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CLEAN ROOM TECHNOLOGY
Justin Mathew
Applied Electronics and InstrumentationCollege Of Engineering, Trivandrum
April 28, 2015
Justin Mathew (CET) Clean Room Technology April 28, 2015 1 / 18
Overview
1 Cleanroom Technology Overview
2 Classification Of Cleanroom
3 Cleanroom for different Industries
4 How cleanroom is acheivedOnion Room DesignAir Flow RegulationUser Protocols
5 Common tools used in Cleanroom
6 Common tools used in a Micro Fabrication Facility
7 Examples Of Cleanroom Facilities
Justin Mathew (CET) Clean Room Technology April 28, 2015 2 / 18
Cleanroom Technology
A cleanroom is an artificially created environment with a very low level ofenvironmental pollutants such as dust, airborne microbes, aerosol particles,and chemical vapors.
The main purpose of a clean room is to
Provide clean environment for the manufacturing of substances thatare sensitive to environmental contamination.
Provide operational conditions that meets the process
Ensure safety in the cleansroom environment
A cleanroom is designed to reduce the contamination of process andmaterials by removing or reducing contamination sources.
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Classification of Cleanroom
ISO Classification Standard
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Cleanroom for different Industries
Class 1 : Integrated circuit manufacturers manufacturing submicrongeometries
Class 10 : Semiconductor manufacturers producing integratedcircuits with line widths below 2µm
Class 100 : Used with a bacteria-free or particulatefree environmentis required in the manufacture of aseptically produced injectablemedicines.
Class 1000 : Manufacture of high quality optical equipment.Assembly and testing of precision gyroscope
Class 10000 : Assembly of precision of hydraulic or pneumaticequipment, servo-control valves, precision timing devices, highgradegearing.
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How cleanroom is acheived
Several design procedures and user protocols allows to acheive cleanroomsthat can are suitable for semiconductor maufacturing process
Design stepsSeveral design methods of the facility help maintain the high degree ofclenlinessOnion Room Concept : The onion concept where the cleanest areasare inside which can be accessed only through successive cleaner areas.Air flow regulation : Air flow is designed to control the flow ofparticulates in the air of cleanroom
User ProtocolsUser protocols like dress code and other entry procedures ensuresminimal dust or contaminants enter the facilty through the personnel.
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Onion Room Design
In this design concept, the cleaner roomsare towards the inner portion and theuser and equipments are passed throughrelatively cleaner areas through differentcleaning procedures before accesing thecleaner work environment.
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Air Flow Regulation
Turbulant Air Flow
Turbulant airflow distributes anyresidual particles uniformly and
provides a dilution effect.
Laminar Air Flow
Laminar Air flow provides a pistoneffect pushing the contaminated air
down which then is removed.
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User Protocols
Dress Code
Gowning Procedure
Put on a new HAIR COVER.
Put on new BEARD/FACIALHAIR COVER if you have facialhair.
Put on non-powdered GLOVES.
Put on new BOOTIES ordedicated cleanroom shoes.
Put on a clean LAB COAT orCOVERALLS.
Justin Mathew (CET) Clean Room Technology April 28, 2015 9 / 18
Common tools used in Cleanroom
High Efficiency Particulate Air Filter (HEPA)Filter out particulates and bacteria in the incoming air.
Ultra Low Penetration Air (ULPA) filtersULPA is also used to filter out particulates, bacteria and viruses.
Pneumatic FilterUsed to remove particulates from compressed air stream
Air IonizerAir ionisers have been used to eliminate the occurrence ofAcinetobacter and reduce static electricity buildup in electronics.
Chemical Fume Extractor
Explosion Proof Vaccum cleaners
Static Control ProductsStatic control material like Ionization Equipment, ESD Wrist Straps,ESD Grounding Cords, ESD Labels and Signs,ESD Bags, ESDVacuum, ESD Chair, ESD Equipment Covers, ESD Test Equipment,ESD Heel Grounders, ESD Monitoring Systems
Justin Mathew (CET) Clean Room Technology April 28, 2015 10 / 18
Common tools used in a Micro Fabrication Facility
Deep Reactive Ion Etching tool
DRIE is a highly anisotropic etchprocess used to create steep-sidedholes and trenches in substrates,typically with high aspect ratios. It isused in advanced 3D wafer levelpackaging technology .
Deep Reactive Ion Etching tool
It is a way to produce a layer of oxideon the surface of a wafer. Modernoxidation systems can deal with1000-2000 wafers per hour.eg: Tempress anneal/oxidationsystem
Justin Mathew (CET) Clean Room Technology April 28, 2015 11 / 18
Common tools used in a Micro Fabrication Facility
E-beam Evaporation
In this process, a source material isheated above its boiling temperatureand evaporated to form a film on thesurface. Here the heating is done bysweeping the substrate with highdensity electron beam.
Gatestack Cluster Tool
It is used for the formation ofcomplete gatestack in 8 inch CMOSmanufacturing process.
Justin Mathew (CET) Clean Room Technology April 28, 2015 12 / 18
Common tools used in a Micro Fabrication Facility
Wafer Bonding
This bonding system can be used forall wafer bonding processes such asanodic, thermo compression andsilicon direct bonding
Thermal Oxidation Oven
It is used to grow thermal oxidationon wafer
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Examples of Cleanroom facilities
The Centre of Excellence in Nanoelectronics (CEN)Indian Institute of Technology Bombay
1000 sq. ft. of class 1000 cleanroom primarily for MEMS /Sensors related activity.
1000 sq. ft. of class 10,000clean room primarily formaterial/processcharacterization.
1000 sq. ft. of class 1000 cleanroom dedicated to advancedprocess tools.
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Examples of Cleanroom facilities
National NanoFabrication CentreIISc Banglore
Photolithography, Depositionand Etching
MEMS and IC Packaging facility
Wafer Dicing:SemiautomaticWafer dicing machine for Siliconand Glass wafers .
Wire Bonding:Semiautomaticwirebonder with Ball and Wedgebonding capability for Au, Aland Cu wires .
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Examples of Cleanroom facilities
Nano Fabrication FacilityIIT Delhi
IIT Delhi consists of a class 1000 clean room facility of 6000 sq.ft. area.The main features in the facility are:
Electron beam lithography
Nano-imprinting
Plasma deposition and plasma etching
Wafer bonding
Electronic circuits CAD tools
Scanning Electrochemical microscopy
Electrochemical Quartz crystal Microbalance
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Examples of Cleanroom Facilities
Clean Room FacilityIIT, Madras
It houses Class-100 and Class-1000 clean rooms. Major facilities providedare:
Double-sided lithography facility
LPCVD for polysilicon deposition
PECVD for dielectrics
e-beam metallization unit and RIE for dry etching
Wire and die bonder
Mask writer
DC/RF sputtering
Electron beam evaporation
DRIE-Bosch process
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Thank You...
Justin Mathew (CET) Clean Room Technology April 28, 2015 18 / 18
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