Acquisition

USB DigitizerUSB Oscilloscope

ATE

Communicationsand Military

Array AntennasPt-Pt Microwave

SDR-Software Defined Radios

HandsetsMan-Packs

Cable HeadEnd Equipment

CMTS

High Definition Imaging / Video

HDTV CamcorderHigh End Scanner

HD Video Conference

41

Leveraging Today’s Technology

• New product portfolio optimizes the combination of off-set, noise and power to meet today’s market needs

• Proprietary 40V precision BiCMOS technology optimized for noise, power, speed and ruggedness

• Proprietary high voltage/high density 0.25µm CMOS platform technology

• Bridge the gap between high voltage analog and low voltage data acquisition

Providing Innovative Precision Solutions for Industrial, Medical and Instrumentation Markets

16-24 BITADC

MUX+/-10V0-10V0-5V+/-5V

SensorμV to V Range

VOLTAGEREFERENCE

HI-509A

VOCM

16-24 BITADC

MUX+/-10V0-10V0-5V+/-5V

SensorμV to V Range

VOLTAGEREFERENCE

HI-509A

VOCM

42

Precision Amplifier Product Tree

30µA Supply Current-50mV to 28V Vcm250 µV Input Vos20V/V, 50V/V, 100V/V, & ADJ

CurrentSenseAmps

ISL2800628V

In Development

Op Amps Instrumentation Amps

43

Precision Analog – Future Growth Engine

• Sensor conditioning– Thermocouple– Strain gauge – Positioning

• Industrial & instrumentation– Test equipment– Weigh scales– Data acquisition systems– Infrastructure

• Medical instrumentation– ECG, EEG, ultrasound– CAT scan, etc.

• Automotive instrumentation

Complete Portfolio of Amps, References and Data Converters

44

Expanding SAM Enables Growth

• Expanding SAM in many areas:– Light and proximity sensors– Precision amps and

voltage references– High speed buffers– High speed data converters– Precision data converters

• Emerging markets and architecture transitions– Pico-projectors– Laser printers Today’s SAM

Data Converters

Light/ProximitySensors

EmergingMarkets

SAM

Amps &Voltage References

45

Key Takeaways

1

Maintain ASSP leadership in displays, optical storage, DSL and KVM/video2

Identified SAM expansion enables both near and long term growth at or above target gross margins3

An excellent team and right organizational structure to execute and deliver results

4 Expand into new markets and develop new core technologyPico-projectorsProximity and light sensors

5 Establish leadership as signal/control path solution providerData convertersPrecision

6 Solve customers’ challenges through innovation and integration

46

Q&A

Huibert Verhoeven

Vice President and General Manager – High Speed

Products Group

Roger Levinson

Vice President and General Manager – Precision Products

Power Management ProductsPeter OaklanderSenior Vice President

48

Power Management Products Agenda

• Group level– Current state– Snapshot three years later– Future growth drivers

• Vertical market details– Consumer– Computing– Automotive

• Horizontal market details– Specialty– Industrial/Communications

• Key takeaways• Q & A

49

High-End Consumer

Computing Industrial AutomotiveComms

D2AudioPMICs

Battery ManagementHigh Efficiency

RegulatorsClass D Audio

Integrated FET DC/DCPWM Controllers

Battery ManagementAEC Qualified ICs

SERDESDisplay ASSPs

Integrated FET DC/DCBattery Management

PMICsDigital Power

VCORE ControllersPWM Controllers

Hot Swap

Digital PowerLDOs

ModulesPWM Controllers

Integrated FET DC/DCBridge DriversIsolated Power

SupervisoryMilitary ICs

Digital PowerLDOs

ModulesRad-Hard ICs

PWM ControllersIntegrated FET DC/DC

Bridge DriversIsolated Power

Hot Plug ControllersSupervisory

GPP

P

Smart PhonesDocking Stations

AV ReceiversHandheld Consumer

LCD DisplaysGaming

DesktopsNotebooksNetbooksServers

GraphicsEmbedded Computing

Industrial ControlsFactory Automation

MilitaryInstrumentationTest Equipment

Medical

Base StationsNetworking

Wireless BroadbandSet-Top Boxes

SatellitesxDSL

Power TrainHybrid AutosInfotainmentPower Train

SafetyLCD Displays

Broadening GPPP & ASSP PortfolioA

SSP

50

Proven Success in Large Vertical Markets

• Intersil’s core competency– Superior product definition– Execution on new product

development– Intimacy with key market

drivers– Strong technical support– Resourcefulness to respond

to market dynamics– Flexible manufacturing to

support fast ramps• Examples: Computing,

Handheld, Displays

51

General Purpose and Infrastructure Growth

• Leadership position in military and radiation hard end markets

• GPPP product family expansion• Growing number of design wins and

customer base for GPPP product families• Balance in investment • Experienced team

52

Growth through Balanced SAM Expansion

• Balance between ASSP and GPPP

• Engaged in identifying and growing defendable niche markets

• Expanding and defending positions in large verticals

• Expanded Infrastructure share (Industrial & Comms)

