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1
Advances in Micro and Nano Manufacturing: Challenges and Opportunities in technology convergence based solutions
Stefan Dimov
Department of Mechanical Engineering
School of Engineering
2
Advanced Manufacturing (Cross-cutting KET)
4M2020 Scope & Focus
Process Chains & Value Chains For Specific Application Areas
Replication
Process Modelling & SimulationTech
nolo
gic
al Rese
arc
h Micro/Nano Structuring
Application/Product Development
Health
Bio
medic
al
Photo
nic
s
ICT
Energ
y
Thin Film Deposition
Inspection
COTECH
MULTILAYER
EUMINAfab
IMPRESS
4M NoE
POLARIC
Cro
ss-f
ert
ilis
ati
on
of
KE
Ts:
Ad
va
nce
d M
ate
ria
ls,
Na
no
tech
no
log
y,
Ph
oto
nic
s,
Mic
ro-/
Na
no
ele
ctr
on
ics
3What do we „know“ about new emerging products?
Emerging/Future products
✓ will require function (length scale) integration
✓ will be thin and flexible
✓ will consume less energy
✓ will benefit from tailor-made surface properties
✓ will integrate new functional materials
✓ will consist of a mix of different materials in an either hybrid or monolithic manner
✓ will be made extensively from non-IC materials
Customised health monitoring
In-line metrology
Sensors for environment monitoring
Micro sensors integrated in machine tools
µ-connectors
Micro-parts for wearable devices
http://www.4mexpertise.eu/4m2020-library/high-priority-products
4Talk outlines
Technology convergence: Trends, Challenges and Opportunities
FP7 NMP programme in technology convergence
UoB Micro & Nano Manufacturing Programmes: Latest Findings & Trends
Conclusions
5Trends: Technology Convergence
Nanoscience and nanotechnologies,
The Royal Society & The Royal Academy of Engineering (www.nanotec.org.uk)
6Trends: Technology Convergence
Nanoscience and nanotechnologies,
The Royal Society & The Royal Academy of Engineering (www.nanotec.org.uk)
Top down/bottom up “synthesis” (synergistic
effects) through a convergence of technologies for
machining/structuring and material
refinement/deposition
Processing of complementary materials to
silicon, e.g. nanophase metallic materials produced
through refinement or deposition
Applications underpinned by multi-material micro and
nano manufacture
7
Processing units [μm]
> 10
Multi-grain size (mechanical) processing (>10 μm)➢ grain void range 10-5 – 10-3 [m]➢ specific processing energy 101 - 102 [J cm-3]➢ mechanical processing – brittle cracking/plastic deformation
0.1
Sub-grain size (mechanical) processing (0.1-10 μm)➢ dislocation micro-crack range 10-7 – 10-5 [m]➢ specific processing energy 102 - 103 [J cm-3]➢ mechanical processing – microcracking/dislocation slip
0.001
Atom cluster processing (1-100 nm)➢ point defect range 10-9 – 10-7 [m]➢ specific processing energy 103 - 104 [J cm-3]➢ grinding, lapping and polishing
0.00001
Atomic/molecular-bit processing (0.01-1 nm)➢ atomic lattice range 10-11 - 10-9 [m]➢ specific processing energy 104 - 106 [J cm-3]➢ melting, dissolution, diffusion, evaporation, sputtering
Technology Convergence: “Top down” Challenges & Opportunities
8
Processing units [μm]
> 10
Multi-grain size (mechanical) processing (>10 μm)➢ grain void range 10-5 – 10-3 [m]➢ specific processing energy 101 - 102 [J cm-3]➢ mechanical processing – brittle cracking/plastic deformation
0.1
Sub-grain size (mechanical) processing (0.1-10 μm)➢ dislocation micro-crack range 10-7 – 10-5 [m]➢ specific processing energy 102 - 103 [J cm-3]➢ mechanical processing – microcracking/dislocation slip
0.001
Atom cluster processing (1-100 nm)➢ point defect range 10-9 – 10-7 [m]➢ specific processing energy 103 - 104 [J cm-3]➢ grinding, lapping and polishing
0.00001
Atomic/molecular-bit processing (0.01-1 nm)➢ atomic lattice range 10-11 - 10-9 [m]➢ specific processing energy 104 - 106 [J cm-3]➢ melting, dissolution, diffusion, evaporation, sputtering
Each process has its own cost effective processing window
that is determined by its material removal mechanism
