TZU06B2 Product Manual
TZU06B2 ZIGBEE WIRELESS COMMUNICATIONMODULE
Product Manual
TZU06B2 Product Manual
Table of Contents1 General...........................................................................................................................................1
1.1 Module introduction............................................................................................................1
1.2 Hardware description.......................................................................................................... 1
2 CE Certification(ETSI)................................................................................................................. 2
3 Module Pinout............................................................................................................................... 4
4 Hardware Description.................................................................................................................. 6
4.1 Hardware Diagram.............................................................................................................. 6
4.2 Hardware interface.............................................................................................................. 7
4.3 Interface characteristics.......................................................................................................7
5 Firmware Description................................................................................................................... 8
5.1 Firmware introduction.........................................................................................................8
5.2 Customized firmware.......................................................................................................... 9
5.3 Software interface............................................................................................................... 9
6 Absolute Maximum Ratings...................................................................................................... 10
6.1 Environmental characteristics...........................................................................................10
6.2 Recommended operating conditions.................................................................................11
7 DC Electrical Characteristics.................................................................................................... 11
8 Digital IO Specifications.............................................................................................................12
9 AD Converter Characteristics...................................................................................................13
10 AC Electrical Characteristics.................................................................................................. 14
10.1 RF Characteristics........................................................................................................... 14
10.2 TX Power Characteristics............................................................................................... 16
10.3 Temperature characteristics.............................................................................................17
11 Physical Dimensions and Footprint....................................................................................... 18
11.1 Physical Dimensions....................................................................................................... 18
11.2 Recommended Footprint.................................................................................................19
12 Soldering Temperature Time Profile (for reflow soldering)................................................ 20
12.1 Recommended temperature time profile for lead-free solder.........................................20
TZU06B2 Product Manual
13 Reliability Test........................................................................................................................... 21
14 Application Precautions...........................................................................................................22
14.1 Safety precautions........................................................................................................... 22
14.2 Engineering design and using precautions......................................................................22
14.3 Storage conditions...........................................................................................................23
15 Packaging.................................................................................................................................. 24
15.1 Carrier tape......................................................................................................................24
15.2 Reel..................................................................................................................................25
16 Ordering Information................................................................................................................ 26
17 Drawing of Product Label........................................................................................................27
18 Disclaimer.................................................................................................................................. 28
19 RoHS Declaration.....................................................................................................................28
20 Data Sheet Status.................................................................................................................... 28
21 Reference Documents.............................................................................................................29
22 Contact Information..................................................................................................................29
TZU06B2 Product Manual
TZU06B2 PM(Rev 2.0)
Module features Mini 24-pin stamp-like SMT package PCB (sniffer) antenna integrated on
board Small outline package (SOP): 16 mm x
