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ANNUAL REPORT 2005Meeting date: June 1, 2005
Sami Vapalahti, David Hodgson, Xiangyu Dai, Jianwei Hu & Brian G. Thomas
Department of Mechanical & Industrial EngineeringUniversity of Illinois at Urbana-Champaign
Thermal analysis of CC mold and Calibration of CON1D
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 2
Acknowledgements• National Science Foundation
– Grant NSF-GOALI DMI 01-15486• Continuous Casting Consortium at UIUC
(Nucor, Postech, LWB Refractories, Accumold, Algoma, Corus, Labein, Mittal Riverdale)
• National Center for Supercomputing Applications (NCSA) at UIUC
• Fluent, Inc., CFX, UIFLOW (P. Vanka)• Other Graduate students, especially B. Zhao
2
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 3
Introduction to CON1D• 2-D steady heat conduction in mold• 1D transient conduction and solidification in shell:
simulation domain
n 1i
MoldShell
Interface
∆x
solid shell liquid shell
z
x
qsh qint
Vc
Heat fluxHeat flux
Peak nearmeniscus
Copper Moldand Gap
Liquid Steel
1.0123
400
200
top ofmold
23 mm
4
0
Mold Exit
600
Heat Inputto shell insidefrom liquid(q )
Water Spray Zone
Meniscus
Narrow face(Peak near mold exit)
SolidifyingSteel Shell800
Wide face(Very little superheat )
int sh
Heat Removedfrom shell surfaceto gap(q )
(MW/m )2 (MW/m )2
∆x
Vc
i
x
z
22*
2 steel
steel steel steelkT T TCp k
t x T x∂∂ ∂ρ
∂ ∂ ∂∂ = + ∂
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 4
CON1D – features special analysis of interface phenomena
mold
liquidflux
V
solidflux
d dd
velocityprofile
T
shell
V
temperatureprofile
equivalentlayer foroscillation marks
k k ksolid
solid
c
fsol
TsT's
moldThotc
solid
liquid
liquid
eff
eff
T
z
x
Ts
dairkair
dsolidksolid
dliquidkliquid
deff keff
1/hrad
Ts Tsol ≥ Tmold Tfsol≥
Tmoldrcontact
Tfsol Ts’
Mass balance:
0
liquiddslag csolid solid liquid c osc
slag
Q VV d V dx V d
ρ×
= + +∫
Heat transfer:
( )int gap s moldq h T T= −
• Mass balance and heat transfer in the interfacial gap:
3
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 5
CON1D - Applications
steel propertiessteel properties
spray zone variablesspray zone variables
mold flux propertiesmold flux properties
oscillation marks parametersoscillation marks parameters
cooling water propertiescooling water properties
mold geometrymold geometry
temperaturestemperatures
mold and TCsmold and TCs
sheel surface and interiorsheel surface and interior
cooling watercooling water
shell thicknessshell thickness
heat flux leaving the shellheat flux leaving the shell
Mold frictionMold friction
flux layer thickness & fractureflux layer thickness & fracture
simulation parameterssimulation parameters
casting conditionscasting conditions
CON1D
input output
ideal mold taperideal mold taper
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 6
CON1D – example output (Algoma Steel WF-I case)
0
2
4
6
8
10
12
14
0 200 400 600 800 1000
Shel
l Thi
ckne
ss (
mm
)
Distance below meniscus (mm)
CaseI_WF SolidusCaseI_WF Liquidus
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
-200 0 200 400 600 800 1000 1200
Hea
t Flu
x (M
W/m
2)
Distance below meniscus (mm)
CaseI_WF:Gap Heat FluxCaseI_WF:Water Heat Flux
0
50
100
150
200
250
300
350
400
-200 0 200 400 600 800 1000 1200
Tem
pera
ture
(C)
Distance below meniscus (mm)
CaseI_WF:Hot FaceCaseI_WF:Cold FaceShell thickness
Mold Temperature
Mold Heat flux
4
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 7
-2
0
2
4
6
8
10
12
0 200 400 600 800 1000
Endw
all D
efle
ctio
n (m
m)
Distance below meniscus (mm)
CaseI_WF: shell shrinkage(Depenaar)CaseI_WF: Mold distortion
CaseI_WF: total slag thicknessCaseI_WF: half extra length
CaseI_WF: ideal taper
Ideal Mold Taper
