SKY73020-11 (Rx Downmix)

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    Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 [email protected] www.skyworksinc.com

    200362D Skyworks Proprietary and Confidential information Products and Product Information are Subject to Change Without Notice November 6, 2006 1

    PRELIMINARY DATA SHEET

    SKY73020: 700 1000 MHz High Gain and Linearity DiversityDownconversion Mixer for 2G/3G Base Station TransceiverApplications

    Applications

    2G/3G base station transceivers:

    GSM/EDGE, CDMA, UMTS/WCDMA, iDEN

    Land mobile radio

    ISM band transceivers

    High performance radio links

    RF identification

    Features

    Operating frequency range: 700 to 1000 MHz

    IF frequency range: 50 to 250 MHz

    Conversion gain: 7.0 dB

    Input IP3: 27.0 dBm

    Output IP3: 34.0 dBm

    Noise figure: 10.2 dB

    Integrated LO drivers

    Integrated low-loss RF baluns

    High linearity IF amplifiers

    On-chip SPDT LO switch (greater than 65 dB LO-to-LO isolation)

    Small, MCM (36-pin, 6 x 6 mm) Pb-free package (MSL3, 260 C

    per JEDEC J-STD-020)

    Skyworks offers lead (Pb)-free RoHS (Restriction of

    Hazardous Substances) compliant packaging.

    Description

    The SKY73020 is a fully integrated diversity mixer that includes

    Local Oscillator (LO) drivers, an LO switch, high linearity mixers,

    and large dynamic range Intermediate Frequency (IF) amplifiers.

    Low-loss RF baluns have also been included to reduce design

    complications and lower system cost.

    The SKY73020 features an input IP3 of 27.0 dBm and a Noise

    Figure (NF) of 10.2 dB, making the device an ideal solution for

    high dynamic range systems such as 2G/3G base station

    receivers. The LO switch provides more than 65 dB of isolationbetween LO inputs and supports the switching time required for

    GSM/EDGE base stations.

    The SKY73020 is manufactured using a robust silicon BiCMOS

    process and has been designed for optimum long-term reliability.

    The SKY73020 diversity downconversion mixer is provided in a

    compact, 36-pin 6 x 6 mm Multi-Chip Module (MCM). A functional

    block diagram is shown in Figure 1. The pin configuration and

    package are shown in Figure 2. Signal pin assignments and

    functional pin descriptions are provided in Table 1.

    S643

    RFA

    RFB

    IFB+

    RIFB

    IFB

    VCC_

    IFB VCC_LO

    LO1

    LO2

    LO_SEL

    IFA+

    RIFA

    IFA

    VCC_

    IFA

    VCC_

    LO

    Figure 1. SKY73020 Block Diagram

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    PRELIMINARY DATA SHEET SKY73020 DOWNCONVERSION MIXER

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    2 November 6, 2006 Skyworks Proprietary and Confidential information Products and Product Information are Subject to Change Without Notice 200362D

