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TEK5-APL BOX PC PRODUCT MANUAL (TEK5-APL) VER. 1.00 December 2, 2019

TEK5-APL BOX PC PRODUCT MANUAL (TEK5-APL) VER. 1.00 ... · 7B 2x USB 2.0 Host connector 20D RS-XXX4 (Serial Port) DB9 connector 8 Remote Power button connector 21 DVI-D connector

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Page 1: TEK5-APL BOX PC PRODUCT MANUAL (TEK5-APL) VER. 1.00 ... · 7B 2x USB 2.0 Host connector 20D RS-XXX4 (Serial Port) DB9 connector 8 Remote Power button connector 21 DVI-D connector

TEK5-APL BOX PC PRODUCT MANUAL

(TEK5-APL)

VER. 1.00

December 2, 2019

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TEK5-APL HARDWARE MANUAL – VER 1.00 DEC 2, 2019

Page 2 of 47

REVISION HISTORY

Revision Date Originator Notes

1.00 December 2, 2019 TechNexion First public release

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TABLE OF CONTENTS

1. Introduction ............................................................................................................................................... 5

1.1. General Care and Maintenance ......................................................................................................... 5

2. TEP5-APL Product Overview .................................................................................................................... 6

2.1. Functional Block Diagram .................................................................................................................. 6

2.2. Dimensions ......................................................................................................................................... 7

2.3. External Connectors ........................................................................................................................... 8

2.4. Internal Board Connectors ................................................................................................................. 9

2.4.1. Wide Input Power Board (TEK5-Exxxx-Rxx-L-x-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx) ....................... 9

2.4.2. Wide Input Power Board with Power Ignition (TEK5-Exxxx-Rxx-P-x-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx) ..................................................................................................................................................... 10

3. External Connectors ................................................................................................................................ 11

3.1. Mini-SIM Card Slots .......................................................................................................................... 11

3.2. MicroSD Card Slot ............................................................................................................................ 11

3.3. LED Light Indicators ......................................................................................................................... 11

3.4. PWR Button ...................................................................................................................................... 11

3.5. Power Input Connector ..................................................................................................................... 12

3.6. USB Host Connectors ...................................................................................................................... 12

3.7. Remote Power Button Connector ..................................................................................................... 12

3.8. RST Button ....................................................................................................................................... 12

3.9. Gigabit Ethernet Interface (LAN1/LAN2) .......................................................................................... 13

3.10. Antenna Holes ................................................................................................................................ 13

3.11. Grounding ....................................................................................................................................... 13

3.12. SSD Drive Rack (optional) ............................................................................................................. 13

3.13. Galvanic Isolated Connectors (TEK5-Exxxx-Rxx-x-I-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx) (optional) ... 14

3.13.1. Galvanic Isolated Digital I/O Connector (GPIO) (optional) ...................................................... 14

3.13.2. Galvanic Isolated Serial Ports (RS-XXX1/RS-XXX2/RS-XXX3/RS-XXX4) (optional) ............. 15

3.14. Non-Galvanic Isolated Connectors (TEK5-Exxxx-Rxx-x-N-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx) (optional) .................................................................................................................................................. 18

3.14.1. Non-Galvanic Isolated Digital I/O Connector (GPIO) (optional) .............................................. 18

3.14.2. Non-Galvanic Isolated Serial Ports (RS-XXX1/RS-XXX2/RS-XXX3/RS-XXX4) (optional) ..... 19

3.15. DVI-D Connector ............................................................................................................................ 21

3.16. DP (DisplayPort) Connector ........................................................................................................... 21

3.17. VGA (15-pin D-SUB) Connector ..................................................................................................... 21

3.18. Audio Connectors ........................................................................................................................... 22

3.19. Optional Connector Holes .............................................................................................................. 22

4. Internal Connectors and Expansion Options .......................................................................................... 23

4.1. USB1 Header ................................................................................................................................... 24

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4.2. SATA 3.0 Connector and SATA Power Header ............................................................................... 24

4.3. SO-DIMM DDR3L Slots .................................................................................................................... 24

4.4. M.2 KEY-B Slots ............................................................................................................................... 24

4.5. RTC Battery Connector .................................................................................................................... 25

4.6. CMOS Jumper .................................................................................................................................. 25

4.7. JCOMV Jumpers .............................................................................................................................. 25

4.8. SW1/SW2/SW3/SW4 Switches ........................................................................................................ 26

4.8.1. RS-XXX1 (SW1/SW2) ............................................................................................................... 26

4.8.2. RS-XXX2 (SW3/SW4) ............................................................................................................... 26

4.9. COM5 Serial Port Box Header ......................................................................................................... 26

4.9.1. COM5 Galvanic Isolated Serial Port Box Header (TEK5-Exxxx-Rxx-x-I-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx) (optional) ................................................................................................................................ 27

4.9.2. COM5 Non-Galvanic Isolated Serial Port Box Header (TEK5-Exxxx-Rxx-x-N-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx) (optional) ........................................................................................................................ 27

4.10. COM6 Serial Port Box Headers ..................................................................................................... 28

4.11. GPIO Box Header ........................................................................................................................... 29

4.12. JVDIO1 Jumper .............................................................................................................................. 30

4.13. M.2 KEY-E Slot ............................................................................................................................... 30

4.14. Case Open Alert Header ................................................................................................................ 30

4.15. Mini-PCIe Slot ................................................................................................................................. 30

4.16. Power Fuse (TEK5-Exxxx-Rxx-P-x-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx) ............................................. 31

4.17. Backup Battery Connector (TEK5-Exxxx-Rxx-P-x-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx) ...................... 31

4.18. Power Ignition Control (TEK5-Exxxx-Rxx-P-x-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx) ............................. 31

5. BIOS Setup ............................................................................................................................................. 33

5.1. Entering and Exiting BIOS ................................................................................................................ 33

5.2. BIOS Setup Screens Overview ........................................................................................................ 33

5.2.1. Main ........................................................................................................................................... 34

5.2.2. Advanced ................................................................................................................................... 35

5.2.3. Chipset ....................................................................................................................................... 39

5.2.4. Security ...................................................................................................................................... 40

5.2.5. Boot ............................................................................................................................................ 41

5.2.6. Save & Exit ................................................................................................................................ 42

6. Mounting.................................................................................................................................................. 43

6.1. Surface Mounting ............................................................................................................................. 43

7. Ordering Information ............................................................................................................................... 44

7.1. Custom Part Number Rule ............................................................................................................... 44

7.2. Standard Package Contents ............................................................................................................ 45

8. Important Notice ...................................................................................................................................... 46

9. Disclaimer ............................................................................................................................................... 47

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1. Introduction

1.1. General Care and Maintenance Your device is a product of superior design and craftsmanship and should be treated with care. The following suggestions will help you.

• Keep the device dry. Precipitation, humidity, and all types of liquids or moisture can contain minerals that will corrode electronic circuits. If your device does get wet, allow it to dry completely.

• Do not use or store the device in dusty or dirty areas. Its parts and electronic components can be damaged.

• Do not store the device in hot areas. High temperatures can shorten the life of electronic devices, damage batteries, and warp or melt certain plastics.

• Do not store the device in cold areas. When the device returns to its normal temperature, moisture can form inside the device and damage electronic circuit boards.

• Do not open the device while power is on. Otherwise electrical shock may result.

• Do not drop, knock, or shake the device. Rough handling can break internal circuit boards and fine mechanics.

• Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the device.

• Do not paint the device. Paint can clog the parts and prevent proper operation.

• Unauthorized modifications or attachments could damage the device and may violate regulations governing radio devices.

These suggestions apply equally to your device, battery, charger, or any enhancement. If any device is not working properly, take it to the nearest authorized service facility for service. Regulatory information

Disposal of Waste Equipment by Users in Private Household in the European Union This symbol on the product or on its packaging indicates that this product must not be disposed of with your other household waste. Instead, it is your responsibility to dispose of your waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment. The separate collection and recycling of your waste equipment at the time of disposal will help to conserve natural resources and ensure that it is recycled in a manner that protects human health and the environment. For more information about where you can drop off your waste equipment

for recycling, please contact your local city office, your household waste disposal service or the shop where you purchased the product.