(specific processing energy <> material microstructure)
A “toolbox” of processes is required to achieve a length scale
integration in new products (integration of technologies in
innovative processing chains)
Technology Convergence: “Top down” Challenges & Opportunities
9Technology Convergence: “Top down” Challenges
Length scale integration –
fabrication of structures with meso
(<10 mm), micro (<100 μm) and
nano (<100 nm) functional
features;
Tolerances in the range of 1 to
10% of the nominal dimensions (in
precision machining < 0.01%)
Surface roughness required in the
range of 10 to 50 nm that could be
smaller than the grain size of the
material
Nanotechnology
Norio Taniguchi (1974)
10Technology Convergence: “Top down” Challenges
Length scale integration –
fabrication of structures with meso
(<10 mm), micro (<100 μm) and
nano (<100 nm) functional
features;
Tolerances in the range of 0.1 to
10% of the nominal dimensions (in
precision engineering < 0.01%)
Surface roughness required in the
range of 10 to 50 nm that is
smaller than the grain size of the
material
Nanotechnology
Norio Taniguchi (1974)
Managing uncertainties in micro/nano scale
manufacturing
New standards and tolerancing methods to
address the scaling issues
Material microstructure becomes an important
process design parameter
11
Technology Convergence: “Bottom up” Opportunities
Latest development in nano to macro deposition processes, e.g. laser-additive manufacturing and PVD and PECVD (grains down to 5-20 nm)
Significant advances in dislocation-based processes, e.g. SPD: FSP (surface) and ECAP (bulk) for producing UFG (100-500 nm) in metals
Advances in microstructure change processes, especiallytechnologies for producing BMG (e.g. laser processing and vitrification processes), electrolytic processes (ECD) for monolithic bulk metal nanostructures & rapid solidification processing (RSP)
Advances in nanopowders (micro particles with nanocristalinestructure), especially producing nanophase workpieces through sintering and powder extrusion/forging
Hybrid solutions, e.g. explosive welding technology for create bimetallic sandwichs of amorphous foils and Fe-based alloys substrates.
12
IM, HE, Imprinting
Vol. EDM & ECM, IM, Coining, Forging,…
XY
Z
3D Channel (Volume)
IM & NIL
XY
1D Channel
Milling, SLS, Turning, SLA, FDM
Milling, µs&ns LA&F, wEDM Turning, EDM & ECM milling, SLS,
ps & fs LA, FIB, e-beam
Milling, Turning, SLS
Electroplating, Electroforming
XY
Z
3D Channel (Surface)
PVD & CVD
Meta
lsPoly
mers
Cera
mic
sAN
Y
Bending
Scr. Printing, Tape Casting
Array of 1D Channels
X
Printing
Blanking, Punching
PMLP, Etching, Exc. LA
Photolithogr. SLA
XY
2D Channel
Photolithogr., SLA
1
PMLPtemplate
2
UV Imprint4’’ wafer
3
PVDsputtering
4
EL. FORMINGinsert
5
IMPRINTINGparts
Technology Convergence: Integration Challenges & Opportunities
13
IM, HE, Imprinting
Vol. EDM & ECM, IM, Coining, Forging,…
XY
Z
3D Channel (Volume)
IM & NIL
XY
1D Channel
Milling, SLS, Turning, SLA, FDM
Milling, µs&ns LA&F, wEDM Turning, EDM & ECM milling, SLS,
ps & fs LA, FIB, e-beam
Milling, Turning, SLS
Electroplating, Electroforming
XY
Z
3D Channel (Surface)
PVD & CVD
Meta
lsPoly
mers
Cera
mic
sAN
Y
Bending
Scr. Printing, Tape Casting
Array of 1D Channels
X
Printing
Blanking, Punching
PMLP, Etching, Exc. LA
Photolithogr. SLA
XY
2D Channel
Photolithogr., SLA
1
PMLPtemplate
2
UV Imprint4’’ wafer
3
PVDsputtering
4
EL. FORMINGinsert
5
IMPRINTINGparts
Technology Convergence: Integration Challenges
The depth of our knowledge in 4M component
technologies varies and concerted actions are required to
integrate them;
The technology and application breakthroughs can come
only from the development of novel integrated proceeding
chains;
14
CMM Levels:
1 - Initial
2 - Repeatable
3 - Defined
4 - Managed
5 - Optimised
0
1
2
3
4
5Quality & Accuracy
Part size and complexity
Material
Efficiency
Processing
Fixturing & set-up
X-Ray Lith.
