TZU06B1 Product Manual - cdiyue.com Product Manual V2.1.pdf · TZU06B1ProductManual 1 TZU06B1PM(Rev2.0) 1General 1.1 Moduleintroduction TZU06B1introducedinthedocumentisanembeddedwirelesscommunicationmodule

TZU06B1 Product Manual

TZU06B1 ZIGBEE WIRELESS COMMUNICATIONMODULE

Product Manual


Table of Contents1 General...........................................................................................................................................1

1.1 Module introduction..............................................................................................................1

1.2 Hardware description............................................................................................................ 1

2 CE Certification(ETSI)................................................................................................................. 2

3 Module Pinout............................................................................................................................... 4

4 Hardware Description.................................................................................................................. 6

4.1 Hardware Diagram................................................................................................................ 6

4.2 Hardware interface................................................................................................................ 7

4.3 Interface characteristics.........................................................................................................7

5 Firmware Description................................................................................................................... 8

5.1 Firmware introduction...........................................................................................................8

5.2 Customized firmware............................................................................................................ 9

5.3 Software interface................................................................................................................. 9

6 Absolute Maximum Ratings........................................................................................................ 9

6.1 Environmental characteristics............................................................................................. 10

6.2 Recommended operating conditions...................................................................................10

7 DC Electrical Characteristics.................................................................................................... 11

8 Digital IO Specifications.............................................................................................................12

9 AD Converter Characteristics...................................................................................................12

10 AC Electrical Characteristics.................................................................................................. 14

10.1 RF Characteristics............................................................................................................. 14

10.2 TX Power Characteristics................................................................................................. 16

10.3 Temperature characteristics...............................................................................................17

11 Physical Dimensions and Footprint....................................................................................... 18

11.1 Physical Dimensions......................................................................................................... 18

11.2 Recommended Footprint...................................................................................................19

12 Soldering Temperature Time Profile (for reflow soldering)................................................ 20

12.1 Recommended temperature time profile for lead-free solder...........................................20


13 Reliability Test........................................................................................................................... 21

14 Application Precautions...........................................................................................................22

14.1 Safety precautions............................................................................................................. 22

14.2 Engineering design and using precautions........................................................................22

14.3 Storage conditions.............................................................................................................23

15 Packaging.................................................................................................................................. 24

15.1 Carrier tape........................................................................................................................24

15.2 Reel....................................................................................................................................25

16 Ordering Information................................................................................................................ 26

17 Drawing of Product Label........................................................................................................27

18 Disclaimer.................................................................................................................................. 28

19 RoHS Declaration.....................................................................................................................28

20 Data Sheet Status.................................................................................................................... 28

21 Reference Documents.............................................................................................................29

22 Contact Information..................................................................................................................29


TZU06B1 PM(Rev 2.0)

Module features Mini 24-pin stamp-like SMT package U.FL interface for external SMA antenna Small outline package (SOP): 16 mm x

26 mm x 3.7 mm Compliant with CE0168 and EU RoHS

certification Based on 8051 single-chip

microcomputer (SCM) architecture 256K FLASH and 8K RAM Three sleep modes: PM1, PM2, and

PM3 Operating voltage range: 2.0V to 3.6V Can act as End Device, Router or

Coordinator Providing 7 GPIO lines (including 3

analog ADCs) Providing UART serial communication

interface Firmware upgrade via serial port Hardware Supported AES-128

encryption Storage temperature range: –40ºC to

125ºC Operating temperature range: –40ºC to

85ºC Corrosion resistant and moisture

resistant Excellent anti-interference ability Outstanding networking stability Quick network data processing

capability that collection of data from allnodes can be completed in 12 secondsin a ZigBee network composed of 100nodes

Serial data transmit-receive for enddevice in low power mode

Remotely controlling other modules inthe network with commands

ZigBee channel scanning and PANIDscanning

Analyzing topology of current networkwith commands

Updating the network key withcommands

Acquiring the neighbor table, routingtable, and node information withcommands

Switching the current network channelwith commands

Providing abundant module registers forusers to use and providing timers,interruptions etc. to execute users’built-in functions

Scanning of ambient energy values toenable users to view jamming intensityof network channel signals