28.2 mm x 3.7 mm Compliant with CE0168 and EU RoHS
certification Based on 8051 single-chip
microcomputer (SCM) architecture 256K FLASH and 8K RAM Three sleep modes: PM1, PM2, and
PM3 Operating voltage range: 2.0V to 3.6V Can act as End Device, Router or
Coordinator Providing 7 GPIO lines (including 3
analog ADCs) Providing UART serial communication
interface Firmware upgrade via serial port Hardware Supported AES-128
encryption Storage temperature range: –40ºC to
125ºC Operating temperature range: –40ºC to
85ºC Corrosion resistant and moisture
resistant Excellent anti-interference ability
Outstanding networking stability Quick network data processing
capability that collection of data from allnodes can be completed in 12 secondsin a ZigBee network composed of 100nodes
Serial data transmit-receive for enddevice in low power mode
Remotely controlling other modules inthe network with commands
ZigBee channel scanning and PANIDscanning
Analyzing topology of current networkwith commands
Updating the network key withcommands
Acquiring the neighbor table, routingtable, and node information withcommands
Switching the current network channelwith commands
Providing abundant module registers forusers to use and providing timers,interruptions etc. to execute users’built-in functions
Scanning of ambient energy values toenable users to view jamming intensityof network channel signals
ZigBee multicast function
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ZigBee binding function Providing DIYUE Terminal developed
from the ZigBee PRO property set
Standard JTAG programming andreal-time online commissioning via IAR
RF Features
Based on the 2.4GHz IEEE802.15.4/ZigBee PRO technology of theTI CC2530 + CC2591(PA) chip solution
2.4 GHz ISM frequency band 250 Kbps data transmission rate over
the air Maximum packet rate: 50 ms per packet 16 channels (IEEE802.15.4:
CH11–CH26) Maximum output power:
+20dBm( adjustable down to 0dBm)
Signal sensitivity:-97dBm@-40°C, PER=1‰-99dBm@20°C, PER=1‰-102dBm@85°C, PER=1‰
Idle current: 1.5μA RX current: 25 mA TX current: 53mA@0 dBm
76mA @ + 10dBm162mA @ + 20dBm
Deep sleep current: 0.4μA Visible barrier-free communication
distance: 1100 m@-75dBm, PER=1‰
Applications
Smart power grid Smart Energy Wireless alarm Safe home Smart household Smart building
Smart agriculture Wireless sensor network M2M Industrial control Lighting, ventilation control Remote monitoring Environmental monitoring and control
Features of development kit
Contain all of the platform which can quickly establish a simple Mesh network andevaluate TZU06B2 ZigBee wireless communication module performance
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1 General
1.1 Module introduction
TZU06B2 introduced in the document is an embedded wireless communication module
based on IEEE802.15.4/ZigBee technology. The hardware has taken the CC2530[1] +
CC2591[2] chip solution of Texas Instruments (TI) and the software adopts the TZU06 AT
instruction set self developed based on Z-Stack-CC2530-2.5.1a[3] protocol stack officially
released by TI.
The advanced hardware design and the simple AT instruction interface enables TZU06B2
ZigBee wireless communication module to be blended into the wide range of applications.
Due to the strong configuration function of TZU06B2 AT instruction set, you can develop
the products without extra MCU to save more time and cost. Besides, TZU06B2ZigBee
wireless communication module is also an ideal platform for development of ZigBee
firmware apart from the use of customized firmware.
You can add the strong network function into your products without radio frequency
experience or expertise, which can greatly shorten the research and development period
of products and further speed up the marketing of the products.
1.2 Hardware description
TZU06B2 ZigBee wireless communication module is composed of the low power
consumption RF chip CC2530 from TI, the chip CC2591 integrating a power amplifier(PA)
and a low noise amplifier(LNA), 32MHz system clock crystal oscillator, 32.768KHz
monitoring clock oscillator and RF radio frequency front-end matched filtering circuit which
can optimize the radio frequency performance. The module integrates a PCB (sniffer)
antenna on board which can facilitate the user embed the module into their own products.
The RF power amplifier of TZU06B2 wireless communication module increases the output
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power to be 20dBm, which greatly improves the communication capacity and quality of
ZigBee module.
Module Chip FLAH RAM Sealing Dimension
TZU06B2 CC2530+CC2591 256KB 8KB 16mm * 28.2mm * 3.7mm
Table 1-1 Model of TZU06B2 Module
The TZU06B2 is used for ZigBee applications (www.zigbee.org). If you don’t want to use
the AT instruction interface provided by our company and expect to develop your own
software, you need to download the official IAR (applicable for 8051) development tool
and Z-Stack-CC2530-2.5.1a protocol stack of TI.
2 CE Certification(ETSI)
TZU06B2 ZigBee wireless communication module is certified CE0168 at the power level
of 100mW(20dBm) to the following standards:
EMC: EN 301 489-17 v 2.2.1 (2012-09)
EN 301 489-01 v 1.9.2 (2011-09)
Radio: EN 300 328 V1.8.1 (2012-06)
Safety:EN 60950-1:2006+A1:2010+A12:2011+A2:2013
EN 62311:2008
The information of antennae for tests is shown in the following table:
Type Product Manufacturer wavelength Impedan Gain
Antenna W1010 Pulse Electronics 1/4, dipole 50Ω 2.0dBi
Table 2-1 Approved Antennae
When TZU06B2 ZigBee wireless communication module is embedded into an OEM
product, it is prohibited to declare that his OEM products comply with CE0168 certification
in the name of approved CE0168 certification of our company. If the OEM manufacturer
wants to declare that his final products comply with CE0168 certification, it must be
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ensured that the final products shall comply with the European EMC, Radio and Safety
standards. Otherwise, ChengDu DiYue Technology Co., Ltd. has the right to investigate
and affix the responsibility for it.