We hereby declare that the product is in compliance with the essential requirements and other relevant provisions of European Directive 2014/53/EU (Directive on the harmonisation of the laws of the Member States relating to the making available on the market of radio equipment and repealing Directive 1999/5/EC).

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2. TEP5-APL Product Overview

2.1. Functional Block Diagram

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2.2. Dimensions The following figure shows the TEP5-APL dimensions (unit: mm):

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2.3. External Connectors The TEP5-APL has a number of external connectors. Front side view: 1A 1B 2 3 4 12 6 7A 8 11 7B 5 13 14 10 15 9 16A 17 18 16B Rear side view: 19 20C 20A 21 22 23 20D 20B 25 24 26A 26B 26C External Connectors:

No. Description No. Description

1A SIM1 (Mini-SIM) card slot 16A Antenna hole

1B SIM2 (Mini-SIM) card slot 16B Antenna hole

2 microSD card slot 17 Grounding screw

3 LED Light 1/2/3/4 indicators 18 2.5” SSD Drive Rack

4 Power LED indicator 19 GPIO DB15 connector

5 SATA LED indicator 20A RS-XXX1 (Serial Port) DB9 connector

6 Power Input connector 20B RS-XXX2 (Serial Port) DB9 connector

7A 2x USB 2.0 Host connector 20C RS-XXX3 (Serial Port) DB9 connector

7B 2x USB 2.0 Host connector 20D RS-XXX4 (Serial Port) DB9 connector

8 Remote Power button connector 21 DVI-D connector

9 OPT-A connector hole 22 DP connector

10 OPT-B connector hole 23 3.5mm jack Mic in

11 2x USB 3.0 Host connector 24 3.5mm jack Line out

12 Power button 25 VGA (15-pin D-SUB) connector

13 Reset button 26A Antenna hole

14 LAN1 RJ45 connector 26B Antenna hole

15 LAN2 RJ45 connector 26C Antenna hole

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2.4. Internal Board Connectors The TEP5-APL has several connectors, switches and internal expansion options.

2.4.1. Wide Input Power Board (TEK5-Exxxx-Rxx-L-x-xxx-xxxx-xxxxx-x-xxxx-TI-

xxxx) Rear view (opened device) with the standard Power Expansion module:

A B C Power Board D2 R Q K D1 F E M O P G N2 L I2 N1 I1 H1 J2 H6 J1 H2 H2 H3 H5 Internal Connectors and Switches:

No. Description No. Description

A USB (1 port) header I1 SW1 RS-XXX1 Enable switch

B SATA Power connector I2 SW2 DIP switch for RS-XXX1 Serial Port

C SATA 3.0 connector J1 SW3 RS-XXX2 Enable switch

D1 SO-DIMM1 DDR3L slot J2 SW4 DIP switch for RS-XXX2 Serial Port

D2 SO-DIMM2 DDR3L slot K M.2 KEY-B slot (SATA 3.0)

E M.2 KEY-B slot (USB 2.0) L M.2 KEY-B slot (USB 2.0)

F RTC Battery connector M M.2 KEY-E slot (PCIe + USB 2.0)

G CMOS jumper N1 Serial Port (COM5) box header

H1 JCOMV1 jumper N2 Serial Port (COM6) box header

H2 JCOMV2 jumper O GPIO (DIO) box header

H3 JCOMV3 jumper P JVDIO1 jumper

H4 JCOMV4 jumper Q Open Case Alert header

H5 JCOMV5 jumper R mini-PCIe slot (PCIe + USB 2.0)

H6 JCOMV6 jumper

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2.4.2. Wide Input Power Board with Power Ignition (TEK5-Exxxx-Rxx-P-x-xxx-

xxxx-xxxxx-x-xxxx-TI-xxxx) Rear view (opened device) with the wide power input and power ignition Power Expansion module:

A B C Power Board D2 S R Q K D1 F E M O P G N2 L I2 N1 I1 H1 J2 H6 J1 H2 H2 H3 H5 Internal Connectors and Switches:

No. Description No. Description

A USB (1 port) header I1 SW1 RS-XXX1 Enable switch

B SATA Power connector I2 SW2 DIP switch for RS-XXX1 Serial Port

C SATA 3.0 connector J1 SW3 RS-XXX2 Enable switch

D1 SO-DIMM1 DDR3L slot J2 SW4 DIP switch for RS-XXX2 Serial Port

D2 SO-DIMM2 DDR3L slot K M.2 KEY-B slot (SATA 3.0)

E M.2 KEY-B slot (USB 2.0) L M.2 KEY-B slot (USB 2.0)

F RTC Battery connector M M.2 KEY-E slot (PCIe + USB 2.0)

G CMOS jumper N1 Serial Port (COM5) box header

H1 JCOMV1 jumper N2 Serial Port (COM6) box header

H2 JCOMV2 jumper O GPIO (DIO) box header

H3 JCOMV3 jumper P JVDIO1 jumper

H4 JCOMV4 jumper Q Open Case Alert header

H5 JCOMV5 jumper R mini-PCIe slot (PCIe + USB 2.0)

H6 JCOMV6 jumper S Internal battery connector

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3. External Connectors

3.1. Mini-SIM Card Slots The TEP5-APL features two external Mini-SIM card slots: SIM1 for use by 3G/LTE1 wireless module and SIM2 for use by 3G/ LTE2 wireless module respectively. NOTE: These card slots can be only used by a M.2 KEY-B 3G/LTE module installed into the internal 3G/LTE1 and 3G/LTE2 slot. The M.2 KEY-B slots can be found at locations “E” and “L” in chapter 4. Internal Connectors and Expansion Options of this manual. No M.2 KEY-B 3G/LTE module is included in this device (must be purchased separately, not sold by TechNexion).

3.2. MicroSD Card Slot The TEP5-APL features a standard microSD card slot which is connected to the Intel Apollo Lake processor (Intel Atom x5-E3930 / x5-E3940 / x7-E3950) integrated “Ultra Secured Digital Host Controller” (uSDHC). The following main features are supported by uSDHC:

• Compatible with the MMC System Specification version 4.2/4.3/4.4/4.41/5.0.

• Conforms to the SD Host Controller Standard Specification version 3.0.

• Compatible with the SD Memory Card Specification version 3.0 and supports the “Extended Capacity SD Memory Card”.

• Compatible with the SDIO Card Specification version 3.0.

• Supports 1-bit / 4-bit SD and SDIO modes

The MMC/SD/SDIO host controller can support a single MMC / SD / SDIO card or device.

3.3. LED Light Indicators The TEK5-APL has six LED light indicators including four programmable LED Light indicators.

LED # Color PCB Location Registered Address

1 Green LED-A1 0xF9_BIT4 (SIO)

2 Green LED-A2 0xF9_BIT3 (SIO)

3 Green LED-A3 0xED_BIT2 (SIO)

4 Green LED-A4 0xED_BIT1 (SIO)

Besides, the TEP5-APL features Power LED and SATA LED indicators. The Power LED Light indicator is lit, when the system is powered on. The SATA LED Light indicator is blinking, when the SATA SSD is active.

LED # Color ON OFF

5 Green Power on Power off

6 Red SATA SSD is active (blinking) SATA SSD is not active

3.4. PWR Button The TEP5-APL features a “PWR” button for system power on. System is turned on when button is pressed, and the Power LED Light indicator lit. If the system hangs, depressing the button for 5 seconds powers down the system.

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3.5. Power Input Connector The TEP5-APL can be powered over the DC INPUT connector. This device can be ordered with (TEK5-Exxxx-Rxx-P-x-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx) or without (TEK5-Exxxx-Rxx-L-x-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx) a power ignition feature.

TEK5-Exxxx-Rxx-P-x-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx:

Pin # Signal Description

1 VCC DC Voltage input (8~36VDC)

2 GND Ground

3 IGN Signal from MCU

TEK5-Exxxx-Rxx-L-x-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx:

Pin # Signal Description

1 VCC DC Voltage input (8~36VDC)

2 GND Ground

3 NC

Header on TEP5-APL: DINKLE 2EHDRM-03P (3-pin 5.08mm pitch terminal block with threaded flange). Cable receptacle: DINKLE 2ESDVM-03P (3-pin 5.08mm pitch terminal block connector plug). NOTE: For power ignition control details please refer to the 4.18. Power Ignition Control chapter.