ZigBee multicast function ZigBee binding function Providing DIYUE Terminal developed

from the ZigBee PRO property set


TZU06B1 PM(Rev 2.0)

Standard JTAG programming and real-time online commissioning via IAR

RF Features

Based on the 2.4GHz IEEE802.15.4/ZigBee PRO technology of theTI CC2530 + CC2591(PA) chip solution

2.4 GHz ISM frequency band 250 Kbps data transmission rate over

the air Maximum packet rate: 50 ms per packet 16 channels (IEEE802.15.4:

CH11–CH26) Maximum output power: +20

dbm(adjustable down to 0dBm)

Signal sensitivity:-97dBm@-40°C, PER=1‰-99dBm@20°C, PER=1‰-102dBm@85°C, PER=1‰

Idle current: 1.5μA RX current :25mA TX current: 53mA@0dBm

76mA@ + 10dBm164mA@ + 20dBm

Deep sleep current: 0.4μA Visible barrier-free communication

distance: 2700 m@-69dBm, PER=0.5‰Applications

Smart power grid Smart Energy Wireless alarm Safe home Smart household Smart building

Smart agriculture Wireless sensor network M2M Industrial control Lighting, ventilation control Remote monitoring Environmental monitoring and control

Features of development kit

Contain all of the platform which can quickly establish a simple Mesh network andeva lua te TZU06B1 ZigBee wi re less communica t ion modu le per fo rmance


TZU06B1 PM(Rev 2.0)1

1 General

1.1 Module introduction

TZU06B1 introduced in the document is an embedded wireless communication module

based on IEEE802.15.4/ZigBee technology. The hardware has taken the CC2530[1] +

CC2591[2] chip solution of Texas Instruments (TI) and the software adopts the TZU06 AT

instruction set self developed based on Z-Stack-CC2530-2.5.1a[3] protocol stack officially

released by TI.

The advanced hardware design and the simple AT instruction interface enables TZU06B1

ZigBee wireless communication module to be blended into the wide range of applications.

Due to the strong configuration function of TZU06B1 AT instruction set, you can develop

the products without extra MCU to save more time and cost. Besides, TZU06B1ZigBee

wireless communication module is also an ideal platform for development of ZigBee

firmware apart from the use of customized firmware.

You can add the strong network function into your products without radio frequency

experience or expertise, which can greatly shorten the research and development period

of products and further speed up the marketing of the products.

1.2 Hardware description

TZU06B1 ZigBee wireless communication module is composed of the low power

consumption RF chip CC2530 from TI, the chip CC2591 integrating a power amplifier(PA)

and a low noise amplifier(LNA), 32MHz system clock crystal oscillator, 32.768KHz

monitoring clock oscillator and RF radio frequency front-end matched filtering circuit which

can optimize the radio frequency performance. The module provides U.FL interface for

attaching external SMA interface antenna.

The RF power amplifier of TZU06B1 wireless communication module increases the output



power to be 20dBm, which greatly improves the communication capacity and quality of

ZigBee module.

Module Chip FLAH RAM Sealing Dimension

TZU06B1 CC2530+CC2591 256KB 8KB 16mm * 26mm * 3.7mm

Table 1-1 Model of TZU06B1 Module

The TZU06B1 is used for ZigBee applications (www.zigbee.org). If you don’t want to use

the AT instruction interface provided by our company and expect to develop your own

software, you need to download the official IAR (applicable for 8051) development tool

and Z-Stack-CC2530-2.5.1a protocol stack of TI.

2 CE Certification(ETSI)

TZU06B1 ZigBee wireless communication module is certified CE0168 at the power level

of 100mW(20dBm) to the following standards:

EMC： EN 301 489-17 v 2.2.1 (2012-09)

EN 301 489-01 v 1.9.2 (2011-09)

Radio： EN 300 328 V1.8.1 (2012-06)

Safety：EN 60950-1:2006+A1:2010+A12:2011+A2:2013

EN 62311:2008

The information of antennae for tests is shown in the following table:

Type Product Manufacturer wavelength Impedan Gain

Antenna W1010 Pulse Electronics 1/4, dipole 50Ω 2.0dBi

Table 2-1 Approved Antennae

When TZU06B1 ZigBee wireless communication module is embedded into an OEM

product, it is prohibited to declare that his OEM products comply with CE0168 certification

in the name of approved CE0168 certification of our company. If the OEM manufacturer

wants to declare that his final products comply with CE0168 certification, it must be

http://www.zigbee.org

http://www.digikey.cn/Suppliers/cn/Pulse.page?lang=zh



ensured that the final products shall comply with the European EMC, Radio and Safety

standards. Otherwise, ChengDu DiYue Technology Co., Ltd. has the right to investigate

and affix the responsibility for it.

