SPECIFICATIONS Solid State Drive - TECHMAN SSDtm-ssd.com/specification/TECHMAN-PV100-NVMe-SSD-Specification.pdf · Techman Electronics (Changshu) Co., Ltd. 1 of 33 Document Number:

Techman Electronics (Changshu) Co., Ltd.

1 of 33 Document Number: 9SPV100-201-M01 Rev 1

SPECIFICATIONS

Solid State Drive

MODEL : PV100 Series

Release

Date: May 12, 2017

Rev : 1.01

Prepared by Reviewed by Approved by

Samuel Chen Kiwi Tsao Ilong Hsiao

Techman Electronics (Changshu) Co., Ltd.


TECHMAN PV100 SERIES PRODUCT SPECIFICATION

Form factors

2.5” 7.0mm Z-height U.2 (SFF-8639)

M.2 2280 (Double Side) without PLP

M.2 22110 (Double Side) with PLP

Interface

2.5” U2 PCIE Gen 3x4

M.2 2280 PCIE Gen 3x4

M.2 22110 PCIE Gen 3x4

Components

Toshiba 15nm Enterprise Multi Level Cell

Toshiba 15nm Client Multi Level Cell

Support Capacity U.2 240 GB, 400GB, 480GB, 800GB, 960GB, 1600GB,

1920GB

M.2 2280 128GB, 256GB, 512GB

M.2 22110 400GB, 480GB, 800GB, 960GB, 1600GB,

1920GB

Performance

128K Sequential Read 2500 MB/s

128K Sequential Write 1150 MB/s

4K Random Read 215K /215K IOPS

4K Random Write: 120K / 34K IOPS

Power consumption

Power rail

U.2 12V and 3.3 V

M.2 3.3 V

Power consumption

Max power 9.2W

Typical Power 2.5 W

Power mode 10W/6W/3W/1W

Endurance

400GB( eMLC) 2.3DWPD / 1.679PBW






19200GB( eMLC) 0.9DWPD / 3.153PBW

400GB( cMLC) 0.7DWPD / 0.511PBW







Features S.M.A.R.T / Health Information (LOG IDENTIFIER

02H) TRIM Wear-leveling Bad Block Management Background Garbage Collection Advanced Encryption Standard (AES) 256bit

(optional). End-to-End Data Protection Power Loss Data Protection T10-DIF Data Protection1 Variable sector size: 512b, 520b ,4096b ,4104bi Multi-namespace support

Temperature

OPERATING 0 to 55° C(Ambient)

0 to 70° C(SMART

temperature attribute)

Non-OPERATING -55 to 95° C

Airflow requirement

(35° C)

240GB 550 LFM

400GB 750 LFM

480GB 750 LFM

800GB 900 LFM

960GB 900 LFM

1600GB 900 LFM

1920GB 900 LFM

Thermal throttling

Temperature monitoring (In-band)

Temperature monitoring (Out of band : SMBus )

Shock

OPERATING 1000G/0.5ms

Non-OPERATING 1000G/0.5ms

Vibration

OPERATING 3.01 Grms (Random,

2.5~500 Hz

Non-OPERATING 4.9 Grms (Random,

5~800 Hz

Reliability

Uncorrected bit error rate ≤10−17

MTBF > 2,000,000 POH

Operating System support

Windows 10, 8.1, 7 (X86/X64)

Windows server 2016, 2012R2, 2012, 2008R2

RHEL 6.5, 6.6, 6.7, 6.8, 7.0, 7.1, 7.2

SuseLiunx 11 SP3, 11 SP4, 12, 12 SP1

CentOS 6.5, 6.6, 6.7 6.8, 7.0, 7.1, 7.2

Ubuntu Server 14.04, 15.04, 15.10 16.04

Debian 7.8, 8.1, 8.2, 8.3

Vmware 5.5, 6.0 ,6.5

Xenserver 6.5 SP1 ,7.0

Compliance

NVMe Express 1.2

PCI Express Base specification 3.1

Enterprise SSD Factor Version 1.0a

System Management Bus (SMBus) Specification,

Version 2.0

Certification

UL CE C-tick, BSMI KCC, WHQL, VCCI

i Refer to 5.1 Variable sector size for support model list


TABLE OF CONTENTS

TECHMAN PV100 SERIES PRODUCT SPECIFICATION ................................................................................................. 2

1 INTRODUCTION ............................................................................................................................................................. 5

2 PHYSICAL SPECIFICATIONS...................................................................................................................................... 6

DIMENSION ................................................................................................................................................................. 6 WEIGHT ...................................................................................................................................................................... 6 MECHANICAL ............................................................................................................................................................. 6

2.3.1 FORM FACTOR – U.2 ................................................................................................................................................... 6 2.3.2 FORM FACTOR – M.2 2280 .......................................................................................................................................... 7 2.3.3 FORM FACTOR – M.2 22110 (LESS THAN 480GB) ...................................................................................................... 7 2.3.4 FORM FACTOR – M.2 22110 (MORE THAN 800GB)..................................................................................................... 8

3 PERFORMANCE ............................................................................................................................................................. 9

LBA SETTING ............................................................................................................................................................. 9 SEQUENTIAL READ \ WRITE PERFORMANCE ............................................................................................................... 9 RANDOM READ \ WRITE IOPS .................................................................................................................................. 10 LATENCY .................................................................................................................................................................. 12 QUALITY OF SERVICE ............................................................................................................. 錯誤! 尚未定義書籤。 READY TIME ............................................................................................................................................................. 13

4 ELECTRICAL CHARACTERISTICS ......................................................................................................................... 14

POWER SUPPLY ......................................................................................................................................................... 14 VOLTAGE (RAISE \ FALL TIME) ................................................................................................................................ 14 INRUSH CURRENT ..................................................................................................................................................... 14 CURRENT AND POWER CONSUMPTION ...................................................................................................................... 15

4.2.1 FORM FACTOR – U.2 (SFF-8639) .............................................................................................................................. 15 4.2.2 FORM FACTOR – M.2 (22110) ................................................................................................................................... 15 4.2.3 FORM FACTOR – M.2 (22110) ................................................................................................................................... 15

POWER OFF TIME....................................................................................................................................................... 15

5 FEATURES ...................................................................................................................................................................... 16

VARIABLE SECTOR SIZE SUPPORT ............................................................................................................................ 16 THERMAL THROTTLING AND PERFORMANCE ............................................................................................................ 16

6 INTERFACE ................................................................................................................................................................... 17

CONNECTOR ............................................................................................................................................................. 17 6.1.1 FORM FACTOR – U.2 (SFF-8639) .............................................................................................................................. 17

DEVICE PLUG CONNECTOR PIN DEFINITION ............................................................................................................... 18 6.2.1 FORM FACTOR – U.2 (SFF-8639) .............................................................................................................................. 18 6.2.2 FORM FACTOR –M.2 ................................................................................................................................................. 19