3.6. USB Host Connectors The TEP5-APL has two USB 3.0 Host connectors (USB 2.0 and USB 3.0 signals) and four USB 2.0 Host connectors (USB 2.0 signals) to connect to a USB peripheral such as a keyboard, mouse, USB storage device or USB hub.

3.7. Remote Power Button Connector The TEP5-APL features a remote power button connector.

Pin # Signal Description

1 PWRON Switch power source

2 GND Ground

Header on TEP5-APL: DINKLE 0225-1602 (2-pin 3.50mm pitch terminal block with threaded flange). Cable receptacle: DINKLE 0225-0602 (2-pin 3.50mm pitch terminal block connector plug).

3.8. RST Button The TEK5-APL features a “RST” button for system reset.

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3.9. Gigabit Ethernet Interface (LAN1/LAN2) The TEK5-APL by default comes with two Gigabit Ethernet RJ45 connectors. These connectors can support 802.3af Power Sourcing Equipment (PSE) functionality if configured with the PSE power option (TEK5-Exxxx-Rxx-P-x-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx). This signaling allows the presence of a conformant device to be detected by the power source and allows the device and source to negotiate the amount of power required or available. Total wattage of two ports is 38.7W, each port maximum current is 48V / up to 400mA.

LAN1 / LAN2:

Pin # 1000 Mbps 100 Mbps 10 Mbps

1 MDI0+ Transmit Data+ Transmit Data+

2 MDI0- Transmit Data- Transmit Data-

3 MDI1+ Receive Data+ Receive Data+

4 MDI2+

5 MDI2-

6 MDI1- Receive Data- Receive Data-

7 MDI3+

8 MDI3-

3.10. Antenna Holes There are five antenna holes available (two on the front and three rear side). They come fitted with breakaway metal tabs. In order to utilize them, the tabs must be removed by carefully using pincers or pliers.

3.11. Grounding The TEP5-APL must always be grounded to the earth. Grounding helps to limit the effects of noise due to electromagnetic interference on the device. The earth connection will have to be done using the grounding screw. The screw for the ground connection is marked with an engraved ground symbol.

3.12. SSD Drive Rack (optional) The TEK5-APL features one 2.5” SSD drive rack (optional).

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3.13. Galvanic Isolated Connectors (TEK5-Exxxx-Rxx-x-I-xxx-xxxx-xxxxx-x-xxxx-

TI-xxxx) (optional) This product is available with five connectors: GPIO, RS-XXX1, RS-XXX2, RS-XXX3, and RS-XXX4 that can be ordered in either galvanic isolated or non-galvanic isolated versions. The TEK5-Exxxx-Rxx-x-I-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx has five galvanic isolated connectors: GPIO, RS-XXX1, RS-XXX2, RS-XXX3, and RS-XXX4.

3.13.1. Galvanic Isolated Digital I/O Connector (GPIO) (optional) This product is available with one GPIO connector. The galvanic isolated GPIO connector has the following pinout:

GPIO:

Pin #

Signal Description Voltage Current Max.

Inter-face Source

Controller

SIO Pin # Min. Typ. Max.

1 GPIO1A DIG_IN1 4.75V 5V 6V 1A LPC NCT6116D

GPIO33

2 GPIO1B DIG_OUT1 11.21V

12V 12.39V

125 mA

LPC NCT6116D

GPIO37

3 GPIO1C DIG_IN2 4.75V 5V 6V 1A LPC NCT6116D

GPIO34

4 GPIO1D DIG_OUT2 11.21V

12V 12.39V

125 mA

LPC NCT6116D

GPIO40

5 GPIO1E DIG_IN3 4.75V 5V 6V 1A LPC NCT6116D

GPIO35

6 GPIO1F DIG_OUT3 11.21V

12V 12.39V

125 mA

LPC NCT6116D

GPIO41

7 GPIO1G DIG_IN4 4.75V 5V 6V 1A LPC NCT6116D

GPIO36

8 GPIO1H DIG_OUT4 11.21V

12V 12.39V

125 mA

LPC NCT6116D

GPIO42

9

GND Common Ground

10

VCC Supply output

4.75V 5V 5.25V 300 mA

NOTE: Isolation part protection level up to 5KV Vac/VESD Header on TEP5-APL: DINKLE 0156-1810L (10-pin 2.54mm pitch terminal block) connector socket. Cable receptacle: DINKLE 0156-1A10-BK (10-pin 2.54mm pitch terminal block) connector plug.

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3.13.2. Galvanic Isolated Serial Ports (RS-XXX1/RS-XXX2/RS-XXX3/RS-XXX4)

(optional) This product is available with four full function galvanic isolated serial ports: two RS-232/422/485 (RS-XXX1, RS-XXX2), and two RS-232 (RS-XXX3, RS-XXX4). The ports have the following pinout:

RS-XXX1 (RS-232 default setup):

Pin # Signal Description Device

1 SERIAL1_DCD Data Carrier Detect (input) COM1

2 SERIAL1_RXD Receive data (input) COM1

3 SERIAL1_TXD Transmit data (output) COM1

4 SERIAL1_DTR Data Terminal Ready (output) COM1

5 GND Ground

6 SERIAL1_DSR Data Set Ready (input) COM1

7 SERIAL1_RTS Request-to-send (output) COM1

8 SERIAL1_CTS Clear-to-send (input) COM1

9 VCC* 5V supply output (current max. 500mA)

RS-XXX1 (RS-422):

Pin # Signal Description Device

1 NC

2 SERIAL1_RXD- RS-422 Receive negative data signal (input) COM1

3 SERIAL1_TXD+ RS-422 Transmit positive data signal (output) COM1

4 NC

5 GND Ground

6 NC

7 SERIAL1_RXD+ RS-422 Receive positive data signal (input) COM1

8 SERIAL1_TXD- RS-422 Transmit negative data signal (output) COM1

9 VCC* 5V supply output (current max. 500mA)

RS-XXX1 (RS-485):

Pin # Signal Description Device

1 NC

2 NC

3 SERIAL1B+ RS-485 positive data signal COM1

4 NC

5 GND Ground

6 NC

7 NC

8 SERIAL1B- RS-485 negative data signal COM1

9 VCC* 5V supply output (current max. 500mA)

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RS-XXX2 (RS-232 default setup):

Pin # Signal Description Device

1 SERIAL2_DCD Data Carrier Detect (input) COM2

2 SERIAL2_RXD Receive data (input) COM2

3 SERIAL2_TXD Transmit data (output) COM2

4 SERIAL2_DTR Data Terminal Ready (output) COM2

5 GND Ground

6 SERIAL2_DSR Data Set Ready (input) COM2

7 SERIAL2_RTS Request-to-send (output) COM2

8 SERIAL2_CTS Clear-to-send (input) COM2

9 VCC* 5V supply output (current max. 500mA)

RS-XXX2 (RS-422):

Pin # Signal Description Device

1 NC

2 SERIAL2_RXD- RS-422 Receive negative data signal (input) COM2

3 SERIAL2_TXD+ RS-422 Transmit positive data signal (output) COM2

4 NC

5 GND Ground

6 NC

7 SERIAL2_RXD+ RS-422 Receive positive data signal (input) COM2

8 SERIAL2_TXD- RS-422 Transmit negative data signal (output) COM2

9 VCC* 5V supply output (current max. 500mA)

RS-XXX2 (RS-485):

Pin # Signal Description Device

1 NC

2 NC

3 SERIAL2B+ RS-485 positive data signal COM2

4 NC

5 GND Ground

6 NC

7 NC

8 SERIAL2B- RS-485 negative data signal COM2

9 VCC* 5V supply output (current max. 500mA)

RS-XXX3:

Pin # Signal Description Device

1 SERIAL3_DCD Data Carrier Detect (input) COM3

2 SERIAL3_RXD Receive data (input) COM3

3 SERIAL3_TXD Transmit data (output) COM3

4 SERIAL3_DTR Data Terminal Ready (output) COM3

5 GND Ground

6 SERIAL3_DSR Data Set Ready (input) COM3

7 SERIAL3_RTS Request-to-send (output) COM3

8 SERIAL3_CTS Clear-to-send (input) COM3

9 VCC* 5V supply output (current max. 500mA)

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RS-XXX4:

Pin # Signal Description Device

1 SERIAL4_DCD Data Carrier Detect (input) COM4

2 SERIAL4_RXD Receive data (input) COM4

3 SERIAL4_TXD Transmit data (output) COM4

4 SERIAL4_DTR Data Terminal Ready (output) COM4

5 GND Ground

6 SERIAL4_DSR Data Set Ready (input) COM4

7 SERIAL4_RTS Request-to-send (output) COM4

8 SERIAL4_CTS Clear-to-send (input) COM4

9 VCC* 5V supply output (current max. 500mA)

NOTE1: RS-XXX1/RS-XXX2 are set by default as RS-232. To change settings of RS-XXX1 to RS-422/RS-485 you need to adjust SW1 and SW2 DIP switch settings. SW1 and SW2 can at found at location “I1” and “I2” in chapter 4. Internal Connectors and Expansion Options of this manual. To change settings of RS-XXX2 to RS-422/RS-485 you need to adjust SW3 and SW4 DIP switch settings. SW3 and SW4 can at found at location “J1” and “J2” in chapter 4. Internal Connectors and Expansion Options of this manual. NOTE2: RS-XXX1/RS-XXX2/RS-XXX3/RS-XXX4 supply output is set by default at 5V. The supply output can be set either at 5V or 12V. To set the supply output at 12V you need to adjust JCOMV1/JCOMV2/JCOMV3/JCOMV4 jumper settings. The JCOMV jumpers can be found at locations “H1”, ”H2”, “H3”, and “H4” in chapter 4. Internal Connectors and Expansion Options of this manual. NOTE3: Isolation part protection level up to 5KV Vrms Header on TEP5-APL: DB9 (9-pin) standard D-Sub male connector. Cable receptacle: DB9 (9-pin) standard D-Sub female connector.

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3.14. Non-Galvanic Isolated Connectors (TEK5-Exxxx-Rxx-x-N-xxx-xxxx-xxxxx-x-

xxxx-TI-xxxx) (optional) This product is available with five connectors: GPIO, RS-XXX1, RS-XXX2, RS-XXX3, and RS-XXX4 that can be ordered in either galvanic isolated or non-galvanic isolated versions. The TEK5-Exxxx-Rxx-x-N-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx has five non-galvanic isolated connectors: GPIO, RS-XXX1, RS-XXX2, RS-XXX3, and RS-XXX4.

3.14.1. Non-Galvanic Isolated Digital I/O Connector (GPIO) (optional) This product is available with one GPIO connector. The non-galvanic isolated GPIO connector has the following pinout:

GPIO:

Pin #

Signal Description Voltage Current Max.

Inter-face Source

Controller

SIO Pin # Min. Typ. Max.

1 GPIO1A DIG_IN1 3.14V 3.3V 3.46V 12 mA

LPC NCT6116D

GPIO33

2 GPIO1B DIG_OUT2 3.14V 3.3V 3.46V 12 mA

LPC NCT6116D

GPIO37

3 GPIO1C DIG_IN3 3.14V 3.3V 3.46V 12 mA

LPC NCT6116D

GPIO34

4 GPIO1D DIG_OUT4 3.14V 3.3V 3.46V 12 mA

LPC NCT6116D

GPIO40

5 GPIO1E DIG_IN5 3.14V 3.3V 3.46V 12 mA

LPC NCT6116D

GPIO35

6 GPIO1F DIG_OUT6 3.14V 3.3V 3.46V 12 mA

LPC NCT6116D

GPIO41

7 GPIO1G DIG_IN7 3.14V 3.3V 3.46V 12 mA

LPC NCT6116D

GPIO36

8 GPIO1H DIG_OUT8 3.14V 3.3V 3.46V 12 mA

LPC NCT6116D

GPIO42

9

GND Common Ground

10

VCC Supply output

4.75V 5V 5.25V 300 mA

Header on TEP5-APL: DINKLE 0156-1810L (10-pin 2.54mm pitch terminal block) connector socket. Cable receptacle: DINKLE 0156-1A10-BK (10-pin 2.54mm pitch terminal block) connector plug.

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3.14.2. Non-Galvanic Isolated Serial Ports (RS-XXX1/RS-XXX2/RS-XXX3/RS-XXX4)

(optional) This product is available with four full function non-galvanic isolated serial ports: two RS-232/422/485 (RS-XXX1, RS-XXX2), and two RS-232 (RS-XXX3, RS-XXX4). The ports have the following pinout:

RS-XXX1 (RS-232 default setup):

Pin # Signal Description Device

1 SERIAL1_DCD Data Carrier Detect (input) COM1

2 SERIAL1_RXD Receive data (input) COM1

3 SERIAL1_TXD Transmit data (output) COM1

4 SERIAL1_DTR Data Terminal Ready (output) COM1

5 GND Ground

6 SERIAL1_DSR Data Set Ready (input) COM1

7 SERIAL1_RTS Request-to-send (output) COM1

8 SERIAL1_CTS Clear-to-send (input) COM1

9 VCC* 5V supply output (current max. 500mA)

RS-XXX1 (RS-422):

Pin # Signal Description Device

1 NC

2 SERIAL1_RXD- RS-422 Receive negative data signal (input) COM1

3 SERIAL1_TXD+ RS-422 Transmit positive data signal (output) COM1

4 NC

5 GND Ground

6 NC

7 SERIAL1_RXD+ RS-422 Receive positive data signal (input) COM1

8 SERIAL1_TXD- RS-422 Transmit negative data signal (output) COM1

9 VCC* 5V supply output (current max. 500mA)

RS-XXX1 (RS-485):

Pin # Signal Description Device

1 NC

2 NC

3 SERIAL1B+ RS-485 positive data signal COM1

4 NC

5 GND Ground

6 NC

7 NC

8 SERIAL1B- RS-485 negative data signal COM1

9 VCC* 5V supply output (current max. 500mA)

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RS-XXX2 (RS-232 default setup):

Pin # Signal Description Device

1 SERIAL2_DCD Data Carrier Detect (input) COM2

2 SERIAL2_RXD Receive data (input) COM2

3 SERIAL2_TXD Transmit data (output) COM2

4 SERIAL2_DTR Data Terminal Ready (output) COM2

5 GND Ground

6 SERIAL2_DSR Data Set Ready (input) COM2

7 SERIAL2_RTS Request-to-send (output) COM2

8 SERIAL2_CTS Clear-to-send (input) COM2

9 VCC* 5V supply output (current max. 500mA)

RS-XXX2 (RS-422):

Pin # Signal Description Device

1 NC

2 SERIAL2_RXD- RS-422 Receive negative data signal (input) COM2

3 SERIAL2_TXD+ RS-422 Transmit positive data signal (output) COM2

4 NC

5 GND Ground

6 NC

7 SERIAL2_RXD+ RS-422 Receive positive data signal (input) COM2

8 SERIAL2_TXD- RS-422 Transmit negative data signal (output) COM2

9 VCC* 5V supply output (current max. 500mA)

RS-XXX2 (RS-485):

Pin # Signal Description Device

1 NC

2 NC

3 SERIAL2B+ RS-485 positive data signal COM2

4 NC

5 GND Ground

6 NC

7 NC

8 SERIAL2B- RS-485 negative data signal COM2

9 VCC* 5V supply output (current max. 500mA)

RS-XXX3:

Pin # Signal Description Device

1 SERIAL3_DCD Data Carrier Detect (input) COM3

2 SERIAL3_RXD Receive data (input) COM3

3 SERIAL3_TXD Transmit data (output) COM3

4 SERIAL3_DTR Data Terminal Ready (output) COM3

5 GND Ground

6 SERIAL3_DSR Data Set Ready (input) COM3

7 SERIAL3_RTS Request-to-send (output) COM3

8 SERIAL3_CTS Clear-to-send (input) COM3

9 VCC* 5V supply output (current max. 500mA)

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RS-XXX4:

Pin # Signal Description Device

1 SERIAL4_DCD Data Carrier Detect (input) COM4

2 SERIAL4_RXD Receive data (input) COM4

3 SERIAL4_TXD Transmit data (output) COM4

4 SERIAL4_DTR Data Terminal Ready (output) COM4

5 GND Ground

6 SERIAL4_DSR Data Set Ready (input) COM4

7 SERIAL4_RTS Request-to-send (output) COM4

8 SERIAL4_CTS Clear-to-send (input) COM4

9 VCC* 5V supply output (current max. 500mA)

NOTE1: RS-XXX1/RS-XXX2 are set by default as RS-232. To change settings of RS-XXX1 to RS-422/RS-485 you need to adjust SW1 and SW2 DIP switch settings. SW1 and SW2 can at found at location “I1” and “I2” in chapter 4. Internal Connectors and Expansion Options of this manual. To change settings of RS-XXX2 to RS-422/RS-485 you need to adjust SW3 and SW4 DIP switch settings. SW3 and SW4 can at found at location “J1” and “J2” in chapter 4. Internal Connectors and Expansion Options of this manual. NOTE2: RS-XXX1/RS-XXX2/RS-XXX3/RS-XXX4 supply output is set by default at 5V. The supply output can be set either at 5V or 12V. To set the supply output at 12V you need to adjust JCOMV1/JCOMV2/JCOMV3/JCOMV4 jumper settings. The JCOMV jumpers can be found at locations “H1”, ”H2”, “H3”, and “H4” in chapter 4. Internal Connectors and Expansion Options of this manual. Header on TEP5-APL: DB9 (9-pin) standard D-Sub male connector. Cable receptacle: DB9 (9-pin) standard D-Sub female connector.

3.15. DVI-D Connector The DVI-D interface available on the TEK5-APL can be configured to support a primary/secondary/tertiary display.

3.16. DP (DisplayPort) Connector The TEP5-APL has one DP connector. The DP interface available on the TEP5-APL is based on Intel HD Graphics 500/505 engine integrated into the Intel Apollo Lake processor and can be configured to support a primary/secondary/tertiary display. The DP supports the following standards & features:

• DisplayPort 1.2

• DisplayPort Content Protection

• High-bandwidth Digital Content Protection

• Multi Stream Transport (MST) support

• Refresh rate up to 60 FPS for 4K Ultra HD at 30 bpp

• Support for up to 4k x 2k and 3D video formats

• Support for up to 48 bpp Color Depth

3.17. VGA (15-pin D-SUB) Connector The VGA interface available on the TEK5-APL can be configured to support a primary/secondary/tertiary display.

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3.18. Audio Connectors The TEK5-APL has two external 3.5mm stereo audio jacks.

Color Code Signal Description

Green L/R Line out Audio output

Pink Mic in Microphone input

3.19. Optional Connector Holes This model offers two optional connector holes marked OPT-A and OPT-B.

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4. Internal Connectors and Expansion Options Rear view (opened device) with the wide power input and power ignition Power Expansion module:

A B C Power Board D2 S R Q K D1 F E M O P G N2 L I2 N1 I1 H1 J2 H6 J1 H2 H2 H3 H5 Internal Connectors and Switches:

No. Description No. Description

A USB (1 port) header I1 SW1 RS-XXX1 Enable switch

B SATA Power connector I2 SW2 DIP switch for RS-XXX1 Serial Port

C SATA 3.0 connector J1 SW3 RS-XXX2 Enable switch

D1 SO-DIMM1 DDR3L slot J2 SW4 DIP switch for RS-XXX2 Serial Port

D2 SO-DIMM2 DDR3L slot K M.2 KEY-B slot (SATA 3.0)

E M.2 KEY-B slot (USB 2.0) L M.2 KEY-B slot (USB 2.0)

F RTC Battery connector M M.2 KEY-E slot (PCIe + USB 2.0)

G CMOS jumper N1 Serial Port (COM5) box header

H1 JCOMV1 jumper N2 Serial Port (COM6) box header

H2 JCOMV2 jumper O GPIO (DIO) box header

H3 JCOMV3 jumper P JVDIO1 jumper

H4 JCOMV4 jumper Q Open Case Alert header

H5 JCOMV5 jumper R mini-PCIe slot (PCIe + USB 2.0)

H6 JCOMV6 jumper S Internal battery connector

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4.1. USB1 Header The TEK5-APL features an internal 4-pin USB 2.0 header (Marked A).

USB1:

Pin # Signal Description

1 VBUS 5V Universal Serial Bus Power

2 USB_D+ USB differential pair signal

3 USB_D-

4 GND Ground

Header on TEK5-APL: 1x4-pin Header (2.00 Pitch Male Header). Cable receptacle: 1x4-pin Header (2.00 Pitch Female Header). NOTE: This header is located on the Power Board.

4.2. SATA 3.0 Connector and SATA Power Header The TEP5-APL has one internal SATA 3.0 connector (Marked C) for connecting to a SATA storage device. SATA_PWR Power header (Marked B) is located next to it. This device can be ordered with an optional 2.5” SATA drive: an internal SATA SSD drive (TEK5-Exxxx-Rxx-x-x-xxx-xxxx-IS128-x-xxxx-TI-xxxx) or an external, removable SATA SSD drive (TEK5-Exxxx-Rxx-x-x-xxx-xxxx-ES128-x-xxxx-TI-xxxx) kit option.

Pin # Signal Description

1 +5V SATA Power

2 GND Ground

Header on TEP5-APL: Molex 89400-0220 (2.00mm Pitch Wire-to-Board Header, Vertical, 2 Circuits, with Kinked PC Tail). Cable receptacle: Molex 87369-0200 (2.00mm Pitch Crimp Housing, Single Row, 2 Circuits, Natural). NOTE: There is one optional internal 2.5” disk drive bracket or external rack available.

4.3. SO-DIMM DDR3L Slots The TEP5-APL has two SO-DIMM DDR3L memory slots (Marked D1 and D2).

4.4. M.2 KEY-B Slots The TEP5-APL has three internal M.2 KEY-B connectors: 3G/LTE1 (Marked E), 3G/LTE2 (Marked M) and SSD (Marked K). M2-B 3G/LTE1 (to be used with SIM1 card) and 3G/LTE2 (to be used with SIM2 card) connectors support USB 2.0 signals. On the other hand, M2-B SSD connector supports SATA 3.0 signals. M.2 3G/LTE cards in the industry-standard M.2 KEY-B 3042 (30 x 42 mm) and M.2 SATA cards in the industry-standard M.2 KEY-B 2242 (22 x 42 mm) and 2280 (22 x 80 mm) form factor are supported.

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NOTE: No M.2 KEY-B 3G/LTE module is included in this device (must be purchased separately, not sold by TechNexion).

4.5. RTC Battery Connector The TEP5-APL features an internal RTC backup battery connector (Marked F).

Pin # Signal Description

1 RTC_VCC 3V (connect to standard CR2032 battery)

2 GND Ground

Header on TEP5-APL: Molex 53047-0210 (1.25mm Pitch PicoBlade Wire-to-Board Header). Cable receptacle: Molex 051021-8602 (1.25mm Pitch PicoBlade Wire-to-Wire and Wire-to-Board Housing) plug with crimp contact Molex 50058-8000. Battery P/N: KTS BCR2032H14.0AM1XB.

4.6. CMOS Jumper To clear CMOS settings please turn the system off and disconnect the RTC battery (Marked F).

Pin # Description

1-2 Default CMOS jumper settings

2-3 Clear CMOS jumper settings

Then short Pin #2 and Pin #3 of the 3-pin JCMOS1 header (Marked G) for 60 seconds, after which the CMOS will be restored to default factory settings. Restore default CMOS jumper settings before turning on the power. Reconnect the RTC battery (Marked F).

