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1 ANNUAL REPORT 2005 Meeting date: June 1, 2005 Sami Vapalahti, David Hodgson, Xiangyu Dai, Jianwei Hu & Brian G. Thomas Department of Mechanical & Industrial Engineering University of Illinois at Urbana-Champaign Thermal analysis of CC mold and Calibration of CON1D University of Illinois at Urbana-Champaign Metals Processing Simulation Lab BG Thomas 2 Acknowledgements National Science Foundation – Grant NSF-GOALI DMI 01-15486 Continuous Casting Consortium at UIUC (Nucor, Postech, LWB Refractories, Accumold, Algoma, Corus, Labein, Mittal Riverdale) National Center for Supercomputing Applications (NCSA) at UIUC Fluent, Inc., CFX, UIFLOW (P. Vanka) Other Graduate students, especially B. Zhao

ANNUAL REPORT 2005ccc.illinois.edu/s/2005_presentations/08_bgt... · 2005. 5. 31. · Case Studies: 3-D analysis of Nucor mold • Comparison between heat fluxes of 2.5 and 4 MW/m2

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    ANNUAL REPORT 2005Meeting date: June 1, 2005

    Sami Vapalahti, David Hodgson, Xiangyu Dai, Jianwei Hu & Brian G. Thomas

    Department of Mechanical & Industrial EngineeringUniversity of Illinois at Urbana-Champaign

    Thermal analysis of CC mold and Calibration of CON1D

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 2

    Acknowledgements• National Science Foundation

    – Grant NSF-GOALI DMI 01-15486• Continuous Casting Consortium at UIUC

    (Nucor, Postech, LWB Refractories, Accumold, Algoma, Corus, Labein, Mittal Riverdale)

    • National Center for Supercomputing Applications (NCSA) at UIUC

    • Fluent, Inc., CFX, UIFLOW (P. Vanka)• Other Graduate students, especially B. Zhao

  • 2

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 3

    Introduction to CON1D• 2-D steady heat conduction in mold• 1D transient conduction and solidification in shell:

    simulation domain

    n 1i

    MoldShell

    Interface

    ∆x

    solid shell liquid shell

    z

    x

    qsh qint

    Vc

    Heat fluxHeat flux

    Peak nearmeniscus

    Copper Moldand Gap

    Liquid Steel

    1.0123

    400

    200

    top ofmold

    23 mm

    4

    0

    Mold Exit

    600

    Heat Inputto shell insidefrom liquid(q )

    Water Spray Zone

    Meniscus

    Narrow face(Peak near mold exit)

    SolidifyingSteel Shell800

    Wide face(Very little superheat )

    int sh

    Heat Removedfrom shell surfaceto gap(q )

    (MW/m )2 (MW/m )2

    ∆x

    Vc

    i

    x

    z

    22*

    2 steel

    steel steel steelkT T TCp k

    t x T x∂∂ ∂ρ

    ∂ ∂ ∂∂ = + ∂

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 4

    CON1D – features special analysis of interface phenomena

    mold

    liquidflux

    V

    solidflux

    d dd

    velocityprofile

    T

    shell

    V

    temperatureprofile

    equivalentlayer foroscillation marks

    k k ksolid

    solid

    c

    fsol

    TsT's

    moldThotc

    solid

    liquid

    liquid

    eff

    eff

    T

    z

    x

    Ts

    dairkair

    dsolidksolid

    dliquidkliquid

    deff keff

    1/hrad

    Ts Tsol ≥ Tmold Tfsol≥

    Tmoldrcontact

    Tfsol Ts’

    Mass balance:

    0

    liquiddslag csolid solid liquid c osc

    slag

    Q VV d V dx V d

    ρ×

    = + +∫

    Heat transfer:

    ( )int gap s moldq h T T= −

    • Mass balance and heat transfer in the interfacial gap:

  • 3

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 5

    CON1D - Applications

    steel propertiessteel properties

    spray zone variablesspray zone variables

    mold flux propertiesmold flux properties

    oscillation marks parametersoscillation marks parameters

    cooling water propertiescooling water properties

    mold geometrymold geometry

    temperaturestemperatures

    mold and TCsmold and TCs

    sheel surface and interiorsheel surface and interior

    cooling watercooling water

    shell thicknessshell thickness

    heat flux leaving the shellheat flux leaving the shell

    Mold frictionMold friction

    flux layer thickness & fractureflux layer thickness & fracture

    simulation parameterssimulation parameters

    casting conditionscasting conditions

    CON1D

    input output

    ideal mold taperideal mold taper

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 6

    CON1D – example output (Algoma Steel WF-I case)

    0

    2

    4

    6

    8

    10

    12

    14

    0 200 400 600 800 1000

    Shel

    l Thi

    ckne

    ss (

    mm

    )

    Distance below meniscus (mm)