NVME COMMAND .................................................................................................................................................... 20 SCSI COMMAND SET ................................................................................................................................................ 20 SET FEATURE IDENTIFIERS ...................................................................................................................................... 20 LOG PAGE SUPPORT.................................................................................................................................................. 20 SMART / HEALTH INFORMATION (LOG IDENTIFIER 02H) ........................................................................................ 20 VENDOR SPECIFIC (LOG IDENTIFIER C0-FFH) ........................................................................................................... 21 PCIE ID .................................................................................................................................................................... 21 SMBUS FUNCTION.................................................................................................................................................... 22

7 NVME DRIVER SUPPORT .......................................................................................................................................... 24

NVME DRIVER SUPPORT OPERATING SYSTEM .......................................................................................................... 24

8 RELIABILITY ................................................................................................................................................................ 25

MTBF ...................................................................................................................................................................... 25 UBER ....................................................................................................................................................................... 25 DATA RETENTION ..................................................................................................................................................... 25 LIMITED WARRANTY CONDITION (PERIOD OR PBW) ............................................................................................... 25

9 ENVIRONMENTAL CONDITIONS ............................................................................................................................ 26

AMBIENT TEMPERATURE .......................................................................................................................................... 26 AIRFLOW REQUIREMENTS ........................................................................................................................................ 26


TEMP. GRADIENT ...................................................................................................................................................... 26 HUMIDITY ................................................................................................................................................................. 26 VIBRATION ............................................................................................................................................................... 26 SHOCK ...................................................................................................................................................................... 26 DROP ........................................................................................................................................................................ 26 ESD .......................................................................................................................................................................... 26

10 RESTRICTED MATERIALS CONTENT ................................................................................................................... 27

11 LABEL ............................................................................................................................................................................. 28

DRIVE LABELS .......................................................................................................................................................... 28

12 AGENCY CERTIFICATES ........................................................................................................................................... 30

SAFETY REGULATION ............................................................................................................................................... 30 EMC ......................................................................................................................................................................... 30

13 REVISION HISTORY .................................................................................................................................................... 31

APPENDIX A MAX PERFORMANCE TEST EQUIPMENT............................................................................................. 32

BIOS CONFIGURATION ........................................................................................................................................................... 32 WINDOWS CONFIGURATION .................................................................................................................................................... 32 LINUX CONFIGURATION .......................................................................................................................................................... 32

APPENDIX B SSD PRODUCT NUMBER LIST ................................................................................................................... 33


1 INTRODUCTION

A leader in manufacturing storage device, Techman Electronics (Changshu) Co., Ltd. (or Techman)

is positioned to provide Solid State Drive, a better solution to enterprise. Techman’s SSD mainly

consists of multicore processor and eMLC NAND flash memory which, along with our innovative

firmware architecture, deliver significant performance, high reliability, and power efficiency in a

small form factor. In addition, Techman’s SSD is compliant with Advanced Encryption Standard

(AES). Above enable Techman’s SSD to work much faster and hence to improve user experience

and satisfaction. In this manual is defined the functional, mechanical, and interface specifications of

Techman SSD PV100 series.

The general features of PV100 series are as follows:

S.M.A.R.T / Health Information (LOG IDENTIFIER 02H)

TRIM

Wear-leveling

Bad Block Management

Background Garbage Collection

Advanced Encryption Standard (AES) 256bit (optional).

End-to-End Data Protection

Power Loss Data Protection

T10-DIF Data Protection1

Variable sector size: 512b, 520b ,4096b ,4104b

Multi-namespace support


2 PHYSICAL SPECIFICATIONS

Dimension

Form factor Length (mm) Width(mm) Height(mm)

2.5 inch 100.45 Max 69.85 +/- 0.25 7.0 +0/-0.5

M.2 2280 80.0 +\- 0.15 22.0+\- 0.15 3.58+\- 0.15

M.2 22110 110.0 +\- 0.15 22.0+\- 0.15 3.58+\- 0.15

Weight Form factor Weight (g)

2.5 inch 62 Max

M.2 2280 7.5 Max

M.2 22110 (Less than 480GB) 12 Max

M.2 22110 (more than 800GB) 14.5 Max

Mechanical

2.3.1 Form factor – U.2


2.3.2 Form factor – M.2 2280

2.3.3 Form factor – M.2 22110 (Less than 480GB)


2.3.4 Form factor – M.2 22110 (More than 800GB)


3 PERFORMANCE

LBA setting

Unformatted capacity

Capacity LBA User available Bytes User available GBytes

128GB 250,069,680 128,035,676,160 119.24

256GB 468,862,128 240,057,409,536 223.57

400GB 781,422,768 400,088,457,216 372.61

480GB 937,703,088 480,103,981,056 447.13

512GB 1,000,215,216 512,110,190,592 476.94

800GB 1,562,824,368 800,166,076,416 745.21

960GB 1,875,385,008 960,197,124,096 894.25

1600GB 3,125,627,568 1,600,321,314,816 1490.42

1920GB 3,750,748,848 1,920,383,410,176 1788.50

Note: (*1) 1 GB = 1,000,000,000 bytes; 1 sector = 512 Bytes;

Sequential Read \ Write Performance

Model Capacity Sequential Read Sequential Write

PV100E55 (U.2) (Toshiba 15nm Multi Level Cell (eMLC)

PV100E55-240 240GB 2100 250

PV100E55-400 400GB 2400 550

PV100E55-480 480GB 2400 600

PV100E55-800 800GB 2500 900

PV100E55-960 960GB 2500 950

PV100E55-1600 1600GB 2500 800 PV100E55-1920 1920GB 2500 850

PV100C55 (U.2) (Toshiba 15nm Multi Level Cell (cMLC)

PV100C55-240 240GB 2100 350

PV100C55-400 400GB 2400 650

PV100C55-480 480GB 2400 700

PV100C55-800 800GB 2500 750

PV100C55-960 960GB 2500 750

PV100C55-1600 1600GB 2500 900

PV100C55-1920 1920GB 2500 950

PV100D5N (M.2 2280) (Toshiba 15nm Multi Level Cell (cMLC)

PV100D5N-128 128GB 1500 190

PV100D5N-256 256GB 2100 350

PV100D5N-512 512GB 2400 650

PV100E5B (M.2 22110) (Toshiba 15nm Multi Level Cell (eMLC)

PV100E5B-400 400GB 2400 550

PV100E5B-480 480GB 2400 600

PV100E5B-800 800GB 2500 900

PV100E5B-960 960GB 2500 950

PV100E5B-1600 1600GB 2500 800 PV100E5B-1920 1920GB 2500 850

PV100C5B (M.2 22110) (Toshiba 15nm Multi Level Cell (cMLC)

