超高性能工程塑膠材料

UPI、PBI、PI、TPI、PEEK

適合半導體前、後段製程設備零配件、耗材。

李咨潤 allen 0966-507101

主題

關於PBI advanced materials Co., Ltd.

PBI Advanced Materials Co., Ltd.Product Development Group, UEP Div.

Mie

1. PBI 先進材料股份有限公司 │

PBI Advanced Materials Korea Co., Ltd.

Bucheon, Korea

PBI Advanced Materials Co., Ltd.

Tokyo officeTokyoWestern-Japan officeKumamoto

PBI Advanced Materials (Taiwan) Co., Ltd.

Taipei, Taiwan

Sato Light Industrial Co., Ltd.

HeadquartersAnotsudai factoryKameyama factoryMie

Tokai Denka Industrial Co., Ltd.

Kameyama factoryMieOita factoryOita

Qingdao Sato Light Co.,Ltd.

Qingdao, China

Tokyo

Fukushima

Kobe

6

PBI advanced material 材料三大應用

耐高溫Tg:425℃

HDT:480℃ 抗磨耗&

導電/

抗靜電耐酸鹼、

Plasma

工程塑膠材料種類與選擇

150℃

200℃

300℃Ultra Engineering Plastics

Stand Polymers

<Partially-Crystalline><Amorphous>

250℃

PBI Advanced Materials Co., Ltd.Product Development Group, UEP Div.

0

100

200

300

400

500

0 50 100 150 200

Hea

t d

efle

ctio

n t

emp

erat

ure

/ °

C

Tensile strength / MPa

2. PBi Shapes │ Polymers 高耐溫工程塑膠選擇

PBI

PI

PEI

PEEK

PPS

PESTPI PAI

PI

PI

PEKEKKPPSU

PBN

PC

PBT

POM

PA-6

PA-66

Mechanical strength

He

at r

esi

stan

ce

High performance plastics

5000 series

8000 series7000 series

6000 series

4000 series

6000 series

PBI Advanced Materials Co., Ltd.Product Development Group, UEP Div.

0

1

2

3

4

5

CF4 95% CF4 +5% CHF3

O2 O2

Etch

ing

rati

o /

wt%

SCM7000

Vespel® SP-1

3. PBI & PI products │ Plasma etching 電漿蝕刻應用

-Plasma etching testTest 1. CF4, 95% CF4 + 5% CHF3, O2

Test piece: 100x100x10 mmPower: 80 WPressure: ~0.3 TorrTemperature: 107°CExposure: 50 hr

Test 2. O2

Test piece: 50x50x3 mmPowder: 200WPressure: ~0.6 TorrTemperature: RTExposure: 50 hr

Reference: Dry etching gases

Material Gas

Si, SiO2 CF4, CHF3, C4F8

Si3N4 CF4+O2, SF6

poly-Si, WSi Cl2+HBr, SF6

Al, Al+Si, Al+Cu Cl2+BCl3, Cl2+CCl4W SF6

Organic thin layer O2

Test 1 Test 2

almost the same

~Quarter

Depends on exposure conditions?

These data are not to be construed as specifications.

PI

PBI Advanced Materials Co., Ltd.Product Development Group, UEP Div.

0

1

2

3

4

5

200 300 400

Sto

rage

mo

du

lus

/ G

Pa

Temperature / °C

SCM7000SCM6000NT1Vespel® SCP-5000Vespel® SP-1

0

100

200

300

0 100 200 300

Flex

rual

str

engt

h /

MP

a

Temperature / °C

SCM7000SCM6000NT1Vespel® SCP-5000Vespel® SP-1

3. PBI & PI products │ Thermal properties―Short term 瞬間耐熱特性比較

~50°C

~100°C

Mechanical strength under high temp. of

SCM7000 (300°C)

SCM6000NT1 (200°C)

shows higher than that of SP-1 at 23°C.

Inflection point of

SCM7000: ~100°C higherSCM6000NT1: ~50°C higherthan that of SCP-5000.

These data are not to be construed as specifications.

PBI Advanced Materials Co., Ltd.Product Development Group, UEP Div.