The "CE" marking must be placed in a prominent position of OEM products. Please refer
to http://ec.europa.eu/enterprise/faq/ce-mark.htm for more information about CE
certification mark.
Important tips:
In Europe, frequency band of 2.4GHz is used only for the equipment with the maximum
equivalent isotropically radiated power (e.i.r.p.) of less than 10mW(10dBm). In case that
e.i.r.p. of the equipment is more than 10mW, the Manufacturer or Authorized Agent must
notify the competent authorities of the spectrum management of the relevant member
state prior to four weeks that the products are put on the market. Besides, the equipment
must be marked with warning symbol to draw the user's attention to the fact that it might
not be legal to use the equipment in every member state.
For this reason, we recommend that the European customers limit the output power to
10mW (10dBm) to avoid having to deal with the local authorities for spectrum
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management of each relevant member state.
3 Module Pinout
Fig. 3-1 TZU06B2 Pinout (top view)
In order to facilitate the user to develop and design the products based on TZU06B2
ZigBee wireless communication module, we have detailed the pin information of TZU06B2
ZigBee wireless communication module in the following Table 3-1.
All GND pins are directly connected with the module; but for best RF performance, each
GND pin shall be connected to a complete ground externally .
Pin No. Pin Name CC2530 Pinout IO Characteristic Function Description
1 GND GND - System GND
2 DC P2.2 - Commissioning clock
3 DD P2.1 - Commissioning data
4 D6 P2.0 RW General GPIO
5 D5 P1.7 RW General GPIO
6 D4 P1.6 RW General GPIO
7 D3 P1.5 RW General GPIO
8 NC P1.4 -
9 D9 P1.3 - Restore Factory Defaults
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10 D8 P1.2 - Sleepy/Wake-up
11 NC P1.1 -
12 D7 P1.0 - Sleepy Instructions
13 GND GND - System GND
14 VDD VDD - System power
15 VDD VDD - System power
16 NC P0.7 -
17 ADC2/D2 P0.6 R/RW ADC or general GPIO
18 RTS P0.5 - Flow control for UART
19 CTS P0.4 - Flow control for UART
20 TX P0.3 - Transmit line for UART
21 RX P0.2 - Receiving line for UART
22 ADC1/D1 P0.1 R/RW ADC or general GPIO
23 ADC0/D0 P0.0 R/RW ADC or general GPIO
24 nRESET nRESET - System reset
Table 3-1 Description of TZU06B2 Pinout
Notes:
Rising edge trigger,when the rising edge was detected three times consecutively, the device
will be restored to factory defaults.
Rising edge trigger.
Only the END Device(ZED) is in sleepy state this pin will be low power ‘0’ and ‘1’ in
others.
When flow control is started by TZU06 AT command, the corresponding RTS and CTS
of external hardware circuit shall be on.
When flow control is closed by TZU06 AT instruction, it is suggested to disconnect the
corresponding RTS and CTS of external hardware circuit to reduce equipment power
consumption..
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Low level is adopted for system reset. In case of nRESET=’0’, the module is staying in
reset state.
4 Hardware Description
4.1 Hardware Diagram
CC2530
Voltage: 3.3V I/O
AD
UART
GPIO
JTAG
nRESET nRESETProgramming
Debug
32MHz-System Clock
VDD
CC2591
32.768kHz
Filteringand
matching
PA_EN、EN、HGM
Mach
Mach
Sniffer
Frequency:2405MHz~2480MHz
Fig. 4-1 Hardware Diagram of TZU06B2
TZU06B2 wireless communication module is based on CC2530F256 chip from TI.
CC2530F256 integrates the RF transceiver complying with 2.4-GHz IEEE 802.15.4, the
standard enhanced 8051 CPU in the industry, 256KB FLASH and 8KB RAM which can be
programmed in the system and many other external facilities with strong functions.
The chip also provides the industrial standard serial communication interface, JTAG
programming and debugging interface, debugging components for 8051 single-chip
microcomputer, which simplifies the self-defined software development of CC2530.
In addition to this a number of MAC functions are also implemented in hardware to
help maintain the strict timing requirements imposed by the ZigBee and IEEE802.15.4
standards.
Also,the CC2530 chip has three power management modes, which enables it to be more
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adaptable to the ultra-low power consumption system. It only takes a few milliseconds for
change between different power modes that further ensures the low power consumption
of the equipment.
