2017-06-23 1

2017-06-23

Silicon PIN Photodiode

Version 1.3

SFH 2200

Ordering Information

Features:

• Suitable for reflow soldering

• Especially suitable for applications from 400 nm to 1100 nm

• small package: (WxDxH) 4 mm x 5.1 mm x 0.85mm

• Solder control structure

Applications

• Photointerrupters

• Industrial electronics

• Consumer electronics

• For control and drive circuits

• Remote control

Type: Photocurrent Spectral sensitivity Ordering Code

IP [µA] S [nA/Ix]

Ev = 1000 lx, white LED,

VR = 5 VVR = 5 V, Std. Light A, T

= 2856 K

SFH 2200 8 (≥ 5) 71 Q65112A0250

2017-06-23 2

Version 1.3 SFH 2200

Maximum Ratings (TA = 25 °C)

Characteristics (TA = 25 °C)

Parameter Symbol Values Unit

Operating and storage temperature range Top; Tstg -40 ... 85 °C

Reverse voltage VR 20 V

Total Power dissipation Ptot 150 mW

ESD withstand voltage

(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)

VESD 2000 V

Thermal resistance for mounting on pcb RthJA 275 K/W

Parameter Symbol Values Unit

Spectral sensitivity

(VR = 5 V, Std. Light A, T = 2856 K)

(typ (min)) S 71 nA/Ix

Photocurrent

(Ev = 1000 lx, white LED, VR = 5 V)

(typ (min)) IP 8 (≥ 5) µA

Wavelength of max. sensitivity (typ) λS max 940 nm

Spectral range of sensitivity (typ) λ10% (typ) 300

... 1100

nm

Radiant sensitive area (typ) A 7.02 mm2

Dimensions of radiant sensitive area (typ) L x W 2.65 x 2.65 mm x

mm

Half angle (typ) ϕ ± 60 °

Dark current

(VR = 10 V)

(typ (max)) IR 1 (≤ 25) nA

Spectral sensitivity of the chip

(λ = 950 nm)

(typ) Sλ typ 0.7 A / W

Quantum yield of the chip

(λ = 950 nm)

(typ) η 0.91 Electro

ns

/Photon

Open-circuit voltage

(Ev = 1000 lx, Std. Light A)

(typ (min)) VO 365 (≥ 300) mV

Short-circuit current

(Ev = 1000 lx, Std. Light A)

(typ) ISC 71 µA

Rise and fall time

(VR = 5 V, RL = 50 Ω, λ = 850 nm, IP = 800 µA)

(typ) tr, tf 0.04 µs

Forward voltage

(IF = 100 mA, E = 0)

(typ) VF 1 V

Capacitance

(VR = 0 V, f = 1 MHz, E = 0)

(typ) C0 60 pF

Version 1.3 SFH 2200

2017-06-23 3

Temperature coefficient of VO (typ) TCV -2.6 mV / K

Temperature coefficient of ISC

(Ev = 1000 lx, Std. Light A)

(typ) TCI 0.18 % / K

Noise equivalent power

(VR = 10 V, λ = 950 nm)

(typ) NEP 0.026 pW /

Hz½

Detection limit

(VR = 10 V, λ = 950 nm)

(typ) D* 1.0e13 cm x

Hz½ / W

Relative Spectral Sensitivity 1) page 12

Srel = f(λ)Photocurrent / Open-Circuit Voltage 1) page 12

IP (VR = 5 V) / VO = f(EV)

Parameter Symbol Values Unit

400 500 600 700 800 900 1000 11000

20

40

60

80

100

nm

nm

Srel %

nm

2017-06-23 4

Version 1.3 SFH 2200

Power Consumption

Ptot = f(TA), RthJA = 275 K/WDark Current 1) page 12

IR = f(VR), E = 0

Capacitance 1) page 12

C = f(VR), f = 1 MHz, E = 0Dark Current 1) page 12

IR = f(TA), VR = 10 V, E = 0

SFH 2200

0 5 10 15 20V

R

[V]

200

400

600

800

1000

1200

1400

1600

1800

2000I

R

[pA]

0,01 0,1 1 100

20

40

60

VR

V

C pF

Version 1.3 SFH 2200

2017-06-23 5

Directional Characteristics 1) page 12

Srel = f(ϕ)

Package Outline

Dimensions in mm.Package

TOPLED D5140, Silicone, colourless, clear

OHF01402

90

80

70

60

50

40 30 20 10

20 40 60 80 100 1200.40.60.81.0

ϕ

0.2

0.4

0.6

0.8

1.0

1000

0

0

2017-06-23 6

Version 1.3 SFH 2200

Approximate Weight:

46 mg

Recommended Solder Pad

Dimensions in mm.

