CLEAN ROOM TECHNOLOGY - mrbaiju.files.wordpress.com · 07/06/2015 · Overview 1 Cleanroom Technology Overview 2 Classi cation Of Cleanroom 3 Cleanroom for di erent Industries 4

CLEAN ROOM TECHNOLOGY

Justin Mathew

Applied Electronics and InstrumentationCollege Of Engineering, Trivandrum

April 28, 2015

Justin Mathew (CET) Clean Room Technology April 28, 2015 1 / 18

Overview

1 Cleanroom Technology Overview

2 Classification Of Cleanroom

3 Cleanroom for different Industries

4 How cleanroom is acheivedOnion Room DesignAir Flow RegulationUser Protocols

5 Common tools used in Cleanroom

6 Common tools used in a Micro Fabrication Facility

7 Examples Of Cleanroom Facilities


Cleanroom Technology

A cleanroom is an artificially created environment with a very low level ofenvironmental pollutants such as dust, airborne microbes, aerosol particles,and chemical vapors.

The main purpose of a clean room is to

Provide clean environment for the manufacturing of substances thatare sensitive to environmental contamination.

Provide operational conditions that meets the process

Ensure safety in the cleansroom environment

A cleanroom is designed to reduce the contamination of process andmaterials by removing or reducing contamination sources.


Classification of Cleanroom

ISO Classification Standard


Cleanroom for different Industries

Class 1 : Integrated circuit manufacturers manufacturing submicrongeometries

Class 10 : Semiconductor manufacturers producing integratedcircuits with line widths below 2µm

Class 100 : Used with a bacteria-free or particulatefree environmentis required in the manufacture of aseptically produced injectablemedicines.

Class 1000 : Manufacture of high quality optical equipment.Assembly and testing of precision gyroscope

Class 10000 : Assembly of precision of hydraulic or pneumaticequipment, servo-control valves, precision timing devices, highgradegearing.


How cleanroom is acheived

Several design procedures and user protocols allows to acheive cleanroomsthat can are suitable for semiconductor maufacturing process

Design stepsSeveral design methods of the facility help maintain the high degree ofclenlinessOnion Room Concept : The onion concept where the cleanest areasare inside which can be accessed only through successive cleaner areas.Air flow regulation : Air flow is designed to control the flow ofparticulates in the air of cleanroom

User ProtocolsUser protocols like dress code and other entry procedures ensuresminimal dust or contaminants enter the facilty through the personnel.


Onion Room Design

In this design concept, the cleaner roomsare towards the inner portion and theuser and equipments are passed throughrelatively cleaner areas through differentcleaning procedures before accesing thecleaner work environment.


Air Flow Regulation

Turbulant Air Flow

Turbulant airflow distributes anyresidual particles uniformly and

provides a dilution effect.

Laminar Air Flow

Laminar Air flow provides a pistoneffect pushing the contaminated air

down which then is removed.


User Protocols

Dress Code

Gowning Procedure

Put on a new HAIR COVER.

Put on new BEARD/FACIALHAIR COVER if you have facialhair.

Put on non-powdered GLOVES.

Put on new BOOTIES ordedicated cleanroom shoes.

Put on a clean LAB COAT orCOVERALLS.


Common tools used in Cleanroom

High Efficiency Particulate Air Filter (HEPA)Filter out particulates and bacteria in the incoming air.

Ultra Low Penetration Air (ULPA) filtersULPA is also used to filter out particulates, bacteria and viruses.

Pneumatic FilterUsed to remove particulates from compressed air stream

Air IonizerAir ionisers have been used to eliminate the occurrence ofAcinetobacter and reduce static electricity buildup in electronics.

Chemical Fume Extractor

Explosion Proof Vaccum cleaners

Static Control ProductsStatic control material like Ionization Equipment, ESD Wrist Straps,ESD Grounding Cords, ESD Labels and Signs,ESD Bags, ESDVacuum, ESD Chair, ESD Equipment Covers, ESD Test Equipment,ESD Heel Grounders, ESD Monitoring Systems


Common tools used in a Micro Fabrication Facility

Deep Reactive Ion Etching tool

DRIE is a highly anisotropic etchprocess used to create steep-sidedholes and trenches in substrates,typically with high aspect ratios. It isused in advanced 3D wafer levelpackaging technology .

Deep Reactive Ion Etching tool

It is a way to produce a layer of oxideon the surface of a wafer. Modernoxidation systems can deal with1000-2000 wafers per hour.eg: Tempress anneal/oxidationsystem



E-beam Evaporation

In this process, a source material isheated above its boiling temperatureand evaporated to form a film on thesurface. Here the heating is done bysweeping the substrate with highdensity electron beam.

Gatestack Cluster Tool

It is used for the formation ofcomplete gatestack in 8 inch CMOSmanufacturing process.



Wafer Bonding

This bonding system can be used forall wafer bonding processes such asanodic, thermo compression andsilicon direct bonding

Thermal Oxidation Oven

It is used to grow thermal oxidationon wafer


Examples of Cleanroom facilities

The Centre of Excellence in Nanoelectronics (CEN)Indian Institute of Technology Bombay

1000 sq. ft. of class 1000 cleanroom primarily for MEMS /Sensors related activity.

1000 sq. ft. of class 10,000clean room primarily formaterial/processcharacterization.

1000 sq. ft. of class 1000 cleanroom dedicated to advancedprocess tools.



National NanoFabrication CentreIISc Banglore

Photolithography, Depositionand Etching

MEMS and IC Packaging facility

Wafer Dicing:SemiautomaticWafer dicing machine for Siliconand Glass wafers .

Wire Bonding:Semiautomaticwirebonder with Ball and Wedgebonding capability for Au, Aland Cu wires .



Nano Fabrication FacilityIIT Delhi

IIT Delhi consists of a class 1000 clean room facility of 6000 sq.ft. area.The main features in the facility are:

Electron beam lithography

Nano-imprinting

Plasma deposition and plasma etching

Wafer bonding

Electronic circuits CAD tools

Scanning Electrochemical microscopy

Electrochemical Quartz crystal Microbalance


Examples of Cleanroom Facilities

Clean Room FacilityIIT, Madras

It houses Class-100 and Class-1000 clean rooms. Major facilities providedare:

Double-sided lithography facility

LPCVD for polysilicon deposition

PECVD for dielectrics

e-beam metallization unit and RIE for dry etching

Wire and die bonder

Mask writer

DC/RF sputtering

Electron beam evaporation

DRIE-Bosch process


Thank You...


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CLEAN ROOM TECHNOLOGY - mrbaiju.files.wordpress.com · 07/06/2015 · Overview 1 Cleanroom Technology Overview 2 Classi cation Of Cleanroom 3 Cleanroom for di erent Industries 4