    CaseI_WF SolidusCaseI_WF Liquidus

    0

    0.5

    1

    1.5

    2

    2.5

    3

    3.5

    4

    4.5

    5

    -200 0 200 400 600 800 1000 1200

    Hea

    t Flu

    x (M

    W/m

    2)

    Distance below meniscus (mm)

    CaseI_WF:Gap Heat FluxCaseI_WF:Water Heat Flux

    0

    50

    100

    150

    200

    250

    300

    350

    400

    -200 0 200 400 600 800 1000 1200

    Tem

    pera

    ture

    (C)

    Distance below meniscus (mm)

    CaseI_WF:Hot FaceCaseI_WF:Cold FaceShell thickness

    Mold Temperature

    Mold Heat flux

  • 4

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 7

    -2

    0

    2

    4

    6

    8

    10

    12

    0 200 400 600 800 1000

    Endw

    all D

    efle

    ctio

    n (m

    m)

    Distance below meniscus (mm)

    CaseI_WF: shell shrinkage(Depenaar)CaseI_WF: Mold distortion

    CaseI_WF: total slag thicknessCaseI_WF: half extra length

    CaseI_WF: ideal taper

    Ideal Mold Taper

    CON1D – example output (Algoma Steel WF-I case)

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 8

    800

    900

    1000

    1100

    1200

    1300

    1400

    1500

    1600

    0 2000 4000 6000 8000 10000 12000 14000

    She

    ll Te

    mpe

    ratu

    re (

    C)

    Distance below meniscus (mm)

    CON1D: Shell Temperature

    CaseI_WF

    Surface temperature in mold and spray zones

    CON1D – example output (Algoma Steel WF-I case)

  • 5

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 9M. Langeneckert, MS Thesis, 2001M. Langeneckert, MS Thesis, 2001

    TC prediction (useful for validation) needs calibration with 3-D model

    • Example 3-D mold section analysis for offset

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 10

    Offset Calculation

    sect w-w

    sect t-tcold

    hot

    MOLD#2 NARROWFACE

    Mol

    d te

    mpe

    ratu

    re [

    o C]

    Position in mold from cold side [mm]

    4.0 mmoffset

    Thermocouple location,

    Temp = 99 oC

    25

    45

    65

    85

    105

    125

    145

    165

    185

    0 10 20 30 40

    3D Ansys section t-tCON1D at thermcoouple CON1D section w-w3D Ansys section w-w

    -18 -9 0 9 18 27

    45

    TCOLD

    THOT

    q=1.75 MW m-2

    hw= 45 kW m-2 K-1

    Tw = 25 o C

    km= 364 W m-1 K-1

    hfin = 55.6 kW m-2 K-1

    all [mm], {dm=27, dch=18 wch =5, Lch=13.5}

    thermocouple

  • 6

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 11

    Case Study: Algoma funnel mold

    • CON1D calculation for more accurate boundary conditions for hot and cold faces

    • ANSYS calculations to investigate different cases:– Case 1: No thermocouple hole present in domain.– Case 2: Thermocouple hole included in domain.– Case 3: Thermocouple hole and the cooling effect

    of the TC wire are both modelled in the domain.– Other cases: show that mold thickness variations

    due to funnel have negligible effect on hotface and TC temps.

    • Offset calculations with CON1D considering ANSYS case 2

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 12

    Algoma: model domains

    Thermocouple holeThermal expansion slots

    Hot Face

    Cold Face

    Water Channel (bored holes)

    Cross section of the mold

    Domain for cases 2 and 3

    Domain for case 1

  • 7

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 13

    28.31Water temperature (°C)

    35.7748Water tube heat transfer coefficient (kW m-2K-2)

    1.704Heat Flux (MW m-2)

    800Depth below meniscus (mm)

    8.7 m/sWater Velocity in bored holes

    Perfectly insulatedRemaining faces of model

    14mmDistance of thermocouple from hot face

    372 W m-1K-1Thermal conductivity of copper

    Simulation Conditions (Case 3)

    Algoma: 3-D mold temperaturesTC

    TC Temperature (base of TC hole):132.7°C (case 1)138.95°C (case 2 & 3)

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 14

    Algoma Mold Temp.: Case 3

    Temperature profiles along different paths, thermocouple hole with thermocouple wire

    0

    20

    40

    60

    80

    100

    120

    140

    160

    180

    200

    0 20 40 60 80 100

    Distance from hotface (mm)

    Tem

    pera

    ture

    (C)

    Path 1Path 2Path 2Path 3Path 3Path 4

    TC (point B)

    Bottom of cooling water hole (N,I)

  • 8

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 15

    • The difference in temperature profiles at 110, 400 and 800mm below meniscus

    • Correlation between hotface temperature and heat flux

    Case Studies: Algoma

    Comparison of Temperature profiles from hotface to base of thermocouple hole at different depths

