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Techman Electronics (Changshu) Co., Ltd.
1 of 32 Document Number: 9SE5501-201-M01 Rev 5
SPECIFICATIONS
Solid State Drive
MODEL :
XC100 Series (Single Port)
XC120 Series (Dual Port)
Release
Date: January 19, 2017
Rev : 2.03
Prepared by Reviewed by Approved by
Samuel Chen Ted Hsieh Ilong Hsiao
Techman SSD reserves the right to change specification of product and discontinue products without notice
Techman Electronics (Changshu) Co., Ltd.
2 of 32 Document Number: 9SE5501-201-M01 Rev 5
TECHMAN XC100 SERIES (SINGLE PORT) XC120 SERIES (DUAL PORT)
PRODUCT SPECIFICATION
Form factors
2.5” U2: 15.0mm Z-height U.2 (SFF-8639)
Half-height, Half-Length (Single slot X4)
Interface
2.5” U2: PCIE Gen 3x4
2.5” U2 : PCIE Gen 3x(2x2) dual porti
Half-height, Half-Length: PCIE Gen 3x4
Components
Toshiba 15nm Enterprise Multi Level Cell
Toshiba 15nm Client Multi Level Cell
Support Capacity
800GB, 1600GB, 3200GB
Performance
128K Sequential Read 3200 MB/s
128K Sequential Write 1850 MB/s
4K Random Read 750K IOPS
4K Random Write: 380K IOPS
Power consumption
Power rail
U.2 12V and 3.3V
HHHL 12V and 3.3V
Power consumption
Max power 23W
Typical Power 8 W
Power mode 25W/20W/15W
Endurance
800GB (eMLC) 6DWPD / 8.76PBW
1600GB (eMLC) 6DWPD / 17.52PBW
3200GB (eMLC) 6DWPD / 35.04PBW
800GB (cMLC) 2DWPD / 2.92BW
1600GB (cMLC) 2DWPD / 5.84PBW
3200GB (cMLC) 2DWPD / 11.68PBW
Features
S.M.A.R.T / Health Information (LOG IDENTIFIER
02H)
TRIM
Wear-leveling
Bad Block Management
Background Garbage Collection
Advanced Encryption Standard (AES) 256bit
(optional).
End-to-End Data Protection
Power Loss Data Protection
T10-DIF Data Protection
Variable sector size: 512b, 520b ,4096b ,4104b
Multi-namespace supportii
Dual port supportiii
Temperature
OPERATING 0 to 55° C
Non-OPERATING -55 to 95° C
Airflow requirement 800GB 400LFM
1600GB 650LFM
3200GB 650LFM
Thermal throttling
Temperature monitoring (In-band)
Temperature monitoring (Out of band : SMBus )
Shock
OPERATING 1000G/0.5ms
Non-OPERATING 1000G/0.5ms
Vibration
OPERATING 3.01 Grms (Random,
2.5~500 Hz
Non-OPERATING 4.9 Grms (Random,
5~800 Hz
Reliability
Uncorrected bit error rate ≤10−17
MTBF > 1,200,000 POH
Operating System support
Windows 10, 8.1, 7 (X86/X64)
Windows server 2016, 2012R2, 2012, 2008R2
RHEL 6.5, 6.6, 6.7, 6.8, 7.0, 7.1, 7.2
SuseLiunx 11 SP3, 11 SP4, 12, 12 SP1
CentOS 6.5, 6.6, 6.7, 6.8, 7.0, 7.1, 7.2
Ubuntu Server 14.04, 15.04, 15.10, 16.04
Debian 7.8, 8.1, 8.2, 8.3
Vmware 5.5, 6.0, 2006
Xenserver 6.5 SP1, 7.0
Compliance
NVMe Express 1.1b
NVMe Express 1.2iv
PCI Express Base specification 3.1
Enterprise SSD Factor Version 1.0a
PCI Express Card Electromechanical Specification
Revision 3.0
System Management Bus (SMBus) Specification,
Version 2.0
Certification
UL CE C-tick, BSMI KCC,WHQL,VCCI
i Techman NVMe XC120 series support ii Techman NVMe XC120 series support iii Techman NVMe XC120 series support iv Techman NVMe XC120 series support
Techman Electronics (Changshu) Co., Ltd.
3 of 32 Document Number: 9SE5501-201-M01 Rev 5
TABLE OF CONTENTS
TECHMAN XC100 SERIES (SINGLE PORT) XC120 SERIES (DUAL PORT) PRODUCT SPECIFICATION ........... 2
1 INTRODUCTION ............................................................................................................................................................. 5
2 PHYSICAL SPECIFICATIONS...................................................................................................................................... 6
DIMENSION ................................................................................................................................................................. 6 2.1
WEIGHT ...................................................................................................................................................................... 6 2.2
MECHANICAL ............................................................................................................................................................. 6 2.3
2.3.1 FORM FACTOR – U.2 ................................................................................................................................................... 6 2.3.2 FORM FACTOR – HHHL .............................................................................................................................................. 7
3 PERFORMANCE ............................................................................................................................................................. 8
LBA SETTING ............................................................................................................................................................. 8 3.1
SEQUENTIAL READ \ WRITE PERFORMANCE ............................................................................................................... 8 3.2
RANDOM READ \ WRITE IOPS .................................................................................................................................... 9 3.3
LATENCY .................................................................................................................................................................. 10 3.4
QUALITY OF SERVICE ............................................................................................................................................... 11 3.5
READY TIME ............................................................................................................................................................. 12 3.6
4 ELECTRICAL CHARACTERISTICS ......................................................................................................................... 13
POWER SUPPLY ......................................................................................................................................................... 13 4.1
VOLTAGE (RAISE \ FALL TIME) ................................................................................................................................ 13 4.2
INRUSH CURRENT ..................................................................................................................................................... 13 4.1
CURRENT AND POWER CONSUMPTION ...................................................................................................................... 13 4.2
POWER OFF TIME....................................................................................................................................................... 13 4.3
5 INTERFACE ................................................................................................................................................................... 14
CONNECTOR ............................................................................................................................................................. 14 5.1
5.1.1 FORM FACTOR – U.2 (SFF-8639) .............................................................................................................................. 14 DEVICE PLUG CONNECTOR PIN DEFINITION ............................................................................................................... 15 5.2
5.2.1 FORM FACTOR – U.2 (SFF-8639) .............................................................................................................................. 15 5.2.2 FORM FACTOR – HHHL ............................................................................................................................................ 16
NVME COMMAND .................................................................................................................................................... 17 5.3
SCSI COMMAND SET ................................................................................................................................................ 17 5.4
SET FEATURE IDENTIFIERS ...................................................................................................................................... 17 5.5
LOG PAGE SUPPORT.................................................................................................................................................. 17 5.6
SMART / HEALTH INFORMATION (LOG IDENTIFIER 02H) ........................................................................................ 17 5.7
VENDOR SPECIFIC (LOG IDENTIFIER C0-FFH) ........................................................................................................... 19 5.8
PCIE ID .................................................................................................................................................................... 19 5.9
SMBUS FUNCTION.................................................................................................................................................... 19 5.10
LED FUNCTION ........................................................................................................................................................ 19 5.11
5.11.1 FORM FACTOR – U.2 (SFF-8639) ......................................................................................................................... 19 5.11.2 FORM FACTOR – HHHL ....................................................................................................................................... 19
6 NVME DRIVER SUPPORT .......................................................................................................................................... 20
NVME DRIVER SUPPORT OPERATING SYSTEM .......................................................................................................... 20 6.1
7 RELIABILITY ................................................................................................................................................................ 22
MTBF ...................................................................................................................................................................... 22 7.1
UBER ....................................................................................................................................................................... 22 7.2
DATA RETENTION ..................................................................................................................................................... 22 7.3
ENDURANCE ............................................................................................................................................................. 22 7.4
8 ENVIRONMENTAL CONDITIONS ............................................................................................................................ 23
AMBIENT TEMPERATURE .......................................................................................................................................... 23 8.1
AIRFLOW REQUIREMENTS ........................................................................................................................................ 23 8.2
TEMP. GRADIENT ...................................................................................................................................................... 23 8.3
HUMIDITY ................................................................................................................................................................. 23 8.4
Techman Electronics (Changshu) Co., Ltd.