Electroforming
Process Pair
0 20 40 60 80 100
Maturity level Process1: X-Ray
Maturity Level Process2:
Electroforming
Maturity Level-Pair
Initial Repeatable Defined Managed Optimised
Process Pair:
XRay -
Electroforming
%
• Very well characterised pair. The
capability maturity hexagons are
symmetrical and similar in shape
for both processes.
• The pair is suitable for utilization
in a process chain (LIGA)
• ‘Fixturing and set-up’ are more
compatible than complementary.
Maturity assessment of processes and process pairs
Technology Convergence: Integration Challenges
Vella P., Dimov S., Minev R., Brousseau E. (2016) Technology Maturity Assessment of Micro and Nano Manufacturing Processes and Process Chains, IMechB Part B (in-press)
154M2020 R&D Agenda: Challenges & Opportunities
Electro Discharge Machining
Laser Ablation
Micro-milling
…
Ion Beam MachiningRD
2 :
Mic
ro/N
an
o S
tru
ctu
ring
Te
ch
no
log
ies
RD 4: Integrated
Processing Chains for
Specific Applications
RD 1: Material Refinement &
Deposition Technologies
PVD ECAP BMG …
Processing Chain A
(1st level)
Processing Chain B
(1st level)
RD 3: Modelling of process-material interactions
RD 5: Uncertainties of Integrated Process Chains
Process Chain A-B
(2nd level)
164M2020 R&D Agenda: Challenges & Opportunities
Electro Discharge Machining
Laser Ablation
…
Ion Beam MachiningRD
2 :
Mic
ro/N
an
o S
tru
ctu
ring
Te
ch
no
log
ies
RD 4: Integrated
Processing Chains for
Specific Applications
RD 1: Material Refinement &
Deposition Technologies
PVD ECAP BMG …
RD 3: Modelling of process-material interactions
RD 5: Uncertainties of Integrated Process Chains
Synergistic
Effects: Micro-
Milling & ECAP
Micro-milling
17
Levels 1 ∩ 2
1st Level: process parameters
2nd Level: Machining strategies
Optimisation potential
Synerg
istic
Effect
sProcess-Material interactions: Optimisations’ Options
18μMilling Strategies: Optimisation issues
Objectives:
To study factors influencing the
resultant surface quality during micro
milling
To verify experimentally the effect of
different machining strategies on
surface quality
Tool Path Generation
Resulting Surface Finish in Copper
Micro-Milling
Varying Machining Strategies & Keeping the Same Process Parameters
Micro-Structure
Dimov S, Pham D T, Ivanov A, Popov K, Fansen K (2004)
Micro-milling strategies: optimization issues, Proc. IMechE,
Part B, Vol 218, 731-736
Results: strategy type - surface finish (Ra)
Type 1.2, 3 0.44 µm
Type One Direction 0.23 µm
Type Spiral 0.28 µm
Type 1 Connect 0.17 µm
Spiral Maintain Cut Direction 0.14 µm
Spiral Maintain Cut Type 0.21 µm
Follow Hardwalls 0.13 µm
Constant load 0.13 µm
19Micro-milling of thin features (ribs & webs)
Objectives:
To study the main factors affecting the machining of thin ribs and webs.
To propose new machining strategies for micro-milling of thin ribs and webs.
Conclusions:
1. Machining from leastsupported to best supportedthin features in a component.
2. Machining with cutters without corner radius.
3. Removing the bulk of material layer by layer and then the resulting steps with ball-nose cutters at low speed.
1 “Standard”
Heidenhain
cycles
2 A layer-
based
strategy
3 Two stage
strategyDimov SS, Pham DT, A. Ivanov A, Popov K (2006)
Micro milling strategies for machining thin features,
Proc. IMechE, Part C, Vol 220(11), 1677-1783
20
Levels 1 ∩ 2 ∩ 3
Levels 1 ∩ 2
1st Level: process parameters
2nd Level: Machining strategies
3rd Level: Material refinement/deposition
Optimisation potential
Synerg
istic
Effect
sProcess-Material interactions: Optimisations’ Options
21Material Microstructure Effects in μMilling
3 Ultra Fine Grained (UFG) Al 5083 resulting from four Equal Channel Angular Pressing (ECAP) passes - grains of ~ 150-200 nm
Are
aRaAR (μm) RaCP (μm) RaUFG (μm)
A B A B A B
1 0.49 0.45 0.30 0.39 0.09 0.10
2 0.64 0.62 0.26 0.60 0.12 0.16
3 0.47 0.51 0.46 0.56 0.16 0.18
4 0.33 0.49 0.45 0.47 0.15 0.17
AV 0.48 0.52 0.37 0.51 0.13 0.15
Experimental Set-up
1 “As Received” (AR) AI 5083 - grains of ~ 200 μm
2 Conventionally Processed (CP) Al 5083 -grains of ~ 450-600 nm
200 nm
ResultsArea 1
Area 2
Area 3
Area 4
Popov K, Dimov S, Pham DT, Minev R, Rosochowski A, OlejunikI (2006) Micro-milling: Material Microsturucture Effects, Proc. IMechE, Part B, Vol 220 1807-1813
22Modelling Surface Generation Process in Micro-milling
Microstructure mapping for multi-phase materials
1. Micrograph of the
AISI1040 sample
2. Grey-scale
picture
3. Binary picture
4. Grain boundaries’
picture
AM Elkaseer, SS Dimov, KB Popov, M Negm, R Minev (2012) Modeling the Material Microstructure Effects on the Surface Generation Process in Microendmilling of Dual-Phase Materials, ASME J. of Manufacturing Science and Engineering, 134, 4, 044501 (10 pages)
234M2020 R&D Agenda: Challenges & Opportunities
Micro-milling
Electro Discharge Machining
…
Ion Beam MachiningRD
2 :
Mic
ro/N
an
o S
tru
ctu
ring
Te
ch
no
log
ies
RD 4: Integrated
Processing Chains for
Specific Applications
RD 1: Material Refinement &
Deposition Technologies
PVD ECAP BMG …
RD 3: Modelling of process-material interactions
RD 5: Uncertainties of Integrated Process Chains
Laser Ablation
Synergistic
Effects: Laser
Ablation & BMGs
24BMGs: Ultimate Material for Length-Scale Integration
Material Mechanical Properties
Tg (o
C) Tm (o
C) σy (Mpa) Hv ρ (g/cc) TSPF (o
C)
Vit 1B 350 659 1900 540 6.04 420 - 460
Steel 1200 - 1500 900 341 7.80
25Micromachining response of amorphous and crystalline Ni-based alloys
Findings:
Laser processing both with short and long pulses is a promising technique for micromachining amorphous Ni-based alloys because does not lead to material crystallisation.
There was no signs of crack formation in amorphous Ni-based alloys and thus a higher surface integrity can be achieved after after µs laser machining.
The µs and ps laser machining of micro-scale features and micro-structures in metallic glasses is possible while preserving the attractive mechanical properties of metallic glasses.
SEM images of trenches produced in amorphous, (a) and (b), and polycrystalline, (c), Ni78B14Si8; (d) a cross-sectional FIB image of the crater produced by a single µs pulse.