4.7. JCOMV Jumpers There are six jumpers: JCOMV1, JCOMV2, JCOMV3, JCOMV4, JCOMV5 and JCOMV6 (Marked H1, H2, H3, H4, H5 and H6 respectively). To set RS-XXX1/RS-XXX2/RS-XXX3/RS-XXX4/COM5 port supply output at 12V or COM6 port power supply at 5V please turn the system off.

Pin # Description

1-2 RS-XXX1 / RS-XXX2 / RS-XXX3 / RS-XXX4 / COM5 port 5V supply output (default)

2-3 RS-XXX1 / RS-XXX2 / RS-XXX3 / RS-XXX4 / COM5 port 12V supply output

Pin # Description

1-2 COM6 port 3.3V supply output (default)

2-3 COM6 port 5V supply output

Then short Pin #1 and Pin #2 of the 3-pin JCOMV jumper (Marked H1, H2, H3, H4, H5, H6). Turn on the power.

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4.8. SW1/SW2/SW3/SW4 Switches RS-XXX1 and RS-XXX2 serial ports can be configured either as RS-232, or RS-422 or RS-485. These serial ports are set by default as RS-232. Setting the RS-XXX1 in other mode will require to open the device and adjust the internal SW1 DIP (Marked I1) and SW2 Terminator Resistor DIP (Marked I2) switch settings. Setting the RS-XXX2 in other mode will require to adjust the internal SW3 DIP (Marked J1) and SW4 Terminator Resistor DIP (Marked J2) switch settings.

4.8.1. RS-XXX1 (SW1/SW2) SW1:

Pin # Enable RS-232 (default) Enable RS-422 Enable RS-485

1-4 OFF ON OFF

2-3 OFF OFF ON

SW2:

Pin # RS-232 (default) RS-422 RS-485

1-8 ON OFF OFF

2-7 OFF ON OFF

3-6 OFF OFF ON

4-5 - - -

4.8.2. RS-XXX2 (SW3/SW4) SW3:

Pin # Enable RS-232 (default) Enable RS-422 Enable RS-485

1-4 OFF ON OFF

2-3 OFF OFF ON

SW4:

Pin # RS-232 (default) RS-422 RS-485

1-8 ON OFF OFF

2-7 OFF ON OFF

3-6 OFF OFF ON

4-5 - - -

4.9. COM5 Serial Port Box Header The TEK5-APL features one internal full function RS-232 serial port header: COM5 (Marked N1), that can be ordered in either galvanic isolated or non-galvanic isolated version.

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4.9.1. COM5 Galvanic Isolated Serial Port Box Header (TEK5-Exxxx-Rxx-x-I-xxx-

xxxx-xxxxx-x-xxxx-TI-xxxx) (optional)

COM5:

Pin # Signal Description Device

1 SERIAL5_DCD Data Carrier Detect (input) COM5

2 SERIAL5_RXD Receive data (input) COM5

3 SERIAL5_TXD Transmit data (output) COM5

4 SERIAL5_DTR Data Terminal Ready (output) COM5

5 GND Ground

6 SERIAL5_DSR Data Set Ready (input) COM5

7 SERIAL5_RTS Request-to-send (output) COM5

8 SERIAL5_CTS Clear-to-send (input) COM5

9 VCC* 5V supply output (current max. 500mA)

10 NC Key

NOTE1: COM5 supply output is set by default at 5V. COM5 supply output can be set either at 5V or 12V. To set the COM5 supply output at 12V you need to adjust JCOMV5 jumper settings. The JCOMV5 jumper can be found at locations “H5” in chapter 4. Internal Connectors and Expansion Options of this manual. Please refer to the chapter 4.7. JCOMV Jumpers of this manual for more details. NOTE2: DB9 RS-232 cable is available for this header (optional). The DB9 connector pinout is the same as the RS-XXX1 serial port. Please refer to the chapter 3.14.2. Non-Galvanic Isolated Serial Ports (RS-XXX1/RS-XXX2/RS-XXX3/RS-XXX4) (optional) of this manual for more details. NOTE3: Isolation part protection level up to 5KV Vrms

4.9.2. COM5 Non-Galvanic Isolated Serial Port Box Header (TEK5-Exxxx-Rxx-x-N-

xxx-xxxx-xxxxx-x-xxxx-TI-xxxx) (optional)

COM5:

Pin # Signal Description Device

1 SERIAL5_DCD Data Carrier Detect (input) COM5

2 SERIAL5_RXD Receive data (input) COM5

3 SERIAL5_TXD Transmit data (output) COM5

4 SERIAL5_DTR Data Terminal Ready (output) COM5

5 GND Ground

6 SERIAL5_DSR Data Set Ready (input) COM5

7 SERIAL5_RTS Request-to-send (output) COM5

8 SERIAL5_CTS Clear-to-send (input) COM5

9 VCC* 5V supply output (current max. 500mA)

10 NC Key

NOTE1: COM5 supply output is set by default at 5V. To set the COM5 supply output at 12V you need to adjust JCOMV5 jumper settings. The JCOMV5 jumper can be found at locations “H5” in chapter 4.

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Internal Connectors and Expansion Options of this manual. Please refer to the chapter 4.7. JCOMV Jumpers of this manual for more details. NOTE2: DB9 RS-232 cable is available for this header (optional). The DB9 connector pinout is the same as the RS-XXX1 serial port. Please refer to the chapter 3.14.2. Non-Galvanic Isolated Serial Ports (RS-XXX1/RS-XXX2/RS-XXX3/RS-XXX4) (optional) of this manual for more details.

4.10. COM6 Serial Port Box Headers The TEK5-APL features an internal non-galvanic isolated 4-wire RS-232 port header: COM6 (Marked N2).

COM6:

Pin # Signal Description Device

1 NC COM6

2 SERIAL6_RXD Receive data (input) COM6

3 SERIAL6_TXD Transmit data (output) COM6

4 NC COM6

5 GND Ground

6 NC COM6

7 SERIAL6_RTS Request-to-send (output) COM6

8 SERIAL6_CTS Clear-to-send (input) COM6

9 VCC* 5V supply output (current max. 500mA)

10 NC Key

NOTE1: COM6 supply output is set by default at 3.3V. COM6 supply output can be set either at 3.3V or 5V. To set the COM6 supply output at 5V you need to adjust JCOMV6 jumper settings. The JCOMV6 jumper can be found at location “H6” in chapter 4. Internal Connectors and Expansion Options of this manual. Please refer to the chapter 4.7. JCOMV Jumpers of this manual for more details. NOTE2: DB9 RS-232 cable is available for this header (optional). The DB9 connector pinout is the same as the RS-XXX1 serial port. Please refer to the chapter 3.14.2. Non-Galvanic Isolated Serial Ports (RS-XXX1/RS-XXX2/RS-XXX3/RS-XXX4) (optional) of this manual for more details.

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4.11. GPIO Box Header The SBC-APL-350 features one internal non-galvanic isolated GPIO box header (Marked O). You can select 3.3V or 5V power for this header.

DIO1:

Pin #

Signal Description Voltage Current Max.

Inter-face Source

Controller

SIO Pin # Min. Typ. Max.

1 GPIO2A DIG_OUT1 3.14V 3.3V 3.46V 100 mA

LPC NCT6116D

GPIO70

2 GPIO2B DIG_OUT2 3.14V 3.3V 3.46V 100 mA

LPC NCT6116D

GPIO72

3 GPIO2C DIG_OUT3 3.14V 3.3V 3.46V 100 mA

LPC NCT6116D

GPIO73

4 GPIO2D DIG_OUT4 3.14V 3.3V 3.46V 100 mA

LPC NCT6116D

GPIO74

5 GND Common Ground

6 GPIO2E DIG_OUT6 3.14V 3.3V 3.46V 100 mA

LPC NCT6116D

GPIO75

7 GPIO2F DIG_OUT7 3.14V 3.3V 3.46V 100 mA

LPC NCT6116D

GPIO77

8 GPIO2G DIG_OUT8 3.14V 3.3V 3.46V 100 mA

LPC NCT6116D

GPIO76

9

VCC Supply output

3.14V 3.3V 3.46V 300 mA

10

NC

Header on SBC-APL-350: 2x5-pin Box Header (2.00 Pitch Male Header). Cable receptacle: 2x5-pin Box Header (2.00 Pitch Female Header). NOTE1: DIO1 supply output is set by default at 3.3V. The supply output can be set either at 3.3V or 5V. To set the supply output at 5V you need to adjust JVDIO1 jumper settings. The JVDIO1 jumper can be found at location “P” in chapter 4. Internal Connectors and Expansion Options of this manual. NOTE2: Optional DB9 GPIO cable is available for this header. Please refer to the table above Pins 1-9 for DB9 connector pinout.