    S646

    27

    26

    25

    24

    23

    22

    21

    20

    19

    1

    2

    3

    4

    5

    6

    7

    8

    9

    10 11 12 13 14 15 16 17 18

    36 35 34 33 32 31 30 29 28

    NC

    RFA

    VCC_LO

    GND

    VCC_LO

    GND

    NC

    RFB

    VCC

    _RFB

    NC

    GND

    IFB+

    IFB

    NC

    VCC

    _IFB

    RIFB

    NC

    VCC

    _RFA

    NC

    GND

    IFA

    IFA+

    NC

    VCC

    _IFA

    RIFA

    NC

    GND

    GND

    LO2

    GND

    GND

    GND

    LO_SEL

    GND

    LO1

    VCC_LO

    Figure 2. SKY73020 Pinout 36-Pin MCM

    Table 1. SKY73020 Signal Descriptions

    Pin # Name Description Pin # Name Description

    1 RFA Channel A RF input 19 LO1 Local oscillator 1 input

    2 NC No connect 20 GND Ground

    3 GND Ground 21 VCC_LO DC supply, +5 V

    4 VCC_LO DC supply, +5 V 22 GND Ground

    5 GND Ground 23 LO_SEL Local oscillator select switch control

    6 VCC_LO DC supply, +5 V 24 GND Ground

    7 GND Ground 25 GND Ground

    8 NC No connect 26 GND Ground

    9 RFB Channel B RF input 27 LO2 Local oscillator 2 input

    10 VCC_RFB Channel B RF DC supply, +5 V 28 NC No connect

    11 NC No connect 29 RIFA Channel A IF bias adjust

    12 GND Ground 30 VCC_IFA Channel A IF DC supply, +5 V

    13 IFB+ Positive channel B IF output 31 NC No connect

    14 IFB Negative channel B IF output 32 IFA+ Positive channel A IF output

    15 NC No connect 33 IFA Negative channel A IF output

    16 VCC_IFB Channel B IF DC supply, +5 V 34 GND Ground

    17 RIFB Channel B IF bias adjust 35 NC No connect

    18 NC No connect 36 VCC_RFA Channel A RF DC supply, +5 V

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    Functional Description

    The SKY73020 is a high gain diversity mixer, optimized for base

    station receiver applications. The device consists of two diversity

    channels (A and B), each consisting of a low-loss RF balun, high

    linearity passive mixer, and a low-noise IF amplifier.

    Two LO amplifiers (independent of channels A and B) are also

    included that allow the SKY73020 to connect directly to the output

    of a Voltage Controlled Oscillator (VCO). This eliminates the extra

    gain stages needed by most discrete passive mixers. A Single-

    Pole, Double-Throw (SPDT) switch has been included to select

    between two different LO inputs for frequency hopping

    applications (i.e., GSM).

    RF Baluns and Passive Mixer

    The RF baluns provide a single-ended input, which can easily be

    matched to 50 using a simple external matching circuit. The RF

    baluns offer very low loss, and excellent amplitude and phase

    balance.

    The high linearity SKY73020 is a passive, double balanced mixer

    that provides a very low conversion loss and an excellent 3rd

    Order Input Intercept Point (IIP3).

    Addtionally, the balanced nature of the mixer provides for high

    port-to-port isolation.

    LO Buffers and SPDT LO Switch

    The LO buffers allow the input power of the SKY73020 to be in

    the range of 3 dBm. The LO section is optimized for low-side LO

    injection. However, each of the two LOs can be driven over a wide

    frequency range with only slight degradation in performance.

    A high isolation SPDT switch allows the SKY73020 to be used for

    frequency hopping applications. This switch provides greater than

    65 dB of LO1 to LO2 isolation:

    LO_SEL Input LO Path Selected

    High LO1 (pin 19) enabled

    Low LO2 (pin 27) enabled

    For applications that do not require frequency hopping, LO_SEL isfixed to one state and the appropriate LO input is used. An internal

    pull-down resistor enables the LO2 input.

    IF Amplifier

    The SKY73020 includes high dynamic range IF amplifiers that

    follow the passive mixers in the signal path. The outputs require a

    supply voltage connection using inductive chokes. These choke

    inductors should be high-Q and have the ability to handle 200 mA

    or greater.

    A simple matching network allows the output ports to be matched

    to a balanced 200 impedance. The IF amplifiers are optimized

    for IF frequencies between 50 and 250 MHz. The IF amplifiers canbe operated outside of this range, but with a slight degradation in

    performance.

    Electrical and Mechanical Specifications

    The absolute maximum ratings of the SKY73020 are provided in

    Table 2 and the recommended operating conditions in Table 3.

    Electrical characteristics for the SKY73020 are provided in

    Table 4.

    Typical performance characteristics of the SKY73020 are

    illustrated in Figures 3 through 39.

    Table 2. SKY73020 Absolute Maximum Ratings

    Parameter Symbol Minimum Maximum Units

    Supply voltage (VCC_LO, VCC_RFB, VCC_IFB,

    VCC_IFA, and VCC_RFA)

    VCC 5.5 V

    Supply current ICC 420 mA

    RF input power PRF 20 dBm

    LO input power PLO 6 dBm

    Operating case temperature TC 40 +85 C

    Storage case temperature TSTG 40 +150 C

    Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other

    parameters set at or below their nominal value.