CC2591 is a 2.4GHz RF front-end chip with low power consumption and high
performance. It integrates the power amplifier PA of transmitter and the low-noise
amplifier LNA of receiver, which greatly improves the communication capacity and quality
of ZigBee module.
4.2 Hardware interface
All GPIOs of TZU06B2 ZigBee wireless communication module can be accessed through
S-register. When you need to use AT instruction set for developing custom firmware,
please refer to TZU06 AT Instruction Manual and TZU06 DVK Products Manual.
4.3 Interface characteristics
ParameterTestconditions
Minimumvalue
Typicalvalues
Maximumvalue
Unit
UART Baud Rate 9600 115200 bps
Analog channel resolution Half-duplex 7 12 bit
Analog input impedance 20 kΩ
Analog input voltage 2 3.3 V
Bus clock frequency 33 533 kHz
GPIO output voltage -0.3 3.6 V
Real-time clock frequency 32.768 kHz
Effective serial data 80 Bytes/packet
Maximum packet rate 50 ms/packet
Table 4-1 TZU06B2 Interface Characteristics
TZU06B2 ZigBee wireless communication module has integrated one sniffer antennae on
board, so the user should not use another antennae when using it. However, you must do
as following principles when using the TZU06B2 module to develop and design your own
2I C
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product:
Do not place the module into the metal shell
Avoid placing the sniffer antenna near the mental objects and the distance
between them should be greater than 5 cm
Do not place the module near the device or equipment who has strong
electromagnetic radiation, such as WIFI, transformers, etc.
When using the module to develop and design, you should pay attention to
theses:
--Let the Sniffer Antenna keep away from the PCB edge as possible
--Do not layout or copper near the Sniffer Antenna
--Do not use metal shell to package it
5 Firmware Description
5.1 Firmware introduction
TZU06B2 ZigBee wireless communication module solidifies the boot program inside and
supports the serial update of new firmware. In order to enter into the serial update mode,
the module just needs to receive the special data 0xF8 through serial port within 3
seconds after power-cycling or resetting the module. In order to avoid the module
mistaken entering into the update mode, you must ensure that the special data 0xF8
cannot be received through serial port within 3 seconds after power-cycling or resetting
the module.
In addition to the serial port upgrading function, the module also contains TZU06 AT
instruction interface provided by our company. Please see details in TZU06 AT Instruction
Manual. For firmware updating, see www.cdiyue.com. Each module has only 64-bit
identifier stored in FLASH, and these identifiers are similar to the MAC address in PC.
Command and response in AT instructions realize the communication through the serial
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port of TZU06B2 module, thus only one simple serial terminal software is needed to
conduct the operations under various instructions. We have provided TZU06 AT
instruction configuration tool, and you can also select other serial terminal tools.
AT instruction set that TZU06B2 module has been pre-loaded is based on Z-Stack-
CC2530-2.5.1a and it can be used as coordinator, router and end device. An end device is
not equipped with wiring function, so it can be ready to go to sleep mode (so the end
device generally applies battery for power supply), and also can send and receive data
through the router of parent node. An end device is also equipped with the function to
constantly change its location and replace the parent node in the network.
A router is typically a mains power supply equipment, which is mainly responsible for the
cabling intelligence and data receiving and sending in the network.
Of course, TZU06B2 module also can act as a PAN coordinator and Trust Center and
through the control center of external host, it can easily use various instructions to set and
manage the whole ZigBee network.
5.2 Customized firmware
For customers who have batch requirements of TZU06B2 module, we can customize the
firmware on their demand.
5.3 Software interface
When using the default firmware provided by our company, you can control TZU06B2
module directly through AT instruction interface and the special register (S-Register)
stored in FLASH. If you want to understand the complete instruction list and the relevant
information of S-Register, please refer to TZU06 AT Instruction Manual .
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6 Absolute Maximum RatingsParameter Symbol Min value Max value Unit Note
Supply voltage DDV -0.3 3.6 V
Pin voltage PINV -0.3 3.6 V
RF input level maxP 10 dBm
Output power outP 20 dBm
Storage temperature range stgT -40 125 ℃
Operating temperature range opT -40 85 ℃
Reflow temperature deathT 245 ℃Lead-freesoldering
Table 6-1 Limit Parameter
Notes:
The limit values given in Table 6-1 shall not be exceeded under any condition and
exceeding any one of the limit values may cause permanent damage to the device.