4 of 32 Document Number: 9SE5501-201-M01 Rev 5
VIBRATION ............................................................................................................................................................... 23 8.5
SHOCK ...................................................................................................................................................................... 23 8.6
DROP ........................................................................................................................................................................ 23 8.7
ESD .......................................................................................................................................................................... 23 8.8
9 RESTRICTED MATERIALS CONTENT ................................................................................................................... 24
10 LABEL ............................................................................................................................................................................. 25
DRIVE LABELS .......................................................................................................................................................... 25 10.1
11 AGENCY CERTIFICATES ........................................................................................................................................... 28
SAFETY REGULATION ............................................................................................................................................... 28 11.1
EMC ......................................................................................................................................................................... 28 11.2
12 REVISION HISTORY .................................................................................................................................................... 29
APPENDIX A MAX PERFORMANCE TEST EQUIPMENT............................................................................................. 30
BIOS CONFIGURATION ........................................................................................................................................................... 30 WINDOWS CONFIGURATION .................................................................................................................................................... 30 LINUX CONFIGURATION .......................................................................................................................................................... 30
APPENDIX B SSD MODE NAME DEFINE ......................................................................................................................... 31
APPENDIX C SSD PRODUCT NUMBER LIST .................................................................................................................. 32
Techman Electronics (Changshu) Co., Ltd.
5 of 32 Document Number: 9SE5501-201-M01 Rev 5
1 INTRODUCTION
A leader in manufacturing storage device, Techman Electronics (Changshu) Co., Ltd. (or Techman)
is positioned to provide Solid State Drive, a better solution to enterprise. Techman’s SSD mainly
consists of multicore processor and eMLC NAND flash memory which, along with our innovative
firmware architecture, deliver significant performance, high reliability, and power efficiency in a
small form factor. In addition, Techman’s SSD is compliant with Advanced Encryption Standard
(AES). Above enable Techman’s SSD to work much faster and hence to improve user experience
and satisfaction. In this manual is defined the functional, mechanical, and interface specifications of
Techman SSD XC100 series & XC120 series.
The general features of XC100 series (Single port) & XC120 (Dual Port) series are as follows:
S.M.A.R.T / Health Information (LOG IDENTIFIER 02H)
TRIM
Wear-leveling
Bad Block Management
Background Garbage Collection
Advanced Encryption Standard (AES) 256bit (optional).
End-to-End Data Protection
Power Loss Data Protection
T10-DIF Data Protection1
Variable sector size: 512b, 520b ,4096b ,4104b
Multi-namespace supportv
Dual port supportvi
v Techman NVMe XC120 series support vi Techman NVMe XC120 series support
Techman Electronics (Changshu) Co., Ltd.
6 of 32 Document Number: 9SE5501-201-M01 Rev 5
2 PHYSICAL SPECIFICATIONS
Dimension 2.1
Form factor Length (mm) Width(mm) Height(mm)
2.5 inch 100.45 Max 69.85 +/- 0.25 15.0 +0/-0.5
HHHL 167.68 Max 68.95 Max 17.20 Max
Weight 2.2Form factor Weight (g)
2.5 inch 210 Max
HHHL 175 Max
Mechanical 2.3
2.3.1 Form factor – U.2
Techman Electronics (Changshu) Co., Ltd.
7 of 32 Document Number: 9SE5501-201-M01 Rev 5
2.3.2 Form factor – HHHL
Techman Electronics (Changshu) Co., Ltd.
8 of 32 Document Number: 9SE5501-201-M01 Rev 5
3 PERFORMANCE
LBA setting 3.1
Unformatted capacity
Capacity LBA User available Bytes
800GB 1,562,824,368 800,166,076,416
1600GB 3,125,627,568 1,600,321,314,816
3200GB 6,251,233,968 3,200,631,791,616
Note: (*1) 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes;
Sequential Read \ Write Performance 3.2
Model Capacity Sequential Read Sequential Write
(U.2) (Toshiba 15nm Multi Level Cell (eMLC)
XC100E55-800
XC120E55-800 800GB 2600 770
XC100E55-1600
XC120E55-1600 1600GB 3200 1400
XC100E55-3200
XC100E55-3200 3200GB 3200 1400
(HHHL) (Toshiba 15nm Multi Level Cell (eMLC)
XC100E5C-800 800GB 2600 770
XC100E5C-1600 1600GB 3200 1400
XC100E5C-3200 3200GB 3200 1400
(U.2) (Toshiba 15nm Multi Level Cell (cMLC)
XC100C55-800
XC120C55-800 800GB 2500 950
XC100C55-1600
XC120C55-1600 1600GB 2800 1850
XC100C55-3200
XC120C55-3200 3200GB 2800 1850
(HHHL) (Toshiba 15nm Multi Level Cell (cMLC)
XC100C5C-800 800GB 2500 950
XC100C5C-1600 1600GB 2800 1850
XC100C5C-3200 3200GB 2800 1850
Note: (*1) Test OS: Centos 7.2 (CPU C-state disable)
Note: (*2) Block size =128Kib
Note: (*3) Sequential Read & write performance test by FIO (OIO= 4 job with 64 Queue Depth)
Note: (*4) XC120 series support Single Port (Gen 3 x4) and Dual Port (Gen 3 2x2), If enabling dual port operations, the
performance will be depending on the IO.