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    4 November 6, 2006 Skyworks Proprietary and Confidential information Products and Product Information are Subject to Change Without Notice 200362D

    Table 3. SKY73020 Recommended Operating Conditions

    Parameter Symbol Minimum Typical Maximum Units

    Supply voltage (VCC_LO, VCC_RFB,

    VCC_IFB, VCC_IFA, and VCC_RFA)

    VCC 4.75 5.00 5.25 V

    Supply current ICC 370 420 mA

    LO input power PLO 3 0 +3 dBm

    LO_SEL input:

    high

    low

    LO_SELH

    LO_SELL

    2.2

    0.8

    V

    V

    Operating case temperature TC 40 +85 C

    RF frequency range FRF 700 1000 MHz

    LO frequency range (Note 1) FLO 625 950 MHz

    IF frequency range FIF 50 250 MHz

    Note 1: The SKY73020 has been optimized for low side LO injection. However, the LO can be used outside of the specified frequency range with degraded performance.

    Table 4. SKY73020 Electrical Specifications (1 of 2)

    (VCC = +5 V, TC = +25 C, LO Input Power = 0 dBm, RF Frequency = 900 MHz, IF Frequency = 70 MHz, LO Frequency = 830 MHz,

    Unless Otherwise Noted)

    Parameter Symbol Test Condition Min Typical Max Units

    Conversion gain G 5.0 7.0 8.0 dB

    Noise Figure NF 10.2 13.0 dB

    Noise Figure with a blocker signal NFBLK Blocking signal input

    power = +8 dBm

    23 dB

    Third order input intercept point IIP3 Tone spacing = 800 kHz,

    Input power = 10 dBm

    each tone

    27.0 dBm

    Third order output intercept point OIP3 Tone spacing = 800 kHz,

    Input power = 10 dBm

    each tone

    32.5 34.0 dBm

    2RF 2LO 2x2 PRF = 10 dBm 63 dBc

    3RF 3LO 3x3 PRF = 10 dBm 70 dBc

    Input 1 dB compression point IP1dB 16.5 dBm

    Output 1 dB compression point OP1dB 19.0 22.5 dBm

    LO1-to-LO2 isolation 65 dB

    Channel-to-channel isolation 46 dB

    RF-to-IF isolation 75 dB

    LO leakage:

    @ RF port

    @ IF port

    45

    80

    30 dBm

    dBm

    LO_SEL input 20 +150 +250 A

    LO switching time 1 s

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    Table 4. SKY73020 Electrical Specifications (2 of 2)

    (VCC = +5 V, TC = +25 C, LO Input Power = 0 dBm, RF Frequency = 900 MHz, IF Frequency = 70 MHz, LO Frequency = 830 MHz,

    Unless Otherwise Noted)

    Parameter Symbol Test Condition Min Typical Max Units

    RF port input return loss ZIN_RF With external matching

    components

    14 dB

    LO port input return loss ZIN_LO With external matching

    components

    14 dB

    IF port input return loss ZOUT_IF With external matching

    components

    14 dB

    10

    9

    8

    7

    6

    5880875 890885 900895 910

    Frequency (MHz)

    Gain(dB)

    905 920915

    3 dBm0 dBm

    +3 dBm

    Figure 3. Mixer A Gain vs Frequency and LO Power

    10

    9

    8

    7

    6

    5

    880875 890885 900895 910 915 920

    Frequency (MHz)

    Gain(dB)

    905

    4.75 V5.00 V5.25 V

    Figure 5. Mixer A Gain vs Frequency and Supply Voltage

    10

    9

    8

    7

    6

    5

    880875 890885 900895 910 915 920

    Frequency (MHz)

    Gain(dB)

    905

    0oC

    25oC

    85oC

    Figure 4. Mixer A Gain vs Frequency and Temperature

    10

    9

    8

    7

    6

    5

    880875 890885 900895 910 915 920

    Frequency (MHz)

    Gain(dB)

    905

    3 dBm0 dBm

    +3 dBm

    Figure 6. Mixer B Gain vs Frequency and LO Power

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    10

    9

    8

    7

    6

    5

    880875 890885 900895 910 915 920

    Frequency (MHz)

    Gain(dB)

    905

    0oC

    25oC

    85oC

    Figure 7. Mixer B Gain vs Frequency and Temperature

    13

    12

    11

    10

    9

    8

    7

    6

    880875 890885 900895 910 915 920

    Frequency (MHz)