The "CE" marking must be placed in a prominent position of OEM products. Please refer

to http://ec.europa.eu/enterprise/faq/ce-mark.htm for more information about CE

certification mark.

Important tips:

In Europe, frequency band of 2.4GHz is used only for the equipment with the maximum

equivalent isotropically radiated power (e.i.r.p.) of less than 10mW(10dBm). In case that

e.i.r.p. of the equipment is more than 10mW, the Manufacturer or Authorized Agent must

notify the competent authorities of the spectrum management of the relevant member

state prior to four weeks that the products are put on the market. Besides, the equipment

must be marked with warning symbol to draw the user's attention to the fact that it might

not be legal to use the equipment in every member state.

For this reason, we recommend that the European customers limit the output power to

10mW (10dBm) to avoid having to deal with the local authorities for spectrum

http://ec.europa.eu/enterprise/faq/ce-mark.htm



management of each relevant member state.

3 Module Pinout

Fig. 3-1 TZU06B1 Pinout (top view)

In order to facilitate the user to develop and design the products based on TZU06B1

ZigBee wireless communication module, we have detailed the pin information of TZU06B1

ZigBee wireless communication module in the following Table 3-1.

All GND pins are directly connected with the module; but for best RF performance, each

GND pin shall be connected to a complete ground externally .

Pin No. Pin Name CC2530 Pinout IO Characteristic Function Description

1 GND GND - System GND

2 DC P2.2 - Commissioning clock

3 DD P2.1 - Commissioning data

4 D6 P2.0 RW General GPIO




8 NC P1.4 -

9 D9 P1.3 - Restore Factory Defaults



10 D8 P1.2 - Sleepy/Wake-up

11 NC P1.1 -

12 D7 P1.0 - Sleepy Instructions

13 GND GND - System GND

14 VDD VDD - System power

15 VDD VDD - System power

16 NC P0.7 -

17 ADC2/D2 P0.6 R/RW ADC or general GPIO

18 RTS P0.5 - Flow control for UART

19 CTS P0.4 - Flow control for UART

20 TX P0.3 - Transmit line for UART

21 RX P0.2 - Receiving line for UART



24 nRESET nRESET - System reset

Table 3-1 Description of TZU06B1 Pinout

Notes:

Rising edge trigger,when the rising edge was detected three times consecutively, the device

will be restored to factory defaults.

Rising edge trigger.

Only the END Device(ZED) is in sleepy state this pin will be low power ‘0’ and ‘1’ in

others.

When flow control is started by TZU06 AT command, the corresponding RTS and CTS

of external hardware circuit shall be on.

When flow control is closed by TZU06 AT instruction, it is suggested to disconnect the

corresponding RTS and CTS of external hardware circuit to reduce equipment power

consumption..



Low level is adopted for system reset. In case of nRESET=’0’, the module is staying in

reset state.

4 Hardware Description

4.1 Hardware Diagram

Fig. 4-1 Hardware Diagram of TZU06B1

TZU06B1 wireless communication module is based on CC2530F256 chip from TI.

CC2530F256 integrates the RF transceiver complying with 2.4-GHz IEEE 802.15.4, the

standard enhanced 8051 CPU in the industry, 256KB FLASH and 8KB RAM which can be

programmed in the system and many other external facilities with strong functions.

The chip also provides the industrial standard serial communication interface, JTAG

programming and debugging interface, debugging components for 8051 single-chip

microcomputer, which simplifies the self-defined software development of CC2530.

In addition to this a number of MAC functions are also implemented in hardware to help

maintain the strict timing requirements imposed by the ZigBee and IEEE802.15.4

standards.



Also,the CC2530 chip has three power management modes, which enables it to be more

adaptable to the ultra-low power consumption system. It only takes a few milliseconds for

change between different power modes that further ensures the low power consumption

of the equipment.

