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From Technologies to Market
Gas Sensors, Detection of Particles, 3D
Images…: What are the Next
opportunities in MEMS?
© 2016© 2016
2©2016 | www.yole.fr | About Yole Développement
MEMS &
Sensors
Displays
Compound
Semi – LED
& OLEDs
Imaging Photonics
MedTech
Manufacturing
Advanced Packaging
Batteries / Energy
Management
Power
Electronics
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
3
A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
M&A operations
Due diligences
www.yolefinance.com
Innovation and business maker
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
Status of the Memsindustry
©2016 | www.yole.fr | Semicon West - MEMS Presentation
5
MEMS, A « TRANSFER FUNCTION » TECHNOLOGY
MEMS is a semiconductor technology thus enabling miniaturization and lower cost manufacturing of existing products
©2016 | www.yole.fr | Semicon West - MEMS Presentation
Galvanometric
mirror
Pressure sensor
Hg tilt sensor
Microphone
Gas sensor
Syringe
Micro-mirror
VCM
MEMS gas sensor
Micro needles
WL auto focus
Microphone
IMU
Pressure/environment
sensor
2016, gas sensors as the
next MEMS success (?)
6
MEMS MARKET ENTRY: PRODUCTS RELEASES EXAMPLES
Automotive is the historical MEMS high volume market
Transition started in 2003 towards consumer products…
©2016 | www.yole.fr | Semicon West - MEMS Presentation
1976 1988 1992 1994 1998 2003 2005 2007 2008 2009 2012 2014
PressureCar engine
control
AccelerosAir Bag
1982
PressureMAP
PressureBlood
Micromirrors
DLP
GyrosVehicle Stability
Microphones
Feature phone
Acceleros
Gaming - Wii
Acceleros &
Gyros
Smartphone
Magnetos
Smartphone
HumiditySmartphone
OpticalDisplay (IMOD) –
e-reader, watches
RF Antenna TunerSmartphone
RF FiltersFeature phone
2015
MicromirrorsLaptop/Tablets
7
HOW DO WE PERCEIVE THE EXTERNAL WORLD?
Audio is the next innovation.
©2016 | www.yole.fr | Semicon West - MEMS Presentation
A psychological survey in 1994 by Hatwell
(Hatwell, Y. (1994). Traité de psychologie
expérimentale. Paris, P.U.F.) showed that 83% of
our external world perception is through our
vision. Thus a high quality image is highly valued by the
user – today Smartphone bill of materials is $10
for the camera module.
The next senses we use are Audio and Smell. Thus,
we believe next innovation in MEMS & Sensors
will be for microphones.
Gas sensors could be the next one to be valued
for consumer applications.
8
THE 5 SENSES AND MANY MORE: MEMS, SENSORS
MEMS & sensors are mimicking humans senses
Smell
Taste
Sight
Touch
MicrobolometersGas sensors & electronic
noses
Force, haptic & touch
sensors
Humidity sensors
CMOS Image
sensor
Audio
Microphones Ultrasonic
©2016 | www.yole.fr | Semicon West - MEMS Presentation
9
Actuators & more sensors give increased perception & functionalities.
Smell
Taste
Sight
Touch
Microbolometers Micromirrors
Pressure
Gas sensors & electronic
noses
Pressure sensors
Force, haptic & touch
sensors
Humidity sensors
Body balance
Inertial systems
RF communicationOscillators, tuners, switches & filters
SpeechMicrospeakers
CMOS Image
sensor
Focus
RF communication
Autofocus
Fluids
Biochips Micropumps
Audio
Microphones Ultrasonic
THE 5 SENSES AND MANY MORE: MEMS, SENSORS & ACTUATORS
©2016 | www.yole.fr | Semicon West - MEMS Presentation
10
MEMS & SENSORS ROADMAP
From More than Moore towards Beyond Law
MEMS & Sensors enable key functionalities.