    NoiseFigure(dB)

    905

    3 dBm0 dBm

    +3 dBm

    Figure 9. Mixer A Noise Figure vs Frequency and LO Power

    13

    12

    11

    10

    9

    8

    7

    6

    880875 890885 900895 910 915 920

    Frequency (MHz)

    NoiseFigure(dB)

    905

    4.75 V5.00 V5.25 V

    Figure 11. Mixer A Noise Figure vs Frequency and Supply Voltage

    10

    9

    8

    7

    6

    5880875 890885 900895 910 915 920

    Frequency (MHz)

    Gain(dB)

    905

    4.75 V5.00 V5.25 V

    Figure 8. Mixer B Gain vs Frequency and Supply Voltage

    13

    12

    11

    10

    9

    8

    7

    6880875 890885 900895 910 915 920

    Frequency (MHz)

    NoiseFigure(dB)

    905

    0oC

    25oC

    85oC

    Figure 10. Mixer A Noise Figure vs Frequency and Temperature

    13

    12

    11

    10

    9

    8

    7

    6

    880875 890885 900895 910 915 920

    Frequency (MHz)

    NoiseFigure(dB)

    905

    3 dBm0 dBm

    +3 dBm

    Figure 12. Mixer B Noise Figure vs Frequency and LO Power

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    13

    12

    11

    10

    9

    8

    7

    6880875 890885 900895 910 915 920

    Frequency (MHz)

    Nois

    eFigure(dB)

    905

    0oC

    25oC

    85oC

    Figure 13. Mixer B Noise Figure vs Frequency and Temperature

    25

    24

    23

    22

    21

    20880875 890885 900895 910

    Frequency (MHz)

    Output1dBCompressionPoint(dBm)

    905 920915

    3 dBm0 dBm

    +3 dBm

    Figure 15. Mixer A OP1dB vs Frequency and LO Power

    25

    24

    23

    22

    21

    20880875 890885 900895 910 915 920

    Frequency (MHz)

    Output1dBCompressionPoint(dBm)

    905

    4.75 V5.00 V5.25 V

    Figure 17. Mixer A OP1dB vs Frequency and Supply Voltage

    13

    12

    11

    10

    9

    8

    7

    6880875 890885 900895 910 915 920

    Frequency (MHz)

    NoiseFigure(dB)

    905

    4.75 V5.00 V5.25 V

    Figure 14. Mixer B Noise Figure vs Frequency and Supply Voltage

    25

    24

    23

    22

    21

    20

    880875 890885 900895 910 915 920

    Frequency (MHz)

    Output1dBCompressionPoint(dBm)

    905

    0oC

    25o

    C85oC

    Figure 16. Mixer A OP1dB vs Frequency and Temperature

    25

    24

    23

    22

    21

    20

    880875 890885 900895 910

    Frequency (MHz)

    Output1dBCompressionPoint(dBm)

    905 920915

    3 dBm0 dBm

    +3 dBm

    Figure 18. Mixer B OP1dB vs Frequency and LO Power

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    25

    24

    23

    22

    21

    20

    880875 890885 900895 910 915 920

    Frequency (MHz)

    Output1dBCompressionPoint(dBm)

    905

    0oC

    25oC

    85oC

    Figure 19. Mixer B OP1dB vs Frequency and Temperature

    37

    36

    35

    34

    33

    32

    31

    30

    880875 890885 900895 910

    Frequency (MHz)

    Output3rdOrderInterceptPoi

    nt(dBm)

    905 920915

    3 dBm0 dBm

    +3 dBm

    Figure 21. Mixer A OIP3 vs Frequency and LO Power

    37

    36

    35

    34

    33

    32

    31

    30880875 890885 900895 910 915 920

    Frequency (MHz)

    Output3rdOrderInterceptPoint(dBm)

    905

    4.75 V5.00 V5.25 V

    Figure 23. Mixer A OIP3 vs Frequency and Supply Voltage

    25

    24

    23

    22

    21

    20880875 890885 900895 910 915 920

    Frequency (MHz)

    Output1dBC

    ompressionPoint(dBm)

    905

    4.75 V5.00 V5.25 V

    Figure 20. Mixer B OP1dB vs Frequency and Supply Voltage

    37

    36

    35

    34

    33

    32

    31

    30

    880875 890885 900895 910 915 920

    Frequency (MHz)