PV100C5B-400 400GB 2400 650

PV100C5B-480 480GB 2400 700

PV100C5B-800 800GB 2500 1000

PV100C5B-960 960GB 2500 1050

PV100C5B-1600 1600GB 2500 900

PV100C5B-1920 1920GB 2500 950

Note: (*1) Test OS: Centos 7.2 (CPU C-state disable)

Note: (*2) Block size =128Kib

Note: (*3) Sequential Read & write performance test by FIO (OIO= 1 job with 32 Queue Depth)

Note: (*4) Consistency up to 90%

Note: (*5) Test Rage = Full capacity


Random Read \ Write IOPS

FOB

Model Capacity 4K Random

Read

4K Random

Write

4K Random

Read\Write

70/30

8K Random

Read

8K Random

Write

8K Random

Read\Write

70/30


PV100E55-240 240GB 150,000 65,000 75,000 75,000 32,000 40,000

PV100E55-400 400GB 205,000 115,000 80,000 115,000 75,000 40,000

PV100E55-480 480GB 205,000 115,000 80,000 115,000 75,000 40,000

PV100E55-800 800GB 215,000 120,000 85,000 120,000 85,000 45,000

PV100E55-960 960GB 215,000 120,000 90,000 120,000 85,000 45,000

PV100E55-1600 1600GB 215,000 120,000 85,000 120,000 85,000 45,000

PV100E55-1920 1920GB 215,000 120,000 90,000 120,000 85,000 45,000


PV100C55-240 240GB 150,000 65,000 75,000 75,000 32,000 40,000

PV100C55-400 400GB 200,000 115,000 80,000 105,000 75,000 40,000

PV100C55-480 480GB 200,000 115,000 80,000 105,000 75,000 40,000

PV100C55-800 800GB 215,000 115,000 85,000 120,000 75,000 45,000

PV100C55-960 960GB 215,000 115,000 90,000 120,000 75,000 45,000

PV100C55-1600 1600GB 215,000 115,000 85,000 120,000 75,000 45,000

PV100C55-1920 1920GB 215,000 115,000 90,000 120,000 75,000 45,000


PV100D5N-128 128GB 110,000 47,500 --

PV100D5N-256 256GB 155,000 90,000 -- -- -- -- PV100D5N-512 512GB 195,000 115,000 -- -- -- --


PV100E5B-400 400GB 205,000 115,000 80,000 115,000 75,000 40,000

PV100E5B-480 480GB 205,000 115,000 80,000 115,000 75,000 40,000

PV100E5B-800 800GB 215,000 120,000 85,000 120,000 85,000 45,000

PV100E5B-960 960GB 215,000 120,000 90,000 120,000 85,000 45,000

PV100E5B-1600 1600GB 215,000 120,000 85,000 120,000 85,000 45,000

PV100E5B-1920 1920GB 215,000 120,000 90,000 120,000 85,000 45,000


PV100C5B-400 400GB 200,000 115,000 80,000 115,000 75,000 40,000

PV100C5B-480 480GB 200,000 115,000 80,000 115,000 75,000 40,000

PV100C5B-800 800GB 215,000 120,000 85,000 120,000 85,000 45,000

PV100C5B-960 960GB 215,000 120,000 90,000 120,000 85,000 45,000

PV100C5B-1600 1600GB 215,000 120,000 85,000 120,000 85,000 45,000

PV100C5B-1600 1920GB 215,000 120,000 90,000 120,000 85,000 45,000


Steady state

Model Capacity 4K Random

Read

4K Random

Write

4K Random

Read\Write

70/30

8K Random

Read

8K Random

Write

8K Random

Read\Write

70/30


PV100E55-240 240GB 150,000 8,500 25,000 75,000 4,000 13,000

PV100E55-400 400GB 205,000 26,000 70,000 115,000 13,000 37,000

PV100E55-480 480GB 205,000 10,500 35,000 115,000 5,300 18,000

PV100E55-800 800GB 215,000 32,000 80,000 120,000 16,000 37,500

PV100E55-960 960GB 215,000 14,500 45,000 120,000 7,500 23,000

PV100E55-1600 1600GB 215,000 34,000 85,000 120,000 16,000 42,000

PV100E55-1920 1920GB 215,000 14,500 50,000 120,000 9,000 27,000


PV100C55-240 240GB 150,000 8,500 25,000 75,000 4,000 13,000

PV100C55-400 400GB 200,000 25,000 70,000 115,000 12,500 36,000

PV100C55-480 480GB 200,000 10,500 35,000 115,000 5,300 19,000

PV100C55-800 800GB 215,000 32,000 80,000 120,000 16,000 37,500

PV100C55-960 960GB 215,000 14,500 45,000 120,000 7,500 23,000

PV100C55-1600 1600GB 215,000 34,000 85,000 120,000 16,000 42,000

PV100C55-1920 1920GB 215,000 14,500 50,000 120,000 9,000 27,000


PV100D5N-128 128GB -- -- -- -- -- -- PV100D5N-256 256GB 150,000 7,500 10,000 75,000 3,500 5,000

PV100D5N-512 512GB 195,000 10,500 13,000 105,000 4,200 7,100


PV100E5B-400 400GB 205,000 26,000 70,000 115,000 13,000 37,000

PV100E5B-480 480GB 205,000 10,500 35,000 115,000 5,300 18,000

PV100E5B-800 800GB 215,000 32,000 80,000 120,000 16,000 37,500

PV100E5B-960 960GB 215,000 14,500 45,000 120,000 7,500 23,000

PV100E5B-1600 1600GB 215,000 34,000 85,000 120,000 16,000 42,000

PV100E5B-1920 1920GB 215,000 14,500 50,000 120,000 9,000 27,000


PV100C5B-400 400GB 200,000 26,000 70,000 115,000 13,000 37,000

PV100C5B-480 480GB 200,000 10,500 35,000 115,000 5,300 18,000

PV100C5B-800 800GB 215,000 32,000 80,000 120,000 16,000 37,500

PV100C5B-960 960GB 215,000 14,500 45,000 120,000 7,500 23,000

PV100C5B-1600 1600GB 215,000 34,000 85,000 120,000 16,000 42,000

PV100C5B-1600 1920GB 215,000 14,500 50,000 120,000 9,000 27,000

Note: (*1) Test OS: Centos 7.2 (CPU C-state disable)

Note: (*2) Random read 4K IOPS & Random write 4K IOPS test by FIO (OIO=1 job with 32 Queue Depth)