Quintana I., Dobrev T., Aranzabe A., Lalev G., Dimov S. (2009)
Investigation of amorphous and crystalline Ni alloys response to machining with micro-second and pico-second lasers, Applied Surface Science, Volume 255, Issues 13-14, Pages 6641-6646
SEM image of the FIB milled trench in an amorphous Ni78B14Si8 that starts at the hole side wall and continues through its surrounding area
26Injection Moulded Different Scales Q-codes
H1= 13.92µm
H1= 503.8 nm
Zr-based BMG Replication Master
ps
Lase
r FIB
mill
ing
Topas COC Replicas
Two Q-codes:
- Micro pixels: 75x75x10 [µm]
- “Nano” pixels: 2.6x2.6x0.9 [µm]
P. Vella, S. Dimov, E. Brousseau, B. Whiteside (2015)
A new process chain for producing bulk metallic glass replicationmasters with micro- and nano-scale features, Int J Adv Manuf Technol, Vol. 76, Pages 523–543
27
Integration of Complementary Technologies in Production Line:
1) Case Study 1: Integration of 3D printing & Laser Processing for producing miniaturise housing enclosures (HYPROLINE)
2) Case Study 2: Integration of Mechanical Machining & Laser Structuring for Producing THz Devices(HINMICO)
Technology Convergence: Integration Challenges & Opportunities
28Integration of laser processing module with 3D printing
29
Case Study 2: Integration of Mechanical Machining & Laser Structuring for Producing
THz Devices(HINMICO)
Penchev P., Shang X., Dimov S. and Lancaster M. (2016) Novel manufacturing route for scale up production of THz technology devices, ASME J. of Micro and Nano-Manufacturing, Vol.4, 021002-1
30Motivation: Emerging Applications for THz Devices
• “Transition Region” between Electronics and Photonicswavelength ~ 1mm-0.1mm (0.3THz ≤ f ≤ 3THz)
• Technology driven by promising applications as follows
Imaging Communications Gas-sensing Astronomy
Serial production of passive signal processing components (e.g. THz filters)
31Two-side Laser Machining of THz components
Key attributes:
• Modular workpiece holding
devices
• Automated workpiece
alignment routines
• Automated strategy for
multi-axis LMM employing
rotary stages
• Generic tool to counteract
the dynamics effect of
optical beam deflector
systems
32Two-side Laser Machining of THz components
CAD model of THz waveguide filter Laser machined THz waveguide filter
Measurement results of the WR-3 filter
• insertion loss is around 4.5 dB
• centre frequency shifts upwards by around 3 GHz (1%)
34
Action ID
Action Title TRL
Expected Type
VC5-S-001
Integration of novel multi-materials into modular, automated and reconfigurable production lines
5-6 IA
VC5-M-002
Integration of nano particles and aggregates into new and precise micro- and macro-engineering tooling and processes
4-5 RIA
VC5-S-003
Multi-materials, multi-scale and 3D-shape closed-loop control strategies for micro- and nano- manufacturing
3-4 RIA
VC5-M-004
In-line control & inspection solutions of novel materials for modular, updatable, reconfigurable and disassemblable products
3-4 RIA
VC5-L-005
Multiscale and multiphysics modelling solutions for novel material systems and products performance & robustness
3-4 RIA
VC5-S-006
Modular, updatable and reconfigurable manufacturing solutions for micro/nano-enabled miniaturized products
3-4 RIA
VC5-S-007
Pilot line for standardized manufacturing of hybrid and structured materials with customized properties
7-8 IA
VC5-M-008
Pilot line for 3D-manufacturing, process, analytical and material interface control and modelling of products integrating hybrid and structured materials
6-7 IA
4M2020 Roadmap: Informing FoF 2018-2020 WP
www.4m2020.eu
35Technology Convergence: Generic Conclusions
There is no one technology that will prevail - the “breakthroughs” if any will come from an innovative integration of complementary technologies and their implementation in new manufacturing platforms.
A “tool box” of technologies exists to support the move from designing 4M2020-based products for specific materials and processes to designing processes/process chains to satisfy specific functional and technical requirements of new emerging multi-material products.
Technology conversion enabled solutions exist for bridging the “gap” between “mechanical” ultra-precision engineering and “MEMS/IC based” technologies.
36Acknowledgements
Companies:
High performance Production line for Small Series Metal Parts (Sep ‘12 – Aug ‘15)
Laser Machining of Ceramic Interface Cards for 3D wafer bumps (Nov ‘15 – Sep ‘18)
High throughput integrated technologies for multimaterialfunctional micro components (Sep ‘13 – Aug ‘16)
Advanced Manufacturing of Multi-Material Multi-Functional Products towards 2020 and Beyond (Sep ‘13 – Aug ‘16)
European ESRs Network on SPL Micro\Nano Structuring for Improved Functional Applications (Sep ’15 – Aug ’19)
Modular Laser-based Additive Manufacturing Platform for large scale industrial application (Oct ‘16 – Sep ‘19)
ECO-efficient LASER technology for FACTories of the future (May 2012 - Apr 2015)
High-Impact Injection Moulding Platform for mass-production of 3D and/or large micro-structured surfaces (Oct ‘17 – Sep ‘20)
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