Standard Operating Manualmfz140.ust.hk/Eq_manual/SOP of Cooke2 evaporator.pdf · Cooke Evaporator CAN do Up to 4 pieces 4 inches full silicon in Non-Standard level. Up to 4 pieces

NANOSYSTEM FABRICATION FACILITY (NFF), HKUST

Copyright © 11.2015 by Hong Kong University of Science & Technology. All rights reserved. Page 1

Standard Operating Manual ___________________________________________________________

Cooke Evaporation System



Contents 1. Picture and Location

2. Process Capabilities

2.1 Cleanliness Standard

2.2 Possible Deposition Materials

2.3 Process Specification

2.3.1 What the Cooke Evaporator CAN do

2.3.2 What the Cooke Evaporator CANNOT do

2.4 Sputter Process Useful Information

3. Useful information to work in NFF

3.1 Emergency Responses and Communications

3.2 Become a Qualified Cooke Evaporator User

4 Operating Safety and Rules

4.1 Operation Safety

4.1.1 General Safety

4.1.2 Equipment Safety

4.2 Operation Rules

5. System Operation

5.1 Cooke Evaporator System Description

5.2 Initial Status Checks

5.3 Initial System Checks

5.4 Preparation before Sputtering Process

5.4.1 MDC-360 Thin Film Deposition Controller

5.4.1.1 Operating Displays

5.4.1.2 Operating Controls

5.4.1.3 PARAMETERS/STATUS Displays

5.4.2 TT6 e-beam Power Supply

5.4.2.1 Main Cabinet

5.4.2.2 Control Module

5.4.2.3 Control Module Chassis

5.4.2.4 XY Sweep Controller

5.4.3 Crucible Indexer

5.4.4 Vacuum Controller

5.5 Load and Edit Recipe

5.5.1 Recipe Displays

5.5.1.1 View/Edit Process

5.5.1.2 View/Edit Material

5.5.1.3 View Results

5.5.1.4 Edit System Setup

5.5.2 Starting a Recipe

5.5.3 Trouble, Error and Warning messages

6. Process Run

6.1 Substrate Loading

6.2 Source Material Loading and Crucible Change

6.3 Startup Procedures

7. Process Recording

8. Clean up

9. Check out

https://snf.stanford.edu/SNF/equipment/metalization-sputtering/evaporation/innotec-es26c-e-beam-evaporator/#section-9



Cooke Evaporation System

1. Picture and Location

Fig.1 Cooke Evaporation System

The Cooke Evaporation System is located at NFF Enterprise Center Cleanroom Room4162.



2. Process Capabilities

2.1 Cleanliness Standard

Cooke Evaporation System is classified as NON-STANDARD equipment.

2.2 Possible Deposition Materials

Aluminum

Chromium

Germanium

Gold

Iron

Molybdenum

Nickel

Platinum

Silicon Dioxide

Silver

Titanium

2.3 Process Specification

2.3.1. What the Cooke Evaporator CAN do

Up to 4 pieces 4 inches full silicon in Non-Standard level.



Special approval is required for substrate other than 4 inches.

2.3.2. What the Cooke Evaporator CANNOT do

Cooke should not be used for depositing thick films due to time, wear on the system,

expense of materials, and adhesion issues with your sample.

Cooke should not be used to evaporate dielectrics.

Capture all the variability between users in terms of e-beam focusing, source condition

(new sources will have a different deposition rate than a source that has been used many

times).



2.4 Sputter Process Useful Information

To avoid over heat problem of the crucible and power supply, please be reminded individual

sputtering process cannot over 500A per run. Then, a 10 minutes cool down time is required

for every 500A sputtering process. User who fails to follow the rules and cause damage to the

equipment, we will charge you the damaged components, crucible (HKD800) and power

supply (HKD20000).

For aluminum deposition, designated pocket is 2. Deposition rate of 2A/s can be used for

1000A or above, 1A/s can be used for 200~500A, 0.5A/s can be used for less than 200A.

Material density is 2.70gm/cm3, acoustic impedance is 8.17gm/cm

2/s, tooling factor is

100%.

For chromium deposition, designated pocket is 6. Deposition rate of 2A/s can be used for




100%.

For germanium deposition, designated pocket is 3. Deposition rate of 2A/s can be used for




100%.

For gold deposition, designated pocket is 4. Deposition rate of 2A/s can be used for 1000A

or above, 1A/s can be used for 200~500A, 0.5A/s can be used for less than 200A. Material

density is 19.30gm/cm3, acoustic impedance is 23.18gm/cm

2/s, tooling factor is 100%.