Note: (*3) Consistency up to 90%

Note: (*4) Test Rage = Full capacity


Latency

Model Capacity Sequential Read Sequential Write 4K Random Read 4K Random Write


PV100E55-240 240GB 180 us 150 us 60 us 30 us

PV100E55-400 400GB 180 us 150 us 60 us 30 us

PV100E55-480 480GB 180 us 150 us 60 us 30 us

PV100E55-800 800GB 180 us 150 us 60 us 30 us

PV100E55-960 960GB 180 us 150 us 60 us 30 us

PV100E55-1600 1600GB 180 us 150 us 60 us 30 us

PV100E55-1920 1920GB 180 us 150 us 60 us 30 us


PV100C55-240 240GB 180 us 150 us 60 us 30 us

PV100C55-400 400GB 180 us 150 us 60 us 30 us

PV100C55-480 480GB 180 us 150 us 60 us 30 us

PV100C55-800 800GB 180 us 150 us 60 us 30 us

PV100C55-960 960GB 180 us 150 us 60 us 30 us

PV100C55-1600 1600GB 180 us 150 us 60 us 30 us

PV100C55-1920 1920GB 180 us 150 us 60 us 30 us


PV100D5N-128 128GB 180 us 150 us 60 us 30 us

PV100D5N-256 256GB 180 us 150 us 60 us 30 us

PV100D5N-512 512GB 180 us 150 us 60 us 30 us


PV100E5B-400 400GB 180 us 150 us 60 us 30 us

PV100E5B-480 480GB 180 us 150 us 60 us 30 us

PV100E5B-800 800GB 180 us 150 us 60 us 30 us

PV100E5B-960 960GB 180 us 150 us 60 us 30 us

PV100E5B-1600 1600GB 180 us 150 us 60 us 30 us

PV100E5B-1920 1920GB 180 us 150 us 60 us 30 us


PV100C5B-400 400GB 180 us 150 us 60 us 30 us

PV100C5B-480 480GB 180 us 150 us 60 us 30 us

PV100C5B-800 800GB 180 us 150 us 60 us 30 us

PV100C5B-960 960GB 180 us 150 us 60 us 30 us

PV100C5B-1600 1600GB 180 us 150 us 60 us 30 us

PV100C5B-1600 1920GB 180 us 150 us 60 us 30 us

Note: (*1) Queue Depth 1 with Max power mode

Note: (*2) Measurement by FIO


Ready time

Model Capacity Power on to PCIe

ready

Power on to

Device ready Unsafe power on


PV100E55-240 240GB < 2sec < 12 sec 30 Sec (Max)








PV100C55-240 240GB < 2sec < 12 sec 30 Sec (Max)








PV100D5N-128 128GB < 2sec < 12 sec 30 Sec (Max)




PV100E5B-400 400GB < 2sec < 12 sec 30 Sec (Max)







PV100C5B-400 400GB < 2sec < 12 sec 30 Sec (Max)







4 ELECTRICAL CHARACTERISTICS

Power Supply

Capacity unit U.2 M.2

Voltage V DC 12V +10% \ -20% DC 3.3V 5%

Noise V 1000m Vp-p Max, 10 ~ 100KHz

100m Vp-p Max, 100 ~ 20KHz

120m Vp-p Max, 10 ~ 30 MHz

Voltage (Raise \ Fall Time)

Capacity unit Raise time ( Max/Min) Fall Time (Max/Min)

128GB

240GB

256GB

100 ms @ 3.3V / 1ms

200ms @ 12V / 1ms 5s / 1ms

400GB

480GB

512GB

100 ms @ 3.3V / 1ms

200ms @ 12V / 1ms 5s / 1ms

800GB

960GB

100 ms @ 3.3V / 1ms

200ms @ 12V / 1ms 5s / 1ms

1600GB

1920GB

100 ms @ 3.3V / 1ms

200ms @ 12V / 1ms 5s / 1ms

Inrush Current

Capacity unit U.2 M.2

128GB

240GB

256GB

A < 2 (12V) < 2.5 (3.3V)

400GB

480GB

512GB

A < 2 (12V) < 2.5 (3.3V)

800GB

960GB A < 2 (12V) < 2.5 (3.3V)

1600GB

1920GB A < 2 (12V) < 2.5 (3.3V)


Current and Power Consumption

4.2.1 Form factor – U.2 (SFF-8639)

Capacity unit Idle (Avg) Read(Avg) Write(Avg)

PV100E55-240 Watt 2.4 5.5 4.2

PV100C55-400

PV100C55-480 Watt 2.4 6.5 6.2

PV100E55-400

PV100E55-480 Watt 2.4 6.5 6.2

PV100C55-800

PV100C55-960 Watt TBD TBD TBD

PV100E55-800

PV100E55-960 Watt TBD TBD TBD

PV100C55-1600


PV100C55-1920


4.2.2 Form factor – M.2 (22110) Capacity unit Idle (Avg) Read(Avg) Write(Avg)

PV100C5B-400

PV100C5B-480 Watt 2.4 6.5 6.2

PV100E5B-400

PV100E5B-480 Watt 2.4 6.5 6.2

PV100C5B-800

PV100C5B-960 Watt 2.4 7.1 8.2

PV100E5B-800

PV100E5B-960 Watt 2.5 7.1 9.2

PV100C5B-1600

PV100C5B-1920 Watt 2.5 7.6 9.1

PV100E5B-1600

PV100E5B-1920 Watt 2.5 7.6 9.1

4.2.3 Form factor – M.2 (22110) Capacity unit Idle (Avg) Read(Avg) Write(Avg)

PV100D5N-128 Watt TBD TBD TBD PV100D5N-256 Watt 2.4 5.5 4.2 PV100D5N-512 Watt 2.4 6.5 5.6

Power off time

Capacity unit SPEC

Power off time s > 5sec


5 FEATURES

Variable Sector Size Support

Model Capacity 512B 512B+8B 4096B 4096B+8

Max power mode PV100D5N-128

PV100D5N-256

PV100D5N-512

128GB

256GB

512GB

Support No Support Support No Support

PV100C55-240

PV100E55-240 240GB Support No Support Support Support

PV100C55-400

PV100E55-400

PV100C5B-400

PV100E5B-400

400GB Support No Support Support Support

PV100C55-480

PV100E55-480

PV100C5B-480

PV100E5B-480

480GB Support No Support Support Support

PV100C55-800

PV100C5B-800 800GB Support No Support Support Support

PV100E55-800

PV100E5B-800 800GB Support Support Support Support

PV100C55-960

PV100C5B-960 960GB Support No Support Support Support

PV100E55-960

PV100E5B-960 960GB Support Support Support Support

PV100C55-1600

PV100C5B-1600

PV100E55-1600

PV100E5B-1600

1600GB Support Support Support Support

PV100C55-1920

PV100C5B-1920

PV100E55-1920

PV100E5B-1920

1920GB Support Support Support Support

Thermal Throttling and Performance

Capacity Temperature

S.M.A.R.T Write performance Read Performance

Normal 100% 100%

Power State 1 Up to 70C Down to 50% Down to 50%

Power State 2 Up to 76C Down to 20% Down to 20%

Power State 3 Up to 80C Freeze Freeze


6 INTERFACE

Connector

6.1.1 Form factor – U.2 (SFF-8639)


Device plug connector pin definition

6.2.1 Form factor – U.2 (SFF-8639) Pin Name Description Pin Name Description

S1 GND Ground E7 REFCLK1+ Reference clock port 0

S2

Not used (SATA/SAS) E8 REFCLK1 - Reference clock port 0

S3

Not used (SATA/SAS) E9 GND Ground

S4 GND Ground E10 PETp0 Transmitter differential pair, Lane 0

S5

Not used (SATA/SAS) E11 PETn0 Transmitter differential pair, Lane 0

S6

Not used (SATA/SAS) E12 GND Ground

S7 GND Ground E13 PERn0 Receiver differential pair, Lane 0

E1 REFCLK1+ Reference clock port 1(not used) E14 PERp0 Receiver differential pair, Lane 0

