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2017-10-13 1
DRAFT – For Reference only. Subject to change without notice.
2017-10-13
Silicon PIN Photodiode
Preliminary Version 0.0
SFH 2201
Ordering Information
Features:
• Suitable for reflow soldering
• small package: (WxDxH) 4 mm x 5.1 mm x 0.85mm
• Solder control structure
Applications
• Photointerrupters
• Industrial electronics
• For control and drive circuits
Type: Photocurrent Spectral sensitivity Ordering Code
IP [µA] S [nA/Ix]
Ev = 1000 lx, white LED,
VR = 5 VVR = 5 V, Std. Light A, T
= 2856 K
SFH 2201 13 (≥ 10) 76 Q65112A3981
2017-10-13 2
DRAFT – For Reference only. Subject to change without notice.
Preliminary Version 0.0 SFH 2201
Maximum Ratings (TA = 25 °C)
Characteristics (TA = 25 °C)
Parameter Symbol Values Unit
Operating and storage temperature range Top; Tstg -40 ... 85 °C
Reverse voltage VR 16 V
Total Power dissipation Ptot 150 mW
ESD withstand voltage
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD 2000 V
Thermal resistance for mounting on pcb RthJA 275 K/W
Parameter Symbol Values Unit
Spectral sensitivity
(VR = 5 V, Std. Light A, T = 2856 K)
(typ ) S 76 nA/Ix
Spectral sensitivity of the chip
(λ = 400 nm)
(typ) Sλ,typ 0.2 A / W
Spectral sensitivity
(λ = 550 nm)
(typ) Sλ typ 0.45 A / W
Photocurrent
(Ev = 1000 lx, white LED, VR = 5 V)
(typ (min)) IP 13 (≥ 10) µA
Wavelength of max. sensitivity (typ) λS max 950 nm
Spectral range of sensitivity (typ) λ10% (typ) 300
... 1100
nm
Radiant sensitive area (typ) A 8.12 mm2
Dimensions of radiant sensitive area (typ) L x W 2.85 x 2.85 mm x
mm
Half angle (typ) ϕ ± 60 °
Dark current
(VR = 10 V)
(typ (max)) IR 1 (≤ 25) nA
Open-circuit voltage
(Ev = 1000 lx, Std. Light A)
(typ (min)) VO 350 (≥300) mV
Short-circuit current
(Ev = 1000 lx, Std. Light A)
(typ) ISC 76 µA
Rise and fall time
(VR = 5 V, RL = 50 Ω, λ = 850 nm, IP = 800 µA)
(typ) tr, tf 0.04 µs
Forward voltage
(IF = 100 mA, E = 0)
(typ) VF 1.25 V
Capacitance
(VR = 0 V, f = 1 MHz, E = 0)
(typ) C0 65 pF
Temperature coefficient of VO (typ) TCV -2.6 mV / K
Preliminary Version 0.0 SFH 2201
2017-10-13 3
DRAFT – For Reference only. Subject to change without notice.
Relative Spectral Sensitivity 1) page 11
Srel = f(λ)Dark Current 1) page 11
IR = f(VR), E = 0
Capacitance 1) page 11
C = f(VR), f = 1 MHz, E = 0
SFH 2201
400 600 800 1000λ [nm]
0
20
40
60
80
100S
rel
[%]
SFH 2201
0 2 4 6 8 10 12 14 16V
R
[V]
600
800
1000
1200
I
R
[pA]
SFH 2201
10-6 10-5 10-4 10-3 0.01 0.1 1 10V
R
[V]
10
20
30
40
50
60
70C [pF]
2017-10-13 4
DRAFT – For Reference only. Subject to change without notice.
Preliminary Version 0.0 SFH 2201
Directional Characteristics 1) page 11
Srel = f(ϕ)
Package Outline
Dimensions in mm.Package
TOPLED D5140, Silicone, colourless, clear
OHF01402
90
80
70
60
50
40 30 20 10
20 40 60 80 100 1200.40.60.81.0
ϕ
0.2
0.4
0.6
0.8
1.0
1000
0
0
Preliminary Version 0.0 SFH 2201
2017-10-13 5
DRAFT – For Reference only. Subject to change without notice.