6.1 Environmental characteristics
Parameter Symbol Absolute maximum ratings Unit Note
ESD1 THHBMV ±2 KV Description of human-bodymode circuit
ESD2 THCDMV ±500 V Description of chargeddevice model
Humidity level MSL MSL3 -
Table 6-2 Environmental Parameters
Notes:
Caution! ESD sensitive device. Precautions should be used when
handling the device in order to prevent permanent damage.
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6.2 Recommended operating conditions
Parameter Min value Typical value Max value Unit Environment
Supply voltage 2 3.3 3.6 V
RF input power - - 10 dbm
RF frequency 2405 2480 MHz
Operating temperature -40 25 85 ℃ -
Relative humidity - - 95 %
Table 6-3 Recommended Operating Conditions
7 DC Electrical Characteristics
Test conditions:VDD=3.3V,TOP=25℃,fc=2400~2480MHz.
Parameter Test conditions SymbolParameter value
Min Typical Max
Supply Voltage DDV 2.0V 3.3V 3.6V
Power mode 0
Idle WI 8.1mA
RX RI 27mA
TX TI 166mA
Power mode 1 4μs wake-up 1PMI 0.2mA 0.3mA
Power mode 2 Sleep timer running 2PMI 1μA 2μA
Power mode 3 External interruption 3PMI 0.4μA 1μA
ResetresetI 1.2mA 2mA
Operate GPIO to hard
reset module resetT 18μs
Timer 1Timer running, using
32M XOSC 1TMI 90μA
Timer 2Timer running, using
32M XOSC 2TMI 90μA
Timer 3Timer running, using
32M XOSC 3TMI 60μA
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Timer 4Timer running, using
32M XOSC 4TMI 70μA
Sleep TimerTimer running, using
32.753K RCOSC STMI 0.6μA
ADC Converting ADCI 1.2mA
FLASHErase ERAI 1mA
Burst write BOOSTI 6mA
Idle Current PM2 Mode I d l eI 1.5μA
RX Current RXI 25mA
TX Current
TX power = 0dBmTXI
53mA
TX power = 10dBm 73mA
TX power = 20dBm 162mA
Wake up Time From sleep to active S to AT 100μs
Shutdown Time From active to sleep A to ST 5μs
Working time From idle to TX/RX i to wT 200μs
Converting time From TX to RX T RT 200μs
Table 7-1 DC Electrical Characteristics of TZU06B2
8 Digital IO Specifications
The digital I/Os of TZU06B2 ZigBee wireless communication module have the ratings
shown as Table 8-1.
Test conditions: VDD=3.3V,TOP=25℃.
Parameter Test conditionsSymb
ol
Parameter value
Minim
um
value
Typical
values
Maxim
um
valueLogic0 input voltage ILV 0.5V
Logic1 input voltage IHV 2.5V
Logic0 input current Input voltage 0V ILI -50nA 50nA
Logic1 input current Output voltage DDV IHI -50nA 50nA
I/O-pin pullup resistors PUR 20kΩ
I/O-pin pulldown resistors PDR 20kΩ
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Logic0 output voltage, 4mA
pins
Output load current:
4mA
4OLV 0.5V
Logic1 output voltage, 4mA
pins
Output load current:
4mA
4OHV 2.4V
Logic0 output voltage, 20mA
pins
Output load current:
20mA
20OLV 0.5V
Logic1 output voltage, 20mA
pins
Output load current:
20mA
20OHV 2.4V
Table 8-1 Digital IO Specification of TZU06B2
9 AD Converter Characteristics
TZU06B2 wireless communication module is equipped with AD converter which has the
following characteristics.
Support the resolution ratio from 7bits to 12bits and the corresponding
bandwidth is from 30kHz to 4kHz.
Provide 8 input channels (P0 port)
Support difference or single-ended input
Support various reference voltages: internal reference voltage, external
reference voltage VDD (external single-ended input signal and external
difference input signal)
Have the temperature sensor input channel (inside the module)
Automatically treat the periodical sample or convert the results through
serial numbers of the channels
Test conditions:
Parameter Test conditionsParameter value
UnitMin Typical Max
Input voltage 0 DDV V
External referencevoltage
0 DDV V
External differencereference voltageExternal reference
0 DDV V
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Input impedance 200 k
Converting time
Resolution: 7 bits 4 s
Resolution: 9 bits 16 s
Resolution: 10 bits 32 s
Resolution: 12 bits 128 s
Table 9-1 AD Converter Characteristics of TZU06B2
10 AC Electrical Characteristics
10.1 RF Characteristics
Test conditions: TZU06B2 connect externally 50Ω load.