For iron deposition, designated pocket is 2. Deposition rate of 2A/s can be used for 1000A




For molybdenum deposition, designated pocket is 6. Deposition rate of 2A/s can be used

for 1000A or above, 1A/s can be used for 200~500A, 0.5A/s can be used for less than 200A.



100%.



For nickel deposition, designated pocket is 6. Deposition rate of 2A/s can be used for




27.4%.

For platinum deposition, designated pocket is 5. 0.5A/s or 0.8A/s can be used for less than

300A. Material density is 21.40gm/cm3, acoustic impedance is 36.04gm/cm

2/s, tooling

factor is 100%.

For silicon dioxide deposition, designated pocket is 6. Deposition rate of 2A/s can be used

for 1000A or above, 1A/s can be used for 200~500A, 0.5A/s can be used for less than 200A.



100%.

For silver deposition, designated pocket is 1. Deposition rate of 2A/s can be used for 1000A




For titanium deposition, designated pocket is 3. Deposition rate of 2A/s can be used for




100%.

Please be reminded film thickness input in the thin film controller is in the unit of 1000A.

For more details information about the process, please consult NFF Enterprise staffs (Peter

PUN or Wilson YIP).

3. Useful information to work in NFF

3.1 Emergency Responses and Communications

In case of emergency issues, please contact NFF staffs,

Peter PUN – Technician (x7225)

Wilson YIP – Senior Technical Officer (x7216)

CK WONG – Senior Technical Officer (x7226)

https://snf.stanford.edu/SNF/equipment/metalization-sputtering/evaporation/innotec-es26c-e-beam-evaporator/#section-9



In case of technical help, please contact NFF staffs,

Peter PUN – Technician (x7225)

Wilson YIP – Senior Technical Officer (x7216)

3.2 Become a Qualified Cooke Evaporator User

Please follow the procedures below to become a qualified user:

Read all materials provided on the NFF website of the Cooke evaporator.

Request Cooke evaporator operation training and examination online.

4. Operating Safety and Rules

4.1. Operation Safety

4.1.1. General Safety

NFF user must familiar themselves with the following general safety issues:

Location of emergency exits and assembly points

Procedures for obtaining first aid assistance must be known.

Various alarm sounds and emergency call procedures must be known.

4.1.2. Equipment Safety

In emergency when using the equipment, push the red emergency button (Fig. 2) to

interrupt the equipment power, and report to the NFF staffs immediately. DO NOT attempt

to resume the equipment on before the problem is solved.

If the equipment fails while being used, never try to fix the problem by your own, please

write down the alarm information and report to NFF sputtering module staffs.

High voltages and hot surfaces are present in this equipment. All users must be properly

qualified, and must not attempt to defeat any equipment interlocks.

Process alarm or warning message will be displayed at the top right corner of the screen

(Fig. 3). DO NOT attempt to resume the equipment on before the alarm/warning message is

verified.

To avoid any serious injury, please make sure the chamber bolts have been fastened in a

safe position before you raise the chamber.

To avoid any serious injury, please keep person away from the chamber area during



chamber rising.

To avoid any malfunction of the hoist system, please insert the hoist stopper during the

source material re-filling. This stopper can stop the sudden falling off of the hook up

chamber (Fig. 4).

To protect your eyes, user must wear the provided goggles to observe the e-beam position

through the viewport (Fig.2).

Fig.2 Emergency button (ESO)



Fig.3 Alarm/Warning message

Fig.4 Hoist stopper

4.2. Operation Rules

Do not operate the equipment unless you are properly trained and approved to operate the



equipment.

Cooke evaporator can be reserved in NFF website.

Please reserve the time slot on your own, and make sure you use your own time slot to do

the sputtering process.

Reservation will be forfeited if user does not show up and check-in within half of the

session time and it may cause a $200 penalty.

Do not leave an on-going etching process unattended.

Please fill all the details of the log-sheet attached, i.e. date, name, project number, email,

project details, material …

Do not change details of the recipe established in the controller. If you need to start a new

material, please consult NFF etching module staffs for help.

Please record all the details of the recipe you used; the memory will be full and need to

release from time to time.

To avoid rapid cooling of the source parts, the process chamber can only be vent at least

half hour after evaporation process.

To avoid over heat problem of the crucible and power supply, individual sputtering process

cannot over 500A per run. Then 10 minutes cool down time is required for another 500A

sputtering process.

