Suss Micro Optics, Wafer Scale Manufacturing, R. Voelkel, June 2009

Wafer Scale Manufacturing

Processes In Optical

Technologies For IlluminationReinhard Völkel

SUSS MicroOptics, Neuchâtel

www.suss.ch, [email protected]

http://www.suss.ch/

2

Light Makes The Difference!

Egyptian God Ra with Madame Taperet , 1000 BC (Louvre, Paris)

R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009

Light Makes The Difference!

3

Thomsas A. Edison (Patent 1880)


Lighting Roadmap

4

Lighting, Illumination: Optics Is Light Work!

5 Source: 3M Vikuiti, ASML, Coherent

Light Sources Devices, Systems

„Collect all photons and illuminate!“

Performance (brightness, contrast, color,

uniformity, efficiency)

Size (larger area, smaller device)

Costs (manufacturing, energy saving, lifetime)


Conservation of Etendue – Lagrange Invariant

Etendue is a property of an optical system, which characterizes how

"spread out" the light is in area and angle.

Lagrange invariant is a measure of the light propagating through an

optical system. For a given optical system, the Lagrange invariant is a

constant throughout all space, that is, it is invariant upon refraction and

transfer.

6R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009

Concepts for Illumination

Optical Design & Illumination

Leonard Euler (1707 – 1783)


In 1893 August Köhler (1866–1948) from

Carl Zeiss in Jena, introduced a new and

revolutionary method for uniform illumination

of specimen in an optical microscope in his

doctoral thesis.

The Köhler method allows to adjust the size

and the numerical aperture of the object

illumination in a microscope independent

from each other.

August Köhler, Zeitschrift für wissenschaftliche

Mikroskopie, Band X, Seite 433-440 (1893)

Köhler Illumination, Köhler Integrator (Fly‘s Eye)


In 1893 August Köhler (1866–1948) from Carl

Zeiss in Jena, introduced a new and revolutionary

method for uniform illumination of specimen in an

optical microscope in his doctoral thesis.

The Köhler method allows to adjust the size

and the numerical aperture of the object

illumination in a microscope independent

from each other.

August Köhler, Zeitschrift für wissenschaftliche

Mikroskopie, Band X, Seite 433-440 (1893)

Köhler Illumination, Köhler Integrator (Fly‘s Eye)


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1946: Microlens Array Homogenizer


12

2005: Nikon Corporation


Light Sources Today: More Power – Less Energy!

Uniformity

Efficiency

Costs


Illumination Concepts For Displays

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Source: 3M Vikuiti


Richard Ulbricht Invented The Ulbricht Sphere

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Dr. Richard Ulbricht (1849 – 1923, Dresden)

Invented the Ulbricht Sphere when he was trying to find the optimium

optics for electrical illumination of Dresden„s train stations (≈ 1891)


LED

Reflector

LED

Substrate

Beam Collimation Beam Shaping

Intensity

Homogenization

Plastic, Glass

Tasks for Micro-Optics


RXI Collimator

• High efficiency LED out-coupling

• Etendue limited performance (88% max)

• Short (D / L ~ 3)

• Bezier curves description (8 surfaces)

• Direct optimization

RXI

Refraction Reflection Total Internal Refraction


Wafer-Scale Manufacturing Is Quite Sucessful!

Wafer-based „SEMI“ technology changed our world dramatically in the

last 50 years!

Manufacturing concepts from SEMI are adapted for other products.

Computers, digital cameras, displays, LED, OLED, high-power switches,

wafer-level cameras, ...

Wafer-based „SEMI“ technology for Optics is very successful.

Question: Is it now possible to integrate Optics on the LED using

Wafer-Level Packaging?