Note: (*5) Consistency up to 90%
Note: (*6) Test Rage = Full capacity
Techman Electronics (Changshu) Co., Ltd.
9 of 32 Document Number: 9SE5501-201-M01 Rev 5
Random Read \ Write IOPS 3.3
FOB
Model Capacity 4K Random
Read
4K Random
Write
4K Random
Read\Write
70/30
8K Random
Read
8K Random
Write
8K Random
Read\Write
70/30
(U.2) (Toshiba 15nm Multi Level Cell (eMLC)
XC100E55-800
XC120E55-800 800GB 580,000 200,000 210,000 310,000 100,000 110,000
XC100E55-1600
XC120E55-1600 1600GB 750,000 380,000 350,000 380,000 180,000 180,000
XC100E55-3200
XC100E55-3200 3200GB 750,000 380,000 350,000 380,000 180,000 180,000
(HHHL) (Toshiba 15nm Multi Level Cell (eMLC)
XC100E5C-800 800GB 580,000 200,000 210,000 310,000 100,000 110,000
XC100E5C-1600 1600GB 750,000 380,000 350,000 380,000 180,000 180,000
XC100E5C-3200 3200GB 750,000 380,000 350,000 380,000 180,000 180,000
(U.2) (Toshiba 15nm Multi Level Cell (cMLC)
XC100C55-800
XC120C55-800 800GB 580,000 250,000 300,000 283,000 128,000 150,000
XC100C55-1600
XC120C55-1600 1600GB 700,000 390,000 430,000 350,000 210,000 230,000
XC100C55-3200
XC120C55-3200 3200GB 700,000 390,000 430,000 350,000 210,000 230,000
(HHHL) (Toshiba 15nm Multi Level Cell (cMLC)
XC100C5C-800 800GB 580,000 250,000 300,000 283,000 128,000 150,000
XC100C5C-1600 1600GB 700,000 390,000 430,000 350,000 210,000 230,000
XC100C5C-3200 3200GB 700,000 390,000 430,000 350,000 210,000 230,000
Steady state
Model Capacity 4K Random
Read
4K Random
Write
4K Random
Read\Write
70/30
8K Random
Read
8K Random
Write
8K Random
Read\Write
70/30
(U.2) (Toshiba 15nm Multi Level Cell (eMLC)
XC100E55-800
XC120E55-800 800GB 580,000 55,000 140,000 310,000 27,000 71,000
XC100E55-1600
XC120E55-1600 1600GB 750,000 115,000 250,000 380,000 55,000 130,000
XC100E55-3200
XC100E55-3200 3200GB 750,000 115,000 250,000 380,000 55,000 130,000
(HHHL) (Toshiba 15nm Multi Level Cell (eMLC)
XC100E5C-800 800GB 580,000 55,000 140,000 310,000 27,000 71,000
XC100E5C-1600 1600GB 750,000 115,000 250,000 380,000 55,000 130,000
XC100E5C-3200 3200GB 750,000 115,000 250,000 380,000 55,000 130,000
(U.2) (Toshiba 15nm Multi Level Cell (cMLC)
XC100C55-800
XC120C55-800 800GB 580,000 90,000 210,000 283,000 45,000 110,000
XC100C55-1600
XC120C55-1600 1600GB 700,000 150,000 310,000 350,000 72,000 170,000
XC100C55-3200
XC120C55-3200 3200GB 700,000 150,000 310,000 350,000 72,000 170,000
(HHHL) (Toshiba 15nm Multi Level Cell (cMLC)
XC100C5C-800 800GB 580,000 90,000 210,000 283,000 45,000 110,000
XC100C5C-1600 1600GB 700,000 150,000 310,000 350,000 72,000 170,000
XC100C5C-3200 3200GB 700,000 150,000 310,000 350,000 72,000 170,000
Note: (*1) Test OS: Centos 7.2 (CPU C-state disable)
Note: (*2) Random read 4K IOPS & Random write 4K IOPS test by FIO (OIO= 4 job with 64 Queue Depth)
Note: (*3) XC120 series support Single Port (Gen 3 x4) and Dual Port (Gen 3 2x2), If enabling dual port operations, the
performance will be depending on the IO.
Note: (*4) Consistency up to 90%
Techman Electronics (Changshu) Co., Ltd.
10 of 32 Document Number: 9SE5501-201-M01 Rev 5
Note: (*5) Test Rage = Full capacity
Latency 3.4
Model Capacity Sequential Read Sequential Write 4K Random Read 4K Random Write
(U.2) (Toshiba 15nm Multi Level Cell (eMLC)
XC100E55-800
XC120E55-800 800GB 100 us 110 us 100 us 20 us
XC100E55-1600
XC120E55-1600 1600GB 100 us 110 us 100 us 20 us
XC100E55-3200
XC100E55-3200 3200GB 100 us 110 us 100 us 20 us
(HHHL) (Toshiba 15nm Multi Level Cell (eMLC)
XC100E5C-800 800GB 100 us 110 us 100 us 20 us
XC100E5C-1600 1600GB 100 us 110 us 100 us 20 us
XC100E5C-3200 3200GB 100 us 110 us 100 us 20 us
(U.2) (Toshiba 15nm Multi Level Cell (cMLC)
XC100C55-800
XC120C55-800 800GB 100 us 110 us 100 us 20 us
XC100C55-1600
XC120C55-1600 1600GB 100 us 110 us 100 us 20 us
XC100C55-3200
XC120C55-3200 3200GB 100 us 110 us 100 us 20 us
(HHHL) (Toshiba 15nm Multi Level Cell (cMLC)
XC100C5C-800 800GB 100 us 110 us 100 us 20 us
XC100C5C-1600 1600GB 100 us 110 us 100 us 20 us
XC100C5C-3200 3200GB 100 us 110 us 100 us 20 us
Note: (*1) Queue Depth 1 with Max power mode
Note: (*2) Measurement by Fio
Techman Electronics (Changshu) Co., Ltd.