Version 1.3 SFH 2200

2017-06-23 7

Handling Indication

The package is casted with silicone. Mechanical stress at the silicone surface should be avoided. Pickup the device at the plastic frame.

Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E

00

s

OHA04525

50

100

150

200

250

300

50 100 150 200 250 300

t

T

˚C

St

t

Pt

Tp240 ˚C

217 ˚C

245 ˚C

25 ˚C

L

OHA04612

Profile Feature

Profil-Charakteristik

Ramp-up rate to preheat*)

25 °C to 150 °C2 3 K/s

Time tS TSmin to TSmax

tS

tL

tP

TL

TP

100 12060

10 20 30

80 100

217

2 3

245 260

3 6

Time25 °C to TP

Time within 5 °C of the specified peaktemperature TP - 5 K

Ramp-down rate*TP to 100 °C

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

Ramp-up rate to peak*)

TSmax to TP

Liquidus temperature

Peak temperature

Time above liquidus temperature

Symbol

Symbol

Unit

Einheit

Pb-Free (SnAgCu) Assembly

Minimum MaximumRecommendation

K/s

K/s

s

s

s

s

°C

°C

480

2017-06-23 8

Version 1.3 SFH 2200

Taping

Dimensions in mm.

Tape and Reel

12 mm tape with 1500 pcs. on ∅ 180 mm reel

D0

2P

P0

1P

WFE

Direction of unreeling

N

W1

2W

A

OHAY0324

Label

Leader:Trailer:

13.0

Direction of unreeling

±0.2

5

min. 160 mm *

min. 400 mm *

*) Dimensions acc. to IEC 60286-3; EIA 481-D

Version 1.3 SFH 2200

2017-06-23 9

Tape dimensions [mm]Tape dimensions in mm

Reel dimensions [mm]Reel dimensions in mm

Barcode-Product-Label (BPL)

Dry Packing Process and Materials

Note:

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.

Regarding dry pack you will find further information in the internet. Here you will also find the normative

references like JEDEC.

W P0 P1 P2 D0 E F

12 + 0.3 / - 0.1 4 ± 0.1 4 ± 0.1

or

8 ± 0.1

2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 5.5 ± 0.05

A W Nmin W1 W2max

180 12 60 12.4 + 2 18.4

OHA00539

OSRAM

Moisture-sensitive label or print

Barcode label

Desiccant

Humidity indicator

Barcode label

OSRAM

Please check the HIC immidiately afterbag opening.

Discard if circles overrun.Avoid metal contact.

WET

Do not eat.

Comparatorcheck dot

parts still adequately dry.

examine units, if necessary

examine units, if necessary

5%

15%

10%bake units

bake units

If wet,

change desiccant

If wet,

Humidity IndicatorMIL-I-8835

If wet,

Mois

ture

Level 3

Flo

or tim

e 168 H

ours

Mois

ture

Level 6

Flo

or tim

e 6

Hours

a) H

umid

ity In

dicato

r C

ard is

> 1

0% w

hen read a

t 23 ˚

C ±

5 ˚C

, or

reflo

w, v

apor-phase r

eflow

, or equiv

alent p

rocessin

g (peak p

ackage

2. Afte

r th

is b

ag is o

pened, devic

es that w

ill b

e subje

cted to

infrare

d

1. Shelf

life in

seale

d bag: 2

4 month

s at <

40 ˚

C a

nd < 9

0% rela

tive h

umid

ity (R

H).

Mois

ture

Level 5

a

at facto

ry c

onditions o

f

(if b

lank, s

eal date

is id

entical w

ith d

ate c

ode).

a) M

ounted w

ithin

b) S

tore

d at

body tem

p.

3. Devic

es require

bakin

g, befo

re m

ounting, i

f:

Bag s

eal date

Mois

ture

Level 1

Mois

ture

Level 2

Mois

ture

Level 2

a4. If b

aking is

require

d,

b) 2a o

r 2b is

not m

et.

Date

and ti

me o

pened:

refe

rence IP

C/J

ED

EC

J-S

TD

-033 fo

r bake p

rocedure

.

Flo

or tim

e see b

elow

If bla

nk, see b

ar code la

bel

Flo

or tim

e > 1

Year

Flo

or tim

e 1

Year

Flo

or tim

e 4

Weeks10%

RH

.

_<

Mois

ture

Level 4

Mois

ture

Level 5

˚C).