No Parameter Test conditions Min Typicalvalues
Max Unit
1 Frequency range 2400 2500 MHz
2 Channel numberSee Table 10.2 for thecorrespondence betweenchannel and frequency
CH11 CH26
3 Input impedance 47 53 Ω
4 Receiver sensitivity PER=1% -102 -99 -98 dBm
5Input level Inputvoltage
PER=1% 10 dB
6Adjacent-channelrejection, 5MHzchannel spacing
Wanted signal –82 dBm,adjacent modulation channelat +5MHz, PER=1%
49 dB
7Adjacent-channelrejection, -5MHzchannel spacing
Wanted signal –82 dBm,adjacent modulation channelat -5MHz, PER=1%
49 dB
8Adjacent-channelrejection, 10MHzchannel spacing
Wanted signal –82 dBm,adjacent modulation channelat +10MHz, PER=1%
57 dB
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9Adjacent-channelrejection, -10MHzchannel spacing
Wanted signal –82 dBm,adjacent modulation channelat -10MHz, PER=1%
57 dB
10Channel rejection,≥20MHz,≤-20MHz
Wanted signal –82 dBm,Undesired signal is anIEEE802.15.4 modulatedchannel, stepped through allchannels from 2405 to 2480MHz, PER=1%
57 dB
11 Co-channelrejection
Frequency of interferencesignal is same as that of
-3 dB
12Frequency errortolerance
Minimum: ±80ppm ±150 ppm
13Symbol rate errortolerance
Minimum: ±80ppm ±1000 ppm
14Error vectormagnitude(EVM)
Output power at lowestpower setting:20dBm
2%
15Actual maximumoutput power
Output power at lowestpower setting:20dBm
19.3 20.2 dBm
16Actual minimumoutput power
Output power at lowestpower setting:0dBm
-0.9 0.09 dBm
Table 10-1 RF Characteristics of TZU06B2 RF Transceiver
Notes:
The previous relation between the setting output power and actual output power of
TZU06B2 wireless communication module is detailed at Section 10.2. When the output
power of the module shall be set, please refer to S01 of S-register in TZU06 AT Instruction
Manual.
Channel Frequency(center) Channel Frequency (center)
CH11 2,405MHz CH19 2,445MHz
CH12 2,410MHz CH20 2,450MHz
CH13 2,415MHz CH21 2,455MHz
CH14 2,420MHz CH22 2,460MHz
CH15 2,425MHz CH23 2,465MHz
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CH16 2,430MHz CH24 2,470MHz
CH17 2,435MHz CH25 2,475MHz
CH18 2,440MHz CH26 2,480MHz
Totally 16 channels, frequency coverage: 2400MHz--2483MHz
Table 10-2 Channel VS. Frequency of TZU06B2
No Parameter Test conditions Minim Typica Maxim Unit
1Power on resetPOR time
Ensure the successful reset (adda RC network)
21.7 ms
2 Impulse reset timeSuccessful reset 18 s
Unsuccessful reset 0 1 s
Table 10-3 TZU06B2 Reset Specifications
10.2 TX Power Characteristics
The diagram below(Fig.10-1) shows the typical output power in dependency on TZU06B2
power setting at 3.3V and room temperature.
Fig. 10-1 Setting Power VS. Output Power of TZU06B2
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10.3 Temperature characteristics
Fig.10-2 and Fig.10-3 illustrate the temperature behaviour of the TZU06B2 module.
Please note that although the temperature behaviour of sensitivity was measured to up to
100℃ the absolute maximum rating is 85℃.