• Full engagement in Auto• Optimized Computing

engagement

Today’s SAMSA

M Audio

Industrial LDOs

Digital DC/DC

Auto Qualed ICs

PMICs

Integrated FETs

Modules

Power Management’s Three Year Vision

53

Power Management Growth Drivers

Vertical/ASSP• Replicating vertical successes• Discipline to focus on opps

that value differentiated solutions

• Expansion in Auto investment• Product cost reductions• Capabilities of engineering

team• Technologies and new

customer relationships from recent acquisitions

Horizontal/GPPP• Continue to invest in GPPP

above corporate average• Increased customer exposure • successful design in funnel

across a wide customer base• Provide above average gross

margins• Above average growth rate• Addition of Zilker Labs to

portfolio • Increase in Specialty portfolio• Traction in module business

54

Key Talent Additions and Transitions

Davin Lee to VP/GM of Consumer Power VP/GM Industrial/Comm, Xicor

Director of Automotive Products ADI, 22 yrs

Director of West Coast Design ADI, Maxim, 23 yrs

Director of D2Audio/Zilker Labs D2Audio, Vitesse, Benchmarq, 25 yrs

Sr. Systems Mgr. Zilker Labs ColdWatt, Dell, Astec, Bell Labs, 25 yrs

Sensor Sr Applications Manager MSEE; Maxim, Teradyne, 16 yrs

Sr. Design Mgr. Zilker Labs ESS Technology, Cirrus Crystal, TI, 26 yrs

BackgroundPosition

New Director Emerging Markets ColdWatt, Dell, Astec, Bell Labs, 25 yrs

Industry Audio Expert: D2Audio Intersil 8 yrs, Moto 13 yrs

Power Semiconductor Sr. Technologist AOS, Fultec, LTC, NSC, HP, FCS, 28 yrs

55

Consumer Power & Audio

56

Competitive Advantages

• Broad proven IP on 0.25µm power process• Higher levels of integration

– Ex. Display: Power + DCP + VCOM + Level Shift + EE (45V)• Higher performance

– Better efficiency: longer battery life for handhelds and slimmer flat panel TVs due to less heat dissipation

• Customer intimacy– Deep relationships with Tier 1 customers for better product

definition• Execution

– Proven history of delivering in competitive vertical markets

57

Mini PMIC

System Opportunities: Smartphone

Expanding SAMExisting SAM Not Served

Memory/SIMM Card/USB interfaces

Combined Audio/USB Jack

RFSwitch

PA

PABuck

RFTransceiver

StereoCaplessHP Amp

Class DAudioAmp

Ambient/Proximity

Light Sensor

USB/AudioSwitch

Apps/GraphicsProcessor

Ser

Des

TX

Ser

Des

RX

CMOSCameraModule

Main LCD

SecondaryLCD/OLED

VideoAmp

Osc &RTC

Dual I/PCharger

I2C/Interrupt

BuckRegulator

Batt VoltageMonitor

Sequence/WDT/GPIOs

BackupBatt Charger

Acc Detect

13 LDOs

PMICLevel Trans.ESD Prot.

Battery ManagementOC/OVP Charger Fuel Gauge Authentication

Single-ChipGPRS/Edge

Chipset

Buck ULVLDO

DualLDO

LEDFlash/Torch

WhiteLED

and/orOLEDDriver

58

PMIC Expansion in Display Panels

User Interface

ColumnDriver

ColumnDriver

VideoProcessor

VGAInput

Interface

TimingController

Gamma Buffers

LogicBuck

Boost

LDO

EEPROM

AdaptiveLED

Driver

ChargePump

LevelShifters

ChargePump

VCOMDCP

VCOMDCP

LCDPower

Backlight Power

LCDPower

+Analog

+Level

Shifters

59

SAM Potential in Game Consoles

Expanding SAMExisting SAM Not Served

Graphics RAM

VTT/Cache

Core

GPU

GDDR

LDOs

Audio Codec

FETs

FETs

Power Stage

Power Stage

Power Stage

Power Stage

FETs

FETs

FETs

FETs

DC/DC

VCORE DC/DC

VCORE DC/DC

DC/DC

DC/DC

AC/DC

Boost Charger

or

60

D2Audio Value Proposition

DSP Class D Controller

Sound ProcessingLicense ($)

One-chip solution

More Features, Fewer Parts, Better Sound

Competitor Solutions

Intersil’s D2Audio Solution

Royalty-free software + GUI control

61

Computing Power

62

Computing Growth Drivers

• Products and technology– Advanced modulators– Broad product portfolio

• Reliable supplier– Tripled capacity in 18

months– High quality: reduced PPM

during ramp

• Relationships– Above drives trust with

OEMs and ODMs

PWM

COMP+

V W

COMP

Synthetic inductor current

R3 Advanced Control Architecture

Fix data make readable

0

100

200

300

400

500

600

700

1H06 2H06 1H07 2H07 1H08 2H080

10

20

30

40

50

60

70

Capacity PPM

Quality vs Fab Capacity Installed

63

Opportunities in Notebooks

Expanding SAM Commoditizing SAMExisting SAM

CPU

AuxPower Mgmt

CPU Vcore

MOSFETDriver

SystemRegulation

DDR MemoryPower Mgmt

Class DCodecAmbientLight SensorWiMAX

AdvancedGraphicsProcessor

GPU DDRMemory Power

PWM forGPU Core

Chipset PowerManagement

InterfaceController

USB/RS-232/Cardbus

Interfaces

IntegratedMOSFETs

CPUPower

SystemPower

Charger

BatteryProtection

BatteryCharger

CellBalancing

Power SupplySequencer

FuelGauge

North/South Bridge

Not Served

LED BacklightController

Display Panel or Motherboard

Linear Regulators

64

Servers Offer Value Added Opportunities

Expanding SAMExisting SAM

CPU Core Power Stage

CPU VTT Power Stage

DDR3 Power Stage

DDR3 VTT Power Stage

CPU PLL Power Stage

P3V3

P1V8

P1V1

P1V1 IOH

1.2V AUX

1.5V ICH9

1.8V AUX

1.0V AUX

SilverBox

Intersil Has the Best Low Power Efficiency Performance

Equipment $/Box 2008-102P Server +50%

Blade Server +65%

Workstation +50%

P1V5P1V5

3.3V3.3V

65

Computing Strategy

• Maintain Notebook VCORE market share leadership• Focus R&D on high value sockets in Notebook,