11 of 32 Document Number: 9SE5501-201-M01 Rev 5
Quality of Service 3.5Quality of Service= 99%
Model Capacity Read (OIO=1) Write (OIO=1) Read (OIO=128) Write (OIO=128)
(U.2) (Toshiba 15nm Multi Level Cell (eMLC)
XC100E55-800
XC120E55-800 800GB 102 us 21us 750us 2400us
XC100E55-1600
XC120E55-1600 1600GB 102 us 21us 650us 1100us
XC100E55-3200
XC100E55-3200 3200GB 102 us 21us 650us 1100us
(HHHL) (Toshiba 15nm Multi Level Cell (eMLC)
XC100E5C-800 800GB 102 us 21us 750us 2400us XC100E5C-1600 1600GB 102 us 21us 650us 1100us XC100E5C-3200 3200GB 102 us 21us 650us 1100us
(U.2) (Toshiba 15nm Multi Level Cell (cMLC)
XC100C55-800
XC120C55-800 800GB 105 us 21us 800us 1750us
XC100C55-1600
XC120C55-1600 1600GB 105 us 21us 670us 750us
XC100C55-3200
XC120C55-3200 3200GB 105 us 21us 670us 750us
(HHHL) (Toshiba 15nm Multi Level Cell (cMLC)
XC100C5C-800 800GB 105 us 21us 800us 1750us XC100C5C-1600 1600GB 105 us 21us 670us 750us XC100C5C-3200 3200GB 105 us 21us 670us 750us
Quality of Service= 99.99%
Model Capacity Read (OIO=1) Write (OIO=1) Read (OIO=128) Write (OIO=128)
(U.2) (Toshiba 15nm Multi Level Cell (eMLC)
XC100E55-800
XC120E55-800 800GB 105 us 30us 1400us 2800us
XC100E55-1600
XC120E55-1600 1600GB 105 us 30us 1200us 1800us
XC100E55-3200
XC100E55-3200 3200GB 105 us 30us 1200us 1800us
(HHHL) (Toshiba 15nm Multi Level Cell (eMLC)
XC100E5C-800 800GB 105 us 30us 1400us 2800us
XC100E5C-1600 1600GB 105 us 30us 1200us 1800us
XC100E5C-3200 3200GB 105 us 30us 1200us 1800us
(U.2) (Toshiba 15nm Multi Level Cell (cMLC)
XC100C55-800
XC120C55-800
800GB 110us 30us 1500us 2000us
XC100C55-1600
XC120C55-1600
1600GB 110us 30us 1200us 1400us
XC100C55-3200
XC120C55-3200
3200GB 110us 30us 1200us 1400us
(HHHL) (Toshiba 15nm Multi Level Cell (cMLC)
XC100C5C-800 800GB 110us 30us 1500us 2000us
XC100C5C-1600 1600GB 110us 30us 1200us 1400us
XC100C5C-3200 3200GB 110us 30us 1200us 1400us
Note: (*1) Random 4K (Queue Depth 1,128) with Max power mode
Note: (*2) Measurement by Fio
Techman Electronics (Changshu) Co., Ltd.
12 of 32 Document Number: 9SE5501-201-M01 Rev 5
Ready time 3.6
Model Capacity Power on to PCIe
ready
Power on to
Device ready Unsafe power on
(U.2) (Toshiba 15nm Multi Level Cell (eMLC)
XC100E55-800
XC120E55-800 800GB < 2sec < 12 sec 40 Sec (Max)
XC100E55-1600
XC120E55-1600 1600GB < 2sec < 12 sec 50 Sec (Max)
XC100E55-3200
XC100E55-3200 3200GB < 2sec < 12 sec 60 Sec (Max)
(HHHL) (Toshiba 15nm Multi Level Cell (eMLC)
XC100E5C-800 800GB < 2sec < 12 sec 40 Sec (Max)
XC100E5C-1600 1600GB < 2sec < 12 sec 50 Sec (Max)
XC100E5C-3200 3200GB < 2sec < 12 sec 60 Sec (Max)
(U.2) (Toshiba 15nm Multi Level Cell (cMLC)
XC100C55-800
XC120C55-800 800GB < 2sec < 12 sec 40 Sec (Max)
XC100C55-1600
XC120C55-1600 1600GB < 2sec < 12 sec 50 Sec (Max)
XC100C55-3200
XC120C55-3200 3200GB < 2sec < 12 sec 60 Sec (Max)
(HHHL) (Toshiba 15nm Multi Level Cell (cMLC)
XC100C5C-800 800GB < 2sec < 12 sec 40 Sec (Max)
XC100C5C-1600 1600GB < 2sec < 12 sec 50 Sec (Max)
XC100C5C-3200 3200GB < 2sec < 12 sec 60 Sec (Max)
Techman Electronics (Changshu) Co., Ltd.
13 of 32 Document Number: 9SE5501-201-M01 Rev 5
4 ELECTRICAL CHARACTERISTICS
Power Supply 4.1
Capacity unit SPEC
Voltage V DC 12V +10% \ -20%
Noise V 1000 mVp-p Max, 10 ~ 100KHz
100 mVp-p Max, 100 ~ 20KHz
Voltage (Raise \ Fall Time) 4.2
Capacity unit Raise time ( Max/Min) Fall Time (Max/Min)
800GB 50 ms / 1ms 5s / 1ms
1600GB 50 ms / 1ms 5s / 1ms
3200GB 50 ms / 1ms 5s / 1ms
Inrush Current 4.1
Capacity unit Inrush Current Note
800GB A < 2.0
1600GB A < 2.0
3200GB A < 2.0
Current and Power Consumption 4.2
Capacity unit Idle (Avg) Read(Avg) Write(Avg)
25W power mode
800 GB Watt 8 20 21
1600 GB Watt 8 20 23 3200 GB Watt 8 20 23
Power off time 4.3
Capacity unit SPEC
Power off time s > 3sec
Techman Electronics (Changshu) Co., Ltd.
14 of 32 Document Number: 9SE5501-201-M01 Rev 5
5 INTERFACE
Connector 5.1
5.1.1 Form factor – U.2 (SFF-8639)
Techman Electronics (Changshu) Co., Ltd.