CC2591 is a 2.4GHz RF front-end chip with low power consumption and high

performance. It integrates the power amplifier PA of transmitter and the low-noise

amplifier LNA of receiver, which greatly improves the communication capacity and quality

of ZigBee module.

4.2 Hardware interface

All GPIOs of TZU06B1 ZigBee wireless communication module can be accessed through

S-register. When you need to use AT instruction set for developing custom firmware,

please refer to TZU06 AT Instruction Manual and TZU06 DVK Products Manual.

4.3 Interface characteristics

ParameterTestconditions

Minimumvalue

Typicalvalues

Maximumvalue

Unit

UART Baud Rate 9600 115200 bpsAnalog channel resolution Half-duplex 7 12 bit

Analog input impedance 20 kΩ

Analog input voltage 2 3.3 V

Bus clock frequency 33 533 kHz

GPIO output voltage -0.3 3.6 V

Real-time clock frequency 32.768 kHz

Effective serial data 80 Bytes/packetMaximum packet rate 50 ms/packet

Table 4-1 TZU06B1 Interface Characteristics

TZU06B1 ZigBee wireless communication module provides a U.FL interface for attaching

the external SMA antenna. It is proposed to use the antenna and feeder provided by our

2I C



company so that the optimal RF performance of the module can be exerted.

5 Firmware Description

5.1 Firmware introduction

TZU06B1 ZigBee wireless communication module solidifies the boot program inside and

supports the serial update of new firmware. In order to enter into the serial update mode,

the module just needs to receive the special data 0xF8 through serial port within 3

seconds after power-cycling or resetting the module. In order to avoid the module

mistaken entering into the update mode, you must ensure that the special data 0xF8

cannot be received through serial port within 3 seconds after power-cycling or resetting

the module.

In addition to the serial port upgrading function, the module also contains TZU06 AT

instruction interface provided by our company. Please see details in TZU06 AT Instruction

Manual. For firmware updating, see www.cdiyue.com. Each module has only 64-bit

identifier stored in FLASH, and these identifiers are similar to the MAC address in PC.

Command and response in AT instructions realize the communication through the serial

port of TZU06B1 module, thus only one simple serial terminal software is needed to

conduct the operations under various instructions. We have provided TZU06 AT

instruction configuration tool, and you can also select other serial terminal tools.

AT instruction set that TZU06B1 module has been pre-loaded is based on Z-Stack-

CC2530-2.5.1a and it can be used as coordinator, router and end device. An end device is

not equipped with wiring function, so it can be ready to go to sleep mode (so the end

device generally applies battery for power supply), and also can send and receive data

through the router of parent node. An end device is also equipped with the function to

constantly change its location and replace the parent node in the network.

A router is typically a mains power supply equipment, which is mainly responsible for the

http://www.cdiyue.com



cabling intelligence and data receiving and sending in the network.

Of course, TZU06B1 module also can act as a PAN coordinator and Trust Center and

through the control center of external host, it can easily use various instructions to set and

manage the whole ZigBee network.

5.2 Customized firmware

For customers who have batch requirements of TZU06B1 module, we can customize the

firmware on their demand.

5.3 Software interface

When using the default firmware provided by our company, you can control TZU06B1

module directly through AT instruction interface and the special register (S-Register)

stored in FLASH. If you want to understand the complete instruction list and the relevant

information of S-Register, please refer to TZU06 AT Instruction Manual .

6 Absolute Maximum Ratings

Parameter Symbol Min value Max value Unit Note

Supply voltage DDV -0.3 3.6 V

Pin voltage PINV -0.3 3.6 V

RF input level maxP 10 dBm

Output power outP 20 dBm

Storage temperature range stgT -40 125 ℃

Operating temperature range opT -40 85 ℃

Reflow temperature deathT 245 ℃Lead-freesoldering

Table 6-1 Limit Parameter



Notes:

The limit values given in Table 6-1 shall not be exceeded under any condition and

exceeding any one of the limit values may cause permanent damage to the device.