To avoid damage the crucible and power supply, the power% is limited to 46%, and the

power will not increase over this limit, otherwise a maximum power alert will be given. To

overcome this problem, user can make fine adjustment to the e-beam position in order to

soak the source at the side of the crucible. To adjust the e-beam position, please read the

following section 5.4.2.4 XY sweep controller, sweep select module, (Fig.15).

To avoid source material over run problem, total film deposition thickness cannot exceed,

5000A for aluminum, 2000A for chromium, 2000A for Titanium, 2000A for Molybdenum,

1500A for Nickel.

To avoid any damage of the hoist system, user must check the vacuum gauge and verify that

the chamber is fully vented (in atmosphere) before activating the hoist.

To avoid too slow or too fast substrate holder rotation, we do not allow user to change the



substrate rotation speed.

To avoid unintended termination of the deposition process, user must check the lifetime of

the crystal is sufficient for the whole deposition process or not; otherwise it may terminate

the process when the crystal life is below 80%. A fresh crystal starts out with a lifetime of

99%. Please see details description of the following MDC-360 controller section.

To avoid unintended contamination of the source material and substrate, make sure there is

no metal film peeling off from the chamber liner, pocket surrounding area, and the substrate

holder. If it happens, please report to the module technicians.

To avoid damage the source, contaminate the system or eventually leads water leak, please

do not operate a source on an empty pocket or with the beam impacting some portion of the

surrounding structure.

5. System Operation

5.1 Cooke Evaporator System Description

The Cooke evaporation system is a semi-automatic electron beam thin film deposition tool,

and equipped with a CTI cryo-pump, it capable of sustained a 10-7

torr high vacuum.

Basically, the system consists of, 1) vacuum chamber, 2) pumping system, 3) control system,

4) electron-beam power supplies. Brief descriptions of individuals are as follow:

1. Vacuum Chamber

The vacuum chamber is a cylindrical stainless steel bell-jar, 20” ID x 30” high, with a

removable top-plate, and a viewport is located in the center of the chamber. In order to

load/unload the substrates or source material, there is a hoist actuator can be used to lift the

top plate or the whole chamber. The chamber has two attachment screws for connecting the

process chamber to the top plate for whole chamber lifting. In addition, a set of chamber

liners are inserted, and can be removed for routine cleaning. In order to get a better

uniformity and step coverage, the system is also equipped with a rotating substrate holding

plate.

2. Pumping system

The pumping system is a programmable controller with output to provide automated control



of all vacuum related components. The program allows automated startup, pump down,

venting, and shutdown.

3. Control system

The Maxtek MDC-360 controller offers full capability of view/edit source material or

deposition recipes, with the crucible indexer which controls the pocket rotation, this

eventually provides automatic control of single or multi-layer deposition.

4. E-beam power supplies

The e-beam power supplies include main AC main cabinet, high voltage control module, XY

sweep controller, and the crucible indexer. These units used to maintain the e-beam and

control its position.

5.2 Initial Status Checks

Please check the status of Cooke evaporator shutdown notice posted in the NFF reservation

website.

If the equipment has been reserved, you can check the name and project number that

displayed in NFF reservation website are correct.

Please check-in the reserved equipment on your own within half of the session time. To do

the check-in, please scan your NFF access card over the card reader attached.

If you failed to check in the machine, there is an interlock, and you cannot operate the

equipment normally.

Before operate the equipment, make sure you have read and ready to fill the details of the

log-sheets attached.

5.3 Initial System Checks

There are several interlocks used to monitor the whole system for safe operation, please

check and make sure the following interlocks of TT6 controller are fulfilled before using the

system (Fig. 5):

VACUUM INTERLOCK: minimum vacuum level (3x10-6

Torr) must be present before

high voltage is energized, to prevent danger operation of high voltage and high current



power supply when the chamber is at low vacuum or even at atmosphere pressure.

WATER FLOW INTERLOCK: water cooling that protects the cryo pump, sputter gun, and

the rate monitor head from damage due to over-heat.

DOORS: interlock on all doors and panels that permit high voltage access are closed, and

then the interlock will be satisfied.

ZERO: interlock insures that the emission control is at its minimum position before high

voltage and filament voltage can be applied to the source.

READY: when all the interlocks are closed, this indicator will be energized. The OFF push

button LED will also energize at this moment.