CON1D – example output (Algoma Steel WF-I case)
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 8
800
900
1000
1100
1200
1300
1400
1500
1600
0 2000 4000 6000 8000 10000 12000 14000
She
ll Te
mpe
ratu
re (
C)
Distance below meniscus (mm)
CON1D: Shell Temperature
CaseI_WF
Surface temperature in mold and spray zones
CON1D – example output (Algoma Steel WF-I case)
5
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 9M. Langeneckert, MS Thesis, 2001M. Langeneckert, MS Thesis, 2001
TC prediction (useful for validation) needs calibration with 3-D model
• Example 3-D mold section analysis for offset
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 10
Offset Calculation
sect w-w
sect t-tcold
hot
MOLD#2 NARROWFACE
Mol
d te
mpe
ratu
re [
o C]
Position in mold from cold side [mm]
4.0 mmoffset
Thermocouple location,
Temp = 99 oC
25
45
65
85
105
125
145
165
185
0 10 20 30 40
3D Ansys section t-tCON1D at thermcoouple CON1D section w-w3D Ansys section w-w
-18 -9 0 9 18 27
45
TCOLD
THOT
q=1.75 MW m-2
hw= 45 kW m-2 K-1
Tw = 25 o C
km= 364 W m-1 K-1
hfin = 55.6 kW m-2 K-1
all [mm], {dm=27, dch=18 wch =5, Lch=13.5}
thermocouple
6
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 11
Case Study: Algoma funnel mold
• CON1D calculation for more accurate boundary conditions for hot and cold faces
• ANSYS calculations to investigate different cases:– Case 1: No thermocouple hole present in domain.– Case 2: Thermocouple hole included in domain.– Case 3: Thermocouple hole and the cooling effect
of the TC wire are both modelled in the domain.– Other cases: show that mold thickness variations
due to funnel have negligible effect on hotface and TC temps.
• Offset calculations with CON1D considering ANSYS case 2
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 12
Algoma: model domains
Thermocouple holeThermal expansion slots
Hot Face
Cold Face
Water Channel (bored holes)
Cross section of the mold
Domain for cases 2 and 3
Domain for case 1
7
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 13
28.31Water temperature (°C)
35.7748Water tube heat transfer coefficient (kW m-2K-2)
1.704Heat Flux (MW m-2)
800Depth below meniscus (mm)
8.7 m/sWater Velocity in bored holes
Perfectly insulatedRemaining faces of model
14mmDistance of thermocouple from hot face
372 W m-1K-1Thermal conductivity of copper
Simulation Conditions (Case 3)
Algoma: 3-D mold temperaturesTC
TC Temperature (base of TC hole):132.7°C (case 1)138.95°C (case 2 & 3)
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 14
Algoma Mold Temp.: Case 3
Temperature profiles along different paths, thermocouple hole with thermocouple wire
0
20
40
60
80
100
120
140
160
180
200
0 20 40 60 80 100
Distance from hotface (mm)
Tem
pera
ture
(C)
Path 1Path 2Path 2Path 3Path 3Path 4
TC (point B)
Bottom of cooling water hole (N,I)
8
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 15
• The difference in temperature profiles at 110, 400 and 800mm below meniscus
• Correlation between hotface temperature and heat flux
Case Studies: Algoma
Comparison of Temperature profiles from hotface to base of thermocouple hole at different depths
0
50
100
150
200
250
300
350
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Distance from hotface (mm)
Tem
pera
ture
(C)
110mm below meniscus400mm below meniscus800mm below meniscus
Comparison of heat flux against temperature of hotface
150
170
190
210
230
250
270
290
310
330
350
1.50E+06 2.00E+06 2.50E+06 3.00E+06 3.50E+06
Heat flux (W)
Tem
pera
ture
(C)
Max tempMin TempLinear (Max temp)Linear (Min Temp)
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 16
Small air gap between TC bead and mold greatly lowers TC temperature
0.00
20.00
40.00