    Output3rdOrderInterceptPo

    int(dBm)

    905

    0oC

    25oC

    85oC

    Figure 22. Mixer A OIP3 vs Frequency and Temperature

    37

    36

    35

    34

    33

    32

    31

    30

    880875 890885 900895 910

    Frequency (MHz)

    Output3rdOrderInterceptPoint(dBm)

    905 920915

    3 dBm0 dBm

    +3 dBm

    Figure 24. Mixer B OIP3 vs Frequency and LO Power

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    37

    36

    35

    34

    33

    32

    31

    30

    880875 890885 900895 910 915 920

    Frequency (MHz)

    Output3rdOrderInterceptPoint(dBm)

    905

    0oC

    25oC

    85oC

    Figure 25. Mixer B OIP3 vs Frequency and Temperature

    65

    60

    55

    50880 890885 900895 910 915

    Frequency (MHz)

    Channel-to-

    ChannelIsolation

    (dB)

    905

    4.75 V5.00 V

    5.25 V

    Figure 27. Channel A To Channel B Isolation vs Frequency and

    Supply Voltage

    80

    75

    70

    65880 890885 900895 910 915

    Frequency (MHz)

    LO-to-LOIsolation(dB)

    905

    4.75 V5.00 V5.25 V

    Figure 29. LO1-To-LO2 Isolation vs Frequency and Supply Voltage

    37

    36

    35

    34

    33

    32

    31

    30880875 890885 900895 910 915 920

    Frequency (MHz)

    Output3rdOrder

    InterceptPoint(dBm)

    905

    4.75 V5.00 V5.25 V

    Figure 26. Mixer B OIP3 vs Frequency and Supply Voltage

    65

    60

    55

    50880 890885 900895 910 915

    Frequency (MHz)

    Channel-to-

    ChannelIsolation(dB)

    905

    0oC

    25oC

    85oC

    Figure 28. Channel A To Channel B Isolation vs Frequency and

    Temperature

    80

    75

    70

    65880 890885 900895 910 915

    Frequency (MHz)

    LO-to-LOIsolation(dB)

    905

    0oC

    25oC

    85oC

    Figure 30. LO1-To-LO2 Isolation vs Frequency and Temperature

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    60

    65

    70

    75

    80

    85880 890885 900895 910 915

    Frequency (MHz)

    2RF

    x2LO1(dBc)

    905

    4.75 V5.00 V5.25 V

    Figure 31. Channel A 2RF 2LO vs Frequency and Supply Voltage

    60

    65

    70

    75

    80

    85880 890885 900895 910 915

    Frequency (MHz)

    2RFx2LO2(dBc)

    905

    4.75 V5.00 V5.25 V

    Figure 33. Channel B 2RF 2LO vs Frequency and Supply Voltage

    70

    72

    74

    76

    78

    80

    82

    84

    86880 890885 900895 910 915

    Frequency (MHz)

    LO1-to-IFALeakage(dBc)

    905

    4.75 V5.00 V5.25 V

    Figure 35. Channel A LO1-to-IF Leakage vs Frequency and Supply

    Voltage

    60

    65

    70

    75

    80

    85880 890885 900895 910 915

    Frequency (MHz)

    2RF

    x2LO1(dBc)

    905

    0oC

    25oC

    85oC

    Figure 32. Channel A 2RF 2LO vs Frequency and Temperature

    60

    65

    70

    75

    80

    85880 890885 900895 910 915

    Frequency (MHz)

    2RFx2LO2(dBc)

    905

    0oC

    25oC

    85o

    C

    Figure 34. Channel B 2RF 2LO vs Frequency and Temperature

    70

    72

    74

    76

    78

    80

    82

    84

    86

    880 890885 900895 910 915

    Frequency (MHz)

    LO1-to-IFALeakage(dBc)

    905

    0oC

    25oC

    85oC

    Figure 36. Channel A LO1-to-IF Leakage vs Frequency and

    Temperature

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    80

    78

    76

    74

    72

    880 890885 900895 910 915

    Frequency (MHz)

    RF-to-IF

    AIsolation(dBc)