15 of 32 Document Number: 9SE5501-201-M01 Rev 5
Device plug connector pin definition 5.2
5.2.1 Form factor – U.2 (SFF-8639)
Pin Name Description Pin Name Description
S1 GND Ground E7 REFCLK1+ Reference clock port 0
S2
Not used (SATA/SAS) E8 REFCLK1 - Reference clock port 0
S3
Not used (SATA/SAS) E9 GND Ground
S4 GND Ground E10 PETp0 Transmitter differential pair, Lane 0
S5
Not used (SATA/SAS) E11 PETn0 Transmitter differential pair, Lane 0
S6
Not used (SATA/SAS) E12 GND Ground
S7 GND Ground E13 PERn0 Receiver differential pair, Lane 0
E1 REFCLK1+ Reference clock port 1(not used) E14 PERp0 Receiver differential pair, Lane 0
E2 REFCLK1 - Reference clock port 1(not used) E15 GND Ground
E3 3.3Vaux 3.3V auxiliary power E16 RSVD Reserved
E4 PERST1# Reference clock port 1(not used) S8 GND Ground
E5 PERST0# Fundamental reset port 0 S9
Not used (SATA/SAS)
E6 RSVD Reserved S10
Not used (SATA/SAS)
P1
Not used (SATA/SAS) S11 GND Ground
P2
Not used (SATA/SAS) S12
Not used (SATA/SAS)
P3
Not used (SATA/SAS) S13
Not used (SATA/SAS)
P4 IfDet_N Interface detect (drive type) S14 GND Ground
P5 GND Ground S15 RSVD Reserved
P6 GND Ground S16 GND Ground
P7
Not used (SATA/SAS) S17 PETp1 Transmitter differential pair, Lane 1
P8
Not used (SATA/SAS) S18 PETn1 Transmitter differential pair, Lane 1
P9
Not used (SATA/SAS) S19 GND Ground
P10 PRSNT_N Presence detect
(also used for drive type) S20 PERn1 Receiver differential pair, Lane 1
P11 Activity Activity signal from the drive S21 PERp1 Receiver differential pair, Lane 1
P12 Hot-Plug Ground S22 GND Ground
P13 +12V_pre 12V power S23 PETp2 Transmitter differential pair, Lane 2
P14 +12V 12V power S24 PETn2 Transmitter differential pair, Lane 2
P15 +12V 12V power S25 GND Ground
S26 PERn2 Receiver differential pair, Lane 2
S27 PERp2 Receiver differential pair, Lane 2
S28 GND Ground
E17 PETp3 Transmitter differential pair, Lane 3
E18 PETn3 Transmitter differential pair, Lane 3
E19 GND Ground
E20 PERn3 Receiver differential pair, Lane 3
E21 PERp3 Receiver differential pair, Lane 3
E22 GND Ground
E23 SMCLK SMBus clock
E24 SMDAT SMBus data
E25 DualPortEn_N Dual port enable
DualPortEn_N pin should be asserted by the system (driven low by storage backplane), then X120 Series will be configured as 2x2 lanes
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5.2.2 Form factor – HHHL
Pin Name Description Pin Name Description
Side A Side B
1 +12V 12V power 1 PRSNT1# Hot-Plug presence detect
2 +12V 12V power 2 +12V 12V power
3 +12V 12V power 3 +12V 12V power
4 GND Ground 4 GND Ground
5 SMCLK SMBus(System Management Bus) clock 5 JTAG2 TCK (Test Clock), clock input for JTAG
interface
6 SMDAT SMBus (System Management Bus) data 6 JTAG3 TDI (Test Data Input)
7 GND Ground / UART_HOST 7 JTAG4 TDO (Test Data Output)
8 +3.3V 3.3V power 8 JTAG5 TMS (Test Mode Select)
9 JTAG1 TRST# (Test Reset) resets the JTAG
interface 9 +3.3V 3.3V power
10 3.3Vaux 3.3V auxiliary power 10 +3.3V 3.3V power
11 WAKE# Signal for Link reactivation 11 PERST# Fundamental reset
Mechanical Key
12 RSVD Reserved 12 GND Ground
13 GND Ground 13 REFCLK+ Reference clock (differential pair)
14 PETp0 Transmitter differential pair, Lane 0 14 REFCLK - Reference clock (differential pair)
15 PETn0 Transmitter differential pair, Lane 0 15 GND Ground
16 GND Ground 16 PERp0 Receiver differential pair, Lane 0
17 PRSNT2# Hot-Plug presence detect 17 PERn0 Receiver differential pair, Lane 0
18 GND Ground 18 GND Ground
End of the x1 Connector
19 PETp1 Transmitter differential pair, Lane 1 19 RSVD Reserved
20 PETn1 Transmitter differential pair, Lane 1 20 GND Ground
21 GND Ground 21 PERp1 Receiver differential pair, Lane 1
22 GND Ground 22 PERn1 Receiver differential pair, Lane 1
23 PETp2 Transmitter differential pair, Lane 2 23 GND Ground
24 PETn2 Transmitter differential pair, Lane 2 24 GND Ground
25 GND Ground 25 PERp2 Receiver differential pair, Lane 2
26 GND Ground 26 PERn2 Receiver differential pair, Lane 2
27 PETp3 Transmitter differential pair, Lane 3 27 GND Ground
28 PETn3 Transmitter differential pair, Lane 3 28 GND Ground
29 GND Ground 29 PERp3 Receiver differential pair, Lane 3
30 RSVD Reserved 30 PERn3 Receiver differential pair, Lane 3
31 PRSNT2# Hot-Plug presence detect 31 GND Ground
32 GND Ground 32 RSVD Reserved
End of the x4 Connector
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NVMe Command 5.3
ID (Hex) ATTRIBUTES ID (Hex) ATTRIBUTES
NVMe Admin Command
00h Delete I/O Submission Queue 0Ah GET Features
01h Delete I/O Completion Queue 0Ch Asynchronous Event Notification
02h Get Log Page 0Dh Namespace Management
04h Create I/O Submission Queue 10h Firmware Activate
05h Create I/O Completion Queue 11h Firmware Image Download
06h Identify 15h Namespace Attachment
08h Abort 80h Format NVM
09h SET Feature
NVMe I/O Command
00h Flush 0Dh Reservation Register ( XC120 series only)
01h Write 0Eh Reservation Report ( XC120 series only)
02h Read 11h Reservation Acquire ( XC120 series only)
09h Dataset Management (De-allocate only) 15h Reservation Release ( XC120 series only)
SCSI command Set 5.4
ID (Hex) Command ID (Hex) Command
08h Read 6 A0h Report LUNs
28h Read 10 03h Request Sense
A8h Read 12 1Bh Start Stop Unit
88h Read 16 35h Synchronize Cache 10
12h Inquiry 91h Synchronize Cache 16
1Ah Mode Sense 6 00h Test Unit Ready
5Ah Mode Select 10 3Bh Write Buffer
15h Mode Select 6 0Ah Write 6
55h Mode Select 10 2Ah Write 10
4Dh Log Sense AAh Write 12
25H Read Capacity 10 8Ah Write 16
9Eh/10 Read Capacity 16 42h Unmap
SET Feature Identifiers 5.5
Feature
Identifier (Hex) ATTRIBUTES
Feature
Identifier
(Hex)
ATTRIBUTES
01h Arbitration 08h Interrupt Coalescing
02h Power Management 09h Interrupt Vector Configuration
03h LBA Range Type 0Ah Write Atomicity (Option)
04h Temperature Threshold 0bh Asynchronous Event Configuration
05h Error Recovery (Option) 80h Software Progress Marker
07h Number of Queues
Log Page Support 5.6
ID (Hex) ATTRIBUTES
01h Error Information 03h Firmware Slot Information
02h SMART/ Health Information 05h Command Effects Log
SMART / Health Information (Log Identifier 02h) 5.7
Byte Description
0
Critical Warning: This field indicates critical warnings for the state of the controller. Each bit corresponds to a critical
warning type; multiple bits may be set. If a bit is cleared to ‘0’, then that critical warning does not apply. Critical
warnings may result in an asynchronous event notification to the host. Bits in this field represent the current associated
state and are not persistent.
