TechnoConfluence TC-iHT-1200-250

TechnoConfluence Intelligent Engineering Solutions Pvt. Ltd.

Key Features:

• In-situ Material/Mechanical Characterization at High temperature up to 1600o C• Non-contact Differential measurement• Accurate measurement of complex profiles of components, subsystems, etc.• Different levels of resolution (30nm to 10mm) and sampling rates (few Hz to 20 kHz)• Flexibility in material type (metals, glasses and ceramics)• Open architecture to accommodate novel test and characterization requirements• Access to raw data in addition to test specific post-processing as per ASTM standards• Controlled test environment (Oxidizing, Reducing, Inert, controlled humidity, etc.)• User defined temperature protocols• Option for visualization of specimen during test• Option for implementation of automated test procedures• Option for configuration as an online quality control (QC) tool• Customization and Adaptation available for novel test procedures

TC-iHT-1200-250 (In-situ High Temperature Characterization System)

3 High Temperature Vibrometry

i. Impulse Test (natural frequencies and mode shapes)ii. Forced Excitation/vibration test

Challenges: In a typical forced excitation test, most of the actuators and accelerometers cannot be used at tem-peratures above few hundred degrees (>200o C) and sample excitation and associated frequency measurements at high temperatures pose significant challenges. Even an impulse (ping) test requires frequency measurements using accelerometers or other sensors limiting the applicability of tests to few hundred degrees.

Our Solution: Our unique differential displacement measurement captures entire profile thereby provid-ing complete information of frequencies and mode shapes. For very accurate resonant frequency measure-ments, a specialized forced excitation test is also available as add-on in our vibrometry test suite.

4 High Temperature 3-D Profile Measurement

Challenges: Typical profile measurements on parts at room temperature may not be valid at high tem-peratures (>1000oC) where profile changes occur due to process related residual stresses, density gradients across thickness or incomplete processing of parts etc. At high temperature, there is always a possibility of shift in the reference against which profile is measured leading to significant errors using conventional measurement techniques. Our Solution: Our in-situ measurement technique captures specimen/part profiles at high temperatures and under varied operating conditions (like oxidizing, reducing, humid etc) to measure profile changes in real time thus enabling accurate control of process parameters. Options are available for 3-D scan/simultaneous capture of highly featured surfaces and real-time curvature measurements up to 1600oC.

1 High Temperature Mechanical Characterization

i. Tensile and Compression Test (Including Creep Test)ii. Three and Four Point Bend Test (Including Creep Test)iii. Fracture Toughness Measurement

Challenges: High temperature (>1000oC) material/mechanical characterization of ceramics, metals and alloys subjected to large deformations place challenging requirements on measurement systems. Accu-rate measurement of time and/or load dependent deformed profile/curvature of entire sample (e.g. during creep test) is essential to obtain complete information to characterize the material.

Our Solution: A novel “non-contact” 2-D/3-D differential profile measurement technique overcomes limi-tations of point based techniques (strain gauges, LVDTs etc.) by capturing entire deformed profile in-situ. This proprietary technique enables measurement of entire sample profile (deformation) including support displacements at any given instant in time, up to testing temperatures of 1600o C in-situ, thereby eliminating errors related to boundary conditions (support/reference shift).

2 Viscoelastic Characterization using ‘One Sided Thickness and Gap

Challenges: Characterization of glasses near their glass transition (Tg) and metals near their melting point require accurate measurements of deformed sample shapes and time lag with respect to loading profile.

Our Solution: Capability of one-sided differential thickness/gap measurements enables characterization of glasses above their glass transition (Tg) by placing samples between transparent plates. Time history of change in thickness (deformation) with respect to applied load profile is captured accurately. In addition to thickness change, lateral deformation time history provides complete information about the viscoelastic behavior of the material.

Three Point Bend Test - Deformed profile along with support

One Sided Thickness and Gap Measurement

Measurement Capability’

Measured Vibration Spectrum and Mode Shapes

3-D Profile Change captured at 1200oC


Specifications

Thermal/Environmental Chamber

• Temperature Range: RT-1200oC (optional extended range: below RT-1600oC)• Heating/Cooling rate: upto 10oC/min (higher rate optional)• Uniformity of temperature over the sample under test: better than 2oC• Chamber Temperature Accuracy: ±3oC• Number of ramp and soak segments: 16 (Higher numbers are available as option)

Load Controlled Test

• Maximum load : 200N*• Load resolution: 0.1N*• Frequency Range: Static to 2kHz

Displacement Controlled Test

• Maximum displacement: 28mm**• Displacement Resolution: 30nm**• Frequency Range: Static to 2kHz

Profile Measurement Sensor

• Max Measurement range: 28mm• Best Resolution: 30nm• Sampling rate: upto 70kHz• Scanning resolution: 100nm***• Simultaneous Profile capture: Yes (Optional)

Control Computer with extended display and Software available as standard feature

* better load resolution is available for smaller load range** depends on the profile measurement sensor range*** better scanning resolution is available for shorter scanning range.


World Trade Center, 22nd floor, Unit No. N 2201A, Brigade Gateway Campus, Malleswaram West, Bangalore – 560 055, INDIA.

Phone: +91 80 6793 5687 | Fax: +91 80 6793 5301E-mail: [email protected], [email protected] Web: www.technoconfluence.com

ABOUT US

TechnoConfluence is a multidisciplinary technology company having a strong group of

more than 150 finest subject matter experts from academic, industry and R&D

organizations, encompassing all Engineering/Technology disciplines, with a mission to

transform technologically challenging problems into game changing solutions.