COMPA NY PRIVA TE 052_12f_rev4_Stand ard Process !o"#$%CSP STAT S C& '(PAC %T)* An+ &ardco(+ (r'nto,t of t&'s doc, -ent 's ,ncontro!!ed ,n!ess 't .ears )CC contro!!ed sta-( e/ce(t for for-s on!+* TIT%E STAN)AR) PROCESS %O$ AN) OM OR SCS $AER PROCESS )OC NO AP000523P ORM REV 4 Pae11 REVERSE FLOW STANDARD PROCESS FLOW FOR WLCSP Wafer Taping AP080044WI Wafer from die bank (in-house lots from WS or WP) ff-shore lots re!ei"ing to #ie $ank I%A Wafer Inspe!tion %P0&00''WI $ a!kgrind AP08004WI * +ure, #etaping AP080'4WI .aser /ark AP080'1WI Wafer /ount AP0800'4WI +2 Wafer I#3.inking AP08000%P Wafer Sa AP0800'85%P /fg nd pti!al AP0800'4WI %A nd pti!al %P0&008WI Pi!k 6 Pla!e T72 AP0800'8WI Pi!k 6 Pla!e Waffle Pak AP0800'8WI utgoing %A %P0&000WI . $at!h ut .aser /ark AP080'1WI * +ure, #etaping AP080'4WI Note : Laser Mark and Backgrind are OPTIONAL