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2:1
Composite Temperature: Contains a value corresponding to a temperature in degrees Kelvin that represents the
current composite temperature of the controller and namespace(s) associated with that controller. The manner in which
this value is computed is implementation specific and may not represent the actual temperature of any physical point in
the NVM subsystem. The value of this field may be used to trigger an asynchronous event (refer to section 5.14.1.4).
Warning and critical overheating composite temperature threshold values are reported by the WCTEMP and CCTEMP
fields in the Identify Controller data structure in Figure 90.
3 Available Spare: Contains a normalized percentage (0 to 100%) of the remaining spare capacity available.
4 Available Spare Threshold: When the Available Spare falls below the threshold indicated in this field, an
asynchronous event completion may occur. The value is indicated as a normalized percentage (0 to 100%).
5
Percentage Used: Contains a vendor specific estimate of the percentage of NVM subsystem life used based on the
actual usage and the manufacturer’s prediction of NVM life. A value of 100 indicates that the estimated endurance of
the NVM in the NVM subsystem has been consumed, but may not indicate an NVM subsystem failure. The value is
allowed to exceed 100. Percentages greater than 254 shall be represented as 255. This value shall be updated once per
power-on hour (when the controller is not in a sleep state).
Refer to the JEDEC JESD218A standard for SSD device life and endurance measurement techniques.
31:6 Reserved
47:32
Data Units Read: Contains the number of 512 byte data units the host has read from the controller; this value does not
include metadata. This value is reported in thousands (i.e., a value of 1 corresponds to 1000 units of 512 bytes read)
and is rounded up. When the LBA size is a value other than 512 bytes, the controller shall convert the amount of data
read to 512 byte units.
For the NVM command set, logical blocks read as part of Compare and Read operations shall be included in this value.
63:48
Data Units Written: Contains the number of 512 byte data units the host has written to the controller; this value does
not include metadata. This value is reported in thousands (i.e., a value of 1 corresponds to 1000 units of 512 bytes
written) and is rounded up. When the LBA size is a value other than 512 bytes, the controller shall convert the amount
of data written to 512 byte units.
For the NVM command set, logical blocks written as part of Write operations shall be included in this value. Write
Uncorrectable commands shall not impact this value.
79:64 Host Read Commands: Contains the number of read commands completed by the controller.
For the NVM command set, this is the number of Compare and Read commands.
95:80 Host Write Commands: Contains the number of write commands completed by the controller.
For the NVM command set, this is the number of Write commands.
111:96
Controller Busy Time: Contains the amount of time the controller is busy with I/O commands. The controller is busy
when there is a command outstanding to an I/O Queue (specifically, a command was issued via an I/O Submission
Queue Tail doorbell write and the corresponding completion queue entry has not been posted yet to the associated I/O
Completion Queue). This value is reported in minutes.
127:112 Power Cycles: Contains the number of power cycles.
143:128 Power On Hours: Contains the number of power-on hours. This does not include time that the controller was powered
and in a low power state condition.
159:144 Unsafe Shutdowns: Contains the number of unsafe shutdowns. This count is incremented when a shutdown
notification (CC.SHN) is not received prior to loss of power.
175:160
Media and Data Integrity Errors: Contains the number of occurrences where the controller detected an unrecovered
data integrity error. Errors such as uncorrectable ECC, CRC checksum failure, or LBA tag mismatch are included in
this field.
191:176 Number of Error Information Log Entries: Contains the number of Error Information log entries over the life of the
controller.
Support by NVMe 1.2 Firmware
195:192
Warning Composite Temperature Time: Contains the amount of time in minutes that the controller is operational
and the Composite Temperature is greater than or equal to the Warning Composite Temperature Threshold
(WCTEMP) field and less than the Critical Composite Temperature Threshold (CCTEMP) field in the Identify
Controller data structure in Figure 90.
If the value of the WCTEMP or CCTEMP field is 0h, then this field is always cleared to 0h regardless of the
Composite Temperature value.
199:196
Critical Composite Temperature Time: Contains the amount of time in minutes that the controller is operational and
the Composite Temperature is greater the Critical Composite Temperature Threshold (CCTEMP) field in the Identify
Controller data structure in Figure 90.
If the value of the CCTEMP field is 0h, then this field is always cleared to 0h regardless of the Composite Temperature
value.
201:200
Temperature Sensor 1: Contains the current temperature reported by temperature sensor 1.
Bits Description
15:00 Temperature Sensor Temperature (TST): Contains the current temperature in degrees
Kelvin reported by the temperature sensor.
The physical point in the NVM subsystem whose temperature is reported by the temperature
sensor and the temperature accuracy is implementation specific. An implementation that does
not implement the temperature sensor reports a temperature of zero degrees Kelvin. The
temperature reported by a temperature sensor may be used to trigger an asynchronous event
203:202 Temperature Sensor 2: Contains the current temperature reported by temperature sensor 2. Refer to bye201:200