    905

    4.75 V5.00 V5.25 V

    Figure 37. Channel A RF-to-IF Isolation vs Frequency and Supply

    Voltage

    40

    42

    44

    46

    48

    50

    52

    54

    56880 890885 900895 910 915

    Frequency (MHz)

    LO1/LO2-to-RFALeakage(dBc)

    905

    4.75 V5.00 V5.25 V

    Figure 39. Channel A LO1-to-RF Leakage vs Frequency and

    Supply Voltage

    80

    78

    76

    74

    72

    880 890885 900895 910 915

    Frequency (MHz)

    RF-to-IF

    AIsolation(dBc)

    905

    0oC

    25oC

    85oC

    Figure 38. Channel A RF-to-IF Isolation vs Frequency and

    Temperature

    40

    42

    44

    46

    48

    50

    52

    54

    56880 890885 900895 910 915

    Frequency (MHz)

    LO1/LO2-to-RFALeakage(dBc)

    905

    0oC

    25oC

    85oC

    Figure 40. Channel A LO1-to-RF Leakage vs Frequency and

    Temperature

    Evaluation Board Description

    The SKY73020 Evaluation Board is used to test the performance

    of the SKY73020 downconversion mixer. An assembly drawing for

    the Evaluation board is shown in Figure 41 and the layer detail is

    provided in Figure 42.

    Circuit Design Considerations

    The following design considerations are general in nature and

    must be followed regardless of final use or configuration:1. Paths to ground should be made as short and as low

    impedance as possible.

    2. The ground pad of the SKY73020 provides critical electrical

    and thermal functionality. This pad is the main thermal

    conduit for heat dissipation. Since the circuit board acts as

    the heat sink, it must shunt as much heat as possible from

    the device. Therefore, design the connection to the ground

    pad to dissipate the maximum heat produced by the circuit

    board. For more information on soldering the SKY73020, refer

    to the Package and Handling Information section of this Data

    Sheet.

    3. Skyworks recommends including external bypass capacitors

    on the VCC voltage inputs of the device.

    4. Components L5, L6, L14, and L15 (see Figure 3) are high-Q,

    low-loss inductors. These inductors must be able to pass

    currents in excess of 200 mA DC.

    5. Components R1 and R2 (see Figure 3) allow for external

    adjustment of the IF amplifier bias points. For operation as

    specified in Tables 3 and 4, these resistors are not required.

    A schematic diagram for the SKY73020 Evaluation Board is

    shown in Figure 43.

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    S811

    J4

    J1

    J7

    J6

    J3

    J8

    J5

    L12

    L13

    L15

    L11

    R2L14

    L1

    L2

    C28

    C29

    C26

    C23

    C20 C21

    C18C17

    C24

    C22

    L10C19

    C15C12

    C6

    C7

    C8

    C14

    C11

    C16L8

    L3

    L5

    L4

    T1

    L9

    L6R1

    C25

    C32

    C33

    C27

    C2

    C3

    C1

    C4

    C5U1

    T2

    Figure 41. SKY73020 Evaluation Board Assembly Diagram

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    S903

    Layer 1: Top -- Metal

    Layer 2: Ground

    Layer 3: Power Plane

    Layer 4: Solid Ground Plane

    Figure 42. SKY73020 Evaluation Board Layer Detail

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    RFB

    VCC_

    RFB

    NC

    GND

    IFB+

    IFB

    NC

    VCC_

    IFB

    RIFB

    VCC_

    RFA

    NC

    GND

    IFA+

    IFA

    NC

    VCC_

    IFA

    RIFA

    NC

    VCC_LO

    NC

    GND

    VCC_LO

    GND

    GND

    NC

    RFA

    LO1

    GND

    GND

    VCC_LO

    GND

    LO_SEL

    GND

    GND

    LO2

    J4

    SKY73020

    C15.6 pF

    1

    2

    3

    4

    5

    6

    7

    8

    9

    27

    26

    25

    24

    23

    22

    21

    20

    19

    10 11 12 13 14 15 16 17 18

    36 35 34 33 32 31 30 29 28

    C322 nH

    L26.8 pF

    J7 C85.6 pF

    VCC

    VCC

    C722 nH

    L46.8 pF

    L5470 nH

    L8

    39 nH

    L6470 nH

    C16

    47 pF

    C1733 pF

    C2212 pF

    J6

    T1

    DB714

    VCC

    VCC

    NC

    J3

    VCC

    VCC

    VCC

    VCC

    C2333 pF

    J8

    C131 F

    Element Jumper

    C201 F

    C1433 pF

    C281 F

    C2733 pF

    C2847 pF

    T2

    DB714

    VCC

    J5L1339 nH

    L14470 nH

    L15470 nH

    R2(Not Req'd)

