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BLT Circuit Services Ltd., Brome Industrial Estate, Brome, Eye, Suffolk IP23 7HN England
Telephone +44 (0)1379 870870 Fax +44 (0)1379 870970Email [email protected]
Soldering Products for Circuit Assembly
STENCIL CLEANERS
Product Description Main application Flash Point
Water Soluble
SCS/1 Solvent based, universal cleaner for paste, flux and adhesive residues. Suitable for hand and under stencil machine cleaning.
Fast drying for hand application 20ºC Yes
SCS/2M Solvent based for paste, flux and adhesive residues. Medium drying for machine use 32ºC Yes
SCS/13M Solvent based for paste, flux and adhesive residues.Medium drying, lowest odour for machine use
40ºC No
Flux Saponifier 1990
Aqueous base for dilution with water for paste, flux and adhesive residues.
Machine or hand use None Yes
© C
opyr
ight
BLT
Circ
uit
Serv
ices
Ltd
201
9 -
desi
gn: w
ww
.pan
publ
icity
.co.
uk
www.bltcircuitservices.co.uk
STENCIL WIPES – Lint Free with excellent solvency beating many competitors’ alternative brands. BLT offer the simplest method of wiping clean your stencils with fast evaporating solvents so as not to contaminate paste causing problems on print.
BLT has developed a range of solvent impregnated wipes for manual cleaning of stencils and circuit boards.Wipes are available impregnated with ISOPROPYL ALCOHOL or preferably for solder paste utilising the water free SCS/1 or SCS/2M. Supplied in 200mm x 200mm x 100 sheet or larger 200 Sheet tubs.
POLYIMIDE TAPES AND DOTS – Silicone for heat and wave soldering and acrylic adhesive systems for conformal coating applications.
Temperature resistant for temporary masking during soldering
Tapes - 3, 4, 6, 8, 9, 10, 12, 19, 20 and 25mm x 33M rolls
Dots - 3, 6, 8, 9, 12, 15mm dots x 1,000 on split lining
Other sizes available to order. Many die-cut shapes available to order.
BLT also offer the following:l Conformal coatings l Lead check swabs l SMT adhesives l Stencil wipesl Peelable solder masks l Rework flux paste l SMT Oven cleaner l X-ray facility available forl Solder tip tinner l Flux rework pens range l Desoldering braids customer support
ISO
9001:2015
APPROVED
ZESTRON STENCIL AND ASSEMBLED BOARD CLEANERS
Product Description Main application Flash Point Water Soluble
ZESTRON Vigon SC200RTU Aqueous, universal stencil cleaner for paste, flux and adhesive residues
Compatible with all commercial cleaning machines
None Yes
Zestron UC160 Underside Stencil cleaner for Automatic Wiping systemsCompatible with all commercial cleaning machines
None Yes
ZESTRON Vigon N600 Aqueous ph neutral final board cleaner, no attack on metal components
Compatible with all commercial cleaning machines
None Yes
ZESTRON Vigon N640 Latest development, aqueous ph neutral board cleaner, ideal for cleaning Japanese Solder Paste
Compatible with all commercial cleaning machines
None Yes
ZESTRON Vigon A250 Alkaline, inhibited aqueous board cleanerCompatible with all commercial cleaning machines
None Yes
ZESTRON Atron SP300 Concentrate or RTU for solder pallets and condensation traps
Compatible with all commercial cleaning machines
None Yes
ZESTRON Vigon EFM Solvent flux remover in Aerosol or liquid form Manual application Liquid -12°C No
Plus the full range of ZESTRON high efficiency cleaning products.
SolderWave soldering fluxesSolder pasteCored solder wireSolid solder wireWipes
CLEANING MACHINES – Low cost, air operated, simple operation.
BLT manufactures low cost, efficient machines for stencil and board cleaning.Misprint Cleaner – Air operated, bench top machine for cleaning misprinted boards or flux removal. Proven performance with the SCS range of chemical solutions.VSCM1 and VSCM2 – Air operated, efficient, low cost machine for stencils.ASCM1 and ASCM2 – Fully Automatic stencil cleaning machines for stencil and misprint/tool cleaning.