Fig. 5 System interlocks LEDs of the TT6 Control

5.4 Preparation before Sputtering Process

Prior to the system operation, please read the description of film deposition controller,

e-beam power supply, crucible indexer and vacuum controller.

5.4.1 MDC-360 Thin Film Deposition Controller

Typically, if evaporation rate is a function of source power alone, a rate controller would not

be necessary. One would establish the power required achieving the desired rate by set the

power at that point; this control system is called “open loop” control.



Unfortunately, evaporation rate is a function of many variables. For E-gun sources, rate is

affected by material level, water cooling temperature, beam position, sweep pattern, etc.

Therefore, if we want to achieve a known and constant rate, then we need a rate controller.

The MDC-360 rate controller compares the measured rate with the desired rate and attempts

to keep them equal by adjusting the power level of the power supply, and this is a “close

loop” feedback control. It utilizes three control loop parameters referred to as PID parameters;

Proportional gain, Integral Time constant and Derivative Time constant to provide

optimization to the control loop. However, all these parameters have been set and no further

adjustment required by the user.

Front panel display and operation The MDC-360 thin film controller mainly consists of

Operating displays, Operating Controls, Parameters/Status displays and user keypads (Fig.6).

Fig.6a Schematic MDC-360 thin film controller

Fig.6b Real MDC-360 thin film controller

5.4.1.1 Operating Displays

There are six parameters can be viewed in the operating display, Rate, Power, Thickness,

Layer number, Crystal Health %, and Time to go. Users are required to check those

parameters from time to time during deposition process.

Rate Å/sec: it displays the deposition rate in angstroms per second. Typically, the

deposition rates set in the recipes are in the range of 0.5A/s – 2A/s.

Power %: it displays a percent of power to maintain the deposition rate described above.

Typically, we set the maximum power is about 45% of the full power.



Thickness: it displays the measured thickness in KÅ.

Layer Number: it displays the layer number of the current process.

Crystal Health %: it displays the health percentage of the sensor crystal in use. A fresh

crystal starts out with a health of 99%. Typical useful sensor lifetime is around 80%.

Time to go: time remaining to be completed.

5.4.1.2 Operating Controls

There are six operating keys under the operating displays, Manual, Start, Abort, Reset,

Zero, and Shutter, each key is equipped with LED to indicate the controller’s status.

Manual: this key is used to toggle the MDC-360 manual mode on and off. A red light

behind the key indicates the controller is in manual power control mode. However, we do

not allow user to operate the power control in manual mode.

Start: this key starts a process, a green light behind the key indicate the controller is in

process. When this key is pressed the first time, then a list of stored recipe is displayed in

the right sided PARAMETER/STATUS screen. Then, move cursor to select the desire

recipe, and press “START” key again to start the process. Note that operating messages

will be displayed in the PARAMETERS/STATUS screen.

Abort: to stop a running process, click the “ABORT” key into the abort mode. All source

powers are set to zero, and discrete output from the MDC-360 controller is set to inactive

status.

Reset: the “RESET” key is used to clear the controller from the Abort mode and back into

a Ready mode. A yellow light behind the key indicate a READY mode.

Zero: the “ZERO” key is active at all the times to calibrate the thickness display to go zero.

Fail to set the controller zero will results a film thicker than that desired and displayed.

Therefore, user is not allowed to operate this key.

Shutter: the “SHUTTER” key is use to open and close the shutter manually. The red light

is illuminated when the shutter is closed. However, user is not allowed to operate this key.

5.4.1.3 PARAMETERS/STATUS Displays

Once power on the MDC-360 controller, a Sign-On screen will be displayed (Fig.7), and user



can press any key to put the controller into the IDLE mode. Then, a RESET key can be used

to put the controller further into the READY mode. After pressing the RESET key, then the

Parameters/Status screen will return to the display function being used at the last power off.

Fig.7 Sign-on screen

Left sided of the PARAMETERS/STATUS display, there are STATUS and PROGRAM

keys; it uses to display the status information and program information.

STATUS displays

There are six different run time status screens that can be displayed at any time by pressing

the STATUS key, part of the graphs that user concern will be shown as follows:

Fig.8a Rate vs Time graph

Fig.8b Thickness vs Time graph



Fig.8c Power vs Time graph

5.4.2 TT6 e-beam Power Supply

The TT-6 Electron beam Power supply consists of 1) Main cabinet, and 2) Control

Module/Sweep module, as shown (Fig.9)

Fig. 9 TT-6 e-beam power supply

5.4.2.1 Main Cabinet

Details of the main cabinet (Fig.10) are illustrated as follows; and user must pay attention to

the items written in bold:



(1) MAIN CIRCUIT BREAKER of the whole TT-6 e-beam power supply. When it is ON,

AC power is applied to the power supply.