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205:204 Temperature Sensor 3: Contains the current temperature reported by temperature sensor 3. Refer to bye201:200
207:206 Temperature Sensor 4: Contains the current temperature reported by temperature sensor 4. Refer to bye201:200
209:208 Temperature Sensor 5: Contains the current temperature reported by temperature sensor 5.Refer to bye201:200
211:210 Temperature Sensor 6: Contains the current temperature reported by temperature sensor 6.Refer to bye201:200
213:212 Temperature Sensor 7: Contains the current temperature reported by temperature sensor 7.Refer to bye201:200
215:214 Temperature Sensor 8: Contains the current temperature reported by temperature sensor 8.Refer to bye201:200
511:216 Reserved
Vendor specific (Log Identifier C0-FFh) 5.8
Byte Description
101:0 Reserved
PCIe ID 5.9
ID name Description XC100 U.2 XC120 U.2 XC100 HHHL
Vendor ID (VID) Vendor ID assigned by PCI-SIG 0x1D40 0x1D40 0x1D40
Device ID (DID) Device ID assigned by vendor 0x5501 0x5501 0x5C01
Subsystem Vendor ID Indicates Sub-system vendor ID 0x1D40 0x1D40 0x1D40
Subsystem ID Sub-system identifier 0x5501 0x5501 0x5C01
SMBus Function 5.10SMBUS address Function
0x53 Read Subsystem Management Data Structure -- defined by NVMe BMC revision 1.0a
0x1B (Register address 0x05) Get temperature in raw data
LED Function 5.11
5.11.1 Form factor – U.2 (SFF-8639) LED Description Blink Behavior
P11 (Activity) Activity signal from the drive Blinks at the rate of 250msec high, 250msec low with IO activity
5.11.2 Form factor – HHHL LED Description Blink Behavior
LED 1(Green) Shows IO activity Blinks at the rate of 250msec high, 250msec low with IO activity
LED 2(Green) Drive health indicator Solid green when drive is healthy
LED 3 (Orange) Drive pre-fail indicator Solid yellow if any of the critical warnings in log page 0x02 is
triggered
LED 4 (Red) Drive fail indicator Solid red if drive is in read only state
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6 NVME DRIVER SUPPORT
NVMe Driver support operating system 6.1
OS Version Inbox driver Techman NVMe
Device driver UEFI Boot install
Microsoft
Windows
Windows 10 Support Support Support
Windows 8.1 Support Support Support
Windows 8 No Support Support
Techman NVMe driver
support(*1)
Windows 7 No Support Support
Techman NVMe driver
support(*1)
Windows Server 2016 Support Support Support Windows Server 2012 R2 Support Support Support
Windows Server 2012 No Support Support
Techman NVMe driver
support(*1)
Windows Server 2008 R2 No Support Support
Techman NVMe driver
support(*1)
Red Hat
Enterprise
Linux
RHEL 6.5
RHEL 6.6 No Support Support Not support Bootable(*2)
RHEL 6.7
RHEL 6.8
RHEL 7.0
RHEL 7.1
RHEL 7.2
Support Support Support
SUSE Linux
Enterprise
11 SP3
11 SP4 No Support Support Not support Bootable(*2)
12
12 SP1 Support Support Support
CentOS
6.5
6.6 No Support Support Not support Bootable(*2)
6.7
6.8
7.0
7.1
7.2
Support Support Support
Ubuntu Server
12.04 No Support Support Not support Bootable(*2)
14.04
15.04
15.10
16.04
Support Support Support
Debian
7.8 No Support Support Not support Bootable(*2)
8.1
8.2
8.3
8.4
8.5
8.6
Support Support Support
VMware
6.5
6.0
Support Support Support
5.5 Vmware NVMe
driver support(*3) Vmware NVMe driver
support(*3) Vmware NVMe driver
support(*3)
Citrix
XenServer
6.5 SP1 Citrix NVMe driver
support(*4)
N/A Not support Bootable(*2)
7.0 Support N/A Support
Note: (*1) NVMe device driver requirement
(*2) OS does not support NVMe Booting
(*3) Vmware device driver requirement
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(*4) Citrix device driver requirement
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7 RELIABILITY
MTBF 7.1
> 1,200,000 POH
UBER 7.2
> 10−17 (unrecoverable bit error rate)
Data Retention 7.340 C at 3 months
Endurance 7.4Capacity Flash Type DWPD PBW
XC100E55-800
XC100E5C-800
XC120E55-800
15nm eMLC 6 DWPD 8.76 PBW
XC100E55-1600
XC100E5C-1600
XC120E55-1600
15nm eMLC 6 DWPD 17.52 PBW
XC100E55-3200
XC100E5C-3200
XC120E55-3200
15nm eMLC 6 DWPD 35.04 PBW
XC100C55-800
XC100C5C-800
XC120C55-800
15nm cMLC 2 DWPD 2.92 PBW
XC100C55-1600
XC100C5C-1600
XC120C55-1600
15nm cMLC 2 DWPD 5.84 PBW
XC100C55-3200
XC100C5C-3200
XC120C55-3200
15nm cMLC 2 DWPD 11.68 PBW
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8 ENVIRONMENTAL CONDITIONS
Ambient Temperature 8.1
PARAMETER OPERATING Non-OPERATING UNIT
2.5 inch(*1) 0 ~ 40 (Ambient)
0 ~ 70 (Case) -55 to 95 °C
AIC 0 ~ 55 -55 to 95 °C
Note: (*1) Airflow requirement
(*2) Measuring case temperature
Airflow Requirements 8.2
Capacity Ambient = 25C Ambient = 35C unit
800 GB 350 400 LFM
1600 GB 450 650 LFM
3200 GB 450 650 LFM
Temp. Gradient 8.3
PARAMETER OPERATING Non-OPERATING UNIT
Temperature 30 (Max) 30 (Max) °C/hr
Humidityvii 8.4
PARAMETER OPERATING Non-OPERATING UNIT
Relative Humidity
(non-condensing) 5 to 95 5 to 95 %
Vibration 8.5
PARAMETER OPERATING Non-OPERATING UNIT
U.2 3.01 Grms (Random,
2.5~500 Hz)
4.9 Grms (Random,
5~800 Hz)
HHHL
Shock 8.6
PARAMETER OPERATING Non-OPERATING UNIT
U.2 1000G/0.5ms 1000G/0.5ms
HHHL 50G (Trapezoidal) 50G (Trapezoidal)
Drop 8.7
PARAMETER Weight Height UNIT
Drop (1 corner, 3 edges,
6 surfaces) TBD TBD Packaged
ESD 8.8
PARAMETER Level UNIT
Contact discharge 4 KV
Air discharge 8 KV
vii Should under the condition without condensation.
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9 RESTRICTED MATERIALS CONTENT
No usage of prohibited chemical substances. The chemical substances which defined in TECHMAN
"Environmental Requirements for materials parts and products" document. (9999999-201-M03.PDF)
never be used not only in components but also production process of both this products and
components.
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10 LABEL
Drive Labels 10.1
The “Safety and Series number label” are located on the top cover.
The “Safety label” contains the following information.
