AML · Wafer Bonding Machines & Services MEMS, IC, III-Vs…. AML AML Corporate Presentation Sept 2012

Wafer Bonding Machines & Services

www.aml.co.uk MEMS, IC, III-Vs….

AML

AML Corporate Presentation

Sept 2012

www.aml.co.uk



OXFORD, ENGLAND

1HR FROM LONDON

Applied Microengineering Ltd (AML) I

• Privately owned SME by two founders Rob Santilli, CEO & Tony

Rogers, Technical Director. No other shareholders.

• AML is an independent private company established in 1992. 20

years old this year

• AML manufactures unique in-situ aligned wafer bonding machines &

provides services based around wafer bonding in its state-of-the-

art multi-million $ BONDCENTRE facility in Oxfordshire.

• AML’s unique Aligned Wafer Bonder machines, the only machines

capable of in-situ alignment, activation & bonding on the market, are

particularly suited to the bonding requirements of MEMS, IC, & III-V

industries. The machines have the flexibility for R&D and the

throughput and automation for volume production as well as the

lowest cost of ownership & first class support.

• The unique platform allows processes not possible on other

machines e.g. iCAB in-situ Chemistry Align & Bond



Applied Microengineering Ltd (AML) II

• AML’s machines & services are sold worldwide via agents &

distributors: China, Hong Kong, USA, India, Israel, Europe, Canada,

Japan, Korea, Taiwan, Singapore, Egypt, Russia and Australia.

• AML’s comprehensive BONDCENRE provides services from the

development of bonding processes to a commercial bonding service

– one off to volume. Associated services include CMP, powder

blasting, electroplating, screen printing & metrology, a ‘One Stop’

wafer bonding service

• AML’s BONDCENTRE offers the perfect venue for those involved in

device fabrication, 3D integration, TSV and Wafer Level Packaging.





AML History I

• Company founded 1992 - Private SME

• One of the first Companies in the world formed to exploit Design & Manf of MEMS devices; Field emitters (Nano-tips), Cap P sensors Sun sensor, Electro-chemical, “nose” substrates.. Founders also made first in-situ Aligner-Wafer Bonder in 1985 for in-house use.

Glass

Silicon

Insulator

Pressure

Au electrode

How it started –

Capacitive Pressure

sensors in 1985

Capacitance gap 0.5 µm



AML History II

• Also Design house for Bosch, Tronics,

Onstream & SensorNor

• High Risk low return - Goodbye Mr. Chips

• Easier to make $ building machines!

• Last 12 years AML moved to equipment

manufacturer & service provider centred

around WAFER BONDING

• Worldwide installed base of machines



Products

• Aligned Wafer Bonding machines

Services - BONDCENTRE

• Commercial Wafer Bonding service

• Bonding process development, tech transfer & training

• Associated Processes: cleaning, activation, structuring e.g. Powder blasting (holes) Deposition; Glass frit, Eutectic Electroplating (e.g.vias), CMP & wafer characterisation; Profile, TTV, Ra, & inspection; SAM, IR..



Wafer bonding has found many applications in

field of MST, MEMS, III-V, ICs & Optical devices:

• MEMS devices - Pressure Sensors, Accelerometers, Microfluidics

• Vacuum encapsulation (absolute pressure, IR detectors…)

• 1st Level Packaging to isolate package induced stresses.

• Wafer scale Packaging – MEMS & IC

• III-Vs e.g. high performance LEDs bonded reflector - heat sink

• 3D Interconnects

• Temporary bonds for handle wafers (interlayer & direct)

• Advanced bonded substrates e.g. Si on Glass (SOG), GaAs on Si…

• Layer transfer - Smart cut

Front

End

Back

End

Bonded

Substrates FAB

WLP

3D Starting material Packaging & Int

Device construction



Manual Load

Fully

automatic

Robot Wafer

Load

Fully

automatic



BONDCENTRE Wafer bonding services to the MNT community:



BONDCENTRE SERVICES OFFERED

• Development of Wafer Bonding & associated Processes e.g. for many novel materials; silicon, glass, sapphire, strained silicon, InP, GaAs,…>25 years MEMS experience

• Wafer Bonding process selection & design for your application

• Commercial Wafer Bonding Service prototype to production & products e.g substrates

• Wafer Bonding Technology Transfer (inc Equipment) & Training

• Associated Processes (Pre & Post Bond)

• Applications knowledge for:

MEMS Smart cut layer transfer

Advanced Substrates Wafer Level Packaging

3D integration Vacuum Encapsulation

Temporary Bonding LEDs

Recognised experts & Funded by UK Government to provide services to Industry



• WAFER ALIGNER BONDERS 4 machines in Class 10

• Wafer METROLOGY; AFM, Ra, PROFILE, TTV

• WAFER CLEANING MEGASONIC & Activation

• NEW ‘RAD’ dry ACTIVATION

• INSPECTION: ACOUSTIC MICROSCOPE (SAM) & IR

• ELECTROPLATING: e.g. VIAS in Au, In, Cu & Ni

• SCREEN PRINT - GLASS FRIT/ADHESIVE

• Structuring e.g. Holes via POWDER BLASTING

• CMP

Also access via long term collaboration with CMF @ Rutherford to: • PHOTOLITHOGRAPHY DEPOSITION- PVD & CVD & FURNACES

• Standard ETCHING – DRY & WET

• WAFER SAW WIRE & BUMP BONDING

• METROLOGY: THIN FILM, LINE WIDTH, SEM

Pre & Post Bonding Services & Equipment



There are many wafer bonding processes, different

material combinations and methods of bonding..

Summary

• MEMS design & fabrication history

• Changed direction ~ 12 years ago to

exclusively focus on manufacturing

Aligned Wafer Bonding machines &

providing wafer bonding services

• Wafer bonding machines are supported

with extensive wafer bonding process

knowledge via BONDCENTRE



Documents

AML · Wafer Bonding Machines & Services MEMS, IC, III-Vs…. AML AML Corporate Presentation Sept 2012