    R1(Not Req'd)

    S685

    Figure 43. SKY73020 Evaluation Board Schematic

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    Package Dimensions

    Figure 44 shows the package dimensions for the 36-pin MCM and

    Figure 45 provides the tape and reel dimensions.

    Package and Handling Information

    Since the device package is sensitive to moisture absorption, it is

    baked and vacuum packed before shipping. Instructions on the

    shipping container label regarding exposure to moisture after the

    container seal is broken must be followed. Otherwise, problems

    related to moisture absorption may occur when the part is

    subjected to high temperature during solder assembly.

    THE SKY73020 is rated to Moisture Sensitivity Level 3 (MSL3) at

    260 C. It can be used for lead or lead-free soldering. For

    additional information, refer to the Skyworks Application Note,

    PCB Design & SMT Assembly/Rework Guidelines for MCM-L

    Packages, document number 101752.

    Care must be taken when attaching this product, whether it is

    done manually or in a production solder reflow environment.

    Production quantities of this product are shipped in a standard

    tape and reel format. For packaging details, refer to the Skyworks

    Application Note, Tape and Reel, document number 101568.

    Electrostatic Discharge (ESD) Sensitivity

    The SKY73020 is a static-sensitive electronic device. Do not

    operate or store near strong electrostatic fields. Take proper ESD

    precautions.

    All measurements are in millimeters

    Pads are solder mask defined on one edge and metaldefined on three edges.

    Dimensioning and tolerancing according to ASME Y14.5M-1994

    S689

    6

    6

    Pin 1 Indicator

    Metal Pad Edge

    1.45 0.10

    0.4 0.05

    0.5 0.1

    (0.1)

    Side View

    B

    Bottom View

    A

    Detail A

    Detail D

    Top View

    Pin 36

    Pin 1

    Pin 1 Indicator(See Detail D)

    0.25 0.05

    18X 2.9

    (0.2 x 0.2)

    Solder Mask Opening

    36x SMT Pad

    0.15 A B C

    0.2 A B C

    0.15 A B C

    C

    A

    0.1

    4X 2

    4X 2

    2X 1.9

    2X 1.9

    18X 2.9

    3X R0.2

    4X 1.5

    4X 1.54X 1

    4X 14X 0.5

    4X 0.5

    Figure 44. SKY73020 36-Pin MCM Package Dimensions

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    C1222

    Notes:1. Carrier tape: black conductive polystyrene2. Cover tape material: transparent conductive PSA3. Cover tape size: 9.3 mm width4. All dimensions are in millimeters A

    B

    2.00 0.05

    1.55 0.05

    0.30 0.05

    5o Max.

    5o Max.

    6.3

    0

    1.75 0.10

    1.50 Min.

    5.5

    0

    0.0

    5

    8.00 4.00

    A

    B

    B

    A

    1.70

    12.0

    00.3

    0

    6.30

    Pin #1Indicator

    Figure 45. SKY73020 Tape and Reel Dimensions

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    Ordering Information

    Model Name Manufacturing Part Number Evaluation Kit Part Number

    SKY73020 Downconversion Mixer SKY73020-11 (Pb-free package)

    Copyright 2006 Skyworks Solutions, Inc. All Rights Reserved.

    Information in this document is provided in connection with Skyworks Solutions, Inc. (Skyworks) products or services. These materials, including the information contained herein, are provided by

    Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the

    information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to

    update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.

    No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or

    information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions

    of Sale.

    THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED AS IS WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A

    PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY

    DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS

    SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION,

    LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE

    POSSIBILITY OF SUCH DAMAGE.

    Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury,death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any

    damages resulting from such improper use or sale.

    Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of

    products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for

    applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.

    Skyworks, the Skyworks symbol, and Breakthrough Simplicity are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands

    and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com,

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