(2) THERMAL BREAKERS provide protection for the control circuits.

(3) MAIN POWER INDICATOR, check this LED lights when the power is applied to the

control circuits.

(4) HIGH VOLTAGE INDICATOR, check this LED lights when the high voltage is

turned on.

(5) CUTBACK INDICATOR, this LED energizes when the power supply is in a cut back

condition. Typically, this LED should be OFF during process.

(6) MANUAL/AUTO MODE SWITCH, user must operate the system in auto mode.

(7) BIASVOLTAGE, this trim pot is used to adjust the “bias” set point, and user is not

allowed to change this set point all the time.

(8) VOLTAGE ADJUST, this trim pot is used to adjust the “output voltage level” set point,

and user is not allowed to change this set point all the time.

Fig.10 Main Cabinet (schematic)



5.4.2.2 Control Module

Details of the control module (Fig.11) are illustrated as follows, and user must pay attention

to the items written in bold:

(1) HIGH VOLTAGE/EMISSION, OFF, the on/off function is provided by a pair of

push-buttons on the panel. The off button lights when the High Voltage and the Emission

are off.

(2) HIGH VOLTAGE/EMISSION, ON, the on button lights when the High Voltage and

the Emission are on.

(3) ZERO, this interlock insures that the emission control is at its minimum position before

high voltage and filament voltage can be applied to the source. The LED will energize

when the interlock is fulfilled.

(4) WATER, this interlock assures that there is sufficient water flow to cool the source. The

LED will energize when the interlock is closed.

(5) DOORS, this interlocks on all doors and panels that permit high voltage access are

closed, then the interlock is closed.

(6) VACUUM, the minimum vacuum level set must be present before high voltage can be

energized

(7) READY, when all the interlocks are closed, this indicator will be energized. The OFF

push button LED will also energize at this moment.

(8) VOLTAGE/CURRENT METER, a digital bar graph displays the output voltage and a

digital display shows the emission current. The voltage range of indication is 0 to 10kV and

the current is 0 to 0.999 ampere. Typical value of voltage/current is about 7.5KV and 0.25A

(Fig. 5).

(9) EMISSION CURRENT, adjustment of the emission level of the electron beam source,

and user is not allowed to change this setting.



Fig.11 Control module of TT6

5.4.2.3 Control Module Chassis

Details of the control module chassis (Fig.12) are illustrated as follows:

(1) ON/OFF SWITCH, this provides sweeper power, not TT6 controller power. In our

system, it is always set to be ON.

(2) MODE (CONTROL/SWEEP SELECT) SWITCH, selects between Control and Sweep

Select. In our system, we set SWEEP Select mode instead of Sweep Control mode.

(3) POSITION LEDs, it shows the relative position of the beam in the pocket, lateral axis

(left & right).

(4) POSITION LEDs, it shows the relative position of the beam in the pocket, longitudinal

axis (near & far).

Fig.12a Control module chassis (schematic)



Fig.12b Control module chassis (real)

5.4.2.4 XY Sweep Controller

XY sweep controller includes i) Sweep control module (Fig.13) and ii) Sweep select module

(Fig.14). However, we recommend user adjust the e-beam sweep in manually, so sweep select

module will be focused.

i) Sweep Control Module mainly control the beam sweeping by joy stick

Fig. 13 Sweep Control module

(1) PATTERN MODE SWITCH, this 3 position mode switch is used to select between



SPIRAL, MANUAL beam position and TRIANGLE pattern. With SPIRAL mode, the

longitudinal/modulation frequency knob controls the spiral-collapse frequency, while both

lateral and longitudinal amplitude knobs control the overall size. Then the joystick can be

used to position the beam. The Modulation Amp knob controls the depth of spiraling

collapse. With TRIANGLE mode, the lateral and longitudinal amplitudes and frequencies

of the beam are set with the corresponding knobs. The joystick can be used to position the

beam, and the resulting beam movement is in a diamond pattern. With MANUAL mode,

the joystick can be used to position the beam, there is no sweeping. In this system, we are

running in MANUAL mode, user is strictly prohibited to change the setting.

(2) JOYSTICK, it moves the beam or center position of the patterns.