OPTO

SEM

ICO

NDUCTORS

MO

ISTURE S

ENSITIV

E

This b

ag conta

ins

CAUTION

Flo

or tim

e 72 H

ours

Flo

or tim

e 48 H

ours

Flo

or tim

e 24 H

ours

30 ˚C

/60%

RH

.

_<

LE

VE

L

If bla

nk, see

bar code la

bel

2017-06-23 10

Version 1.3 SFH 2200

Transportation Packing and Materials

Dimensions of transportation box in mm

Width Length Height

195 ± 5 195 ± 5 30 ± 5

OHA02044

PACKVAR:

R077Additional TEXT

P-1+Q-1

Multi TOPLED

Muste

r

OSRAM Opto

Semiconductors

(6P) BATCH NO:

(X) PROD NO:

10

(9D) D/C:

11(1T) LOT NO:

210021998

123GH1234

024 5

(Q)QTY: 2000

0144

(G) GROUP:

260 C RT240 C R

3

220 C R

MLBin3:Bin2: Q

-1-20

Bin1: P-1-20

LSY T6762

2a

Temp ST

R18DEMY

PACKVAR:

R077Additional TEXT

P-1+Q-1

Multi TOPLED

Muste

r

OSRAM Opto

Semiconductors

(6P) BATCH NO:

(X) PROD NO:

10

(9D) D/C:

11(1T) LOT NO:

210021998

123GH1234

024 5

(Q)QTY: 2000

0144

(G) GROUP:

260 C RT240 C R

3

220 C R

MLBin3:Bin2: Q

-1-20

Bin1: P-1-20

LSY T6762

2a

Temp ST

R18DEMY

OSRAM

Packing

Sealing label

Barcode label

Mois

ture

Level 3

Flo

or tim

e 168 H

ours

Mois

ture

Level 6

Flo

or tim

e 6

Hours

a) H

umid

ity In

dicato

r C

ard is

> 1

0% w

hen read a

t 23 ˚

C ±

5 ˚C

, or

reflo

w, v

apor-phase r

eflow

, or equiv

alent p

rocessin

g (peak p

ackage

2. Afte

r th

is b

ag is o

pened, devic

es that w

ill b

e subje

cted to

infrare

d

1. Shelf

life in

seale

d bag: 2

4 month

s at <

40 ˚

C a

nd < 9

0% rela

tive h

umid

ity (R

H).

Mois

ture

Level 5

a

at facto

ry c

onditions o

f

(if b

lank, s

eal date

is id

entical w

ith d

ate c

ode).

a) M

ounted w

ithin

b) S

tore

d at

body tem

p.

3. Devic

es require

bakin

g, befo

re m

ounting, i

f:

Bag s

eal date

Mois

ture

Level 1

Mois

ture

Level 2

Mois

ture

Level 2

a4. If b

aking is

require

d,

b) 2a o

r 2b is

not m

et.

Date

and ti

me o

pened:

refe

rence IP

C/J

ED

EC

J-S

TD

-033 fo

r bake p

rocedure

.

Flo

or tim

e see b

elow

If bla

nk, see b

ar code la

bel

Flo

or tim

e > 1

Year

Flo

or tim

e 1

Year

Flo

or tim

e 4

Weeks10%

RH

.

_<

Mois

ture

Level 4

Mois

ture

Level 5

˚C).

OPTO

SEM

ICO

NDUCTORS

MO

ISTURE S

ENSITIV

E

This b

ag conta

ins

CAUTION

Flo

or tim

e 72 H

ours

Flo

or tim

e 48 H

ours

Flo

or tim

e 24 H

ours

30 ˚C

/60%

RH

.

_<

LE

VE

L

If bla

nk, see

bar code la

bel

Barcode label

Version 1.3 SFH 2200

2017-06-23 11

Disclaimer

Language english will prevail in case of any discrepancies or deviations between the two language wordings.

Attention please!

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances.

For information on the types in question please contact our Sales Organization.

If printed or downloaded, please find the latest version in the Internet.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any

costs incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose!

Critical components* may only be used in life-support devices** or systems with the express written approval of

OSRAM OS.

*) A critical component is a component used in a life-support device or system whose failure can reasonably be

expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that

device or system.

**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or

maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be

endangered.

2017-06-23 12

Version 1.3 SFH 2200

Glossary

1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or

calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily

correspond to the actual parameters of each single product, which could differ from the typical data and calculated

correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data

will be changed without any further notice.

2017-06-23 13

Version 1.3 SFH 2200

Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg

www.osram-os.com © All Rights Reserved.