BLT is a leading manufacturer and
distributor for a comprehensive range
of consumable products for cost
efficient, high reliability circuit assembly.
Established since 1989 and experts in
soldering technologies we have grown rapidly in our home
market and across the world supported by our Technical Team.
We specialise in selling a solution to your needs.
WAVE SOLDERING FLUXES
Flux Description and main application Solids Content
Acid Value
Flash Point
No Clean
35-90 No Residue
ORLO – Alcohol based for spray or foam application and Dip Tinning. Cleanest flux with low solids. Rosin/Resin free. No residue.
2.0% 16 12ºC Yes
35-90TX No Residue
ORLO Alcohol based flux for spray or foam application and Dip Tinning and rework.Increased activity. Rosin/Resin Free . No residue.
2.5% 22 12ºC Yes
35-92LA No Residue
ORL0 – Alcohol/DI Water based for Spray and Foam application. Highest Activity.Rosin/Resin Free. Excellent in Selective and Wave applications, Reduced VOC content. No Residue.
3.8% 30 25ºC Yes
35-92 No Residue
ORL0 - Alcohol based for Spray and Foam application, medium activity. Rosin/Resin Free. No Residue. Good all rounder.
3.0% 22 12ºC Yes
35-92-35ORL0 - Alcohol based for Spray and Foam application, sustained high activity. Rosin/Resin Free. No Residue.
4.0% 35 12ºC Yes
35-41ROL0 - Alcohol based for Spray and Foam application. Low Rosin good for problematic Solder Resists. Perfect for volume consumer applications.
4.0% 25 12ºC Yes
35-41-22ROL0 - Alcohol based for Spray and Foam application, very low Rosin content with Pallet Protection. Ideal for Lead Free.
3.1% 22 12ºC Yes
10-75-30-R ORL0 - VOC Free for Spray application. No Residue, fast wetting. Excellent solderability and wicking. Used for volume manufacturing.
4.5% 30 None Yes
10-75-40-R ORL0 - VOC Free for Spray application, high activity. No Residue. Strongest VOC Free. 4.5% 40 None Yes
10-95-WS Water Soluble, alcohol based for Foam application. Neutral Ph. 14.0% - 12ºCWater
Washable
SOLDER PASTES - Supplied from stock and expertly backed up by our own personnel.
Paste Description and benefits Alloy and Flux content Particle size
Lead Free
LED3 No Refrigeration
No refrigeration, No Clean, suited ideally for void free LED Manufacture. Long Stencil and tack life
SAC305 Flux 11.6%
Type T420-38 Micron
LFS UFP T4 No Refrigeration
No clean, low slumping, No solder balls, Controlled Viscosity, Fine pitch. Excellent wetting, 72 hour tack. Good up to 35ºC
SAC305 AlloyFlux 12.0%
Type T420-38 Micron
LFS UFP ZQ-HFNo refrigeration
No clean, non-refrigerated up to 50ºC, No Mid Chip Beading and Excellent Voiding Properties with reduced possibility of Head in Pillow. 72-120 Hour Tack possible. Twelve month shelf life
SAC305Flux 11.8%
Type T420-38 Micron
Type T525-10 Micron
AIM NC259 No clean, excellent wetting,No Head-in-Pillow
SN100CFlux 12.0%
Type T420-38 Micron
AIM M8 No clean, improved tack time, Easily cleanable in many Solutions including Co Solvent. Nine Month Refrigerated Storage
SAC305Flux 11.5%
Type T420-38 Micron
AIM NC273 LT Low Melt
No clean, low temperature 138ºC soldering, recommended for Double sided mass intolerant boards. Gives a much larger reflow window at temperatures of 175ºC.
Sn42Bi57Ag1Flux 11.50%
Type T420-38 Micron
LMP NC210 No Clean, 210ºC reflow, Silver dosed for ductility Sn64Bi35Ag1Flux 11.0%
Type T420-38 Micron
AIM WS488 Water soluble, excellent wetting SAC305 Flux 11.5%
Type T4 20-38 micron
Tin/Lead
NCS 900 No clean, excellent wetting, 72 hour tack time. Fine pitch, No refrigerated storage up to 35ºC
62/36/2Flux 9.5%
Type T420-38 Micron
AIM NC 258-M8 No Clean, excellent wetting, Cleanable Residues 62/36/2Flux 10%
Type T420-38 Micron
AIM WS 483 Water soluble, high activity. 2 week cleaning window 63/37 Flux 10%
Type T420-38 Micron
SOLDER WIRE
Product Description and benefits Alloy Flux type and content Packaging
Lead Free
Nitrosol SN100SB HF
No clean, excellent wetting,Non-hygroscopic residue, high activity for Halide Free flux, bright shiny solder joints.
