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Great Asia Machinery Co., LTD.
SUNUP High Tech Co., LTD.
Company Background
• The Sunup Tech Corp. was established in 2006 teamed up with a group of experienced engineers in Semiconductor and Optical-electro industry. We focus on the Semi-con and Optoelectronics supplies, spare parts and equipment maintenance.
• The Great Asia Machinery was established in 1997 and earlier on focused on die make and custom-made machinery manufacturing. Now, the Great Asia Machinery has already stepped in the high-tech industry to design and build-up various equipment and will continue to develop relative equipment in solar cell and flexible display fields.
Company Organization
Business Direction Machine Design
Semi-Con and Optical-electro equipment
$50,000 ~100,000 USD Sputtering and Thermal Evaporation
Used Equipment and Maintenance Service
Vacuum Pump Repair:Dry Pump、Oil Pump
Power Supply Repair:DC、RF、Pulse-DC、MF
Used Parts:Gauge、Controller
used vacuum equipment and spare parts imported from Japan,Europe
and America
International Trade and Agency Business
TFT-LCD, LED illumination build-in switch power supply
TFT-LCD Color Filter Glass Polishing Pad
Original creative Invention
original vacuum gate valve
Solar-cell Equipment, Process, Materials, Patent
Primary Business
Vacuum chamber and equipment manufacturing
CNC machine workshop
3D modeling
Equipment maintenance
Vacuum system spare parts
Semiconductor equipment spare parts
Optoelectronics spare parts
Equipment assembly ODM&OEM
System Design and Reference
• Electron Cyclotron Resonance Plasma CVD
(ECRCVD)
• IC Mask Testing Equipment
• Ultra High Vacuum E-Gun Evaporation
• Vacuum Hot Press Furnace
• Vacuum Bonding System
• Nano Ball Mill
Equipment System Design
Electron Cyclotron Resonance
Plasma CVD (ECRCVD)
Specification
Plasma Source:Electron Cyclotron Resonance
Plasma
Substrate Plate Size:300mm*300mm
Microwave Spec.:2.45GHz、2.5KW
Heating Plate Max. Temp:7000C
Vacuum < 1*10-6 torr
Process Gas:CH4、H2、N2、O2、Ar、He
Process Gas Max. Flow:300 sccm
Application
PECVD:Silicon Thin Film Solar Cell
Dry Etch : Semiconductor
IC Mask Testing Equipment
Specification:
Particle count: <0.5μm, <5ea
Pressure:
Vacuum pressure: 8*10-3 torr
Saturated pressure: 2 atm
Vacuum pressure deviation while process on ±0.1% FS
Gases injected:
Non-corrosive gases: PN2, CDA (or Ar)
Corrosive gases: NH3, SO2, H2S
Full scale flow rate: 2000 sccm MFC (minimum flow rate: 1% full scale)
Ultra High Vacuum E-Gun Evaporation
Specification:
Vacuum < 10-9 torr。
Robot system
load-lock chamber
main chamber
IR Lamp annealing in the load-lock chamber
substrate holder rotation system (0~15rpm)
Vacuum Hot Press Furnace
Specification:
Vacuum < 10-3 torr。
Temperature Control System by Japan RKC
Programmable Control
Electronic Control System by Mitsubishi PLC
Controller
Application:
Ceramic Powder sintering
Sputtering material sintering
Vacuum Bonding System
Application:
Diffusion Bonding
Ceramic Bonding
Ceramic / Metallic Bonding
Parts Service
• We specialize in equipment parts/module
repair and part manufacturing for the
processes of thin film and etching in
Semiconductor, as the processes in Opto-
electronics.
Parts Design
Source Materials Selection for Vacuum Application &
Different Modules in Semiconductor & Opto-
electronics.
Geometric Dimensioning and Tolerance System
Complies with ANSI, JIS & CNS Standards.
Fabrication Standard Recommended.
Heat Treatment Recommended(Annealing, Firing….)
Surface Treatment(Ni,Cr,Au,Ag,Cu,Ti,Al…coated &
Anodization)
Jig & Fixture Design for Fitting & Assembly.
AutoCAD Drawing Available.
Vacuum Equipment Parts
Gate Valve
Engineering Plastics Parts
Shower Pipe
Vespel Screw Vespel Ring
Metal(Alloy)
Stainless Steel (SUS 316 , 316L, 304…)
Al, Ti, W, Mo, Cu, Fe, Ni……
Ti Alloy Deposition Ring 8 inch SUS 316 Clamp
8 inch Al Alloy Sputtering Chamber 6 inch Al Alloy Chuck
8 inch Al Alloy Sputtering Collimator 6 inch Al Alloy Sputtering Collimator
8 inch Al Alloy Sputtering Collimator 6 inch Al Alloy Shower Head
8 inch Al Alloy Shower Head 6 inch SUS 316 Front Side Substrate Holder
8 inch SUS Back Side Substrate Holder SUS304 5 inch wafer Evaporation Done
Evaporation: Free oxide Copper
Source Crucible Assembly Inconel 750 Washer
Evaporation: Free oxide Copper
Source Crucible Assembly SUS 304 Symmetry Clamp
In Line Sputtering:AET Mask In Line Sputtering:Floating Mask
In Line Sputtering:Ground Shield AET Plane
Carrier Plate Mask
Mask Holder TRAY
Ceramic Parts
Ceramic Bearing
• Ceramic Ball:Si3N4、ZrO2
• Ceramic Ring Material:Si3N4、ZrO2
•Type:6000,6001,6002,6003,6004,6005,6006,6007,6200,6201,6202,6203,6204,6205,6206,6207,6208,6300,6301,6302,6303,6304,6800,6801,6802,6803,6804,6805,6806,6807 and Custom-made
Machine Workshop
Machines:
– CNC Machining Centers
– CNC Lathe
– CNC Wire Cutting Machine
– CNC Electric-Discharge Machine(EDM)
– Grinding & Polishing Machine
Machined Parts Via Precision Manufacturing with
Optima Positioning Accuracy:
– Dimensional (Displacement) Accuracy within 0.05mm
– Dimensional (Planar) Accuracy within 0.05mm
– Dimensional (Volumetric) Accuracy as Required
Secondary Machining of Parts within Specified &
Tight Tolerance
CNC Machining Centers
Facility 1:
CNC Machining Center
Capacity: 850mm * 520mm
Facility 2:
CNC Machining Center
Capacity : 1300mm * 750mm
Facility 3:
CNC Machining Center
Capacity : 2100mm * 1800mm
CNC Lathe
Facility 4 : CNC Lathe
Facility5 : CNC Lathe
Machine
Facility6:
Electric-Discharge Machine
(EDM)
Facility7:
CNC Wire Cutting Machine
Machine
Facility8:
Horizontal Grinding Machine
Facility9:
High Speed Lathe
Capacity: 430mm * 1100mm
Machine
Facility10:
High Speed Milling
Capacity: 500mm * 1100mm * 400mm
Facility11:
Horizontal Lathe & Milling Machines
Capacity: 1000mm * 2000mm * 80mm
Welding Facility
Facility1:
TIG WELDING MACHINE
Facility2:
MIG WELDING MACHINE(CO2)
Facility3:
Plasma cutting machine
Surface Treatment
Ceramic Materials Thermal Spraying
- Any materials
Electroplating
Anodization
- Only for Aluminum Material
Polishing - Electropolish
- Chemical
- Mechanical
Vacuum Leak Test
• Helium Detector
– ULVAC HELIOT 700
Certificates of Quality System