18

Wafer-Level Camera (WLC)

Microlens Imprint Lithography (SMILE)

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Example: Mobile Phone Cameras


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Example: Mobile Phone Cameras

Wafer-Level Solutions


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Microlens Replication on Wafer Level

1. Lens Imprinting 2. Lens Transfer

Stamp Holder

PDMS Stamp on glass baker

UV epoxy

Wafer

Chuck with glass inlay

Fabricated lens wafer with transferred lenses

Loaded PDMS Stamp

Fabricated lens wafer with residual layer


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Wafer-Level Packaging of Lens Wafer

Substrate holder

Edge handling chuck for lens stacking

with loaded buffer wafer

Process equipment:

Substrate holder with glass inlay to hold buffer and lens wafers

by vacuum

Edge handling chuck or buffer plate avoids lens damages on

lens surfaces

Assisted Alignment for highly precise alignment of Opto wafers

prior to UV bonding

High intensity UV exposure for short process times

Loaded buffer wafer with double sided lens wafer on edge handling chuck

Opto wafer stack with UV bonded lens wafer

VAC 1

VAC 2 Substrate

Holder

Edge Handling Chuck

SUSS MA/BA8 Gen3


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BMBF-VDI COMIKA: Wafer Level Camera

MA/BA8 Gen3 Micro Lens replication on 200mm waferMaterial: Delo Katiobond 18499

Basic concept of WLC sample

Schott B33, 8”

100µm

UV Bond: Delo PHOTOBOND 4302

UV Bond: Delo Katiobond AD VE18499


Micro-Optics on Wafer-Level

Unwrapped phase / lambda

Zeiss Diffusor 6101 HH, 10-02-05 RV

SUSS MicroOptics

x / norm. radius

0.00 1260.77252.15 504.31 756.46 1008.62

y /

no

rm.

rad

ius

12

60

.77

0.0

01

00

8.6

27

56

.46

50

4.3

12

52

.15

Ph

ase

/ l

am

bd

a

-2.22

-1.63

-1.04

-0.46

0.13

0.72

10.02.2005

14:49:32

Mean -0.10

RMS 0.34

P-V 2.94

Refractive Microlens Arrays (ROE) Binary Optics Diffractive Optical Elements (DOE)

Random Diffusers, Homogenizer Wafer-Level Camera, Fiber Arrays, Sensors

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Wafer-Level Camera for disposable endoscopes(Photo: AWAIBA)


Micro-Optics on Wafer-Level



SUSS MicroOptics

x / norm. radius

0.00 1260.77252.15 504.31 756.46 1008.62

y /

no

rm.

rad

ius

12

60

.77

0.0

01

00

8.6

27

56

.46

50

4.3

12

52

.15

Ph

ase

/ l

am

bd

a

-2.22

-1.63

-1.04

-0.46

0.13

0.72

10.02.2005

14:49:32

Mean -0.10

RMS 0.34

P-V 2.94

Refractive Microlens Arrays (ROE) Binary Optics Diffractive Optical Elements (DOE)

Random Diffusers, Homogenizer Wafer-Level Camera, Fiber Arrays, Sensors


Wafer-Based Manufacturing

Technology For MicroOptics

SUSS MicroOptics – We Set The Standards

World leading supplier of high-quality Micro-Optics

8‟‟ Wafer Technology, Wafer-Level Packaging, SUSS Imprint Lithography

More than 200 active customers, e.g. to SEMI equipment manufacturers, Laser

& Optics industry, Sensors & Metrology and Medical

Part of the SUSS MicroTec Group (www.suss.com)

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Neuchâtel, Swiss Watch Valley

SMO is “Preferred Supplier” for Carl Zeiss SMT AG:

DUV Laser Beam Shaping Solutions (ASML Steppers)


SUSS MicroOptics – 8’’ Wafer Fab

Cleanroom facility (Class 1 – 1000) for the wafer-based

manufacturing of high-quality Micro-Optics

Fully established 8‘‘ technology based on SEMI processes

200 mm wafer size (8‟‟)

Fused silica, Borofloat, Silicon and CaF2

Refractive Microlenses: Spheres, aspheres

Diffractive Optical Elements (16-level)