E2 REFCLK1 - Reference clock port 1(not used) E15 GND Ground

E3 3.3Vaux 3.3V auxiliary power E16 RSVD Reserved

E4 PERST1# Reference clock port 1(not used) S8 GND Ground

E5 PERST0# Fundamental reset port 0 S9

Not used (SATA/SAS)

E6 RSVD Reserved S10

Not used (SATA/SAS)

P1

Not used (SATA/SAS) S11 GND Ground

P2

Not used (SATA/SAS) S12

Not used (SATA/SAS)

P3

Not used (SATA/SAS) S13

Not used (SATA/SAS)

P4 IfDet_N Interface detect (drive type) S14 GND Ground

P5 GND Ground S15 RSVD Reserved

P6 GND Ground S16 GND Ground

P7

Not used (SATA/SAS) S17 PETp1 Transmitter differential pair, Lane 1

P8

Not used (SATA/SAS) S18 PETn1 Transmitter differential pair, Lane 1

P9

Not used (SATA/SAS) S19 GND Ground

P10 PRSNT_N Presence detect

(also used for drive type)

S20 PERn1 Receiver differential pair, Lane 1

P11 Activity Activity signal from the drive S21 PERp1 Receiver differential pair, Lane 1

P12 Hot-Plug Ground S22 GND Ground

P13 +12V_pre 12V power S23 PETp2 Transmitter differential pair, Lane 2

P14 +12V 12V power S24 PETn2 Transmitter differential pair, Lane 2

P15 +12V 12V power S25 GND Ground

S26 PERn2 Receiver differential pair, Lane 2

S27 PERp2 Receiver differential pair, Lane 2

S28 GND Ground

E17 PETp3 Transmitter differential pair, Lane 3

E18 PETn3 Transmitter differential pair, Lane 3

E19 GND Ground

E20 PERn3 Receiver differential pair, Lane 3

E21 PERp3 Receiver differential pair, Lane 3

E22 GND Ground

E23 SMCLK SMBus clock

E24 SMDAT SMBus data

E25 DualPortEn_N Dual port enable


6.2.2 Form factor –M.2


NVMe Command

ID (Hex) ATTRIBUTES ID (Hex) ATTRIBUTES

NVMe Admin Command

00h Delete I/O Submission Queue 0Ah GET Features

01h Delete I/O Completion Queue 0Ch Asynchronous Event Notification

02h Get Log Page 0Dh Namespace Management

04h Create I/O Submission Queue 10h Firmware Activate

05h Create I/O Completion Queue 11h Firmware Image Download

06h Identify 15h Namespace Attachment

08h Abort 80h Format NVM

NVMe I/O Command

00h Flush 02h Read

01h Write 09h Dataset Management (De-allocate only)

SCSI command Set

ID (Hex) Command ID (Hex) Command

08h Read 6 A0h Report LUNs

28h Read 10 03h Request Sense

A8h Read 12 1Bh Start Stop Unit

88h Read 16 35h Synchronize Cache 10

12h Inquiry 91h Synchronize Cache 16

1Ah Mode Sense 6 00h Test Unit Ready

5Ah Mode Select 10 3Bh Write Buffer

15h Mode Select 6 0Ah Write 6

55h Mode Select 10 2Ah Write 10

4Dh Log Sense AAh Write 12

25H Read Capacity 10 8Ah Write 16

9Eh/10 Read Capacity 16 42h Unmap

SET Feature Identifiers

Feature

Identifier (Hex) ATTRIBUTES

Feature

Identifier

(Hex)

ATTRIBUTES

01h Arbitration 08h Interrupt Coalescing

02h Power Management 09h Interrupt Vector Configuration

03h LBA Range Type 0bh Asynchronous Event Configuration

04h Temperature Threshold 80h Software Progress Marker

07h Number of Queues

Log Page Support

ID (Hex) ATTRIBUTES

01h Error Information 03h Firmware Slot Information

02h SMART/ Health Information 05h Command Effects Log

SMART / Health Information (Log Identifier 02h)

Byte Description

0

Critical Warning: This field indicates critical warnings for the state of the controller. Each bit corresponds to a critical

warning type; multiple bits may be set. If a bit is cleared to ‘0’, then that critical warning does not apply. Critical warnings

may result in an asynchronous event notification to the host. Bits in this field represent the current associated state and

are not persistent.

2:1

Composite Temperature: Contains a value corresponding to a temperature in degrees Kelvin that represents the

current composite temperature of the controller and namespace(s) associated with that controller. The manner in which

this value is computed is implementation specific and may not represent the actual temperature of any physical point in

the NVM subsystem. The value of this field may be used to trigger an asynchronous event (refer to section 5.14.1.4).

Warning and critical overheating composite temperature threshold values are reported by the WCTEMP and CCTEMP

fields in the Identify Controller data structure in Figure 90.

3 Available Spare: Contains a normalized percentage (0 to 100%) of the remaining spare capacity available.

4 Available Spare Threshold: When the Available Spare falls below the threshold indicated in this field, an

asynchronous event completion may occur. The value is indicated as a normalized percentage (0 to 100%).

5

Percentage Used: Contains a vendor specific estimate of the percentage of NVM subsystem life used based on the

actual usage and the manufacturer’s prediction of NVM life. A value of 100 indicates that the estimated endurance of

the NVM in the NVM subsystem has been consumed, but may not indicate an NVM subsystem failure. The value is

allowed to exceed 100. Percentages greater than 254 shall be represented as 255. This value shall be updated once per

power-on hour (when the controller is not in a sleep state).


Refer to the JEDEC JESD218A standard for SSD device life and endurance measurement techniques.

31:6 Reserved

47:32

Data Units Read: Contains the number of 512 byte data units the host has read from the controller; this value does not

include metadata. This value is reported in thousands (i.e., a value of 1 corresponds to 1000 units of 512 bytes read)

and is rounded up. When the LBA size is a value other than 512 bytes, the controller shall convert the amount of data

read to 512 byte units.