SN100SBHalide Free
2.2% flux cored. ROL0
0.25mm x 100g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
Nitrosol SAC305
No clean, excellent wetting,Non hygroscopic residue, bright joints. SAC305 RMA 2.2%
0.25mm x 100g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
S45VTC Rosin free, No clean, bright joints. 99C Synthetic 1.5%0.35mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
S45VTSC Rosin free, No clean. SAC305 Synthetic 1.5%0.35mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
KS100FT Rosin free, No clean, excellent wetting,Tip saving alloy. 99C Synthetic 3.0%
0.25mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
AIM GLOWCORE SN100C No clean, bright joints. Tin/Copper/
Nickel RMA 3.0%0.25mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
AIM GLOWCORE SAC305 No clean, excellent wetting. SAC305 RMA 3.0%
0.25mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
Solid, Lead Free and Tin/Lead
SN100SB Modified Tin/Copper/Nickel. - - 2mm x 4kg 3mm x 3kg
SAC305 SAC305 – 3% Silver solid wire. - - 2mm x 4kg 3mm x 3kg
LMP NC210 Low melting point - 64%Tin/35% Bismuth/1% Silver.
2mm x 3kg3mm x 3kg
63/37 Leaded Wire. - - 2mm x 4kg 3mm x 3kg
Tin/Lead
Nitrosol TL1 No clean, excellent wetting. 63/37 RMA 1.5%
0.25mm x 100g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
AIM WS482 Water Soluble solder Wire. 63/37 WS 3% 0.4mm x 250g
S45V Rosin free, no clean. 60/40 Synthetic 1.5%0.35mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
*Other diameters also available.
LEAD FREE SOLDERSAll solder is manufactured using 99.98% Pure Virgin Tin from regulated sources. BLT do not use reclaimed tin, due to the inherent risk of abnormal amounts of organic inclusions that can be detrimental to the high reliability electronics market. These cannot be detected in the typical metallic solder analysis. Tin is only sourced from Registered Conflict Free countries.
SN100SB - RoHS compliant, Dross inhibited, Nitrogen cast, high purity, modified Tin/Copper alloy exhibiting excellent flow and wetting characteristics, low drossing, bright solder joints, economical, suitable for Wave Soldering, Hot Air Levelling and selective soldering.Available in I kilo bars, 3.2 kilo feeders, small chunks for Tinning pots and 2 & 3mm wire.
SACP0307 - RoHS compliant, Nitrogen cast Tin 99/Silver 0.3/Copper 0.7, high purity, reliable, low drossing for use in Wave Soldering, Hot Air Levelling and selective soldering. Available in 1 kilo bars, 3.2 kilo feeders, small chunks for Tinning pots and 2 & 3mm wire.
LMPNC210 - RoHS compliant, Tin 64%/Bismuth 35%/Silver 1% low melting point alloy for selective soldering. Available in 1 kilo bars, small chunks and 2 & 3mm wire. SAC305 and SAC387 also available.
Tin/P Dross Inhibitor – Extremely effective anti-oxidant system used when Solder turns a Yellow/Gold tinge to improve flow and greatly reduce dross rates.
BLT offers customers free solder analysis and monitoring and as a licensed dross collection company, can provide customers with a full collection and recycling package for Solder Dross and Solder Pastes.
ISO
9001:2015
APPROVED
TIN/LEAD SOLDERNitro Flo 63/37 Tin/Lead - Nitrogen cast, high purity, dross inhibited solder for all electronic soldering applications.Available in 1 kilo bars, 3.5 kilo feeders and small chunks. Other alloys available on request.
Type 4 Solder Spheres 20-38 microns giving excellent printing definition 0.2mm print.