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4.12. JVDIO1 Jumper There is one jumper: JVDIO1 (Marked P). To set DIO header supply output at 5V please turn the system off.

Pin # Description

1-2 DIO header 5V supply output

2-3 DIO header 3.3V supply output (default)

Then short Pin #1 and Pin #2 of the 3-pin JVDIO1 jumper (Marked P). Turn on the power.

4.13. M.2 KEY-E Slot The TEP5-APL has one internal M.2 KEY-E slot: WIFI/BT (Marked M). M2-E connector supports PCIe and USB 2.0 signals. Only M.2 cards in the industry-standard M.2 KEY-E 2230 (22 x 30 mm) form factor are supported. NOTE: WIFI/BT connector can be only used by a M.2 KEY-E Wi-Fi / Bluetooth module installed into the M.2 KEY-E connector (Marked M).

4.14. Case Open Alert Header The TEP5-APL features an internal Case Open Alert header (Marked Q). This feature is by default disabled. To enable this feature please refer to the chapter 5.2.2. BIOS Setup Screens Overview -Advanced of this manual for more details.

Pin # Signal Description

1 COPEN- Case Open Alert status

2 GND Ground

Header on TEP5-APL: Molex 53047-0210 (1.25mm Pitch PicoBlade Wire-to-Board Header). Cable receptacle: Molex 051021-8602 (1.25mm Pitch PicoBlade Wire-to-Wire and Wire-to-Board Housing) plug with crimp contact Molex 50058-8000.

4.15. Mini-PCIe Slot The TEK5-APL has one internal mini-PCIe connector for full size or half size cards: MINI_PCIE (Marked R). MINI_PCIE connector supports PCIe and USB 2.0 signals. Mini-PCIe full size (30 x 50.95 mm) or half size (30 x 26.8 mm) cards are supported. This product can be ordered with an optional CAN Bus mini-PCIe module in galvanic isolated and non-galvanic isolated variants. TEK5-Exxxx-Rxx-x-x-xxx-xxxx-xxxxx-C-xxxx-TI-xxxx features two galvanic isolated CAN 2.0B ports. TEK5-Exxxx-Rxx-x-x-xxx-xxxx-xxxxx-I-xxxx-TI-xxxx features two non-galvanic isolated CAN 2.0B ports and a G sensor. NOTE: This slot is located on the front side of Power Board.

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4.16. Power Fuse (TEK5-Exxxx-Rxx-P-x-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx) The TEP5-APL features a fast-acting square ceramic surface mount fuse Conquer SEF7A125V (2.6mm x 6.1mm). The fuse has the following current and voltage ratings: 7A at 125V. Power Board rear view:

FUSE NOTE: The power fuse is located on the rear side of the Power Board. To access the fuse you will need to remove the Power Board first.

4.17. Backup Battery Connector (TEK5-Exxxx-Rxx-P-x-xxx-xxxx-xxxxx-x-xxxx-TI-

xxxx) The TEP5-APL features an internal battery connector (Marked S). It’s compatible with an external 18650 battery pack. NOTE: If your system requires a backup battery pack, please contact with TechNexion sales to find out about available options that suit your project requirements.

4.18. Power Ignition Control (TEK5-Exxxx-Rxx-P-x-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx) The TEP5-APL features a power ignition control. Ignition to Power On delay time can be setup in BIOS, default value is 5 seconds. MCU battery control pin timing map:

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Pin definition of the DC-IN connector with the ignition pin:

Pin # Signal Description

1 VCC DC Voltage input (8~36VDC)

2 GND Ground

3 IGN Signal to MCU

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5. BIOS Setup The BIOS (Basic Input / Output System) firmware comes pre-installed on the TEP5-APL. The AMI UEFI BIOS is a non-volatile firmware used to perform hardware initialization during the booting process and provides a basic level of communication between the processor and peripherals. The BIOS setup program includes menus for configuring settings and enabling features of the TEP5-APL. NOTE: BIOS options listed here are for reference only. This section may reflect only the BIOS version corresponding to initial release and may differ from that of the purchased system.

5.1. Entering and Exiting BIOS Enter BIOS setup by selecting DEL key when the system is powered on and the POST (Power On Self Test) message is displayed. Exit BIOS setup by selecting ESC key.

5.2. BIOS Setup Screens Overview When BIOS is started, the main BIOS setup utility top-level screen appears. This screen provides six top-level menu options across the top of the screen. The menu bar on top of the screen has the following main items:

Item #

Screen Name Description

1 Main Contain basic system information

2 Advanced Access advanced configuration options

3 Chipset View the configuration of system chipsets

4 Security Set or change the administrator and user passwords

5 Boot Configure the boot device priority

6 Save & Exit Contain save and exit options

The highlighted item on the menu bar displays the specific items for that menu. Use the left and right arrow keys to select the different menu options. As you select each menu option, the top-level screen for that menu option appears. To select an option on a top-level screen, use the up and down arrow keys to scroll up and down the options presented. To display the submenu, select the item and press ENTER key. On sub-screens that only provide configuration information and cannot be modified, press the ESC key to exit the screen.

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5.2.1. Main By default, the Main screen appears when you enter the BIOS setup program. Main screen contains basic system information, including BIOS version, processor, memory, date/time and access level.

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5.2.2. Advanced The BIOS Advanced screens provide detailed configuration information for the OS, POST Watchdog Timer, SATA, eMMC, SDIO, Super IO, GPIO PORT, LED control and other system information. NOTE: Setting incorrect or conflicting values in Advanced BIOS setup may cause system malfunction or inability to boot. Section 4.6. CMOS Jumper provides instruction on clearing the CMOS and restoring default factory settings. The CMOS jumper can be found at location “H” in chapter 4. Internal Connectors and Expansion Options of this manual.

Trusted Computing

Screen Name Options Description

Security Device Support

Enabled Enables or Disables BIOS support for security device. O.S. will not show Security Device. Disabled

TPM Control

Screen Name Options Description

TPM Control

Enabled TPM Enable/Disable

Disabled

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SATA Configuration

Screen Name Options Description

SATA Drives Chipset SATA Enable Enables or Disables the Chipset SATA controller Chipset SATA Disable

USB Configuration

Screen Name Options Description

USB Configuration USB Support Enable Enables or Disables Legacy USB support

USB Support Disable

Hardware Monitor

Screen Name Options Description

Hardware Monitor Smart Fan Function Smart Fan function setting

SIO Configuration

Screen Name Options Description

Super IO Chip Logical Device(s) Configuration

Serial Port 1 View and Set Basic properties of the SIO Logical Device like IO Base, IRQ Range, DMA Channel and Device Mode

Serial Port 2

Serial Port 3

Serial Port 4

Serial Port 5

GPIO PORT Configuration

Screen Name Options Description

GPIO PORT Config

GPIOXX Mode Select Select input or output mode

GPIOXX Value Input Mode: Display input value Output Mode: Select output value

GPIO Control Address Write IO port 0x2E -> 0x87 Write IO port 0x2E -> 0x87 Write IO port 0x2E -> 0x07 Write IO port 0x2F -> 0x07 Write IO port 0x2E -> 0xEC Write IO port 0x2F -> // 0 : Output mode, 1 : Input mode

BIT3 = GPIO33 BIT4 = GPIO34 BIT5 = GPIO35 BIT6 = GPIO36 BIT7 = GPIO37

Write IO port 0x2E -> 0xED Write IO port 0x2F -> // 0 : Output 0, 1 : Output 1 when in Output mode