Current battleground of the industry
1980 2010 2020
Industry competition
Moore
Industry competition
More than MooreIndustry Competition
Beyond Moore
LaptopPersonal Computers
Smartphones
Autonomous
vehicles
Robotic
Servants
Quantified
self
Drones
Acceleration
SensingInteraction age
ProcessingInformation age
ActuatingEnhancement age
Tablets
Smart
homes
2040
Telekinesis
©2016 | www.yole.fr | Semicon West - MEMS Presentation
11
ACTUATORSSENSORS
THE DIFFERENT MEMS, SENSORS & ACTUATORS & WHERE THEY CAN COMBINE
Pressure Sound
(microphone)
Environment Optical sensors
Dru
g d
elivery
Microfluidics
Ink j
et
head
s
Au
to-F
ocu
s
Mic
rom
irro
rs
RF
µspeakers
Optical MEMS Micro structures
Part
icle
s
Hu
mid
ity
Movement
Gas
Magn
eto
mete
rs
IMUs (6 to 9 DOF)
Accele
rom
ete
rs
Gyro
sco
pes
Tem
pera
ture
Op
tical b
en
ch
es
Mic
ro t
ips
Pro
bes
Watc
hes
co
mp
on
en
ts
PIR
& t
herm
op
iles
Mic
ro b
olo
mete
rs
Sw
itch
Filte
r
Bosch BME680
FLIR Lepton One
Infineon microphoneST pressure sensorInvenSense
MPU9250
Debiotech micro
pump
Texas Instruments DLP
Avago-Broadcom
FBAR Filter
Spiromax Patek
Philippe
Audio
Pixels
MEMS
based
speaker
Reso
nato
r
Bio
ch
ips
poLight AF
SiTime oscillator
Am
bie
nt
ligh
t se
nso
r
Fin
gerp
rin
t
Vis
ion
Optical combos“open” package
environmental combos
“closed” package
6 to 11 DOF
combos
Possible integration with environment
combos
Possible
integration with
opto combos
©2016 | www.yole.fr | Semicon West - MEMS Presentation
MEMS & Sensors
©2016 | www.yole.fr | Semicon West - MEMS Presentation
13
MEMS & SENSORS TRANSITIONING TOWARDS 3 MAIN HUBS…
©2016 | www.yole.fr | Semicon West - MEMS Presentation
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
INERTIAL
DOF6
9IMU
ENVIRONMENTAL
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
OPTICAL
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambient
14
MEMS & SENSORS: THE INERTIAL HUB
©2016 | www.yole.fr | Semicon West - MEMS Presentation
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
DOF6
9IMU
ENVIRONMENTAL
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
OPTICAL
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambient
Complete integration has been
achieved at sensor level
Strong miniaturization race
Still some developments on
power consumption, advanced
packaging
Major developments at Software
level to achieve sensor fusion
Accurate data acquisition
Precise tracking within the
environment
15
MEMS & SENSORS: THE INERTIAL HUB
©2016 | www.yole.fr | Semicon West - MEMS Presentation
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
DOF6
9IMU
ENVIRONMENTAL
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
OPTICAL
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambient
Complete integration has been
achieved at sensor level
Strong miniaturization race
Still some developments on
power consumption, advanced
packaging
Major developments at Software
level to achieve sensor fusion
Accurate data acquisition
Precise tracking within the
environment
Inertial
Bill Of Materials
$1
16
INERTIAL MEMS PACKAGE
Typical package footprint for inertial sensors used in mobile systems
After decreasing die size, improvements are now focused on packaging issues and use of through silicon vias(TSVs) for instance
©2016 | www.yole.fr | Semicon West - MEMS Presentation
17
MEMS & SENSORS: THE OPTICAL HUB
©2016 | www.yole.fr | Semicon West - MEMS Presentation
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
INERTIAL
DOF6
9IMU
ENVIRONMENTAL
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambient
An ever growing market
Imaging is highly valued
The imaging industry stopped
the low cost/high integration
model by increasing the pixel
size and thus the die size
18
MEMS & SENSORS: THE OPTICAL HUB
©2016 | www.yole.fr | Semicon West - MEMS Presentation
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