6.1 Environmental characteristics

Parameter Symbol Absolute maximumratings Unit Note

ESD1 THHBMV ±2 KV Description of human-bodymode circuit

ESD2 THCDMV ±500 V Description of chargeddevice model

Humidity level MSL MSL3 -

Table 6-2 Environmental Parameters

Notes:

Caution! ESD sensitive device. Precautions should be used when

handling the device in order to prevent permanent damage.

6.2 Recommended operating conditions

Parameter Min value Typical value Max value Unit Environment

Supply voltage 2 3.3 3.6 V

RF input power - - 10 dbm

RF frequency 2405 2480 MHz

Operating temperature -40 25 85 ℃ -

Relative humidity - - 95 %

Table 6-3 Recommended Operating Conditions



7 DC Electrical Characteristics

Test conditions：VDD=3.3V,TOP=25℃，fc=2400~2480MHz.

Parameter Test conditions SymbolParameter value

Min Typical Max

Supply Voltage DDV 2.0V 3.3V 3.6V

Power mode 0

Idle WI 8.1mA

RX RI 27mA

TX TI 166mA

Power mode 1 4μs wake-up 1PMI 0.2mA 0.3mA

Power mode 2 Sleep timer running 2PMI 1μA 2μA

Power mode 3 External interruption 3PMI 0.4μA 1μA

ResetresetI 1.2mA 2mA

Operate GPIO to hard

reset module resetT 18μs

Timer 1Timer running, using

32M XOSC 1TMI 90μA


32M XOSC 2TMI 90μA


32M XOSC 3TMI 60μA


32M XOSC 4TMI 70μA

Sleep TimerTimer running, using

32.753K RCOSC STMI 0.6μA

ADC Converting ADCI 1.2mA

FLASHErase ERAI 1mA

Burst write BOOSTI 6mA

Idle Current PM2 Mode I d l eI 1.5μA

RX Current RXI 25mA

TX Current

TX power = 0dBmTXI

53mA

TX power = 10dBm 76mA

TX power = 20dBm 164mA



3.3 , 25DD OPV V T ℃。

Wake up Time From sleep to active S to AT 100μs

Shutdown Time From active to sleep A to ST 5μs

Working time From idle to TX/RX i to wT 200μs

Converting time From TX to RX T RT 200μs

Table 7-1 DC Electrical Characteristics of TZU06B1

8 Digital IO Specifications

The digital I/Os of TZU06B1 ZigBee wireless communication module have the ratings

shown as Table 8-1.

Test conditions: VDD=3.3V,TOP=25℃.

Parameter Test conditionsSymb

ol

Parameter value

Minim

um

value

Typical

values

Maxim

um

valueLogic0 input voltage ILV 0.5V

Logic1 input voltage IHV 2.5V

Logic0 input current Input voltage 0V ILI -50nA 50nA

Logic1 input current Output voltage DDV IHI -50nA 50nA

I/O-pin pullup resistors PUR 20kΩ

I/O-pin pulldown resistors PDR 20kΩ

Logic0 output voltage, 4mA

pins

Output load current:

4mA

4OLV 0.5V


pins


4mA

4OHV 2.4V


pins


20mA

20OLV 0.5V


pins


20mA

20OHV 2.4V

Table 8-1 Digital IO Specification of TZU06B1

9 AD Converter Characteristics

TZU06B1 wireless communication module is equipped with AD converter which has the

following characteristics.

Support the resolution ratio from 7bits to 12bits and the corresponding



bandwidth is from 30kHz to 4kHz.

Provide 8 input channels (P0 port)

Support difference or single-ended input

Support various reference voltages: internal reference voltage, external

reference voltage VDD (external single-ended input signal and external

difference input signal)

Have the temperature sensor input channel (inside the module)

Automatically treat the periodical sample or convert the results through

serial numbers of the channels

Test conditions: VDD=3.3V,TOP=25℃

Parameter Test conditionsParameter value

UnitMin Typical Max

Input voltage 0 DDV V

External referencevoltage

0 DDV V

External differencereference voltageExternal reference

0 DDV V

Input impedance 200 k

Converting time

Resolution: 7 bits 4 s




Table 9-1 AD Converter Characteristics of TZU06B1



10 AC Electrical Characteristics

10.1 RF Characteristics

Test conditions: VDD=3.3V,TOP=25℃, TZU06B1 connect externally 50Ω load.