60.00
80.00
100.00
120.00
140.00
160.00
0.001 0.01 0.1 1
Air gap size (m m )
Tem
pera
ture
(C)
Maintaing close contact between TC and mold wall is important
9
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 17
• CON1D assumes rectangular cooling channels -> find way to match temperature with a round cooling channel (for same heat flux)
• Method found: – match the area of the cooling channels:
Acircle (14mm diameter) = Arectangle (12.4x12.4mm)– Keep same distance from hotface– Decrease mold thickness to 33mm
Case Studies: Algoma
CaseI_WF CaseIV_WF
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 18
Thermocouple hole no conduction ANSYS Path
4 Temp P3 Temp
P 2 Temp
P 1 Temp
P 194.95 K 195.11 F 196.45 A 197.21
Q 130.67 L 130.68 G 132.17 B 138.95
R 81.093 M 78.787 H 79.974 C N/A
S 44.589 N 38.345 I 39.299 D N/A
T 42.46 O 42.638 J 42.697 E N/A
CON1D CaseI_WF CaseIII_WF CaseIV_WF
Hot Face 190.5 195.8 195.4
Cold Face 75.7 81.0 80.6
Heat Flux ANSYS CaseIV_WF 14 mm CaseIV_WF 12.10 mm
1.704 MW/m2 139.95 131.10 139.82
Case Studies: Algoma
CON1D matches ANSYS for 3-D mold temperature calculations, so long as the mold thickness is decreased to 33.0 mm (from a range of thicknesses around funnel up to 105mm).
Offset = 1.9mm (meaning that TCs in CON1D should positioned at 12.1 mm below the hotface, which is 1.9mm closer to the hotface than actually occurs in the caster).
10
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 19
Case Studies: Nucor
• ANSYS calculations to investigate different cases:– Constant Qhot and copper conductivity
• Q = 2500 and 4000 kW/m2 :– Temperature dependent conductivity of
copper– Qhot a function of distance below meniscus
• Offset calculations with CON1D considering ANSYS cases 1 and 3
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 20
Case Studies: 3-D analysis of Nucor mold
• Comparison between heat fluxes of 2.5 and 4 MW/m2
FEA Model part
11
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 21
Temperature profiles along different paths
Case Studies: Nucor
Path I
Path II
Path IV
Path III
Path I
Q = 4000 kW/m2Q = 2500 kW/m2
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 22
Difference between constant and temperature dependent Kcopper
Case Studies: Nucor
)50(601355 −−= TKcopper
%45.0%100*37.124
37.12481.123=
−
• Difference in thermocouple temperatures:
Case 1 and 3 temperatures along path 1
12
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 23
Q as a function of Z coordinate
Case Studies: Nucor
Path I
Path IV
Case 4
Case 5
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 24
Case Studies: Nucor
• Using the same boundary conditions as in case 3• The effect of changing K taken into account in
ANSYS• Thermocouple hole was not taken into account in
ANSYS calculation
CON1D: offset is -0.3mm
123.85125.97123.81Temperature
CON1D (15.3mm)CON1D (15mm)ANSYS (15mm)Case(distance from hotface)
13
University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 25
Conclusions• CON1D can be used to optimize and design a casting machine
and to inspect possible problems in production• Calibration of CON1D needs 3D thermal analysis to define the
offset, which was performed for 2 production casting molds• When defining the offsets:
– It is reasonable to neglet temperature dependence of thermal conductivity of copper
– The thermocouple hole should be included in the 3D simulation model– Copper near to the mold coldface far from the cooling channels has little
effect on the temperature profile between the hotface and cooling channel, so may be neglected in 3-D calculations
– With offsets, the simple CON1D model predictions of mold and thermocouple temperatures are quite close to the 3-D model