INERTIAL
DOF6
9IMU
ENVIRONMENTAL
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambient
An ever growing market
Imaging is highly valued
The imaging industry stopped
the low cost/high integration
model by increasing the pixel
size and thus the die size
Imaging
Bill Of Materials
$10
19
MEMS & SENSORS: THE ENVIRONMENTAL HUB
©2016 | www.yole.fr | Semicon West - MEMS Presentation
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
INERTIAL
DOF6
9IMU
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
OPTICAL
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambientInteresting way for the
MEMS industry to gain value:
More integration at
environmental level seems a
good opportunity
Pressure + Microphone
Add Particles & Gas
detection (market pull)
20
MEMS & SENSORS: THE ENVIRONMENTAL HUB
©2016 | www.yole.fr | Semicon West - MEMS Presentation
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
INERTIAL
DOF6
9IMU
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
OPTICAL
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambientInteresting way for the
MEMS industry to gain value:
More integration at
environmental level seems a
good opportunity
Pressure + Microphone
Add Particles & Gas
detection (market pull)
Environmental
Bill Of Materials
$0.70
21
MEMS & SENSORS: THE ENVIRONMENTAL HUB
©2016 | www.yole.fr | Semicon West - MEMS Presentation
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
INERTIAL
DOF6
9IMU
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
OPTICAL
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambientInteresting way for the
MEMS industry to gain value:
More integration at
environmental level seems a
good opportunity
Pressure + Microphone
Add Particles & Gas
detection (market pull)
Environmental
Bill Of Materials
$1.50
Environmental
Bill Of Materials
$0.70
22
SENSOR HUB vs MCU/AP
A fight to acquire value
Value is in the software, not in the hardware
• Deep access to the functionalities of the sensor
• Low power consumption
• Optimized performance
• They try to add value to their sensors by providingsensor hub, adding software and promoting use case,showing the real added-value offer by their sensorscombined with their software.
• High power consumption
• Limited access to sensors
• Players: Qualcomm, Samsung,Apple, etc…
• Application processors and MCU manufacturers try tooverride sensor hubs and access the full functionality ofthe sensors. It requires allocated resources, maybe notas optimized as a sensor hub provides
MCU
AP
$30 - 40
Sensor
Hub
Sensor 1Sensor 2
Sensor #
…
…
A great competition to gather value at a
higher level in the system, because value
is in the software, not in the hardware.
<<$1/sensor
$1 -$2
Value
Sensor
System
©2016 | www.yole.fr | Semicon West - MEMS Presentation
23
IOT, WEARABLES … WHERE IS THE NEXT SEMICONDUCTOR WAVE?
Looking for next « Holy Grail » …
What is the next growth driver?
©2016 | www.yole.fr | Semicon West - MEMS Presentation
0
50
100
150
200
250
300
350
400
450
SEMICONDUCTOR INDUSTRY REVENUE (in bn US$)
Source: WSTS, Cisco, Gartner, Yole
?
IoT?
Wearables?
Likely the next growth
driver will be a mix of
smartphones, IoT,
wearables, cars …
24
$0,0
$0,5
$1,0
$1,5
$2,0
$2,5
$3,0
$3,5
$4,0
2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020
2000–2020 MEMS ASP decreaseSource Yole Développement
Where can the market absorb this price decrease?
The smartphone wave boosted volume sales but prices dropped!
MEMS AVERAGE SELLING PRICE
Smartphone wave
CAGR
-6%
CAGR
-13%
©2016 | www.yole.fr | Semicon West - MEMS Presentation
25
IS THE MEMS INDUSTRY DIGGING ITS OWN GRAVE?
The commoditization paradox!
Does it make sense to further shrink MEMS devices by out passing physics law requiring minimal sensor mass for detection?
The CIS industry solved this issue by increasing pixel & die size, thus the price!