For the NVM command set, logical blocks read as part of Compare and Read operations shall be included in this value.

63:48

Data Units Written: Contains the number of 512 byte data units the host has written to the controller; this value does

not include metadata. This value is reported in thousands (i.e., a value of 1 corresponds to 1000 units of 512 bytes

written) and is rounded up. When the LBA size is a value other than 512 bytes, the controller shall convert the amount

of data written to 512 byte units.

For the NVM command set, logical blocks written as part of Write operations shall be included in this value. Write

Uncorrectable commands shall not impact this value.

79:64 Host Read Commands: Contains the number of read commands completed by the controller.

For the NVM command set, this is the number of Compare and Read commands.

95:80 Host Write Commands: Contains the number of write commands completed by the controller.

For the NVM command set, this is the number of Write commands.

111:96

Controller Busy Time: Contains the amount of time the controller is busy with I/O commands. The controller is busy

when there is a command outstanding to an I/O Queue (specifically, a command was issued via an I/O Submission

Queue Tail doorbell write and the corresponding completion queue entry has not been posted yet to the associated I/O

Completion Queue). This value is reported in minutes.

127:112 Power Cycles: Contains the number of power cycles.

143:128 Power On Hours: Contains the number of power-on hours. This does not include time that the controller was powered

and in a low power state condition.

159:144 Unsafe Shutdowns: Contains the number of unsafe shutdowns. This count is incremented when a shutdown

notification (CC.SHN) is not received prior to loss of power.

175:160

Media and Data Integrity Errors: Contains the number of occurrences where the controller detected an unrecovered

data integrity error. Errors such as uncorrectable ECC, CRC checksum failure, or LBA tag mismatch are included in

this field.

191:176 Number of Error Information Log Entries: Contains the number of Error Information log entries over the life of the

controller.

195:192

Warning Composite Temperature Time: Contains the amount of time in minutes that the controller is operational

and the Composite Temperature is greater than or equal to the Warning Composite Temperature Threshold

(WCTEMP) field and less than the Critical Composite Temperature Threshold (CCTEMP) field in the Identify

Controller data structure in Figure 90.

If the value of the WCTEMP or CCTEMP field is 0h, then this field is always cleared to 0h regardless of the

Composite Temperature value.

199:196

Critical Composite Temperature Time: Contains the amount of time in minutes that the controller is operational and

the Composite Temperature is greater the Critical Composite Temperature Threshold (CCTEMP) field in the Identify

Controller data structure in Figure 90.

If the value of the CCTEMP field is 0h, then this field is always cleared to 0h regardless of the Composite Temperature

value.

201:200

Temperature Sensor 1: Contains the current temperature reported by temperature sensor 1.

Bits Description

15:00 Temperature Sensor Temperature (TST): Contains the current temperature in degrees

Kelvin reported by the temperature sensor.

The physical point in the NVM subsystem whose temperature is reported by the temperature

sensor and the temperature accuracy is implementation specific. An implementation that does

not implement the temperature sensor reports a temperature of zero degrees Kelvin. The

temperature reported by a temperature sensor may be used to trigger an asynchronous event

203:202 Temperature Sensor 2: Contains the current temperature reported by temperature sensor 2. Refer to bye201:200



209:208 Temperature Sensor 5: Contains the current temperature reported by temperature sensor 5.Refer to bye201:200




511:216 Reserved

Vendor specific (Log Identifier C0-FFh)

Byte Description

101:0 Reserved

PCIe ID

ID name Description PV100 U.2 PV100 M.2

Vendor ID (VID) Vendor ID assigned by PCI-SIG 0x1D40 0x1D40

Device ID (DID) Device ID assigned by vendor 0xB100 0xB100

Subsystem Vendor ID Indicates Sub-system vendor ID 0x1D40 0x1D40


Subsystem ID Sub-system identifier 0xB100 0xB100

SMBus Function SMBUS address Function

0x53 Read Subsystem Management Data Structure -- defined by NVMe BMC revision 1.0a

0x1B (Register address 0x05) Get temperature in raw data

Command

Code Bytes Description

00 00 Length of Status: Indicates number of additional bytes to read before encountering PEC.

Always 6 (06h) in this version of the spec.

01 Status Flags (SFLGS): This field indicates the status of the NVM subsystem.

SMBus Arbitration – Bit 7 is set ‘1’ after a SMBus block read is completed all the way to

the

stop bit without bus contention and cleared to ‘0’ if a SMBus Send Byte FFh is received on

this SMBus slave address.

Drive Not Ready – Bit 6 is set to ‘1’ when the subsystem cannot process NVMe management

commands, and the rest of the transmission may be invalid. If cleared to ‘0’, then the

NVM subsystem is fully powered and ready to respond to management commands. This

logic level intentionally identifies and prioritizes powered up and ready drives over their

powered off neighbors on the same SMBus segment.

Drive Functional – Bit 5 is set to ‘1’ to indicate an NVM subsystem is functional. If cleared

to ‘0’, then there is an unrecoverable failure in the NVM subsystem and the rest of the

transmission may be invalid.

Reset Not Required - Bit 4 is set to ‘1’ to indicate the NVM subsystem does not need a reset

to resume normal operation. If cleared to ‘0’ then the NVM subsystem has experienced an

error that prevents continued normal operation. A controller reset is required to resume

normal operation.

Port 0 PCIe Link Active - Bit 3 is set to ‘1’ to indicate the first port’s PCIe link is up (i.e.,

the Data Link Control and Management State Machine is in the DL_Active state). If cleared

to ‘0’, then the PCIe link is down.

Port 1 PCIe Link Active - Bit 2 is set to ‘1’ to indicate the second port’s PCIe link is up. If

cleared to ‘0’, then the second port’s PCIe link is down or not present.

Bits 1-0 shall be set to ‘1’.

02 SMART Warnings: This field shall contain the Critical Warning field (byte 0) of the NVMe SMART

/ Health Information log. Each bit in this field shall be inverted from the NVMe definition (i.e., the

management interface shall indicate a ‘0’ value while the corresponding bit is ‘1’ in the log page).

Refer to the NVMe specification for bit definitions.

If there are multiple controllers in the NVM subsystem, the management endpoint shall combine the

Critical Warning field from every controller such that a bit in this field is:

Cleared to ‘0’ if any controller in the subsystem indicates a critical warning for that

corresponding bit.

Set to ‘1’ if all controllers in the NVM subsystem do not indicate a critical warning for the

corresponding bit.

03 Composite Temperature (CTemp): This field indicates the current temperature in degrees Celsius. If

a temperature value is reported, it should be the same temperature as the Composite Temperature from

the SMART log of hottest controller in the NVM subsystem. The reported temperature range is vendor

specific, and shall not exceed the range -60 to +127°C. The 8 bit format of the data is shown below.