Servers and Workstations• Leverage investment in derivative markets

– Netbooks– Games– Embedded

• Stay competitive with manufacturing cost reductions• Maintain leadership position with key OEMs

and ODMs

66

Automotive Products

67

Intersil Content for Automotive

Expanding SAM Existing SAM

Vehicle DynamicsTemp Sensors

Digital Potentiometers

Adaptive SuspensionSensor Conditioning Amplifiers

Digital Potentiometers

LightingLED Drivers

Rear Seat EntertainmentD2AudioSerDes

Advanced Driver Assistance(Camera/Lidar/Radar)

HS ConvertersAmplifiersSerDes

Light SensorsDisplay DriversStandard Power

InfotainmentD2Audio

Display ASSPsA-V Amps

Intel Power ASSPsUSB ITFs

TransmissionCurrent Shunt Sensor

Interface ICsTemp Sensors

AmplifiersASSPs

Electronic Power SteeringFET Drivers

High & Low Side Current Sense Amps

Hybrid-Electric Vehicle Cell Balancing

LDOsAmplifiers

68

Automotive Growth Drivers

• IC growth is continuing as the average vehicle electronic content increases from $260 in 2006 to $340 in 2011

• Increase in electronics content over the next few years is mainly driven by – Reduction of fuel consumption– Reduction of environmental pollution (CO2)– Additional safety systems– Replacement of mechanical and hydraulic systems– Expansion of telematics in autos

69

Competitive Advantages

• High reuse of power and mixed signal IP in ASSPs• Leveraging GPPP product portfolio• High quality reputation from Space/Mil business• Leveraging experienced R&D teams• Expanding our customer base into new

geographical regions• Addition of experienced talent and new acquisitions • Relationships with Auto OEMs and Tier 1 customers

70

Specialty Products

71

Specialty Growth Drivers

• Core competency/brand recognition in achieving Military DSCC certification

• Consistency of product supply• Demonstrated SEE/TID radiation performance

and flight survivability• Breadth of building block portfolio• Customer intimacy on secure and high rel

products• Differentiated COTS products augmented with

temperature extensions serves military/harsh environment market

72

Space Market Expansion

Intersil CompetenciesRadiation Hard design expertise

+System knowledge

+Power / AMS core IP

+Proprietary process technology

+Worldwide sales presence

Delivers• SEE/ELDRS survivability

• Power efficiency

• Reliability

• Weight savings

• Select signal chain products

• Access to developing markets

Unique Competencies Enable Market Expansion

73

Large and Expanding Content

Power Management Blocks

Signal Chain Blocks

74

Industrial & Communications Power

75

Steady Progress

• Consistency of investment in GPPP team– Product portfolio– Technical support capability– Engineering talent and scale

• Above corporate average investment in R&D

• Focus on differentiation, less “me too”• Focus on some specific end markets within

Industrial/Communications• Our broadened line card has stimulated:

– Distributor network promotion– Customer confidence to engage

2006 2007 2008

Opportunities

Design Wins

76

Expanding Portfolio

Infrastructure Power Management Example

High CurrentPoint-of-Load

DC/DC

BusConverter

48V to8~12V

High EfficiencyPoint-of-Load

DC/DC

Low DropoutPoint-of-Load

DC/DC

Digital LoopDC/DC

VoltageMonitors

ORingFET

Controller

DC/DCBus

Converter400V to 48V

ORingFET

Controller

DC/DCBus

Converter400V to 48V

PFC

(Pow

er F

acto

r Cor

rect

ion)

AC

/DC

Power Modules

Existing SAM Expanding SAM

77

Investment in Modules

• Help customers who have limited power R&D

• Provide fast time to market

• Value for space constrained apps

• Expand SAM

78

Future Significant Growth in Digital Power

• The digital power IC market is poised for growth with markets ready for mainstream adoption, including:– Communications– Industrial management– Data processing– Energy

• Gartner projects the digital controller market to grow nearly $400 million by 2011– This represents less than 4% of

the total voltage regulator market• Zilker Labs acquisition gives

Intersil leadership position in this emerging market

Digital Controller Market Forecast ($M)

$0

$50

$100

$150

$200

$250

$300

$350

$400

2006 2007 2008 2009 2010 2011

Data Processing Communications Industrial Energy Management Consumer

79

Zilker Digital DC/DC Benefits

• Power conversion performance• Fewer discrete components drives smaller

PCB footprint• The same IC is easily reconfigurable for

multiple uses in a system• Easy-to-use software development tools

PCBs & Data Courtesy Ericsson Power Modules

Zilker-basedDigital Module

Evaluation Software

% Efficiency over ILOAD

Analog Module

80

Key Takeaways

1 Maintained key sockets in Notebook next generation

2 Continue to invest in value added computing sockets

3 New PMICs expanding SAM in beyond handheld

4 D2Audio and Zilker acquisitions add technology and new customer base

5 ASSP execution model being replicated in new vertical end applications

6 Continuing to invest in Industrial and Comm power above corporate avg.

7 Expanding Specialty and Auto investment

8 Key additions and transitions have strengthened Power Management team

81

Q&A

Michael Althar

Vice President and General Manager – Specialty Products

Davin Lee

Vice President and General Manager – Consumer

Power Products

Paul Sferrazza

Vice President and General Manager – Computing

Power Products

82

Break10:10 – 10:25

83

Agenda

Introduction Jonathan Kennedy 7:30 - 7:35

Corporate Overview Dave Bell 7:35 - 8:10

Analog & Mixed Signal Products Susan Hardman 8:10 - 9:10

Power Management Products Pete Oaklander 9:10 - 10:10

Break 10:10 - 10:25

Worldwide Sales & Marketing David Loftus 10:25 - 10:50

Worldwide Operations & Technology Sagar Pushpala 10:50 - 11:15

Financial Overview Jonathan Kennedy 11:15 - 11:45

Conclusion and Final Q&A Dave Bell 11:45 - 12:00

Lunch 12:00

Worldwide Sales& Corp. Marketing

David LoftusSenior Vice President

85

Key Themes

• Tremendous market opportunity • Highly experienced team• Close partnerships with worldwide Tier 1