(3) & (4) AMPLITUDE, it adjusts the overall pattern size.

(5) & (6). FREQUENCY, it adjusts the sweeping speeds.

(7) MOD AMP, it adjusts the depth of the spiral’s collapse

ii) Sweep Select Module control the beam by using the knobs instead of joystick.

Fig.14 Sweep Select module

(1) MANUAL/AUTO SWITCH, to change the control of the Sweep Select module from

front panel to the remote input. In this system, we are running in MANUAL mode.

(2) SELECT PATTERN, to select the active pattern for manual mode. In this system, we are

using Sweep pattern 1.



(3) ACTIVE PATTERN LED, it indicates which one of the four patterns is active.

(4) PATTERN MODE SWITCH, to select between SPIRAL, TRIANGLE, and MANUAL

mode of operation. In this system, we are running in MANUAL mode.

(5) & (6) POSITION, turn these 2 knobs to adjust the beam or the center position of

the patterns. However, make sure you know where the e-beam is pointing at before make

any adjustment. Also, please make fine adjustment only.

(7) & (8) AMPLITUDE, it adjusts the overall pattern size

(9) & (10) FREQUENCY, it adjusts the sweeping speed.

(11) MOD AMP, it adjusts the depth of the spiral’s collapse.

5.4.3 Crucible Indexer

The Telemark 376 indexer (Fig. 15), positions the crucibles from one of the sources; it also

has a position-indicating function. The controller features crucible pocket selection lights to

tell the operator which crucible is in the “evaporate” position. However, it should be run in

AUTO mode. In the Cooke evaporation system, it equipped with 4 pockets for different kind

of materials. Typically, pocket 1 to 4, contains Nickel crucible, Molybdenum crucible,

Aluminum crucible, Chromium crucible/Titanium crucible respectively. For titanium and

chromium source, it shares the same pocket 4, so user must check and change the crucible if

necessary.

Fig.15 Crucible indexer

5.4.4 Vacuum Controller

The HSD vacuum controller is a five modes switch, and we will describe the mode of

operation that useful to the user in the following (Fig.16):

PUMP mode, it evacuates the chamber from atm. to high vacuum. Firstly, the mechanical

pump will be turned on, and then the roughing valve will open to evacuate the chamber



until high-set-point reached. Then, roughing valve will be closed, and the high vacuum

valve will be open. Once high vacuum pumping has commenced, the ion gauge will be on,

and the system will remain in this mode during deposition.

VENT mode, it brings the chamber from high vacuum to atm. Firstly, the high vacuum

valve will be close, and then vent valve will be open. However, the vent valve will remain

in open position even when the chamber is completely vented. To conserve the vent gas,

when venting is completed, turn the dial to START-UP mode, then the vent valve will close

while the system will remain in stand-by situation.

Fig. 16 HSD vacuum controller

5.5 Load and Edit Recipe

User is required to check, and set the recipe before deposition. To view or edit the recipe,

please read the following:

5.5.1 Recipe Displays

If a PROGRAM key is pressed, then a Main Menu will be displayed as follow (Fig.17):

Fig.17 Main Menu

In this Menu, View/Edit Process, View/Edit Material, View Result and Edit System Setup are

displayed. User can move the cursor to the position to select the desire function.



5.5.1.1 View/Edit Process

In this View/Edit Process screen (Fig.18), all the recipes are displayed.

Fig.18 View/Edit Process screen

By moving the cursor to the recipe name, and click ENTER key, then the details of the recipe

will be displayed (Fig.19). In this screen, it shows process name, layer, thickness and material

used. Normally, user is allowed to edit the thickness of the film to be deposited. In addition, if

user who want to deposit a multiple layer of films, please consult NFF staff for help.

Fig.19 Recipe details

In the material column, user can click on it to simply view or select the listed materials

(Fig.20). However, user is allowed to view the material, but not allow to make change.



Fig.20 Material list

5.5.1.2 View/Edit Material

To view details of the material, user must return to the Main Menu, and select the View/Edit

Material, and then the screen will be displayed (Fig.21).

Fig.21 View/Edit material

In each material, you can view/edit the details of the material by clicking into it. The details

of the material will be displayed as follow (Fig.22)

Fig.22 Material details

In this screen, you can view all the details of the parameters of the material. However, we

only list some of the parameters that users might need to pay attention, including Material

Name, Pocket No., Soak Power, Pre-deposit Power, Deposit Rate, and Maximum Power.