BIT3 = GPIO33 BIT4 = GPIO34 BIT5 = GPIO35 BIT6 = GPIO36 BIT7 = GPIO37

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Write IO port 0x2E -> 0xF0 Write IO port 0x2F -> // 0 : Output mode, 1 : Input mode

BIT0 = GPIO40 BIT1 = GPIO41 BIT2 = GPIO42

Write IO port 0x2E -> 0xF1 Write IO port 0x2F -> // 0 : Output 0, 1 : Output 1 when in Output mode

BIT0 = GPIO40 BIT1 = GPIO41 BIT2 = GPIO42

Write IO port 0x2E -> 0xFC Write IO port 0x2F -> // 0 : Output mode, 1 : Input mode

BIT0 = GPIO70 BIT2 = GPIO72 BIT3 = GPIO73 BIT4 = GPIO74 BIT5 = GPIO75 BIT6 = GPIO76 BIT7 = GPIO77

Write IO port 0x2E -> 0xFD Write IO port 0x2F -> // 0 : Output 0, 1 : Output 1 when in Output mode

BIT0 = GPIO70 BIT2 = GPIO72 BIT3 = GPIO73 BIT4 = GPIO74 BIT5 = GPIO75 BIT6 = GPIO76 BIT7 = GPIO77

Write IO port 0x2E -> 0xAA Network Stack Configuration

Screen Name Options Description

Network Stack

Enabled Enable/Disable UEFI Network Stack

Disabled

eMMC Configuration

Screen Name Options Description

eMMC Support Enable Enable/Disable eMMC Support

Disable

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Ignition Delay Control

Screen Name Options Description

Ignition Delay Control Enable Enable/Disable Ignition Power On / Off Delay Power On/Off Delay Time to be set (in seconds)

Disable

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5.2.3. Chipset The Chipset screens contain North Bridge and South Bridge configuration options.

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5.2.4. Security The Security screens contain the administrator and user passwords settings.

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5.2.5. Boot The Boot screens contain device priority boot options.

Restore AC Power Loss

Screen Name Options Description

Restore AC Power Loss Power Off Select AC power state when power is re-applied after a power failure Power On

Last State

Boot Option Priorities

Screen Name Options Description

Boot Option Priorities Boot Option #1 Sets the system boot order

Boot Option #2

Boot Option #3

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5.2.6. Save & Exit The Save & Exit screens contain save and exit options.

Save & Exit

Screen Name Options Description

Save & Exit Save Changes and Reset

Save changes and exit, discard changes and exit, or discard changes

Discard Changes and Reset

Restore Defaults

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6. Mounting This section describes the mounting procedures for the TEP5-APL. The material in area of the mounting must provide sufficient strength for safe mounting of this device.

6.1. Surface Mounting Please follow the steps below to properly install the wall mount bracket set. Prepare your device and two

wall mount brackets. Before starting unscrew six screws from the rear side panel. Then, align the bracket

with the device (Step 1). Finally tighten all screws to the surface (Step 2-3). Repeat the steps to secure

the second bracket to your device.

There are 4 mounting holes (M5) on the top side of the device required for surface mounting. Four M4 or M5 screws with at least 8mm head-to-tip length are required to secure this device to the surface. Top view:

1 2

3 4

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7. Ordering Information The TEP5-APL is available in several configurations. Please contact your TechNexion sales contact window or distributor for options and availability details.

7.1. Custom Part Number Rule The TEK5-APL can be ordered in custom tailored configuration to meet special application requirements and conditions according to the following custom part number creation rules. Custom part numbers carry minimum order quantities (MOQ). Please connect with your TechNexion distributor or account manager for conditions and availability. Part number format: TEK5-Exxxx-Rxx-x-x-xxx-xxxx-xxxxx-x-xxxx-TI-xxxx

Interface Code Description

Processor E3930 Intel Atom x5-E3930 (2x 1.8GHz)

E3940 Intel Atom x5-E3940 (4x 1.8GHz)

E3950 Intel Atom x7-E3950 (4x 2.0GHz)

Memory R20 2GB SO-DIMM DDR3L

R40 4GB SO-DIMM DDR3L

R80 8GB SO-DIMM DDR3L (dual channel)

Power Board P 2x PSE (PoE 802.3af) + Power Ignition + 8~36V DC input

L 2x GbE LAN + 8~36V DC input

Galvanic Isolation N Non-Galvanic Isolated RS-XXX / GPIO ports

I Galvanic Isolated RS-XXX / GPIO ports

Storage eMMC - -

E32 eMMC 32GB (default)

E64 eMMC 64GB

Storage M.2 - -

M064 M.2 SSD 64GB

M128 M.2 SSD 128GB

Storage SATA - -

IS128 Internal 2.5” SATA3 SSD 128GB

ES128 External 2.5” SATA3 SSD 128GB removable kit

CAN Bus - -

C CAN Bus mini-PCIe module: 2x galvanic isolated CAN 2.0B

I CAN Bus mini-PCIe module: 2x CAN 2.0B + 3D Gyroscope / Accelerometer

Wi-Fi / Bluetooth - -

9377 Qualcomm QCA9377 802.11a/b/g/n/ac (2.4 + 5GHz) + Bluetooth 5

Temperature Range TI Industrial Temperature range (-40° to +70° C)

Custom ID XXXX Custom Part number ID for customized software loader and special component (BOM)

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7.2. Standard Package Contents

Item Partnumber Description

1 TEP5-APL Fanless box PC computing system with Intel Apollo Lake CPU

2 Accessoires 4x screw (M3x6) for M.2 cards

1x standoff (M3x6.6L) for M.2 SSD card

1x screw (M2x4) for mini-PCIe card

1x standoff (M2x7.5L) for mini-PCIe card

1x Power Input (3-pin) connector plug

1x Remote Power Button (2-pin) connector plug

1x GPIO (10-pin) connector plug

1x rubber feet pad set

1x wall mount bracket set

NOTE: Pack contents might vary depending on your ordered configuration.

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8. Important Notice TechNexion reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TechNexion terms and conditions of sale supplied at the time of order acknowledgment. TechNexion warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TechNexion standard warranty. Testing and other quality control techniques are used to the extent TechNexion deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TechNexion assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TechNexion components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TechNexion does not warrant or represent that any license, either express or implied, is granted under any TechNexion patent right, copyright, mask work right, or other TechNexion intellectual property right relating to any combination, machine, or process in which TechNexion products or services are used. Information published by TechNexion regarding third-party products or services does not constitute a license from TechNexion to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TechNexion under the patents or other intellectual property of TechNexion. TechNexion products are not authorized for use in safety-critical applications (such as life support) where a failure of the TechNexion product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TechNexion products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TechNexion. Further, Buyers must fully indemnify TechNexion and its representatives against any damages arising out of the use of TechNexion products in such safety-critical applications. TechNexion products are neither designed nor intended for use in military/aerospace applications or environments unless the TechNexion products are specifically designated by TechNexion as military grade or "enhanced plastic." Only products designated by TechNexion as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TechNexion products which TechNexion has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TechNexion products are neither designed nor intended for use in automotive applications or environments unless the specific TechNexion products are designated by TechNexion as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TechNexion will not be responsible for any failure to meet such requirements.

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9. Disclaimer © 2001-2019 TechNexion Ltd. All Rights Reserved. No part of this document may be photocopied, reproduced, stored in a retrieval system, or transmitted, in any form or by any means whether, electronic, mechanical, or otherwise without the prior written permission of TechNexion Ltd. No warranty of accuracy is given concerning the contents of the information contained in this publication. To the extent permitted by law no liability (including liability to any person by reason of negligence) will be accepted by TechNexion Ltd., its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or inaccuracies in this document. TechNexion Ltd. reserves the right to change details in this publication without notice. Product and company names herein may be the trademarks of their respective owners. TechNexion Ltd. 16F-5, No. 736, Zhongzheng Road, ZhongHe District, 23511, New Taipei City, Taiwan Phone : +886-2-82273585 Fax : +886-2-82273590 E-mail : [email protected] Web : https://www.technexion.com/