customers• Organization and channel improvements

enhance demand creation capabilities• Balancing ASSP engagements with wider

GPPP business• Move to the left – improving position as

customers’ critical component supplier• Capitalize on brand value

86

WorldwideSemiconductorMarket (CY2008)

$266 BillionSource: iSuppli Jan 2009

Intersil Revenue (CY2008)$770M Million

Source: Intersil

Intersil TAM (CY2008)

$37.1 BillionSource: Databeans, iSuppli

Tremendous Market Opportunity

87

Why We Will Win

• The right people on the bus– Agile, motivated, highly experienced team

• VP Americas: 2007, ADI, Authentec, Harris• VP Europe: 1999, Harris, Philips, ST• VP APAC: 2002, Elantec• VP Japan: 2006, Maxim, ST, Thomson, Hitachi

• Align to strengths and exploit SAM expansion– Vertical market ODM model– Green and longer battery life requirements– Automotive electronic content– Globalization of Space market– Integration: defining value

• Leverage sustainable competitive advantages• Continued penetration of Tier 1s

– Focus on under-penetrated customers– Exceptional support– Becoming a trusted advisor

88

Power Still #1 Growth Opportunity

2014 Analog GPPP TAM $25.9B

Power 52.1%

Interface 12.9%

Data Converters 18.1%

Comparators 0.9%

Amplifiers 16.0%

• Capitalize on winning positions in Computing and Consumer power

• New opportunities: digital power and modules for Industrial & Communications

• Balance with focused AMS investments

2009 Analog GPPP TAM $14.9B

Power 51.2%

Interface 14.3%

Data Converters

14.8%

Comparators 1.9%

Amplifiers 17.8%

Source: Databeans Estimates

89

Balancing our Investments

• Projected 5 year growth rates– Analog ASSP 10% CAGR– Analog GPPP 12% CAGR

• Direct resources focused on growing closer strategic relationships with Tier 1 computing, consumer, and communications companies to drive ASSP– Deep understanding of

customer applications– Close hands-on support to

achieve winning results and closer relationships

• Continual effort to optimize channels and partners to drive broader general purpose product growth

0

10,000

20,000

30,000

40,000

50,000

60,000

$M

2006 2007 2008 2009 2010 2011 2012 2013 2014

ASSP vs GPPP

GPPP ASSP

Source: Databeans Estimates

90

Successful Coverage Model

Direct Sales FocusClose Tier 1 ASSP Engagement

Pull-through of GPPPSupport Differentiation

Direct Management & Rep Sales ResourcesOpportunistic ASSP Engagement

Channel Partner CoverageGPPP Focus

Tier 1Customers

Tier 2Customers

Tier 3Customers

Number of Customers

$

$$

$$$

91

Asia Pacific – Strong Investment

Intersil 2008 Revenue

EMEA 9%

APAC 64%

Japan 8%

Americas 19%

• Continue investment in direct sales– Hangzhou Apps team– Expand AMS team for

GPPP• Leverage Notebook

share– ODM relationships– Netbook growth

92

Americas – Build on Tier 1s

• Leverage industry driver relationships– Intel, AMD

• Deepen penetration of Tier 1s– Servers, Automotive,

Communications• Upgrade/add partners

– Midwest rep consolidation– Hybrid structure in Bay and

Boston to increase focus on Tier 2 and Horizontal business

– Exploit move from Avnet to Avnet/Memec

93

Japan – Great Expansion

• Expand on major wins at Tier 1 consumer accounts, especially gaming and displays

• GPPP drives Industrial• Leverage strong position

in Optical Drives -dominate BluRay

• Invest in Auto

94

EMEA – Aligned for Success

• Alignment with key markets and customers– Communications– Auto– Space, High Reliability

• Add regional distis to complement globals– GPPP drives Industrial

95

A Customer’s View of ValueC

ompo

nent

sC

onsi

dere

d

ProcessorDSPFPGASOC, ASSPData Converters

- Speed- Accuracy

Memory ArchHigh Speed InterfaceCore Power

PowerSlow Speed InterfaceSignal Path

Commodity

ConceptualDesign

ArchitecturalTradeoffs

CriticalComponentSelection

SystemPrototype

& Eval

FinalBOM &Ramp

Production

Non CriticalComponentSelection

Buying Cycle

Customer Value PropInnovation

Differentiation Customer Execution Phase

96

Late Entrants Suffer

Often commodity analog companies are late to the gameLittle opportunity to impact architecture/BOMRarely sole source, challenged for margins

