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5G Deployment Driving RF and SOI Technology Opportunity Laura Formenti DMA Marketing Director STMicroelectronics International RF-SOI Workshop, Shanghai, September 17, 2019

5G Deployment Driving RF and SOI Technology Opportunity · 2019. 11. 27. · • 5G LNA + Switch Integration • Full copper back end • High Resistivity and Trap Rich SOI substrates

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  • 5G Deployment Driving RF and

    SOI Technology Opportunity

    Laura Formenti

    DMA Marketing Director

    STMicroelectronics

    International RF-SOI Workshop, Shanghai, September 17, 2019

  • 2Agenda 2

    • 5G deployment status

    • 5G disruption driving RF content

    • RF technology for 5G

    • ST RF-SOI technologies

    • ST value as RF technology partner

  • 35G Standardization & Deployment

    • 5G standard status & schedule

    • Major equipment manufacturers carrying out trials to achieve 5G commercial use by 2020

    • 5G will cost much more to deploy than previous mobile technologies and it will take much longer to perfect

    3

    • Rel.15 (5G phase 1 or ‘stand-alone’) frozen in

    Q1-19

    • Rel.16 (5G phase 2 5G V2X, industrial IoT,

    URLLC enhancements) to be frozen in Q1-20

    Image courtesy of 3gpp

  • 45G Deployment Status

    • 5G investments organized since 2015 at national level through the three mobile operators: China Mobile, China Unicom and

    China Telecom

    • 5G commercial roll-out in 40 cities by October 2019

    • Leading 5G network deployment in more than 80 cities

    • 5G trials started in 2014

    • Recent warning the technology will take much longer than

    previously thought

    • All MNOs have started 5G trials with commercial launches

    planned by the end of 2019

    • AT&T plans to expand 5G nationwide in the first half of 2020

    • AT&T and Verizon using mmWave spectrum for FWA

    • 138 trials across all 28 member states recorded by early 2019

    • However only 7% of 5G spectrum assigned

    4

    Source:ABI Research

  • The 5G Disruption

    • Very high peak data rate – x10-20* (up to 20Gbps DL)

    • Reduced latency – 10 times lower (1ms)*

    • Very high reliability – 99.999%

    • High density connected nodes ( >106 / km2 )

    • High coverage

    • New architecture with diversified and denser network (small cells)

    • New technologies: Advanced beamforming, massive MIMO

    • New spectrum: Use of millimeter wave

    * vs 4G

    5G Network Infrastructure

    Front Haul Fixed Wireless To the Home

    Small Cell

    Repeater

    Base

    Station

    5G Mobility

    5

  • 5G Driving Smartphone RF Content Growth

    5G massive multi-band requirement expands Si content in RF Front End Module

    6

    Sub-6 GHz

    2016 2018 2019-20

    >75% RF-SOI

    area increase

    >25% RF-SOI

    area increase

    RF FEM

    • MIMO 4x4 DL/UL

    • Sub-6GHz bands• Total Carrier BW

    800MHz (up to 8 CC CA)

    • Dual connectivity• Continuing growth

    of CA combination number

  • 5G RF TechnologiesFull range of 5G RF leading technologies for terminals and infrastructure ICs

    7

    H9SOIFEM C65SOIFEM SOIMMW BiCMOS7RF BiCMOS9MW BiCMOS55 28FDSOI

    Device Cross-section

    Applications • 4G & 5G sub-6GHz handsets /

    BTS RF FEM

    • WiFi RF FEM

    • 5G sub-6GHz

    handsets / BTS

    RF FEM

    • WiFi

    802.11ac/ax FEM

    • 5G mmWave

    handsets / BTS RF

    FEM & RF

    Transceiver

    • 5G mmW PAA

    • WiGig

    802.11ad/ay

    • WiFi

    802.11ac/ax RF

    FEM

    • 5G sub-6 GHz /

    mmW BTS RF

    FEM &

    Transceiver

    • 5G mmW BTS

    RF FEM &

    Transceiver

    • 5G mmW PAA

    • High-speed

    AD/DA and I/O

    • 5G BTS RF

    FEM &

    Transceiver

    Process lithoWafer size

    Techn. node

    130nm

    8’’

    PD-SOI

    65nm

    12’’

    PD-SOI

    65/40nm

    12’’

    PD-SOI

    250nm

    8’’

    SiGe

    130nm

    8’’

    SiGe

    55nm

    12’’

    SiGe

    28nm

    12’’

    FD-SOI

    Key benefits High performance analog RF dedicated processes for RF Switches, LNA, PA & RF FEM integration capability

    Based on high-performance HBT

    Analog RF for infrastructure, including high-end & digital

    integration capability

    RF, Mixed signal

    & Digital

    Integration

    Status Production Production 2020 Production Production Production Production

    RF-SOI BiCMOS FDSOI

  • 88

    Picture Source: Soitec

    RF switch (*)