No Parameter Test conditions Min Typicalvalues

Max Unit

1 Frequency range 2400 2500 MHz

2 Channel numberSee Table 10.2 for thecorrespondence betweenchannel and frequency

CH11 CH26

3 Input impedance 47 53 Ω

4 Receiver sensitivity PER=1% -102 -99 -98 dBm

5Input level Inputvoltage

PER=1% 10 dB

6Adjacent-channelrejection, 5MHzchannel spacing

Wanted signal –82 dBm,adjacent modulation channelat +5MHz, PER=1%

49 dB

7Adjacent-channelrejection, -5MHzchannel spacing

Wanted signal –82 dBm,adjacent modulation channelat -5MHz, PER=1%

49 dB

8Adjacent-channelrejection, 10MHzchannel spacing

Wanted signal –82 dBm,adjacent modulation channelat +10MHz, PER=1%

57 dB

9Adjacent-channelrejection, -10MHzchannel spacing

Wanted signal –82 dBm,adjacent modulation channelat -10MHz, PER=1%

57 dB

10Channel rejection,≥20MHz,≤-20MHz

Wanted signal –82 dBm,Undesired signal is anIEEE802.15.4 modulatedchannel, stepped through allchannels from 2405 to 2480MHz, PER=1%

57 dB

11 Co-channelrejection

Frequency of interferencesignal is same as that of

-3 dB



12Frequency errortolerance

Minimum: ±80ppm ±150 ppm

13Symbol rate errortolerance

Minimum: ±80ppm ±1000 ppm

14Error vectormagnitude(EVM)

Output power at lowestpower setting:20dBm

2%

15Actual maximumoutput power


19.7 20.3 dBm

16Actual minimumoutput power


-0.8 0.1 dBm

Table 10-1 RF Characteristics of TZU06B1 RF Transceiver

Notes:

The previous relation between the setting output power and actual output power of

TZU06B1 wireless communication module is detailed at Section 10.2. When the output

power of the module shall be set, please refer to S01 of S-register in TZU06 AT Instruction

Manual.

Channel Frequency(center) Channel Frequency (center)

CH11 2,405MHz CH19 2,445MHz

CH12 2,410MHz CH20 2,450MHz

CH13 2,415MHz CH21 2,455MHz

CH14 2,420MHz CH22 2,460MHz

CH15 2,425MHz CH23 2,465MHz

CH16 2,430MHz CH24 2,470MHz

CH17 2,435MHz CH25 2,475MHz

CH18 2,440MHz CH26 2,480MHz

Totally 16 channels, frequency coverage: 2400MHz--2483MHz

Table 10-2 Channel VS. Frequency of TZU06B1



No Parameter Test conditions Minim Typica Maxim Unit

1Power on resetPOR time

Ensure the successful reset (adda RC network)

21.7 ms

2 Impulse reset timeSuccessful reset 18 s

Unsuccessful reset 0 1 s

Table 10-3 TZU06B1 Reset Specifications

10.2 TX Power Characteristics

The diagram below(Fig.10-1) shows the typical output power in dependency on TZU06B1

power setting at 3.3V and room temperature.

Fig. 10-1 Setting Power VS. Output Power of TZU06B1



10.3 Temperature characteristics

Fig.10-2 and Fig.10-3 illustrate the temperature behaviour of the TZU06B1 module.

Please note that although the temperature behaviour of sensitivity was measured to up

to 100℃ the absolute maximum rating is 85℃.

Fig. 10-2 Temperature VS. Signal Sensitivity of TZU06B1

Fig. 10-3 Temperature VS. Transmitting Power of TZU06B1



11 Physical Dimensions and Footprint

11.1 Physical Dimensions

Fig. 11-1 Physical Dimensions of TZU06B1

Parameter Parameter Description Parameter value

W Module width 16mm

L1 Module length 26mm

A1 Distance between semi-holes 1.27mm

A2 Distance from semi-hole to PCB 0.8mm

A3 Distance from U.FL center to PCB edge 2.44mm

A4 Distance from U.FL center to PCB edge 1.48mm

Table 11-1 Physical Dimensions of TZU06B1



11.2 Recommended Footprint

L

1.27mm1mm

1.2mm

1 12

1324

17mm

Fig. 11-2 Recommended Footprint of TZU06B1

Notes:

1. When the surface mounted TZU06B1 ZigBee wireless communication module is

used, it is suggested that the bonding pad shall be 1mm wide and 1.2mm high.