Random diffusers, hybride Micro-Optics

Double sided arrays, stops, coatings

Wafer-Level Packaging, Bonding

Master Lens Arrays for Replication and

Imprint Lithography

29 R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009

Micro-Optics Solutions

Semiconductor Technology

Industrial Optics & Vision

Healthcare & Life Science

Metrology

Laser & Material Processing

Information Technology

Research



SUSS MicroOptics

x / norm. radius

0.00 1260.77252.15 504.31 756.46 1008.62

y /

no

rm.

rad

ius

12

60

.77

0.0

01

00

8.6

27

56

.46

50

4.3

12

52

.15

Ph

ase

/ l

am

bd

a

-2.22

-1.63

-1.04

-0.46

0.13

0.72

10.02.2005

14:49:32

Mean -0.10

RMS 0.34

P-V 2.94

Health Care & Life

Science28%

Industrial Optics, Vision14%

Information Techn.

8%

Laser & Material

Processing9%

Metrology7%

Research9%

SEMI Technology

18%

Divers7%


Wafer-Based Manufacturing of Microlens Arrays (ROE)

SUSS MicroOptics uses standard manufacturing technologies from

Semiconductor Industry, like resist coating, lithography, resist melting,

reactive ion etching, deposition, sputtering and lift-off

Excellence in quality, array uniformity, and lateral dimension accuracy


High-Quality Diffractive Optical Elements

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8„„ wafer scale

Binary, 8-level, 16-level

SiO2, B33, Si, CaF2

0.5 μm min feature size

< 50nm overlay accuracy

190nm to 5µm wavelength


Laser Beam Shaping and Homogenizing

Laser Beam Shaping

Spot-GeneratorFlat-Top (1D)Flat-Top (2D Line-Generator Ablation (borosilicate)

Excimer Flat-Top


Diffuser for Köhler Integrator

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No diffuser Diffuser (rotating)

Experiment: Laser Diode, 670 nm, condenser lens ƒFL = 40 mm

Uniformity: > 10 % Uniformity: << 5 %


SEM – Images of Diffusers

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Ground Glass 10° HT Diffuser 1° (SMO)E Diffuser (SMO)


m

m

70

160

2

1

m

m

160

500

2

1

m

m

100

300

2

1

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Shaping of Random Diffusers

Ground Glass Diffuser

Shaped Random Diffuser (2D)


Improved Diffuser Plates (Fused Silica)

Gauss, Super-Gauss, Flat-Top, …

No zero order, sharp cut-off, no loss in large angles

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-5 -4 -3 -2 -1 0 1 2 3 4 5

I

HWHM

1.23°

Rotational

symmetric

Gaussian like

intensity shape

1

Enci

rcle

d E

ner

gy

90%

Encircled

Energy

Design

Value

2.52° >1.34

°

10%

Encircled

Energy

Design

Value

Encircled Energy


Static 1D Random Diffuser


MO-Optics: Customized Illumination

for SUSS Mask Aligner

MO-Optics – YIELD IMPROVEMENT

MO-Optics

Better uniformity (± 2%)

More light (up to 25%)

Flexible illumination settings

Higher resolution for proximity, steeper sidewalls

Optimized illumination for specific mask pattern


Example: 480 µm Proximity GAP

Aligner: MA150 @SMO, Angle Defining Element: Small Ring

Proximity Gap: 480µm

Photoresist: AZ 1.3µm dick (Silizium-Wafer)

20µm Lines & Spaces (MO-Optics, Ring) 20µm Vias (MO-Optics, Ring)


MO-Optics: Gray-Level with Customized Illumination

#2589 Ring IFP LV0.5#2588 Malteser 0°IFP LV1.0 #2590 Malteser 45°IPF LV1.0 #2591 ohne Blende

(Proximity Lithography at Fraunhofer IOF, Jena)


Substrate Conformal Imprint Lithography

(SCIL)

Marc A. Verschuuren, Robert van de Laar, Hans van Sprang

Philips Research

45

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48 R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009

Future: Light Sources and Collimation Optics

on Wafer-Level?

SUSS.

Our Solutions

Set Standards

SUSS MicroOptics www.suss.ch

SUSS MicroTec www.suss.com


Documents

Suss Micro Optics, Wafer Scale Manufacturing, R. Voelkel, June 2009