This field should not report a temperature when that is older than 5 seconds. If recent data is not

available, the NVMe management endpoint should indicate a value of 80h for this field.

Value Description

00h-7Eh: Temperature is measured in degrees Celsius (0 to 126C)

7Fh: 127C or higher

80h: No temperature data or temperature data is more the 5 seconds old.

81h: Temperature sensor failure

82h-C3h Reserved

C4 Temperature is -60C or lower

C5-FFh: Temperature measured in degrees Celsius is represented in twos complement (-1

to -59C)

04 Percentage Drive Life Used (PDLU): Contains a vendor specific estimate of the percentage of NVM

subsystem NVM life used based on the actual usage and the manufacturer’s prediction of NVM life. If

an NVM subsystem has multiple controllers the highest value is returned. A value of 100 indicates that

the estimated endurance of the NVM in the NVM subsystem has been consumed, but may not indicate


Command

Code Bytes Description

an NVM subsystem failure. The value is allowed to exceed 100. Percentages greater than 254 shall be

represented as 255. This value should be updated once per power-on hour and equal the Percentage

Used value in the NVMe SMART Health Log Page.

06:05 Reserved: Shall be set to 0000h.

07 PEC: An 8 bit CRC calculated over the slave address, command code, second slave address

and returned data. Algorithm is in SMBus Specifications.

08 08 Length of identification: Indicates number of additional bytes to read before encountering PEC.

Always 22 (16h) in this version of the spec.

10:09 Vendor ID: The 2 byte vendor ID, assigned by the PCI SIG. Should match VID in the Identify

Controller command response. MSB is transmitted first.

30:11 Serial Number: 20 characters that match the serial number in the NVMe Identify Controller command

response. First character is transmitted first.

31 PEC: An 8 bit CRC calculated over the slave address, command code, second slave address

and returned data. Algorithm is in SMBus Specifications.

32+ 255:32 Vendor Specific


7 NVME DRIVER SUPPORT

NVMe Driver support operating system

OS Version Inbox driver Techman NVMe

Device driver

UEFI Boot

(UEFI 2.3.1)

Legacy Boot

Microsoft

Windows

Windows 10 Support Support Support Support

Windows 8.1 Support Support Support Support

Windows 8 No Support Support

Techman NVMe

driver support(*1)

Techman NVMe

driver support(*1)

Windows 7 No Support Support

Techman NVMe

driver support(*1)

Techman NVMe

driver support(*1)

Windows Server 2016 Support Support Support Support Windows Server 2012

R2 Support Support Support Support

Windows Server 2012 No Support Support

Techman NVMe

driver support(*1)

Techman NVMe

driver support(*1)

Windows Server 2008

R2 No Support Support

Techman NVMe

driver support(*1)

Techman NVMe

driver support(*1)

Red Hat

Enterprise

Linux

RHEL 6.5 - 6.6 No Support Support

Not support

Bootable(*2) Support

RHEL 6.7 - 6.8 Support Support

Not support


RHEL 7.0 - 7.3 Support Support Support Support

SUSE Linux

Enterprise

11 SP3

11 SP4 No Support Support

Not support

Bootable(*2)

Not support

Bootable(*2)

12 / SP1 / SP2 Support Support Support Support

CentOS

6.5 – 6.6 No Support Support

Not support

Bootable(*2)

Not support

Bootable(*2)

6.7 – 6.8 Support Support

Not support

Bootable(*2)

Not support

Bootable(*2)

7.0 – 7.3 Support Support Support Support

Ubuntu

Server

12.04 No Support Support

Not support

Bootable(*2)

Not support

Bootable(*2)

14.04 14.10

15.04 15.10

16.04 16.10

Support Support Support Support

Debian

7.8 No Support Support

Not support

Bootable(*2)

Not support

Bootable(*2)

8.1

8.2

8.3

Support Support Support Support

VMware

6.0

6.5 Support N/A Support Support

5.5 Vmware NVMe

driver support(*3) Vmware NVMe

driver support(*3) Vmware NVMe

driver support(*3)

Vmware NVMe

driver support(*3)

Citrix

XenServer

6.5 SP1 Citrix NVMe

driver support(*4) N/A

Not support


7.0 – 7.1 Support N/A Support Support Note: (*1) NVMe device driver requirement

(*2) OS does not support NVMe Booting

(*3) Vmware device driver requirement

(*4) Citrix device driver requirement


8 RELIABILITY

MTBF

> 2,000,000 POH (operating temperature between 0°C ~ 55°C.)

UBER

≤ 10−17 (unrecoverable bit error rate)

Data Retention 40 C at 3 months

Limited Warranty Condition (Period or PBW)

Capacity Flash Type DWPD Product Warranty

Policy (PBW)

Product Warranty

Policy (Period)

PV100E55-240 15nm eMLC 0.9 DWPD 0.394 PBW 5 years

PV100E55-400

PV100E5B-400 15nm eMLC 2.3 DWPD 1.679 PBW 5 years

PV100E55-480


PV100E55-800


PV100E55-960


PV100E55-1600


PV100E55-1920


PV100C55-240 15nm cMLC 0.3 DWPD 0.131 PBW 5 years

PV100C55-400

PV100C5B-400 15nm cMLC 0.7 DWPD 0.511 PBW 5 years

PV100C55-480


PV100C55-800


PV100C55-960


PV100C55-1600


PV100C55-1920


Capacity Flash Type Product Warranty

Policy (TBW)

Product Warranty

Policy (Period)

PV100D5N-128 15nm cMLC 60 TBW 3 years




9 ENVIRONMENTAL CONDITIONS

Ambient Temperature

PARAMETER OPERATING Non-OPERATING UNIT

2.5 inch(*1) 0 ~ 40 (Ambient)

0 ~ 70 (Case) (*2) -55 to 95 °C

M.2(*1) 0 ~ 55 (Ambient)

0 ~ 70 (Surface) (*3) -55 to 95 °C

Note: (*1) Airflow requirement

(*2) Measuring case temperature

(*3) Measuring PCB surface temperature

Airflow Requirements

Capacity unit Ambient = 25C Ambient = 35C

128GB

240GB

256GB LFM 450 550

400GB

480GB

512GB LFM 550 750

800GB

960GB LFM 750 900

1600GB

1920GB LFM 750 900

Temp. Gradient


Temperature 30 (Max) 30 (Max) °C/hr

Humidityii


Relative Humidity

(non-condensing) 5 to 95 5 to 95 %

Vibration


U.2 3.01 Grms (Random,

2.5~500 Hz

4.9 Grms (Random,

5~800 Hz

M.2

Shock


U.2 1000G/0.5ms 1000G/0.5ms

M.2 1000G/0.5ms 1000G/0.5ms

Drop

PARAMETER Weight Height UNIT

Drop (1 corner, 3 edges,

6 surfaces) 1.55 kg 91 cm Packaged

ESD

PARAMETER Level UNIT

Contact discharge 4 KV

Air discharge 8 KV

ii Should under the condition without condensation.