©2016 | www.yole.fr | Semicon West - MEMS Presentation
SIZE REDUCTION PRICE DROP
SHRINKING MARGINS
INCREASING VOLUMES
(SMART PHONES/WEARABLES)
THE MEMS MARKET
PARADOX: units volume
growth is much higher than
market value
STABLE/DECLINING MARKET IN
US$ VALUE
Where is the cursor?
26
LOOKING AT THE CIS INDUSTRY: MOBILE MARKET TREND
Main rear camera & sub front camera roadmap: increased added value for more cost.
The trend is for more complexity at the system level
Log
Image sensor Resolution
2Mp
4Mp
8Mp
16Mp
20182010 2012 2014 2016
Sub CameraResolution VGA-1.2Mp
Pixel size 1.1µm
2020
OIS
Sub CameraResolution 5Mp
Pixel size 1.1µm
Sub CameraResolution 8Mp
Pixel size 1.2µm
Main CamerasResolution 8Mp
Pixel size 1.4µm
OIS
OIS
Main CamerasResolution 8Mp-16Mp
Pixel size 1.1µm- 1.5µm
Main CameraResolution 16Mp+
Pixel size 1.0-1.6µm
Dual CamerasResolution 2x 8Mp
Pixel size 1.1µm+
Size constraints &
Drive for better images &
Features:
→ More pixels
→ Smaller modules
→ Image stabilization (OIS)
27
WHAT CAN WE LEARN FROM THE CIS INDUSTRY AND APPLY TO MEMS & SENSORS?
More integration, improved environment tracking, sensor fusion
CMOS IMAGE SENSORS
More complexity at the system level: drive for
better images and features
More pixels
Smaller modules
Image stabilization (OIS)
MEMS & Sensors
More complexity at the system level: drive for
better accuracy/precise tracking and features
Sensor fusion
More integration: Pressure + Microphone
Improved environment tracking: Particles &
Gas sensing
©2016 | www.yole.fr | Semicon West - MEMS Presentation
28
NEW MEMS CHALLENGES
Power consumption is becoming a major trend
MEMS market challenges are evolving
2016, a new virtuous cycle?Yesterday
ASP
decrease
Consumer
volume
Size
decrease
Power
consumption
decrease
Importance
for user case
Sensor fusion,
software &
more features
Mobiles have to survive for long
periods on battery power while
interacting with environment
(voice calls, Wi-Fi, Bluetooth,
GPS, sensors …).
Start with applications, and
work downwards to the chips
needed to support them.
Less silicon, more brain.
• Yesterday, the main MEMS challenges were decrease size, which in turn led to price decrease then volume growth.
• Today, trends are different. They are: importance of user case (start with the definition of an application), fusion of different
sensors with software and power decrease (which paradoxically is linked to a chip size increase because of the ASIC).
©2016 | www.yole.fr | Semicon West - MEMS Presentation
Start with more intelligence!
© 2016
Conclusions
©2016 | www.yole.fr | Semicon West - MEMS Presentation
30
CONCLUSIONS & OUTLOOK
From Sensing to Sensor fusion to Actuating
Sensing
Trend is fusion to open new application fields
More accurate data
Precise tracking within the environment
Low Power
Hubs approach and in particular the environmental hub seems a nice opportunity to gain value
Add particles and gas sensing
Combine Pressure and Microphone ?
Actuating
Actuators are back and represent big market opportunities
Auto-focus devices
Micro-mirrors
RF switches
…
©2016 | www.yole.fr | Semicon West - MEMS Presentation
31
RELATEDYOLE REPORTS
Some slides from this presentation were extracted from the following reports
Status of the MEMS industry 2016To be released in Q2 2016
Gas sensors Report 2016
Released in Feb 2016 – More info. here.
Status of the CMOS Image sensor industry Released in Jan. 2015 – More info. here.
©2016 | www.yole.fr | Semicon West - MEMS Presentation
32
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©2016 | www.yole.fr | Semicon West - MEMS Presentation