OpportunityQualification

Designand

PrototypeSupport

Close the OrderSelling Cycle

Customer Value PropInnovation

Differentiation Customer Execution Phase

ConceptualDesign

ArchitecturalTradeoffs

CriticalComponentSelection

SystemPrototype

& Eval

FinalBOM &Ramp

Production

Non CriticalComponentSelection

Buying Cycle

97

Move to the Left for Value

ASSPs and acquisitions provide key opportunity to move to the left

i.e., D2Audio, Kenet, Zilker

Customer Value PropInnovation

Differentiation Customer Execution Phase

ConceptualDesign

ArchitecturalTradeoffs

CriticalComponentSelection

SystemPrototype

& Eval

FinalBOM &Ramp

Production

Non CriticalComponentSelection

Buying Cycle

Pull ThroughBalance of

ProductPortfolio

Designand

PrototypeSupport

Close the Order

ImprovedSelling Cycle

OpportunityQualification

ArchitecturalEngagement Negotiation

98

Example of Success

Customer: Major Auto Tier 1Prior Business: NoneProgram/Opportunity: nine-channel audio amplifier, 1Mu/yrCompetition: TI, IRStrategy: Lead with D2Audio products; emphasis on DSP

implementation of cabin correction, graceful fault protection/recovery, premium audiophile endorsement

Pull-through Opportunity: Power managementResults: Customer asked Intersil to deliver full design DSP + power:

Intersil content more than doubled

99

Capitalize on Brand Value

• Leverage well established technology and quality leadership

• Reinforce technology leadership positions– Light Sensors, Hi Rel, etc.

• Co brand with acquisitions that have established unique brand value

– D2Audio

– Zilker Labs

100

Key Takeaways

1 Highly experienced management team

2

Balanced play between ASSP and GPPP3

Strong worldwide team with a winning strategy, reinforced with exceptional products

4 Moving to the left – establishing Intersil as a “Trusted Advisor”

5 Intersil is well positioned for industry recovery

Worldwide Operations & TechnologySagar PushpalaSenior Vice President

102

Operations & Technology’s Vision

A nimble, customer-centric supplier of

• Innovative analog technology solutions• Cost efficient manufacturing processes• Best in class quality and reliability

103

Achievements since last Analyst Day

Internal: 40% capacity availableAdding new technologies, ramping, going greener!

Foundry: Supply agreements in place for 50% incremental capacity

Multiple foundry locations for 0.25µm

Back-End: Long-term partnershipsConsigned tester capacity, captive assembly & testStrengthen off-shore engineering team

104

Key Talent Additions

BackgroundDirector, Process Technology PhD; NSM, LLTC

Foundry Engineering PhD; MXIM

ESD Expert PhD; IBM, TSMC

Reliability Engineering MS; Motorola, Freescale

Position

105

Flexible Manufacturing, Low Cost Wafers

• Asset-Lite– 25% internal: 75% foundry wafers– Multi-foundry sourcing for high volume

technologies– Continue to invest in competitive technologies

• Intersil owned• Jointly developed• Off-the-shelf

106

Flexible, Low Cost Assembly & Test

• Asset-Lite…..– >99% backend sub-con outsourced– Multi-backend sub-con sourcing for volume

assembly packages– Continue to invest in unique capabilities, cost

reduction roadmap• e.g.: Optical/Sensors, Modules, Form factor, BOM

– Captive test floors at sub-cons• Stronger Asia presence

107

“Asset-Lite” Operations

Fabs (2 1) internal

Foundries (2 primary, 13 other)

Back-End (2 internal, 14 external)

Front End: Revenues Back-End: Die Tested

Internal 25%External 75%(64 75%)

Internal 1%

External 99%

108

Asset-Lite Advantages

Analog IDM(+) Strong process knowledge(+) Access to own wafer fabs(+) Process tuned to products(+) Lowest cost at max capacity(+) Proprietary processes(-) High Capex investment(-) Longer time to market(-) Lower GM at lower utilization

levels

Fabless(+) Low Capex investment(+) Shorter time to market(+) Stable GM(-) Higher wafer, assembly & test

prices(-) Generic, narrow process

portfolio(-) Minimal process knowledge

Analog Asset-Lite(+) Strong process knowledge(+) Access to depreciated

foundry fabs(+) Process tuned to products(+) Stable gross margin(+) Proprietary processes(+) Low Capex investment(+) Shorter time to market(±) Competitive wafer,

assembly & test prices

109

Access to Low Cost Wafer Locations

ChinaGermany

IntersilFlorida

Japan

Taiwan

Singapore

Idaho

Minnesota

New YorkMaine Vermont

California

110

Access to Low Cost Assembly & Test

IntersilCalifornia

China

South Korea

IntersilFlorida

Malaysia

Thailand

Philippines

Taiwan

Singapore

111

Proprietary Processes = Broad Product Portfolio

Barriers to Entry!

Intersil Owned + Jointly Developed + Off-the-Shelf Foundry Processes

BCDPlatform

Power StageLinear

RegulatorsDC/DC

ConvertersInterface ProductsModules

(FET)

Proc

esse

sPr

oduc

ts

BiCMOS

Mixed Signal

InterfaceProducts

BiCMOSHi-Perfor,

HV

HS Op AmpsDSL LD

ATE

BiCMOSHi Voltage

(100V)

BroadbandPower

Class D AudioTelecom PM

BiPOLARHi Voltage

SOI

DSL LDPrec. AmpsInstr. Amps

CMOSMixed Signal

Switch/MUXLDD

Display DriverLCD Buffers(HV CMOS)

CMOSNVM

EEPROMVREFDCP

Battery MgmtFuel Gauge

Digital PowerManagement

CMOSSensor

OEIC Products

CMOSDeep

Submicron

Data Converters

AFEDigital Audio

112

Continuous Cost and Quality Improvements

• Dual foundry sources for high volume processes• Crisper inventory management• Complete internal 4” fab consolidation (2 fabs