2. L=26mm.

3. You must ensure that the corresponding PCB of “keep-out area” part in Fig. 3-1 shall

have no any device, running line or applied copper.

4. You must also ensure that there is no exposed copper on your layout which may

contact with the underside of the module.

5. To get the best RF performance, it is recommended that each GND pin shall be

connected to a complete ground level.

6. It is recommended to use multiple vias between each ground pad and a solid ground

plane to minimize inductivity in the ground path.



12 Soldering Temperature Time Profile (for reflow

soldering)

12.1 Recommended temperature time profile for lead-free solder

Fig. 12-1 TZU06B1 Temperature Profile for Lead-free Solder

Notes:

Preheat: The recommended temperature climbing speed shall be 2℃/s and not exceed

2.5℃/s at the preheat area.

Cooling: The recommended temperature descent speed shall be 3℃/s and not exceed

4℃/s at the cooling area.

Maximum Reflow Cycles of the module: twice

The module must not be placed at the bottom of PCB board for

reflow soldering (if the module is placed at the bottom of PCB

board for reflow soldering, device inside the module will drop off

due to gravity).



13 Reliability Test

To guarantee the environment adaptability of TZU06B1, we have done the the following

measurements.

Table 13-1 Reliability Test of TZU06B1

No Test items Test methods

1 Vibration testSetting the vibration frequency of 50Hz, amplitude of 1.5mm,and each side of XYZ vibrates for 20 minutes respectively

2 Shock testThe module is dropped from the height of 50cm to hard floor tocarry out the test for 3 times

3 Heat cycle testCharged operation of module: start temperature of cycle:25℃-->-40℃ (30 minutes) -->85℃ (30 minutes), for 5 cyclesbetween high and low temperature

4 Moisture testModule operates at the environment of + 60℃ and 90% RH for24 hours

5Low temperaturecold start test

Module will be powered after placed in the environment of-40℃ for 1 hour

6Low temperaturetest

Operating in the environment of -40℃ for 3 * 24 hours

7High temperaturetest

Operating in the environment of +85℃ for 3 * 24 hours



14 Application Precautions

14.1 Safety precautions

Before use of TZU06B1, check and evaluate their operation when mounted on your

products . These products may short-circuit. If electrical shocks, smoke, fire, and/or

accidents involving human life are anticipated when a short circuit occurs, then provide

the following failsafe functions as a minimum :

(1) One protective circuit shall be designed or the protective device shall be installed to

ensure the system safety

(2) One redundant circuit or one system shall be designed to prevent the safety loopholes

due to single malfunction so as to ensure the system safety.

14.2 Engineering design and using precautions

（1）Excess temperature during use of the products is the major factor of shortening the

life of the products. Thus, full consideration of the impacts of heat radiation shall be taken

in the design or use of the products to ensure that the environment temperature of the

products shall not exceed the maximum operable temperature.

（2）Otherwise, it may cause the reduction of the product performance and damage the

products.

（3）If impulse or other transient load will be loaded to your products, the operation of

TZU06B1 module must be inspected before installation and the potential impacts on the

products shall be evaluated.

（4）When the products are used under the following special environment, the product

manual shall be carefully read and the using of performance and reliability of TZU06B1

must be evaluated;

Liquid environment. Such as water, saline water, paint, alkali, organic solvent or

other possible sprinkle liquid



The environment of direct sunshine, outdoor or dusty environment

Environment easy to condensation

Environment with high concentration and harmful gases (such as air with salt,

muriatic acid, chlorine, sulfur dioxide, sulfuretted hydrogen, ammonia gas or

nitrogen oxide)

（5）Mechanical stress shall be avoided in assembly or operation of TZU06B1.

（6）Do not press the shielding cover or tighten the objects to the shielding cover

（7）When the TZU06B1 is working, the safe distance between it and human body must

be greater than 20 centimeters.