Fig. 10-2 Temperature VS. Signal Sensitivity of TZU06B2
Fig. 10-3 Temperature VS. Transmitting Power of TZU06B2
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11 Physical Dimensions and Footprint
11.1 Physical Dimensions
W
L
A1 A2A3
A4
A5
Fig. 11-1 Physical Dimensions of TZU06B2
Parameter Parameter Description Parameter value
W Module width 16mm
L1 Module length 28.2mm
A1 Distance between semi-holes 1.27mm
A2 Distance from semi-hole to PCB 0.8mm
A3 Distance from sniffer antenna to PCB edge 0.4mm
A4 Distance from sniffer antenna to PCB edge 1.4mm
A5 Distance from sniffer antenna to PCB edge 0.2mm
Table 11-1 Physical Dimensions of TZU06B2
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11.2 Recommended Footprint
L
1.27mm1mm
1.2mm
1 12
1324
17mm
Fig. 11-2 Recommended Footprint of TZU06B2
Notes:
1. When the surface mounted TZU06B2 ZigBee wireless communication module is
used, it is suggested that the bonding pad shall be 1mm wide and 1.2mm high.
2. L=28.2mm.
3. You must ensure that the corresponding PCB of “keep-out area” part in Fig. 3-1 shall
have no any device, running line or applied copper.
4. You must also ensure that there is no exposed copper on your layout which may
contact with the underside of the module.
5. To get the best RF performance, it is recommended that each GND pin shall be
connected to a complete ground level.
6. It is recommended to use multiple vias between each ground pad and a solid ground
plane to minimize inductivity in the ground path.
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12 Soldering Temperature Time Profile (for reflow
soldering)
12.1 Recommended temperature time profile for lead-free solder
Fig. 12-1 TZU06B2 Temperature Profile for Lead-free Solder
Notes:
Preheat: The recommended temperature climbing speed shall be 2℃/s and not exceed
2.5℃/s at the preheat area.
Cooling: The recommended temperature descent speed shall be 3℃/s and not exceed
4℃/s at the cooling area.
Maximum Reflow Cycles of the module: twice
The module must not be placed at the bottom of PCB board for
reflow soldering (if the module is placed at the bottom of PCB
board for reflow soldering, device inside the module will drop off
due to gravity).
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13 Reliability TestTo guarantee the environment adaptability of TZU06B2, we have done the the following
measurements.
Table 13-1 Reliability Test of TZU06B2
No Test items Test methods
1 Vibration testSetting the vibration frequency of 50Hz, amplitude of 1.5mm,and each side of XYZ vibrates for 20 minutes respectively
2 Shock testThe module is dropped from the height of 50cm to hard floor tocarry out the test for 3 times
3 Heat cycle testCharged operation of module: start temperature of cycle:25℃-->-40℃ (30 minutes) -->85℃ (30 minutes), for 5 cyclesbetween high and low temperature
4 Moisture testModule operates at the environment of + 60℃ and 90% RH for24 hours
5Low temperaturecold start test
Module will be powered after placed in the environment of-40℃ for 1 hour
6Low temperaturetest
Operating in the environment of -40℃ for 3 * 24 hours
7High temperaturetest
Operating in the environment of +85℃ for 3 * 24 hours
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14 Application Precautions
14.1 Safety precautions
Before use of TZU06B2, check and evaluate their operation when mounted on your
products . These products may short-circuit. If electrical shocks, smoke, fire, and/or
accidents involving human life are anticipated when a short circuit occurs, then provide
the following failsafe functions as a minimum :
(1)One protective circuit shall be designed or the protective device shall be installed to
ensure the system safety.
(2)One redundant circuit or one system shall be designed to prevent the safety loopholes
due to single malfunction so as to ensure the system safety.
14.2 Engineering design and using precautions
(1)Excess temperature during use of the products is the major factor of shortening the
life of the products. Thus, full consideration of the impacts of heat radiation shall be taken
in the design or use of the products to ensure that the environment temperature of the
products shall not exceed the maximum operable temperature.
(2)Otherwise, it may cause the reduction of the product performance and damage the
products.
(3)If impulse or other transient load will be loaded to your products, the operation of
TZU06B2 module must be inspected before installation and the potential impacts on the
products shall be evaluated.
(4)When the products are used under the following special environment, the product
manual shall be carefully read and the using of performance and reliability of TZU06B2
must be evaluated;
Liquid environment. Such as water, saline water, paint, alkali, organic solvent or
other possible sprinkle liquid
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The environment of direct sunshine, outdoor or dusty environment
Environment easy to condensation
Environment with high concentration and harmful gases (such as air with salt,
muriatic acid, chlorine, sulfur dioxide, sulfuretted hydrogen, ammonia gas or
nitrogen oxide)
(5)Mechanical stress shall be avoided in assembly or operation of TZU06B2.