XC100 series (U.2)
(1) Solid state drive
(2) Series
(3) Certification marks (UL / cUL, TÜ V, IC, CE, C-Tick, Korean EMC, Taiwan EMC)
(4) Model number and capacity
(5) Product number
(6) Barcode of product number
(7) Series number (YY: year / WW: week / 1: default / PPPPPP: number)
(8) Barcode of series number
(9) F/W version
P/N: 9SE5501XBXXXTXX
F/W: X.XX
S/N: YYWW1PPPPPP
XXX GB Model: XC100E55
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XC120 series (U.2) Dual-port
(1) Solid state drive
(2) Series
(3) Certification marks (UL / cUL, TÜ V, IC, CE, C-Tick, Korean EMC, Taiwan EMC)
(4) Model number and capacity
(5) Product number
(6) Barcode of product number
(7) Series number (YY: year / WW: week / 1: default / PPPPPP: number)
(8) Barcode of series number
(9) F/W version
P/N: 9SE5501XBXXXTXX
F/W: X.XX
S/N: YYWW1PPPPPP
XXX GB Model: XC120E55
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XC100 series (HHHL)
(1) Solid state drive
(2) Series
(3) Certification marks (UL / cUL, TÜ V, IC, CE, C-Tick, Korean EMC, Taiwan EMC)
(4) Model number and capacity
(5) Product number
(6) Series number (YY: year / WW: week / 1: default / PPPPPP: number)
(7) F/W version
(8) 2D barcode of product number and series number
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11 AGENCY CERTIFICATES
Safety Regulation 11.1
UL UL60950-1 Second Edition
C-UL CSA C22.2 No. 60950-1-07, 2nd Edition
TUV EN 60950-1:2006 + A11:2009 +A1:2010+A12:2011+A2:2013
CB IEC 60950-1:2005(Second Edition) + Am 1:2009 + Am 2:2013
EMC 11.2
FCC FCC CFR 47 Part 15 Subpart B/Oct. 2013 and CISPR 22/1997 ANSI C63.4-2009
ICES-003 Issue 5 Aug. 2012
*CE Marking EN55022:2010 +AC:2011, Class B
EN61000-3-2:2006 +A1:2009 +A2:2009 and EN61000-3-3:2013
EN55024:2010
IEC61000-4-2:2008, IEC61000-4-3:2010,
IEC61000-4-4:2012, IEC61000-4-5:2005,
IEC61000-4-6:2013, IEC61000-4-8:2009
IEC61000-4-11:2004)
*C-Tick AS/NZS CISPR 22:2009 +A1:2010, RULES AND REGULATIONS OF CLASS B
(CISPR 22 Ed. 6.0:2008)
Taiwan EMC CNS 1343 (C6357
VCCI VCCI V-2/Apr. 2012 and V-3/Apr. 2013 and V-4/Apr. 2012
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12 REVISION HISTORY
Rev. No. Reason for Release Release Date TECHMAN
1.00 First Release September 7, 2015 Samuel Chen
1.01
1.Typo
2. Revise 9. Label
Add NVMe logo
October 15, 2015 Samuel Chen
1.02
1. Revise 3.3 Random Read\Write IOPS –steady state
Modify random 4K from 110K to 105K (for Linux)
2. Revise 3.2 Sequential Read \ Write Performance
Modify Sequential Write from 1400MB to 1350MB
(for Linux)
October 21, 2015 Samuel Chen
1.03
Performance improvement (Firmware version 1.03)
1. Revise 3.3 Random Read\Write IOPS –steady state
Modify random 4K write from 105K to 115K
Modify random 4K read from 510K to 750K
2. Revise 3.2 Sequential Read \ Write Performance
Modify Sequential write from 1350MB to 1400MB
Modify Sequential read from 2500MB to 3200MB
January 14, 2016 Samuel Chen
1.10 Change document format February 16, 2016 Samuel Chen
1.11 Add APPENDIX A PERFORMANCE TEST
EQUIPMENT March 3, 2016 Samuel Chen
1.12
Add 8.2 Airflow Requirements
Add XC120 series dual port support (Firmware and
H/W requirement)
April 26 2016 Samuel Chen
2.00 Support NVMe command 1.2 July 11, 2016 Samuel Chen
2.01 Add XC120 Product number
Add Xenserver 7.0 support August 1, 2016 Samuel Chen
2.02
Add APPENDIX B model name define
Modify APPENDIX B SSD PRODUCT NUMBER
LIST to APPENDIX C SSD PRODUCT NUMBER
LIST
September 1, 2016 Samuel Chen
2.03
Add NVMe support operating system (6.1 NVMe
Driver support operating system)
Typo Page8
January 19, 2017 Samuel Chen
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APPENDIX A MAX PERFORMANCE TEST EQUIPMENT
BIOS Configuration
Speed Step: Disabled
Turbo Boost: Disabled
CPU Power and Performance Policy: Performance
CPU C-state : Disabled
Virtualization : Disabled
Windows Configuration
FIO
Direct: Yes
thread:
o 4KB Random I/O: 64 outstanding I/O
o 128KB Seq. I/O: 64 outstanding I/O
Ramp Time: 5 seconds
Run Time:30 seconds
Norandommap: 1
I/O Engine: windowsaio
Numjobs: 4
Iometer
Queue depth:
o 4KB Random I/O: 10 worker with 256 outstanding I/O
o 128KB Seq. I/O: 1 worker with 32 outstanding I/O
Ramp Time: 5 seconds
Run Time:30 seconds
Linux Configuration
FIO
Direct: Yes
Queue depth
o 4KB Random I/O: 64 outstanding I/O
o 128KB Seq. I/O: 64 outstanding I/O
Ramp Time: 5 seconds
Run Time:30 seconds
Norandommap: 1
I/O Engine: libaio
Numjobs: 4
Vdbench
Iorate : max
Threads :128
Elapsed : 5 seconds
Run Time: 30 seconds
Override : 4
Multi JVM execution (jvms) : 16
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APPENDIX B SSD MODE NAME DEFINE
Techman Electronics (Changshu) Co., Ltd.
Model Name XC100 series (Single Port)
XC120 series (Dual Port)
Flash Type E: eMLC
C: cMLC
Interface 5: PCIE Gen3 Lane4
Form factory 5 : U.2 ( SFF-8639)
C: AIC (HHHL)
Capacity -XXXX GB
Techman XC100 E 5 5 -1600
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APPENDIX C SSD PRODUCT NUMBER LIST
XC100 series HHHL Product Number Flash type Capacity Model Name
9SE5C014B01TTQ3 TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 800GB XC100E5C-800
9SE5C014B02TTQ2 TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 1600GB XC100E5C-1600
9SE5C018B04TTQ2 TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 3200GB XC100E5C-3200
9SE5C014B01TTQ2 TOSHIBA 15nm Client Multi Level Cell (cMLC) 800GB XC100C5C-800
9SE5C014B02TTQ1 TOSHIBA 15nm Client Multi Level Cell (cMLC) 1600GB XC100C5C-1600
9SE5C018B04TTQ1 TOSHIBA 15nm Client Multi Level Cell (cMLC) 3200GB XC100C5C-3200
XC100 series U.2 Single-Port (SFF-8639) Product Number Flash type Capacity Model Name
9SE55014B01TTQ3 TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 800GB XC100E55-800
9SE55014B02TTQ2 TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 1600GB XC100E55-1600
9SE55018B04TTQ2 TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 3200GB XC100E55-3200
9SE55014B01TTQ2 TOSHIBA 15nm Client Multi Level Cell (cMLC) 800GB XC100C55-800
9SE55014B02TTQ1 TOSHIBA 15nm Client Multi Level Cell (cMLC) 1600GB XC100C55-1600
9SE55018B04TTQ1 TOSHIBA 15nm Client Multi Level Cell (cMLC) 3200GB XC100C55-3200
XC120 series U.2 Dual-Port (SFF-8639) Product Number Flash type Capacity Model Name
9SE55014B01TTX5 TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 800GB XC120E55-800
9SE55014B02TTX4 TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 1600GB XC120E55-1600
9SE55014B04TTX4 TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 3200GB XC120E55-3200
9SE55014B01TTX4 TOSHIBA 15nm Client Multi Level Cell (cMLC) 800GB XC120C55-800
9SE55014B02TTX3 TOSHIBA 15nm Client Multi Level Cell (cMLC) 1600GB XC120C55-1600
9SE55014B04TTX3 TOSHIBA 15nm Client Multi Level Cell (cMLC) 3200GB XC120C55-3200