1)• 2 captive test floors at existing sub-con partners• Continue to outsource assembly to multiple

partners – leverage lowest costs, China presence

• Best in class product quality levels, ppm • M&A – significantly lower cost of goods sold

113

2009 Key Technology Programs

• Ramp competitive, 0.25µm platform process• 0.18µm process ramp, high voltage

development• Copper bond wire proliferation, many sites• Module development and portfolio expansion

– Lead frame, Copper clip• Smaller, lower cost packages

114

Intersil’s Commitment to Quality

Continuous Improvement in Customer Quality

1Q07 2Q07 3Q07 4Q07 1Q08 2Q08 3Q08 4Q08 Q409Goal

Cus

tom

er R

epor

ted

PPM

Best in Class

115

Key Takeaways

1 Strong and experienced Technology and Operations team

2 Differentiated HPA operations strategy – Asset-Lite: Flexibility, Low Cost

3 Broad portfolio of process and package technologies competitive products

4 Relentless drive to improve quality, delivery, yields, productivity and costs

5 Manufacturing partner leverage stable gross margins

FinancialOverview

Jonathan KennedyInterim CFO

117

Key Financial Objectives

• Grow revenue faster than peers• Diversify and grow revenue base• Earnings accelerate when growth returns• Generate superior free cash flow• Near term spending discipline• Provide excellent returns to shareholders

118

Revenue Diversity

0

200

400

600

800

1000

1200

2007 2008 Goal

Computing Consumer Industrial Communications

Zilker digital power

Kenetdata converters

D2Audio

Gaming

Light sensors

PMICs

LDDs

Modules

119

Faster Revenue Growth

Large peers: ADI, MXIM, LLTC, NSMSmall peers: SMTC, MCRL, POWI, MPWR

2005 2006 2007 2008 4-Yr CAGR

Large peers (< $1B)

-2% 10% -5% -2% 0%

ISIL 13% 23% 2% 2% 10%Small peers (< $300M)

18% 5% 7% 8% 9%

Group 0% 11% -3% -1% 2%

120

Targets When Growth Returns

* Excludes one-time items and acquisition related expenses, includes equity compensation

2007 2008 TargetRevenue $757.1 $769.7 >$1B

Revenue Growth (y/y) 2% 2% Faster than peers

GM (incl equity comp) 57% 57% 58%

Op Income* 22% 22% >26%

Non-GAAP EPS Growth 8% -3% Faster than revenue

ROC 15% 10% 18%

Dividend $0.48 $0.48 Increasing w/ FCF

121

Balance Sheet Targets

Jan 02 Dec 28Assets 2009 2007Current Assets

Cash, cash equivalents and short-term investments $ 312.6 $ 483.8 Trade receivables, net 66.6 117.4 Inventories, net 110.2 98.6 Other current assets 47.2 48.6

Total Current Assets 536.7 748.5 Other Assets

Property, plant and equipment, net 112.8 109.6 Intangible assets 352.4 1,475.7 Long-term investments 81.3 19.1 Other 61.1 52.1

Total Other Assets 607.6 1,656.5 Total Assets $ 1,144.2 $ 2,405.0

Liabilities and Shareholders' EquityCurrent Liabilities

Trade accounts payable $ 22.3 $ 40.2 Deferred net revenue 10.6 10.3 Other accrued items 77.9 74.9

Total Liabilities 110.8 125.4 Non-current Liabilities

Income taxes payable - 40.7

Total Shareholders' Equity 1,033.5 2,238.9 Total Liabilities and Shareholders' Equity $ 1,144.2 $ 2,405.0

122

Excellent Cash Flow

2006 2007 2008Revenue $741 $757 $770Ops Cash Flow $236 $232 $205Net Capex $30 $18 $32Free Cash Flow $206 $214 $173Share O/S (millions) $145 $134 $124FCF/Share $1.42 $1.60 $1.40Dividends Per Share $0.21 $0.40 $ 0.48

123

Near Term Cash Flow Picture

• Improvements in working capital– $10M per quarter reduction in inventory– Inventory back to 100 days by year end– $10M reduction in receivables in Q1

• Minimal capital expenditures– $1M per quarter

• Maintain dividend rate– $.48 per share – currently a 5% yield

• Minimal to no share buy-back• $17M / quarter in non-cash items

– $7M stock compensation, $6M depr., $4M amort

124

History of Spending Discipline

• R&D incremental spending mostly from acquisitions

• SG&A spending managed down

• Overhead continues decline driven by fab consolidations

60

80

100

120

140

160

2006 2007 2008 Q1-09Rate

Ann

ual R

ate

($M

)

Mfg OH R&D SG&A

Percent of Revenue

125

Long Term Cost Savings

• Internal fab consolidation– $6M annual savings

• Copper wire bonding– ~30 bps margin and growing over time

• 0.25µm process– Provides considerable cost savings as new

products are released• Multiple on-going cost reduction programs

underway

126

Near Term Spending Discipline

• 9% force reduction announced in Nov-08– $3 million per quarter savings

• No bonus payouts for 2H-08 or 1H-09– $3 million per quarter savings

• Mandatory vacations in Q4-08 and Q1-09– $6 million per quarter savings

• No annual salary increases– $1 million per quarter savings

• Significant controls on discretionary spending– $1 million per quarter

• These actions = 15% reduction in co-wide spending• Further actions still possible