    0

    50

    100

    150

    200

    250

    300

    350

    0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

    Distance from hotface (mm)

    Tem

    pera

    ture

    (C)

    110mm below meniscus400mm below meniscus800mm below meniscus

    Comparison of heat flux against temperature of hotface

    150

    170

    190

    210

    230

    250

    270

    290

    310

    330

    350

    1.50E+06 2.00E+06 2.50E+06 3.00E+06 3.50E+06

    Heat flux (W)

    Tem

    pera

    ture

    (C)

    Max tempMin TempLinear (Max temp)Linear (Min Temp)

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 16

    Small air gap between TC bead and mold greatly lowers TC temperature

    0.00

    20.00

    40.00

    60.00

    80.00

    100.00

    120.00

    140.00

    160.00

    0.001 0.01 0.1 1

    Air gap size (m m )

    Tem

    pera

    ture

    (C)

    Maintaing close contact between TC and mold wall is important

  • 9

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 17

    • CON1D assumes rectangular cooling channels -> find way to match temperature with a round cooling channel (for same heat flux)

    • Method found: – match the area of the cooling channels:

    Acircle (14mm diameter) = Arectangle (12.4x12.4mm)– Keep same distance from hotface– Decrease mold thickness to 33mm

    Case Studies: Algoma

    CaseI_WF CaseIV_WF

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 18

    Thermocouple hole no conduction ANSYS Path

    4 Temp P3 Temp

    P 2 Temp

    P 1 Temp

    P 194.95 K 195.11 F 196.45 A 197.21

    Q 130.67 L 130.68 G 132.17 B 138.95

    R 81.093 M 78.787 H 79.974 C N/A

    S 44.589 N 38.345 I 39.299 D N/A

    T 42.46 O 42.638 J 42.697 E N/A

    CON1D CaseI_WF CaseIII_WF CaseIV_WF

    Hot Face 190.5 195.8 195.4

    Cold Face 75.7 81.0 80.6

    Heat Flux ANSYS CaseIV_WF 14 mm CaseIV_WF 12.10 mm

    1.704 MW/m2 139.95 131.10 139.82

    Case Studies: Algoma

    CON1D matches ANSYS for 3-D mold temperature calculations, so long as the mold thickness is decreased to 33.0 mm (from a range of thicknesses around funnel up to 105mm).

    Offset = 1.9mm (meaning that TCs in CON1D should positioned at 12.1 mm below the hotface, which is 1.9mm closer to the hotface than actually occurs in the caster).

  • 10

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 19

    Case Studies: Nucor

    • ANSYS calculations to investigate different cases:– Constant Qhot and copper conductivity

    • Q = 2500 and 4000 kW/m2 :– Temperature dependent conductivity of

    copper– Qhot a function of distance below meniscus

    • Offset calculations with CON1D considering ANSYS cases 1 and 3

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 20

    Case Studies: 3-D analysis of Nucor mold

    • Comparison between heat fluxes of 2.5 and 4 MW/m2

    FEA Model part

  • 11

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 21

    Temperature profiles along different paths

    Case Studies: Nucor

    Path I

    Path II

    Path IV

    Path III

    Path I

    Q = 4000 kW/m2Q = 2500 kW/m2

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 22

    Difference between constant and temperature dependent Kcopper

    Case Studies: Nucor

    )50(601355 −−= TKcopper

    %45.0%100*37.124

    37.12481.123=

    • Difference in thermocouple temperatures:

    Case 1 and 3 temperatures along path 1

  • 12

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 23

    Q as a function of Z coordinate

    Case Studies: Nucor

    Path I

    Path IV

    Case 4

    Case 5

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 24

    Case Studies: Nucor

    • Using the same boundary conditions as in case 3• The effect of changing K taken into account in

    ANSYS• Thermocouple hole was not taken into account in

    ANSYS calculation

    CON1D: offset is -0.3mm

    123.85125.97123.81Temperature

    CON1D (15.3mm)CON1D (15mm)ANSYS (15mm)Case(distance from hotface)

  • 13

    University of Illinois at Urbana-Champaign • Metals Processing Simulation Lab • BG Thomas 25

    Conclusions• CON1D can be used to optimize and design a casting machine

    and to inspect possible problems in production• Calibration of CON1D needs 3D thermal analysis to define the

    offset, which was performed for 2 production casting molds• When defining the offsets:

    – It is reasonable to neglet temperature dependence of thermal conductivity of copper

    – The thermocouple hole should be included in the 3D simulation model– Copper near to the mold coldface far from the cooling channels has little

    effect on the temperature profile between the hotface and cooling channel, so may be neglected in 3-D calculations

    – With offsets, the simple CON1D model predictions of mold and thermocouple temperatures are quite close to the 3-D model