35
XC9500X L

XC9500XL. XC9500XL Overview Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

Embed Size (px)

Citation preview

Page 1: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

XC9500XL

Page 2: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

XC9500XL OverviewOptimized for 3.3-V systems

0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming Endurance = 10,000 Charge Retention = 20 years

Meets performance requirements high fMAX = 200 MHz / fast tPD = 4 ns

Best ISP/JTAG support in industry

Best pinlocking in industry

Advanced packaging - New CSPs !

Page 3: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

XC9500XL ArchitectureNew extra-wide function block inputs

– Uniform– Identical Functional Blocks– Identical Macrocells– Identical I/O pins – 5 ns pin-to-pin– 36 to 288 Macrocells (6400 gates)– Abundant Global Product Term Resources– Hysteresis on all inputs– Pullup/Bus Hold Option on Pins at power on – Great synthesis results– Best pinlocking results

Page 4: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

FastCONNECT II Switch Matrix

Very High Speed Switch Matrix

2nd Generation switch matrix

Used Fast Flash technology

Greater connectability for all signals

High routability at high utilization

Software delivers high speed automatically

Substantial power reduction

Page 5: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

XC9500XL Feedback Paths

FastCONNECT

Pin

LocalMacrocell

FastCONNECT

FB X

Macrocell

Macrocell

Pin feedback

FastCONNECT feedback

Local feedback

Page 6: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

XC9500XL Function BlockHandles SDRAM address width with 54 inputs

highest function block fan-in on fast CPLDs

Page 7: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

XC9500XL Macrocell

Local macrocell clock inversion control

Flexible clocking and three-state control

Page 8: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

Product Term Allocator Cascading

2 p-terms requiredhere

5 available here

5 available here

5 native p-terms

3 available here

Total = 18requires 2 cascade timesadded to tPD

Page 9: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

Voltage Compatibility

CORELOGIC

VCCINT = 3.3V VCCIO = 3.3V/2.5V

Note: output p-channel gives full rail swing

Page 10: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

Voltage Compatibility 2.5/3.3/5V

5V

3.3V

Any 5V TTL

device

XC9500XL

Any 2.5/3.3V

device

VCCIO VCCINT

5V

3.3V

3.3V

2.5/3.3V

2.5V

VCCINT

Page 11: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

XC9500XL Voltage Compatibility Summary

VIL

VIH

VOL

VOH

5V CMOS 5V TTL 3.3V LVCMOS 3.3V LVTTL 2.5V Normal

3.3V 3.3V

X XX

X

X

X

X

X

X

X

X

X

X

XX

X

X

X

EIA Standard Voltage Levels

No Power Supply Sequencing Restriction

Page 12: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

Input Signal Hysteresis

VOH

VOL

1.40V 1.45V

VOUT

VIN (VOLTS)

(VOLTS)

50 mV

Page 13: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

Power Optimization

67% decrease from 5V CPLDs

Low power option per macrocell

Even lower power if I/Os swing 0-2.5V

FastCONNECT II lower power than XC9500

I/Os swing full VCCIO range with p-channel pullups (shuts off attached external logic)

Page 14: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

ISP (In System Programming)

Original XC9500 JTAG and ISP instructions

New instruction: CLAMP permits pin by pin definition of logic level

Added S/W support with XACT M1.5

Same third party and ATE support package as XC9500 CPLDs (HP, GenRAD, Teradyne)

Page 15: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

XC9500XL Fits In Industry Standard JTAG Chains

XC9500 XC4000EX

uP

DSP

ASICXC9500

TDI

TDO

TMSTCK

Page 16: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

Third Party ATE Support

Hewlett-Packard

Teradyne

Gen-RAD

Common Support for both Xilinx FPGAs and CPLDs.

Page 17: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

Advanced CSP Packaging

Supports high-growthmarket segments:Communications,Computers, Consumer

Uses standard IRtechniques for mounting

to PC board

Page 18: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

What’s Key for Pin-Locking

Must retain pinouts as the design evolves best done when the design software initially assigns pins different from pinout pre-assigning strong function of utilization in typical CPLD architectures result of both architecture and software strategy

Pin-locking is valuable eliminates or reduces PC Board rework minimizes time to market, saves money lowers designer frustration, risk

Page 19: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

3 Keys to Pin-Locking

FunctionBlock

FastCONNECT

JTAG

Global3-State

GlobalS/R

GlobalClocks

FunctionBlock

FunctionBlock

FunctionBlock

FunctionBlock

FunctionBlock

FunctionBlock

2nd generation switch matrix:

Complete interconnect of all pins & blocks

All pin-to-pin paths at full speed

FunctionBlock

Fully PopulatedSwitch Matrix

Page 20: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

3 Keys to Pin-Locking

ToFastCONNECT

23 Global3-State

GlobalClocks

I/O

I/O

FromFastCONNECT

54

Macrocell 1

ANDArray

Macrocell 18

ProductTermAllocator

Wide FunctionBlock Fan-in

Flexible MacrocellLogic Allocation

Page 21: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

XC9500XL Supports Design Changes with Fixed Pinouts

Design Change XC9500XL Feature

Add another input FastCONNECT switch matrixpin or FB output with 100% connectivity