127

Shareholder Returns

$0

$100

$200

$300

$400

$500

$600

2002 2003 2004 2005 2006 2007 2008

Share repurchases Dividends

128

Key Takeaways

1 Expanding product portfolio will drive revenue growth faster than peers

2 Earnings will accelerate as growth returns, margins will stabilize and we will leverage operating expenses

3 Carefully managing all expenses during downturn, Opex nearly flat for the last three years

4 Positive free cash flow, even in the depths of the downturn, will support dividend

Conclusion & Final Q&A

Dave Bell President & CEO

130

In Closing …

1 Revitalized management team, organized for >$1B

2 Uniquely positioned for future growth

3 Diversifying portfolio -- expanding SAM

4 Maintaining PC market share in strategic areas

5 Organic growth + strategic acquisitions

6 Asset-Lite model + operational excellence

7 Great business model with careful expense controls

8 Management focused on long-term success

Building the Bridge To Future Growth

Intersil 2009 Analyst Day

132

Biographies

133

Dave Bell

Mr. Bell is the President, Chief Executive Officer and a Director of the company. Prior to this role, Mr. Bell had served as Intersil's President and Chief Operating Officer. Mr. Bell joined Intersil in April of 2007 after spending 12 years with Linear Technology Corporation (“LTC”), most recently, from June 2003 to January 2007, as its President. Prior to becoming President of LTC, from January 2002 to June 2003, Mr. Bell served as LTC’s Vice President and General Manager of Power Products and, from February 1999 to January 2002, as LTC’s General Manager of Power Products. From June 1994 to January 1999, he held the position of LTC’s Manager of Strategic Product Development.

Mr. Bell has a B.S. degree in Electrical Engineering from the Massachusetts Institute of Technology.

David B. Bell

President, Chief Executive Officer, and Director

134

Jonathan Kennedy

Jonathan Kennedy is Interim Chief Financial Officer of Intersil Corporation. Mr. Kennedy was appointed Interim Chief Financial Officer of Intersil Corporation in 2008. Prior to this appointment, Mr. Kennedy was Intersil's Corporate Controller for 3 years. Mr. Kennedy joined Intersil in 2004 as Director of Finance and became Intersil's Corporate Controller in 2005. Before joining Intersil, he held management roles in Finance and IT with Alcon, Inc. and Harris Corporation.

Mr. Kennedy holds a Bachelor of Science degree in Business Administration and a Master of Science degree in Accounting from the University of Central Florida. He is also a Certified Public Accountant

Jonathan Kennedy

Interim Chief Financial Officer

135

Worldwide Sales & Corporate Marketing

As Senior Vice President of Worldwide Sales and Corporate Marketing, David Loftus oversees worldwide OEM and Distributor sales, Global Customer Care Network, and Marketing Communications for Intersil Corporation.

Mr. Loftus was previously at Xilinx, Inc. for 17 years, most recently holding the position of Vice President and General Manager of the General Products Division at Xilinx. Prior to that, his positions at Xilinx included General Manager of the CPLD Division, and Vice President/Managing Director of Xilinx Asia Pacific. In his Asia Pacific executive position, Mr. Loftus was based in Hong Kong where his primary role was to build an organization and market strategy capable of supporting customers in the region including the key markets of Korea, Taiwan, ASEAN, India, Australia and China. His responsibilities included direct sales, field applications, distribution, regional marketing and customer service. He was in this role for over three years before moving into a product division general manager role for Xilinx in San Jose, California. Mr. Loftus also held the position of Regional Sales Manager - Southeast United States, as well as other positions with growing responsibility while at Xilinx. Prior to joining Xilinx, Mr. Loftus was a Research Engineer and Program Manager at Georgia Tech Research Institute for seven years.

Mr. Loftus holds a bachelor’s degree in Electrical Engineering and a master’s degree in Management from Georgia Institute of Technology, Atlanta, Georgia.

David Loftus

Senior Vice President, Worldwide Sales & Corporate Marketing

136

Worldwide Operations & Technology

Sagar Pushpala is Intersil's Senior Vice President of Worldwide Operations and Technology. Mr. Pushpala joined Intersil in December 2004 as the Vice president of Wafer Fab and Foundry Operations. Prior to joining Intersil, he served as the Director of Wafer Fab Operations at Maxim Integrated Products where he held responsible positions in their six-inch and eight-inch wafer fabrication lines. Prior to Maxim, Mr. Pushpala served as the Director of Process Technology Development at National Semiconductor where he was responsible for module development in their eight-inch R&D wafer fab. He was instrumental in the qualification of the first eight-inch fabs at both National Semiconductor and Maxim Integrated Products. Over his 20+ year career, Mr. Pushpala has held various senior engineering management positions at National Semiconductor, Saratoga Semiconductor and Advanced Micro Devices.

He is on the Executive Board of the Fab Owners Association (FOA) and Telefunken Semiconductor.

Mr. Pushpala holds a Master of Science degree in Chemical Engineering from the University of Kansas in Lawrence, Kansas and a Bachelor of Technology degree in Chemical Engineering from the Indian Institute of Technology in Madras, India.

Sagar Pushpala

Senior Vice President, Worldwide Operations &

Technology

137

Power Management Products

As Senior Vice President of the Power Management Products Group, Peter Oaklander oversees Intersil's Consumer, Computing, Industrial, Communications, Automotive, and Specialty businesses.

Mr. Oaklander was previously senior vice president of Worldwide Sales and oversaw worldwide OEM and Distributor sales for Intersil Corporation. Prior to joining Intersil, Mr. Oaklander was at Analog Devices for 20 years, most recently holding the position of vice president and general manager of Power Management products in the Analog Semiconductor division. Prior to that, his positions at Analog Devices included vice president and general manager of Analog Devices’ Silicon Valley Operations, managing director of the Asia Pacific region, director of Consumer Sales and Analog Semiconductor Components division Field Marketing in Japan, as well as other positions with growing responsibility.