14.3 Storage conditions

(1) TZU06B1 must not be stressed mechanically during storage

(2) Performance characteristics of the module shall not be evaluated under the following

environment and the storage under this environment may have a large impact on the

performance of TZU06B1 (such as RF performance).

Salty air or environment with high concentration corrosive gases (such as

Cl2,H2S,NH3,SO2,OR NOx )

Storage in direct sunshine

Storage in an environment where air humidity exceeds 85%

(3) After the above-mentioned conditions are satisfied, the storage time of the module

during assembly of final products shall not exceed two years.



15Packaging

15.1 Carrier tape

Fig. 15-1 Dimension of Carrier Tape (Top View)

Fig. 15-2 Diagram of Cover Tape

Fig. 15-3 Diagram of Empty pocket



Fig. 15-4 Orientation of TZU06B1

15.2 Reel

Fig. 15-5 Reel Dimensions

Each reel will be packed in a electrostatic shielding bag



16 Ordering Information

Product code Brief description

TZU06B1

Based on CC2530 + CC2591 chip solution from TI TZU06 AT instruction U.FL interface (for attaching external SMA antenna) 16mm * 26mm * 3.7mm Visible barrier-free communication distance is 2700m @-69dBm

TZU06DVK

Development Kit

Development kit contains

5 X TZURF-EVB Development Boards

2 X TZU06A1 on Carrier-Board



2 X TZU06B2 on Carrier-Board

1 X TZU06USB

2 X Pulse 2.0dbi antenna

2 X RF feeder

2 X molex Micro-USB-to-USB-A data cable

DIYUE Terminal and user manual

DIYUE Firmware Update Tool

TZU06 Development Kit User Manual TZU06 series module firmware



17 Drawing of Product Label

Fig. 17-1 TZU06B1 Product Label

The label dimensions are 12.5mm*20.4mm and the label will withstand temperatures used

during reflow soldering.

Mark Detailed Description

TZU06B1 Module model

CE0168 CE0168 mark

2D-Barcode2D-Barcode shall include four parts: product batch, hardwarereversion,module model and product serial number

150621 15: product batch;06:hardware reversion; 21: product category

215810934600 Product serial number



18 Disclaimer

We reserve the right to modify or improve the product, company name and LOGO at any

time without prior notice. In addition, Chengdu Diyue Technology Co., Ltd. does not

convey any license under its patent rights or assume any responsibility for the use of the

described product.

19 RoHS Declaration

Statement of compliance of TZU06B1 ZigBee wireless communication module to EU

environmental protection:

Hereby we declare to our best present knowledge based on the declaration of our

suppliers that TZU06B1 does not contain the following substances which are banned by

Directive 2011/65/EU (RoHS) or if they do, contain a maximum concentration of 0,1% by

weight in homogeneous materials for:

Lead and lead compounds

Mercury and mercury compounds

Hexavalent Chromium

PBB (polybrominated biphenyl) category

PBDE (polybrominated biphenyl ether ) category

And a maximum concentration of 0.01% by weight in homogeneous materials for:

Cadmium and cadmium compounds

20 Data Sheet Status

In order to improve design performance and supply the best possible products to

customers, Chengdu Diyue Technology Co., Ltd. reserves the right to change the product

specifications without notice. Please download the latest product specifications provided

by our company before initiating or completing one design.



21 Reference Documents

[1] Data sheet CC2530.TI. (www.ti.com-CC2530)

[2] Data sheet CC2591.TI. (www.ti.com-CC2591)

[3] Z-Stack-CC2530-2.5.1a (www.ti.com-Z-Stack-CC2530-2.5.1a)

22 Contact Information

Website: www.cdiyue.com

China Sales

Tel: 028-85106132

Fax: 028-85189190

E-mail: [email protected]

International Sales

Tel: 0086-28-85327536

Fax: 0086-28-85189190

E-mail: [email protected]

http://www.ti.com.cn/product/cn/CC2530?keyMatch=CC2530&tisearch=Search-CN-Products

http://www.ti.com.cn/product/cn/CC2591?keyMatch=CC2591&tisearch=Search-CN-Products

http://www.ti.com.cn/tool/cn/Z-STACK?keyMatch=Z-Stack-CC2530-2.5.1a&tisearch=Search-CN-Everything

http://www.cdiyue.com

[email protected]

[email protected]