Approximate Weight:
46 mg
Recommended Solder Pad
Dimensions in mm.
2017-10-13 6
DRAFT – For Reference only. Subject to change without notice.
Preliminary Version 0.0 SFH 2201
Handling Indication
The package is casted with silicone. Mechanical stress at the silicone surface should be avoided. Pickup the device at the plastic frame.
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
OHA04612
Profile Feature
Profil-Charakteristik
Ramp-up rate to preheat*)
25 °C to 150 °C2 3 K/s
Time tS TSmin to TSmax
tS
tL
tP
TL
TP
100 12060
10 20 30
80 100
217
2 3
245 260
3 6
Time25 °C to TP
Time within 5 °C of the specified peaktemperature TP - 5 K
Ramp-down rate*TP to 100 °C
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature
Peak temperature
Time above liquidus temperature
Symbol
Symbol
Unit
Einheit
Pb-Free (SnAgCu) Assembly
Minimum MaximumRecommendation
K/s
K/s
s
s
s
s
°C
°C
480
Preliminary Version 0.0 SFH 2201
2017-10-13 7
DRAFT – For Reference only. Subject to change without notice.
Taping
Dimensions in mm.
Tape and Reel
12 mm tape with 1500 pcs. on ∅ 180 mm reel
D0
2P
P0
1P
WFE
Direction of unreeling
N
W1
2W
A
OHAY0324
Label
Leader:Trailer:
13.0
Direction of unreeling
±0.2
5
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
2017-10-13 8
DRAFT – For Reference only. Subject to change without notice.
Preliminary Version 0.0 SFH 2201
Tape dimensions [mm]Tape dimensions in mm
Reel dimensions [mm]Reel dimensions in mm
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.
W P0 P1 P2 D0 E F
12 + 0.3 / - 0.1 4 ± 0.1 4 ± 0.1
or
8 ± 0.1
2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 5.5 ± 0.05
A W Nmin W1 W2max
180 12 60 12.4 + 2 18.4
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity IndicatorMIL-I-8835
If wet,
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or equiv
alent p
rocessin
g (peak p
ackage
2. Afte
r th
is b
ag is o
pened, devic
es that w
ill b
e subje
cted to
infrare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body tem
p.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 fo
r bake p
rocedure
.
Flo
or tim
e see b
elow
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Flo
or tim
e 1
Year
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICO
NDUCTORS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Preliminary Version 0.0 SFH 2201
2017-10-13 9
DRAFT – For Reference only. Subject to change without notice.
Transportation Packing and Materials
Dimensions of transportation box in mm
Width Length Height
195 ± 5 195 ± 5 30 ± 5
OHA02044
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
OSRAM
Packing
Sealing label
Barcode label
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or equiv
alent p
rocessin
g (peak p
ackage
2. Afte
r th
is b
ag is o
pened, devic
es that w
ill b
e subje
cted to
infrare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body tem
p.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 fo
r bake p
rocedure
.
Flo
or tim
e see b
elow
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Flo
or tim
e 1
Year
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICO
NDUCTORS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Barcode label
2017-10-13 10
DRAFT – For Reference only. Subject to change without notice.
Preliminary Version 0.0 SFH 2201
Disclaimer
OSRAM OS assumes no liability whatsoever for any use of this document or its content by recipient including, but not
limited to, for any design in activities based on this preliminary draft version. OSRAM OS may e.g. decide at its sole
discretion to stop developing and/or finalising the underlying design at any time.
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
Preliminary Version 0.0 SFH 2201
2017-10-13 11
DRAFT – For Reference only. Subject to change without notice.
Glossary
1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
2017-10-13 12
DRAFT – For Reference only. Subject to change without notice.
Preliminary Version 0.0 SFH 2201
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.