Mr. Oaklander holds a BSEE degree from the Rochester Institute of Technology in Rochester, New York and an MBA degree from the Northwestern Kellogg Graduate School of Management and Hong Kong University of Science & Technology in Hong Kong.

Peter Oaklander

Senior Vice President

138

Power Management Products

Michael Althar is vice president and general manager of Intersil's Specialty Products group. Previously, Mr. Althar served four years as vice president of Marketing and Applications for Intersil’s Core and High Reliability products including military, radiation hardened, custom and commlink products serving the high reliability, space, medical and communications markets. Responsibilities in this role included establishment of Intersil's Bangalore, India design center and leading corporate Reliability and Package Engineering organizations. Prior to that, he served three years as vice president and plant manager of Intersil’s Ohio-based wafer fab operations. Mr. Althar came to Intersil from Harris Corporation where he spent 16 years in a variety of engineering and management roles, including two years as director of product/test/ assembly engineering at Harris' Malaysian assembly and test facility.

Mr. Althar holds a BSEE from Case Western Reserve University and a MSEM from Southern Methodist University.

Michael Althar

Vice President and General Manager – Specialty Products

139

Power Management Products

Davin Lee is vice president and general manager of Intersil’s Consumer Power products group, which markets high-performance power solutions for the consumer electronics market. Prior to his current role, Mr. Lee was VPGM of the Industrial and Communications Products group and served two years as vice president of Intersil’s General Purpose Power products group. He joined Intersil after the acquisition of Xicor, Inc., where he served as vice president of Marketing for three years. Mr. Lee came to Xicor from Altera Corporation, where he was a strategic business manager for two years. Prior to Altera, he spent seven years at National Semiconductor working in various sales and engineering roles.

Mr. Lee holds a BSEE degree from the University of Texas at Austin and an MBA degree from the Kellogg School of Management at Northwestern University.

Davin Lee

Vice President and General Manager – ConsumerPower Products

140

Power Management Products

Paul Sferrazza is vice president and general manager of Intersil’s Computing Power products group. Prior to his current role, Mr. Sferrazza served one year as vice president and four years as director of Intersil’s Power Management IC Design group. Prior to that, he spent two years as senior manager of IC Design and Application for Desktop/Server power products. Mr. Sferrazza came to Intersil from Harris Corporation, where he worked for three years as senior manager of Microcontroller Design and Applications and three years as a senior principal member of Microcontroller Design Engineering. Prior to Harris, Mr. Sferrazza held various positions in microcontroller design, applications, and product Marketing management for GE/RCA Solid State.

Mr. Sferrazza holds a BSES degree in Electrical and Computer Engineering from Yale University. He holds 10 U.S. patents.

Paul Sferrazza

Vice President and General Manager – Computing

Power Products

141

Analog & Mixed Signal

Susan Hardman is senior vice president of Intersil’s Analog Mixed Signal products group. Prior to her current role, Ms. Hardman has served as vice president and general manager of Intersil’s Automotive and Specialty products group and vice president of Intersil’s Corporate Marketing. Ms. Hardman has over 20 years of experience in the semiconductor industry. She joined Intersil from Exar Corporation, where she was vice president and general manager of the company’s Interface products division. Prior to that, she served as vice president of Corporate Marketing and director of Product Marketing for Exar.

Before Exar, Ms. Hardman worked for VLSI Technology for eight years and held a variety of management positions, most recently as director of Product Marketing for the company’s Networking products group. Ms. Hardman began her career with Motorola, where she worked for six years in a variety of engineering roles.

Ms. Hardman holds a BS degree in Chemical Engineering from Purdue University and an MBA degree from the University of Phoenix. She was also named an Outstanding Chemical Engineer by Purdue University in 2004.

Susan Hardman

Senior Vice President

142

Analog & Mixed Signal

Roger Levinson is Vice President and General Manager of the Precision Products Area within the Analog and Mixed Signal Product Group. His organization is focused on precision amplifiers, precision data converters, switch and interface products. Prior to his current role, Mr. Levinson held the position of Vice President of Design Engineering for the Analog and Mixed Signal Product Group. Prior to his tenure at Intersil, Mr. Levinson held Director of Engineering positions at Xicor Corp and Exar Corp. Mr. Levinson was a founder of Analog Integration Partners LLC (acquired by Xicor) - which provided advanced analog front end solutions for system-on-a-chip manufacturers in the areas of video, wireline and wireless communications including wireless LAN, Bluetooth and Gigabit Ethernet. Mr. Levinson has extensive experience in signal path and high performance analog electronics that span a broad number of market areas.

Mr. Levinson holds a BSEE and MSEE in Electrical Engineering from University of California at Davis and has been granted over 15 U.S. patents.

Roger Levinson

Vice President and General Manager – Precision Products

143

Analog & Mixed Signal

Huibert Verhoeven is Vice President and General Manager of Intersil’s High Speed Products group, which develops and markets high performance analog and mixed signal solutions for a broad set of consumer and communication applications. He joined Intersil from National Semiconductor Corporation, where he was the Design Director for the Precision and Low-Voltage/Low-Power amplifier group. Mr. Verhoeven was a driving force behind the development of National Semiconductor’s Precision Product strategy. He managed two US-based and two International development centers and was the Managing Director of National Semiconductor’s subsidiary in the Netherlands.

Mr. Verhoeven holds an MSEE and Ph.D. degree from Delft University of Technology in The Netherlands. He holds US and international patents and is the author of over 10 peer-reviewed and trade publication articles.

Huibert Verhoeven

Vice President and General Manager – High Speed Products Group

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