COMPLIANTRoHS
BLT is a leading manufacturer and
distributor for a comprehensive range
of consumable products for cost
efficient, high reliability circuit assembly.
Established since 1989 and experts in
soldering technologies we have grown rapidly in our home
market and across the world supported by our Technical Team.
We specialise in selling a solution to your needs.
WAVE SOLDERING FLUXES
Flux Description and main application Solids Content
Acid Value
Flash Point
No Clean
35-90 No Residue
ORLO – Alcohol based for spray or foam application and Dip Tinning. Cleanest flux with low solids. Rosin/Resin free. No residue.
2.0% 16 12ºC Yes
35-90TX No Residue
ORLO Alcohol based flux for spray or foam application and Dip Tinning and rework.Increased activity. Rosin/Resin Free . No residue.
2.5% 22 12ºC Yes
35-92LA No Residue
ORL0 – Alcohol/DI Water based for Spray and Foam application. Highest Activity.Rosin/Resin Free. Excellent in Selective and Wave applications, Reduced VOC content. No Residue.
3.8% 30 25ºC Yes
35-92 No Residue
ORL0 - Alcohol based for Spray and Foam application, medium activity. Rosin/Resin Free. No Residue. Good all rounder.
3.0% 22 12ºC Yes
35-92-35ORL0 - Alcohol based for Spray and Foam application, sustained high activity. Rosin/Resin Free. No Residue.
4.0% 35 12ºC Yes
35-41ROL0 - Alcohol based for Spray and Foam application. Low Rosin good for problematic Solder Resists. Perfect for volume consumer applications.
4.0% 25 12ºC Yes
35-41-22ROL0 - Alcohol based for Spray and Foam application, very low Rosin content with Pallet Protection. Ideal for Lead Free.
3.1% 22 12ºC Yes
10-75-30-R ORL0 - VOC Free for Spray application. No Residue, fast wetting. Excellent solderability and wicking. Used for volume manufacturing.
4.5% 30 None Yes
10-75-40-R ORL0 - VOC Free for Spray application, high activity. No Residue. Strongest VOC Free. 4.5% 40 None Yes
10-95-WS Water Soluble, alcohol based for Foam application. Neutral Ph. 14.0% - 12ºCWater
Washable
SOLDER PASTES - Supplied from stock and expertly backed up by our own personnel.
Paste Description and benefits Alloy and Flux content Particle size
Lead Free
LED3 No Refrigeration
No refrigeration, No Clean, suited ideally for void free LED Manufacture. Long Stencil and tack life
SAC305 Flux 11.6%
Type T420-38 Micron
LFS UFP T4 No Refrigeration
No clean, low slumping, No solder balls, Controlled Viscosity, Fine pitch. Excellent wetting, 72 hour tack. Good up to 35ºC
SAC305 AlloyFlux 12.0%
Type T420-38 Micron
LFS UFP ZQ-HFNo refrigeration
No clean, non-refrigerated up to 50ºC, No Mid Chip Beading and Excellent Voiding Properties with reduced possibility of Head in Pillow. 72-120 Hour Tack possible. Twelve month shelf life
SAC305Flux 11.8%
Type T420-38 Micron
Type T525-10 Micron
AIM NC259 No clean, excellent wetting,No Head-in-Pillow
SN100CFlux 12.0%
Type T420-38 Micron
AIM M8 No clean, improved tack time, Easily cleanable in many Solutions including Co Solvent. Nine Month Refrigerated Storage
SAC305Flux 11.5%
Type T420-38 Micron
AIM NC273 LT Low Melt
No clean, low temperature 138ºC soldering, recommended for Double sided mass intolerant boards. Gives a much larger reflow window at temperatures of 175ºC.