Add more logic in XC9500 allows expansionthe macrocell up to 90 P-terms

Add additional input 54 total inputs are available connections to the FB plus FastCONNECT

AND gate capability

Page 22: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

Pin-Locking Compare Table

Routability Excellent Good* Poor Good

Notes: * Decreases with density

Xilinx

XC9500XL

Altera

Max7KS

Lattice

1K/2K/3K

AMD

Mach5

54

Yes

90

Yes

32

No No

No

36

No

18/24

No No

32 32

32

Fully populated switch

Maximum pterms/Mcell

Bi-directional individual

product term allocation

Function block fan-in

Page 23: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

XC9500XL Other Features

Enhanced Data Security Features Read security bits prevent unauthorized reading Write security bits prevent accidental program/erase

Reduced power option per macrocell

3.3v/5v outputs

24 mA, 100% PCI compliant

Output Noise Reduction Slew rate control User programmable ground pin

capability

User Programmable Ground Pin

User I/O Pin

Ground Pin

User I/O Pin

Internal Logic

Additional Ground Pin• Lower ground inductance• Reduce ground noise

Page 24: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

54-input Function Block

CLAMP instruction

2.5V/3.3V/5V I/O Capability

Invertible Local & Global P-Term Clocks and OEs

Input Hystersis +/-50mV

Bus Hold

Common ISP/JTAG Support for CPLDs/FPGAs

Superior connectivity & performance

Better control of board & system signals during ISP

Easy multi-voltage interfacing

Max number of clock & OE options

Improves noise margin; better slowsignal response

Totally controlled board initialization

One language supports all Xilinx products

Xilinx Feature System Designer Benefit

XC9500XLSystem Designer’s CPLD

Page 25: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

Xilinx CPLD Solutions

tPD (pin-to-pin speed)

tSU (set-up speed)

Icc (supply current - typ)

Specification XC9500-5XL* XC9500-5**

tCO (clock-to-out speed)

tOE (output enable speed)

fSYS (system speed)

Voltage

5ns*

3.7ns

11mA (Low Power)18mA (Hi Perf)

3.5ns

4ns

178.6MHz

3.3V

5ns

4ns

30mA (Low Power)50mA (Hi Perf)

4ns

5ns

100MHz

5V

* XC9500XL also available in 4ns version** New 5V speed specifications (as of 9/98)

5ns COMPARISON

Page 26: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

XC9500XL Family

9536XL

Macrocells

Usable Gates

tPD (ns)

36 72

800 1600 3200

4 5 5

196 178 178

PackagesQFPs

44PC64VQ

48CS

44PC64VQ100TQ

48CS

100TQ144TQ

144CS

288

6400

6

151

208PQ

352BG

9572XL 95144XL 95288XL

CSPs/BGA

fMAX (MHz)

144

144TQ

Page 27: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

CPLD Solution for PC99 SDRAM Controller Example

Processor

Personal ComputerPersonal Computer SpartanXLUSB interface/

FireWireinterface

Dev

ice

Bay

MemoryXC9500XLSDRAMController

USB,FireWire

interfaces

USBUSBFireWireFireWire

Page 28: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

Challenges Facing the Design Engineer

100 MHz minimum speed

Multiple SDRAM protocols

Sufficient address width

Clock flexibility

Resources for future expansion

Small package

HDL entry

Cost control

Minimal programming overhead

Board layout before design is complete

Design time

Three-state flexibility

3.3V/2.5V

Page 29: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

Memory Interface Block Diagram

SDR

AM

s

Clock

WriteReset

Address[23:0] Address[11:0]

CSRASCAS

WE

Data[15:0]

Complete SDRAM Controller in a single CPLD

Mic

ropr

oces

sor

CPLD SDRAM Controller

Page 30: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

SDRAM Interface Close-up

Address[23:0]

Data[15:0]

ADDR[11:0]

Clock

Reset

Write

CS

RAS

CAS

WE

ADDR[23:12]

ADDR[11:0]

Refresh Counter

Address DecodeChip

SelectMode

Register

State Machine

Page 31: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

Design in VHDL, Verilog, ABEL,

etc.

Submit designto WebFITTER

Evaluateresults

1 2 3

CPLD Design on the Web

No software to load no user resources needed no license

WebFITTER software always current no upgrade CDs

Runs fast on network (minutes)

Page 32: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

WebFITTER Intro Page

Page 33: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

WebFITTER Activity Report

Page 34: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

WebFITTER Report File

Page 35: XC9500XL. XC9500XL Overview  Optimized for 3.3-V systems 0.35 micron FastFLASH technology 4 Layers of Metal compatible levels with 5.0/2.5V Reprogramming

SDRAM Controller Implementation in XC9500XL

Results for XC95144XL

Utilization 52% of capacity available for other logic

Speed faster than required for 133 MHz clock

Lowest-cost solution

Compare to chip sets and other CPLDs