(6)Do not press the shielding cover or tighten the objects to the shielding cover
(7)When the TZU06B2 is working, the safe distance between it and human body must
be greater than 20 centimeters.
14.3 Storage conditions
(1) TZU06B2 must not be stressed mechanically during storage
(2) Performance characteristics of the module shall not be evaluated under the following
environment and the storage under this environment may have a large impact on the
performance of TZU06B2 (such as RF performance).
Salty air or environment with high concentration corrosive gases (such as
Cl2,H2S,NH3,SO2,or NOx )
Storage in direct sunshine
Storage in an environment where air humidity exceeds 85%
(3) After the above-mentioned conditions are satisfied, the storage time of the module
during assembly of final products shall not exceed two years.
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15 Packaging
15.1 Carrier tape
Fig. 15-1 Dimension of Carrier Tape (Top View)
Fig. 15-2 Diagram of Cover Tape
Fig. 15-3 Diagram of Empty pocket
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Fig. 15-4 Orientation of TZU06B2
15.2 Reel
Fig. 15-5 Reel Dimensions
Each reel will be packed in a electrostatic shielding bag
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16 Ordering InformationProduct code Brief description
TZU06B2
Based on CC2530 + CC2591 chip solution from TI TZU06 AT instruction Sniffer antenna on board 16mm * 28.2mm * 3.7mm Visible barrier-free communication distance is 1100m @-75dBm
TZU06DVK
Development Kit
Development kit contains
5 X TZURF-EVB Development Boards
2 X TZU06A1 on Carrier-Board
2 X TZU06A2 on Carrier-Board
2 X TZU06A1 on Carrier-Board
2 X TZU06B2 on Carrier-Board
1 X TZU06USB
2 X Pulse 2.0dbi antenna
2 X RF feeder
2 X molex Micro-USB-to-USB-A data cable
DIYUE Terminal and user manual
DIYUE Firmware Update Tool
TZU06 Development Kit User Manual TZU06 series module firmware
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17 Drawing of Product Label
Fig. 17-1 TZU06B2 Product Label
The label dimensions are 12.5mm*20.4mm and the label will withstand temperatures used
during reflow soldering.
Mark Detailed Description
TZU06B2 Module model
CE0168 CE0168 mark
2D-Barcode2D-Barcode shall include four parts: product batch, hardwarereversion,module model and product serial number
150622 15: product batch;06:hardware reversion; 22: product category
956624634488 Product serial number
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18 DisclaimerWe reserve the right to modify or improve the product, company name and LOGO at any
time without prior notice. In addition, Chengdu Diyue Technology Co., Ltd. does not
convey any license under its patent rights or assume any responsibility for the use of the
described product.
19 RoHS DeclarationStatement of compliance of TZU06B2 ZigBee wireless communication module to EU
environmental protection:
Hereby we declare to our best present knowledge based on the declaration of our
suppliers that TZU06B2 does not contain the following substances which are banned by
Directive 2011/65/EU (RoHS) or if they do, contain a maximum concentration of 0,1% by
weight in homogeneous materials for:
Lead and lead compounds
Mercury and mercury compounds
Hexavalent Chromium
PBB (polybrominated biphenyl) category
PBDE (polybrominated biphenyl ether ) category
And a maximum concentration of 0.01% by weight in homogeneous materials for:
Cadmium and cadmium compounds
20 Data Sheet StatusIn order to improve design performance and supply the best possible products to
customers, Chengdu Diyue Technology Co., Ltd. reserves the right to change the product
specifications without notice. Please download the latest product specifications provided
by our company before initiating or completing one design.
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21 Reference Documents[1] Data sheet CC2530.TI. (www.ti.com-CC2530)
[2] Data sheet CC2591.TI. (www.ti.com-CC2591)
[3] Z-Stack-CC2530-2.5.1a (www.ti.com-Z-Stack-CC2530-2.5.1a)
22 Contact InformationWebsite: www.cdiyue.com
China Sales
Tel: 028-85106132
Fax: 028-85189190
E-mail: [email protected]
International Sales
Tel: 0086-28-85327536
Fax: 0086-28-85189190E-mail: [email protected]