Anyway, user is not allowed to make any changes on the material parameters.

5.5.1.3 View Results

We do not have this result viewing option.

5.5.1.4 Edit System Setup

System parameters can be editing in this menu. However, we do not allow user to make any



changes on this system setup menu, so we will not go in details.

5.5.2 Starting a Recipe

To start a recipe, please make sure you have read the following procedures of MDC-360

controller to start a recipe:

In READY mode, to start a recipe by clicking the “START” key, and then the Run Process

Selection Screen will be shown (Fig.20).

Fig.23 Run Process Screen

Then, select the process recipe by positioning the cursor on the desired process recipe

name.

Finally, to actually start the process, press the START key again, then the controller will

scan the total process definition and the condition of the system, and the process will start if

everything appears to be in order.

A typical process profile is shown below for reference (Fig. 24).



Fig.24 Typical process profile

5.5.3 Trouble, Error and Warning messages

During process running, there are three levels of audible warnings associated with the trouble

conditions, Attention, Alert, and Alarm. Table 1-1 lists part of the messages and warning

levels that may help users know more about the status, as below

Warning

Messages Type Action

Min Rate & Max Power Alarm Abort

Max Rate & Min Power Alarm Abort

Crystal Failure Alarm/Attention Halt

Source Fault Alarm Halt

Max power alert Alert X

Maximum power Attention X

Table 1-1 MDC-360 warning and messages

Min Rate & Max power: This indicates the output power is at maximum power level set

by the Maximum Power parameter and the rate deviation is below the limit value set in the

Rate Dev. Alarm parameter. When this happens, the controller will go to ABORT mode and

the Alarm warning will sound. Then, user must be report to NFF technical staff.

Max Rate & Min power: This indicates the output power is at minimum power level set

by the Minimum Power parameter and the rate deviation is above the limit value set by the



Rate Dev. Alarm parameter. When this happens, the controller will go to ABORT mode and

the Alarm warning will sound. Then, user must be report to NFF technical staff.

Crystal Failure: This indicates lack of a valid signal from the sensor, and generally results

from a failed crystal but may also indicate problems in the crystal mounting or

interconnection between the sensor and the controller.

Source Fault: This indicates that the correct source pocket position feedback has not been

achieved within the time set by the Rotator Delay parameter.

Max Power Alert: This indicates that the power output level has been at the Maximum

Power level longer than the time period set in the Power Alert Delay parameter.

Maximum Power: This indicates that the output power is at or below the minimum power

set by the Minimum Power parameter.

6. Process RunTo run a process, please read the following instructions below:

6.1 Substrate Loading

To load substrates into the chamber, please follow the procedures below:

Typical the system is idle in a high vacuum condition; please check i) pressure readout

(Fig.25), and ii) cryo temperature (Fig. 26). If the chamber base pressure is over 1x10-5

torr

or cryo temperature is over 23(K), please report to NFF module staffs. To view the

chamber/cryo pressure readout, click the gauge ON button once.



Fig.25 Chamber pressure readout

Fig.26 Cryo pump temperature readout

Then, turn the rotary switch to VENT mode (Fig.16), vent the chamber to atm.

When the chamber pressure readout reach 7.6x102 torr (1ATM) in Fig.26, then turn the

rotary switch to Start-Up mode, and keep the system in a stand-by condition.

Raise the top plate with the hoist control switch until the substrate holding plate is

accessible (Fig.27). To keep the top plate in position during rising, please slightly hold the

plate with one hand.

Place the substrates upside down on the substrate holding plate. If necessarily, please turn

the rotation switch ON to facilitate the substrate loading (Fig. 28).

Check all the substrates are sitting in position. Then, move down the top plate slowly, and

align the top plate with the cylindrical chamber with the hoist control carefully. Please pay

special attention to the substrate holding plate; it is easy to crash with the chamber wall

when it is moving down.

When the top plate is complete downed, fasten the bolts to the top plate at two sides of the

chamber at a safe position.



Fig.27 Substrates holding plate

Fig.28 Rotation control panel

6.2 Source Material Loading and Crucible Change

With the hoist control, raise both top plate and chamber slowly with bolt fastened. Please

pay special attention during chamber rising, no part of your body can be located under the

chamber. Raise the chamber until the level which crucible is accessible, and then insert a

hoist stopper to the shaft to prevent an accidentally falling of the chamber (Fig.4).