0

100

200

300

400

500

0 50 100 150 200

Hea

t d

efle

ctio

n t

emp

erat

ure

/ °

C

Tensile strength / MPa

4. TPI & PEEK products 低溫材料選擇

PBI

PI

PEI

PEEK

PPS

PESTPI PAI

PI

PI

PEKEKKPPSU

PBN

PC

PBT

POM

PA-6

PA-66

Mechanical strength

He

at r

esi

stan

ce

High performance plastics

PBI Advanced Materials Co., Ltd.Product Development Group, UEP Div.

0

5

10

15

20

1E+07 -1E+08

1E+08 -1E+09

1E+09 -1E+10

1E+10 -1E+11

1E+11 -1E+12

1E+12 -1E+13

Freq

uen

cy

Surface resistance / Ω

4. TPI & PEEK products │ Silver series

適用於精密加工的防靜電等級材料.-適合精密微孔加工，不易變形

-毛邊易清理

-低吸水率

-相較於擠出成型的材料，具有穩定的電氣性阻抗

Before deburring [Top]

After deburring [Top]

After deburring [Bottom] Before deburring [Bottom]

200 μm

SCM5100 Silver PEEK Standard

SCM5100-15 Silver PEEK15 Low particle

SCM5100-50 Sliver PEEK50 High modulus

SCM6190 Sliver TPI High temp.SCM5100 machinability

SCM5100

50 μm

No. 1 No. 2 No. 3

These data are not to be construed as specifications.

Measurement: 20 points

PBI Advanced Materials Co., Ltd.Product Development Group, UEP Div.

PBI 專利熱壓成型技術

PBI Advanced Materials Co., Ltd.Product Development Group, UEP Div.

2. PBi Shapes

Polymer(s)

Blending

PBI Method Compression molding

Stock shape

Compounding (2axicis)

Pellet

Injection molding Stock shape

Extrusion molding Stock shapeFiller(s)

SCM series

SPR series

SPR series

SEM series

We will customize the components of the products for customer’s requirements.

Products

Techniques

PBI Advanced Materials Co., Ltd.Product Development Group, UEP Div.

High modulus grade for precision machining.-易於精密鑽孔加工

-加工後，毛邊易清理

-低吸水率

-耐摩耗性佳

-低介電常數

0

5

10

15

20

SCM

5200

-50

Torlo

n 50

30

MDS

100

Kyro

n 22

04

SUM

IKAS

UPE

R

Vesp

el S

CP-5

000

CEPL

A

Flex

ural

mod

ulus

/ GP

a

4. TPI & PEEK products │ Rigid series

SCM5200 Rigid PEEK Standard

SCM5200-15 Rigid PEEK15 Low particle

SCM5200-50 Rigid PEEK50 High modulus

SCM5200 machinability

These data are not to be construed as specifications.

PBI Advanced Materials Co., Ltd.Product Development Group, UEP Div.

Electric conductive grade.-Easy machining same as Natural PEEK

-Low water absorption

-Stable electric properties

-Low particle generation

0

500

1,000

1,500

2,000

CNT CB CF

Part

icle

s /

cou

nts

cm

-2

4. TPI & PEEK products │ ELS PEEK series

SCM5400 Compression Carbon Black

SCM5500ELS Compression CNT

SEM5500 Extrusion CNT

Particle generation

Sample: 50x50x2mmSolvent: 1000 ml IEWaterSonication: 100 kHz, 5 min

These data are not to be construed as specifications.

PBI Advanced Materials Co., Ltd.Product Development Group, UEP Div.

2. Applications with our Products

Flat panel manufacturing

-Wet station-Sputtering equipment-Spin coater-Stepper-Developer-Dry etcher-Stripper

Reflow soldering

-Reflow furnace

Standby pump

-Sliding bearing

-Ball bearing cage for turbo-charger unit

Automobile 自動車相關

-Wet station-Sputtering equipment-Spin coater-Stepper-Developer-Dry etcher-Ion doper-CMP-Wire bonder-Burn-in equipment-IC tester-IC handler

Semiconductor manufacturing