10 RESTRICTED MATERIALS CONTENT

No usage of prohibited chemical substances. The chemical substances, which defined in

TECHMAN "Environmental Requirements for materials parts and products" document. (9999999-

201-M03.PDF) never be used not only in components but also production process of both this

products and components.


11 LABEL

Drive Labels

The “Safety and Series number label” are located on the top cover.

The “Safety label” contains the following information.

PV100 series (U.2)

(1) Solid state drive

(2) Series

(3) Certification marks (UL / cUL, TÜ V, IC, CE, C-Tick, Korean EMC, Taiwan EMC)

(4) Model number and capacity

(5) Product number

(6) Barcode of product number

(7) Series number (YY: year / WW: week / 1: default / PPPPPP: number)

(8) Barcode of series number

(9) F/W version

C US

R

E364818

D43014


PV100- series (M.2)

(1) Solid state drive

(2) Series

(3) Certification marks (UL / cUL, TÜ V, IC, CE, C-Tick, Korean EMC, Taiwan EMC)

(4) Model number and capacity

(5) Product number

(6) Series number (YY: year / WW: week / 1: default / PPPPPP: number)

(7) F/W version

(8) 2D barcode of product number and series number

C US

R

E364818

D43014


12 AGENCY CERTIFICATES

Safety Regulation

UL UL60950-1 Second Edition

C-UL CSA C22.2 No. 60950-1-07, 2nd Edition

TUV EN 60950-1:2006 + A11:2009 +A1:2010+A12:2011+A2:2013

CB IEC 60950-1:2005(Second Edition) + Am 1:2009 + Am 2:2013

EMC

FCC FCC CFR 47 Part 15 Subpart B/Oct. 2013 and CISPR 22/1997 ANSI C63.4-2009

ICES-003 Issue 5 Aug. 2012

*CE Marking EN55022:2010 +AC:2011, Class B

EN61000-3-2:2006 +A1:2009 +A2:2009 and EN61000-3-3:2013

EN55024:2010

IEC61000-4-2:2008, IEC61000-4-3:2010,

IEC61000-4-4:2012, IEC61000-4-5:2005,

IEC61000-4-6:2013, IEC61000-4-8:2009

IEC61000-4-11:2004)

*C-Tick AS/NZS CISPR 22:2009 +A1:2010, RULES AND REGULATIONS OF CLASS B (CISPR 22 Ed.

6.0:2008)

Taiwan EMC CNS 1343 (C6357

VCCI VCCI V-2/Apr. 2012 and V-3/Apr. 2013 and V-4/Apr. 2012


13 REVISION HISTORY

Rev. No. Reason for Release Release Date TECHMAN

0.90 Preliminary September 30, 2016 Samuel Chen

1.00 First release April 14, 2017 Samuel Chen

1.01 Modify performance SPEC ( Page 11-12)

Add Product number list ( Page 35) May 12, 2017 Samuel Chen


APPENDIX A MAX PERFORMANCE TEST EQUIPMENT

BIOS Configuration

Speed Step: Disabled

Turbo Boost: Disabled

CPU Power and Performance Policy: Performance

CPU C-state : Disabled

Virtualization : Disabled

Windows Configuration

FIO

Direct: Yes

thread:

o 128K Precondition I/O: 1 outstanding I/O

o 4KB Random I/O: 64 outstanding I/O

o 128KB Seq. I/O: 32 outstanding I/O

Ramp Time: 5 seconds

Run Time:30 seconds

Norandommap: 1

I/O Engine: windowsaio

Numjobs: 1

Iometer

Queue depth:

o 128K Precondition I/O: 1 worker with 1 outstanding I/O

o 4KB Random I/O: 1 worker with 64 outstanding I/O

o 128KB Seq. I/O: 1 worker with 32 outstanding I/O


Run Time:30 seconds

Linux Configuration

FIO

Direct: Yes

Queue depth

o 128K Precondition I/O: 1 outstanding I/O

o 4KB Random I/O: 64 outstanding I/O

o 128KB Seq. I/O: 32 outstanding I/O


Run Time:30 seconds

Norandommap: 1

I/O Engine: libaio

Numjobs: 1

Vdbench

Iorate : max

Threads :128

Elapsed : 5 seconds

Run Time: 30 seconds

Override : 4

Multi JVM execution (jvms) : 4


APPENDIX B SSD PRODUCT NUMBER LIST

U.2 (SFF-8639) Product Number Flash type Capacity Model Name PLP

support

9PV100E554B2TQ1 TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 240GB PV100E55-240 YES

TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 400GB PV100E55-400 YES

TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 480GB PV100E55-480 YES TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 800GB PV100E55-800 YES TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 960GB PV100E55-960 YES TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 1600GB PV100E55-1600 YES TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 1920GB PV100E55-1920 YES TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 240GB PV100C55-240 YES

TOSHIBA 15nm Client Multi Level Cell (cMLC) 400GB PV100C55-400 YES 9PV100C554B4TQ1 TOSHIBA 15nm Client Multi Level Cell (cMLC) 480GB PV100C55-480 YES TOSHIBA 15nm Client Multi Level Cell (cMLC) 800GB PV100C55-800 YES 9PV100C558B6TQ1 TOSHIBA 15nm Client Multi Level Cell (cMLC) 960GB PV100C55-960 YES TOSHIBA 15nm Client Multi Level Cell (cMLC) 1600GB PV100C55-1600 YES TOSHIBA 15nm Client Multi Level Cell (cMLC) 1920GB PV100C55-1920 YES

M.2 2280 Product Number Flash type Capacit

y

Model Name PLP

support

TOSHIBA 15nm Client Multi Level Cell (cMLC) 128GB PV100D5N-128 No 9PV100D5N4B2TQ1 TOSHIBA 15nm Client Multi Level Cell (cMLC) 256GB PV100D5N-256 No 9PV100D5N8B4TQ1 TOSHIBA 15nm Client Multi Level Cell (cMLC) 512GB PV100D5N-512 No

M.2 22110 Product Number Flash type Capacit

y

Model Name PLP

support

TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 400GB PV100E5B-400 YES

TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 480GB PV100E5B-480 YES

9PV100E5B8B5TQ1 TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 800GB PV100E5B-800 YES



9PV100E5B9BGTQ1 TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 1920GB PV100E5B-1920 YES

9PV100C5B8B3TQ1 TOSHIBA 15nm Client Multi Level Cell (cMLC) 400GB PV100C5B-400 YES





9PV100C5B9BGTQ1 TOSHIBA 15nm Client Multi Level Cell (cMLC) 1920GB PV100C5B-1920 YES

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