Sn42Bi57Ag1Flux 11.50%
Type T420-38 Micron
LMP NC210 No Clean, 210ºC reflow, Silver dosed for ductility Sn64Bi35Ag1Flux 11.0%
Type T420-38 Micron
AIM WS488 Water soluble, excellent wetting SAC305 Flux 11.5%
Type T4 20-38 micron
Tin/Lead
NCS 900 No clean, excellent wetting, 72 hour tack time. Fine pitch, No refrigerated storage up to 35ºC
62/36/2Flux 9.5%
Type T420-38 Micron
AIM NC 258-M8 No Clean, excellent wetting, Cleanable Residues 62/36/2Flux 10%
Type T420-38 Micron
AIM WS 483 Water soluble, high activity. 2 week cleaning window 63/37 Flux 10%
Type T420-38 Micron
SOLDER WIRE
Product Description and benefits Alloy Flux type and content Packaging
Lead Free
Nitrosol SN100SB HF
No clean, excellent wetting,Non-hygroscopic residue, high activity for Halide Free flux, bright shiny solder joints.
SN100SBHalide Free
2.2% flux cored. ROL0
0.25mm x 100g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
Nitrosol SAC305
No clean, excellent wetting,Non hygroscopic residue, bright joints. SAC305 RMA 2.2%
0.25mm x 100g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
S45VTC Rosin free, No clean, bright joints. 99C Synthetic 1.5%0.35mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
S45VTSC Rosin free, No clean. SAC305 Synthetic 1.5%0.35mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
KS100FT Rosin free, No clean, excellent wetting,Tip saving alloy. 99C Synthetic 3.0%
0.25mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
AIM GLOWCORE SN100C No clean, bright joints. Tin/Copper/
Nickel RMA 3.0%0.25mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
AIM GLOWCORE SAC305 No clean, excellent wetting. SAC305 RMA 3.0%
0.25mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
Solid, Lead Free and Tin/Lead
SN100SB Modified Tin/Copper/Nickel. - - 2mm x 4kg 3mm x 3kg
SAC305 SAC305 – 3% Silver solid wire. - - 2mm x 4kg 3mm x 3kg
LMP NC210 Low melting point - 64%Tin/35% Bismuth/1% Silver.
2mm x 3kg3mm x 3kg
63/37 Leaded Wire. - - 2mm x 4kg 3mm x 3kg
Tin/Lead
Nitrosol TL1 No clean, excellent wetting. 63/37 RMA 1.5%
0.25mm x 100g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
AIM WS482 Water Soluble solder Wire. 63/37 WS 3% 0.4mm x 250g
S45V Rosin free, no clean. 60/40 Synthetic 1.5%0.35mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g
*Other diameters also available.
LEAD FREE SOLDERSAll solder is manufactured using 99.98% Pure Virgin Tin from regulated sources. BLT do not use reclaimed tin, due to the inherent risk of abnormal amounts of organic inclusions that can be detrimental to the high reliability electronics market. These cannot be detected in the typical metallic solder analysis. Tin is only sourced from Registered Conflict Free countries.
SN100SB - RoHS compliant, Dross inhibited, Nitrogen cast, high purity, modified Tin/Copper alloy exhibiting excellent flow and wetting characteristics, low drossing, bright solder joints, economical, suitable for Wave Soldering, Hot Air Levelling and selective soldering.Available in I kilo bars, 3.2 kilo feeders, small chunks for Tinning pots and 2 & 3mm wire.
SACP0307 - RoHS compliant, Nitrogen cast Tin 99/Silver 0.3/Copper 0.7, high purity, reliable, low drossing for use in Wave Soldering, Hot Air Levelling and selective soldering. Available in 1 kilo bars, 3.2 kilo feeders, small chunks for Tinning pots and 2 & 3mm wire.
LMPNC210 - RoHS compliant, Tin 64%/Bismuth 35%/Silver 1% low melting point alloy for selective soldering. Available in 1 kilo bars, small chunks and 2 & 3mm wire. SAC305 and SAC387 also available.
Tin/P Dross Inhibitor – Extremely effective anti-oxidant system used when Solder turns a Yellow/Gold tinge to improve flow and greatly reduce dross rates.
BLT offers customers free solder analysis and monitoring and as a licensed dross collection company, can provide customers with a full collection and recycling package for Solder Dross and Solder Pastes.
ISO
9001:2015
APPROVED
TIN/LEAD SOLDERNitro Flo 63/37 Tin/Lead - Nitrogen cast, high purity, dross inhibited solder for all electronic soldering applications.Available in 1 kilo bars, 3.5 kilo feeders and small chunks. Other alloys available on request.
Type 4 Solder Spheres 20-38 microns giving excellent printing definition 0.2mm print.