If the working area under the chamber is safe, please check the level of the source material

in the crucible (Fig.29). Please be reminded Silver engage pocket 1, Aluminum and Iron



share the same pocket 2, Titanium and Germanium share the same pocket 3, Gold engage

pocket 4, Platimun engage pocket 5, and Chromium, Molybdenum, Nickel, Silicon

Dioxide share the same pocket 6. User is not allowed to swap the designated pocket

material to avoid cross material contamination.

Fig.29 e-beam source, rotation pocket, and crucible

Add source material pieces if necessary. However, do not put too many pieces in the

crucible to prevent it from blocking the pocket rotation. In case user needs to change

crucible of source material, use a tweezers to pull it out from the pocket slowly.

All the sources and crucibles are located in the plastic box left hand sided of the chamber.

Check the film monitor crystal lifetime is enough for the process (section 5.4.1.1),

otherwise report to NFF module staffs for replacement.

Visually check any film peeling problem inside the chamber, and report to NFF staff if it

happens.

If everything is in position, then remove the hoist stopper. Please make sure the stopper has

been removed before moving to the next step, otherwise it will damage the hoist system.

Slowly turn down both top plate and chamber with the hoist control, and slightly hold the



chamber wall with one hand to keep it in position.

When the whole chamber is completely sit on the platform table, turn the rotary switch to

PUMP mode, this starts an automatic pumping sequence.

Wait the high vacuum pressure until it reaches at least 5x10-6

Torr, and it takes more than

one hour.

Change the material name plate if necessary.

Power on the substrate rotation (Fig.28) but user is not allowed to change the rotation

speed.

6.3 Startup Procedures

The system is now ready for deposition. Before moving to the next step, please make sure

you read the operation of the thin film controller, and e-beam source power supply/XY sweep

module (section 5.4 & 5.5).

Turn on the MAXTEK MDC-360 deposition controller. View the recipe listed in the

View/Edit PROCESS menu, and selects a recipe using the “arrow” and “enter” keys, then

moves the cursor to the Thickness column, and set the required thickness. The measuring

unit of the film thickness is in 1000A. Finally, check in the Material column, the right

material is selected (Fig.18).

Once, the recipe is ready, turn on the AC power circuit breaker of the Main cabinet (Fig.10).

However, please wait two minutes for the unit to warm up before proceeding.

Check interlocks status on the panel of TT-3/6 controller are all satisfied (Fig.5).

Turn ON the power of the crucible indexer, and it must be set to AUTO mode for operation.

Turn on the high voltage and emission by depressing the Control Module’s

Voltage/Emission ON push-button (Fig.11). Be careful, mis-operation of the power supply

result in costly damage and lethal voltages are present.

High voltage will then applied to the electron beam source and HV level will be indicated

by the HV Voltage digital bar graph (Fig.5).

Select a recipe in the MDC-360 thin film controller by clicking the START key as

described in the section 5.5.



Then start a recipe by further clicking the START key.

The e-beam is now operational; the typical power profile according to the recipe will be

soak, pre-deposition, deposition, and feed and idle (Fig.24).

Once, the e-beam is ON, the beam position must be observed through the view-port with

goggles provided.

The position of the e-beam in the crucible can be moved and adjusted manually (section

5.4.2). We prefer using the Lat./Long. knobs of the Sweep Select Control module instead of

the joystick, because it offers more accurate control of the beam position. The beam

position must be under monitoring from time to time, and it should be always keep the

beam in the crucible pocket.

The beam position may be shifted due to the source material level is dropped during

process, and user must adjust the beam accordingly, otherwise the e-beam percentage

power will be increased to an extremely high level in order to keep the set deposition rate. If

the percentage of power increases to the level over the maximum power set point, then an

alert message and sound will be given out (section 5.5.3).

Once the recipe going to the end, the power will be ramp down. However, please wait for

source material and parts cool down for at least half hour before venting the chamber for

unloading the substrates.

Please follow the substrate loading procedures to unload the substrates.

7. Process Recording Please be reminded you are required to fill all the details of the log sheets. If users fail to do

this, a heavy punishment will be given.

Write down the problems happened or any comments in the log sheets.

8. Clean up Clean up the area.

Return sources or crucibles to their proper locations.



9. Check outCheck out the equipment immediately after use.

Documents

Standard Operating Manualmfz140.ust.hk/Eq_manual/SOP of Cooke2 evaporator.pdf · Cooke Evaporator CAN do Up to 4 pieces 4 inches full silicon in Non-Standard level. Up to 4 pieces