    H9SOIFEM

    LNA 4G LTE & 5G sub-6 GHz

    H9SOIFEM C65SOIFEM

    WiFimodule

    Sub-6 GHz

    WiFi FEM (Switch, LNA, PA) @ 2.4 – 5.8 GHz

    H9SOIFEM BiCMOS7RF

    ST RF Technologies for 5G Sub-6 GHz Smartphone RF FEMs

    (*) proliferation due to multi-antenna & multi-band support

  • 99

    RF FEM + RF Transceiver integration

    SOIMMW (RF-SOI 65/40nm)

    mmWave

    RF FEM RF + IF Transceiver

    Switch

    Antenna tuner

    LNA

    PA

    • SOIMMW RF-SOI process for mmWave support

    • 28FDSOI wide IP portfolio including low power / high-speed AD/DA and SerDes

    Picture Source: Soitec

    28FDSOI

    Mixed signal / digital designs

    ADC

    DAC

    IF Up/Down Conv.

    High-speed

    IO

    ST RF Technologies for 5G mmWaveSmartphone RF FEMs

    RF Up/Down Conv.

  • 10

    ST RF FEM Technologies across multiple end markets

    Terminals Internet of Things

    2.4GHz WiFi & IoT4.5G LTE-A Pro

    5GHz WiFi(802.11ac/ax)

    5G sub-6GHz

    5G mmWave/PAA, WiGig 802.11ad/ay

    Cellular Infrastructure WLAN (WiFi, WiGig)

    IoT

    Integration scale

    H9SOIFEM

    BiCMOS7RF (WiFi FEM)

    H9SOIFEM

    C65SOIFEM

    BiCMOS9MW

    SOIMMW

    BiCMOS9MW (BTS, Small cell)

    Phased Array Antenna / beamforming

    BiCMOS55 (BTS, Small cell)

    BiCMOS7RF (WiFi FEM)

  • ST RF-SOI Technology

    Technology R&D for best

    in class process development & support

    3 RF-SOI fabs

    8” (2) and 12”

    Continued strategic

    investments & long term commitment

    ST RF-SOI: enabling technology for 5G RF Front-End Modules

    11

  • 2000

    2009

    2013

    2016

    2019

    ST RF-SOI History

    H9SOI process available for 1st RF

    Switch demonstrator

    H9SOI RF Switch production Ramp-up

    Introduction of H9SOIFEM

    C65SOIFEM production

    H9SOIFEM high vol production

    5G sub-6GHz

    5G mmWave

    4G LTE-A

    8’’ wafers

    12’’ wafers

    2020

    SOIMMW

    12’’ wafers

    Rousset - France

    CR200 (200mm) R8 (200mm)CR300 (300mm)

    Crolles - France

    SOI substrates in partnership with major suppliers

    12

  • H9SOIFEM for 4G & 5G sub-6 GHz RF FEMs

    H9SOIFEM (130nm lithography, 200mm wafer)

    • Solid and proven RF-SOI technology

    • High performance RF Switches with

    Low Insertion Loss and High linearity

    • Low Noise Figure LNA

    • High Efficiency PA

    • RF FEM Monolithic Integration

    • Multiple back-end stack options for best performance/cost trade-off

    • thick copper option for low loss Transmission Lines and High Q inductances

    • High Resistivity and Trap Rich SOI substrates

    Switch - continued RonCoff advancements over multiple generations

    LNA – NMOS NFmin vs Frequency (Si meas vs model)

    Vds=1.2V,Vgs=0.5-1V

    13

  • C65SOIFEM (65nm lithography, 300mm wafer)

    • High performance RF-SOI for 5G FEM:

    • 5G LNA + Switch Integration

    • Full copper back end

    • High Resistivity and Trap Rich SOI substrates

    Sub-6 GHz• 5GHz LNA ref. design

    silicon measurement:• >15dB Gain

    • < 1dB NF @ 5GHz

    LNA ref. design NF vs Frequency

    IDC=12.2mA, Vgs=0.48V, Vdd=1.2V, TR sub

    NMOS Ft vs VgsSi measurement vs model

    ST C65SOIFEM for 5G Sub-6GHz 14

  • • Innovative RF technologies (RF-SOI, FDSOI, BiCMOS) for 5G terminal and infrastructure

    • Multiple band support from 5G sub-6 GHz to mmWave

    • Flexible architecture partitioning, for best RF performance and silicon integration trade-off

    • Long term technology roadmap & continued strategic investments

    • High volume production & short cycle time

    • High capacity RF-SOI fabs (8’’ and 12’’) in France

    • Experienced supply chain handling billion units/year

    • Dedicated customer support

    • Technology, Design & DK support from fab experts & design specialists

    • Assembly, Packaging, Testing services

    ST Value as 5G RF Technology Partner 15

  • 16

    Thank you

    for your attention !

    STMicroelectronics - October 2019 - All rights reservedThe STMicroelectronics corporate logo is a registered trademark of the STMicroelectronics group of companies All other names are the property of their respective owners.