COMPLIANTRoHS
BLT Circuit Services Ltd., Brome Industrial Estate, Brome, Eye, Suffolk IP23 7HN England
Telephone +44 (0)1379 870870 Fax +44 (0)1379 870970Email [email protected]
Soldering Products for Circuit Assembly
STENCIL CLEANERS
Product Description Main application Flash Point
Water Soluble
SCS/1 Solvent based, universal cleaner for paste, flux and adhesive residues. Suitable for hand and under stencil machine cleaning.
Fast drying for hand application 20ºC Yes
SCS/2M Solvent based for paste, flux and adhesive residues. Medium drying for machine use 32ºC Yes
SCS/13M Solvent based for paste, flux and adhesive residues.Medium drying, lowest odour for machine use
40ºC No
Flux Saponifier 1990
Aqueous base for dilution with water for paste, flux and adhesive residues.
Machine or hand use None Yes
© C
opyr
ight
BLT
Circ
uit
Serv
ices
Ltd
201
9 -
desi
gn: w
ww
.pan
publ
icity
.co.
uk
www.bltcircuitservices.co.uk
STENCIL WIPES – Lint Free with excellent solvency beating many competitors’ alternative brands. BLT offer the simplest method of wiping clean your stencils with fast evaporating solvents so as not to contaminate paste causing problems on print.
BLT has developed a range of solvent impregnated wipes for manual cleaning of stencils and circuit boards.Wipes are available impregnated with ISOPROPYL ALCOHOL or preferably for solder paste utilising the water free SCS/1 or SCS/2M. Supplied in 200mm x 200mm x 100 sheet or larger 200 Sheet tubs.
POLYIMIDE TAPES AND DOTS – Silicone for heat and wave soldering and acrylic adhesive systems for conformal coating applications.
Temperature resistant for temporary masking during soldering
Tapes - 3, 4, 6, 8, 9, 10, 12, 19, 20 and 25mm x 33M rolls
Dots - 3, 6, 8, 9, 12, 15mm dots x 1,000 on split lining
Other sizes available to order. Many die-cut shapes available to order.
BLT also offer the following:l Conformal coatings l Lead check swabs l SMT adhesives l Stencil wipesl Peelable solder masks l Rework flux paste l SMT Oven cleaner l X-ray facility available forl Solder tip tinner l Flux rework pens range l Desoldering braids customer support
ISO
9001:2015
APPROVED
ZESTRON STENCIL AND ASSEMBLED BOARD CLEANERS
Product Description Main application Flash Point Water Soluble
ZESTRON Vigon SC200RTU Aqueous, universal stencil cleaner for paste, flux and adhesive residues
Compatible with all commercial cleaning machines
None Yes
Zestron UC160 Underside Stencil cleaner for Automatic Wiping systemsCompatible with all commercial cleaning machines
None Yes
ZESTRON Vigon N600 Aqueous ph neutral final board cleaner, no attack on metal components
Compatible with all commercial cleaning machines
None Yes
ZESTRON Vigon N640 Latest development, aqueous ph neutral board cleaner, ideal for cleaning Japanese Solder Paste
Compatible with all commercial cleaning machines
None Yes
ZESTRON Vigon A250 Alkaline, inhibited aqueous board cleanerCompatible with all commercial cleaning machines
None Yes
ZESTRON Atron SP300 Concentrate or RTU for solder pallets and condensation traps
Compatible with all commercial cleaning machines
None Yes
ZESTRON Vigon EFM Solvent flux remover in Aerosol or liquid form Manual application Liquid -12°C No
Plus the full range of ZESTRON high efficiency cleaning products.
SolderWave soldering fluxesSolder pasteCored solder wireSolid solder wireWipes
CLEANING MACHINES – Low cost, air operated, simple operation.
BLT manufactures low cost, efficient machines for stencil and board cleaning.Misprint Cleaner – Air operated, bench top machine for cleaning misprinted boards or flux removal. Proven performance with the SCS range of chemical solutions.VSCM1 and VSCM2 – Air operated, efficient, low cost machine for stencils.ASCM1 and ASCM2 – Fully Automatic stencil cleaning machines for stencil and misprint/tool cleaning.