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3DInCites.com
WHO ARE WE?• An online community platform for the discussion of heterogeneous integration and
related semiconductor manufacturing technologies. • A resource for industry news, technology innovation, market analysis, and opinion• A place to learn, share, engage, and collaborate with fellow heterogeneous integration
enthusiasts. • Supported by an advisory board of heterogeneous integration experts from R&D,
manufacturing, market research, design, and test.
2017 3D INCITES AWARDSThe 3D InCites Awards program recognizes achievements to further the commercialization of heterogeneous integration technologies. Awards are presented to companies or individuals whose technologies have made a significant contribution to the advancement of the heterogeneous integration roadmap including 3D packaging, interposer integration, advanced fan-out wafer-level packaging and systems integration. Proceeds from the event go to support science-technology-engineering- mathematics (STEM)-related education programs and scholarships.
3D INCITES ATTRACTS A GLOBAL AUDIENCE OF HETEROGENEOUS INTEGRATION ENTHUSIASTS
THE VALUE OF 3D INCITESAs a brand, 3D InCites is recognized throughout the semiconductor industry for its active representation at heterogeneous integration and related technology events around the globe including:
• European 3D Summit, Jan. 23-25, 2017, Grenoble, France• IMAPS Device Packaging Conference, March 6-9, 2017, Fountain Hills, AZ• IEEE Electronic Components Technology Conference, May 30-June 2, 2017, Lake Buena
Vista, FL• SEMICON West, July 11-13 2017, San Francisco, CA• European MEMS Summit, Grenoble, France• International Wafer Level Packaging Conference, October 24 - 26, 2017, San Jose, CA • MEMS Executive Congress, Nov. 1-2, 2017 Napa Valley, CA • 3D Architectures for Semiconductor Integration and Packaging, TBA Burlingame, CA
Audience over the last 12 months:
• 50,000 Users • 85,000 Sessions • 160,000 Page Views
• Canada• France• Germany• India• Japan
• Singapore• South Korea• Taiwan• United Kingdom• United States
2017
WINNER
The only online resource devoted exclusively to heterogeneous integration technologies.
“3D InCites brings to life the people, the personalities, the ideas, and the minds behind our industry in a uniquely personal way.”
Rajiv Roy, Rudolph Technologies
3DInCites.com
ADVERTISE• Position your company as a heterogeneus integration thought-leader in the
semiconductor industry.• Ensure your company message reaches industry professionals helping to build and
maintain industry awareness of your company, services, and products.• Align your company brand with the credible and esteemed content of 3D InCites.
A resource library of contributed technology features, white papers, book reviews, and market research dedicated specifically to 3D integration and heterogeneous integration topics. Limited to 2 sponsors: $10,000/year
3D InCites In Review• Special Edition eNL: Exclusive sponsorship of special edition eNL blasts of dedicated
event content. eNL banner will display your logo with “made possible by”, as well as the logo of the event being covered. $2000/event
• Sponsored blog posts: Your company blog post will be featured in the 3D InCites eNL. Headline, feature image, and 50-word teaser links to the full post on your company blog. $500/issue
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LEADERBOARD BANNER6 months - $6,70012 months - $12,000(728 x 90 pixels)
BOX BANNER6 months – $6,00012 months - $10,500(200 x 200 pixels)
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For sales and general inquiries contact: [email protected]
Notes: Published rates based on 3 positions per spot. 10% discount for 3D InCites Award Winners. Monthly rates are available.
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