2017-06-23 1
2017-06-23
Silicon PIN Photodiode
Version 1.3
SFH 2200
Ordering Information
Features:
• Suitable for reflow soldering
• Especially suitable for applications from 400 nm to 1100 nm
• small package: (WxDxH) 4 mm x 5.1 mm x 0.85mm
• Solder control structure
Applications
• Photointerrupters
• Industrial electronics
• Consumer electronics
• For control and drive circuits
• Remote control
Type: Photocurrent Spectral sensitivity Ordering Code
IP [µA] S [nA/Ix]
Ev = 1000 lx, white LED,
VR = 5 VVR = 5 V, Std. Light A, T
= 2856 K
SFH 2200 8 (≥ 5) 71 Q65112A0250
2017-06-23 2
Version 1.3 SFH 2200
Maximum Ratings (TA = 25 °C)
Characteristics (TA = 25 °C)
Parameter Symbol Values Unit
Operating and storage temperature range Top; Tstg -40 ... 85 °C
Reverse voltage VR 20 V
Total Power dissipation Ptot 150 mW
ESD withstand voltage
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD 2000 V
Thermal resistance for mounting on pcb RthJA 275 K/W
Parameter Symbol Values Unit
Spectral sensitivity
(VR = 5 V, Std. Light A, T = 2856 K)
(typ (min)) S 71 nA/Ix
Photocurrent
(Ev = 1000 lx, white LED, VR = 5 V)
(typ (min)) IP 8 (≥ 5) µA
Wavelength of max. sensitivity (typ) λS max 940 nm
Spectral range of sensitivity (typ) λ10% (typ) 300
... 1100
nm
Radiant sensitive area (typ) A 7.02 mm2
Dimensions of radiant sensitive area (typ) L x W 2.65 x 2.65 mm x
mm
Half angle (typ) ϕ ± 60 °
Dark current
(VR = 10 V)
(typ (max)) IR 1 (≤ 25) nA
Spectral sensitivity of the chip
(λ = 950 nm)
(typ) Sλ typ 0.7 A / W
Quantum yield of the chip
(λ = 950 nm)
(typ) η 0.91 Electro
ns
/Photon
Open-circuit voltage
(Ev = 1000 lx, Std. Light A)
(typ (min)) VO 365 (≥ 300) mV
Short-circuit current
(Ev = 1000 lx, Std. Light A)
(typ) ISC 71 µA
Rise and fall time
(VR = 5 V, RL = 50 Ω, λ = 850 nm, IP = 800 µA)
(typ) tr, tf 0.04 µs
Forward voltage
(IF = 100 mA, E = 0)
(typ) VF 1 V
Capacitance
(VR = 0 V, f = 1 MHz, E = 0)
(typ) C0 60 pF
Version 1.3 SFH 2200
2017-06-23 3
Temperature coefficient of VO (typ) TCV -2.6 mV / K
Temperature coefficient of ISC
(Ev = 1000 lx, Std. Light A)
(typ) TCI 0.18 % / K
Noise equivalent power
(VR = 10 V, λ = 950 nm)
(typ) NEP 0.026 pW /
Hz½
Detection limit
(VR = 10 V, λ = 950 nm)
(typ) D* 1.0e13 cm x
Hz½ / W
Relative Spectral Sensitivity 1) page 12
Srel = f(λ)Photocurrent / Open-Circuit Voltage 1) page 12
IP (VR = 5 V) / VO = f(EV)
Parameter Symbol Values Unit
400 500 600 700 800 900 1000 11000
20
40
60
80
100
nm
nm
Srel %
nm
2017-06-23 4
Version 1.3 SFH 2200
Power Consumption
Ptot = f(TA), RthJA = 275 K/WDark Current 1) page 12
IR = f(VR), E = 0
Capacitance 1) page 12
C = f(VR), f = 1 MHz, E = 0Dark Current 1) page 12
IR = f(TA), VR = 10 V, E = 0
SFH 2200
0 5 10 15 20V
R
[V]
200
400
600
800
1000
1200
1400
1600
1800
2000I
R
[pA]
0,01 0,1 1 100
20
40
60
VR
V
C pF
Version 1.3 SFH 2200
2017-06-23 5
Directional Characteristics 1) page 12
Srel = f(ϕ)
Package Outline
Dimensions in mm.Package
TOPLED D5140, Silicone, colourless, clear
OHF01402
90
80
70
60
50
40 30 20 10
20 40 60 80 100 1200.40.60.81.0
ϕ
0.2
0.4
0.6
0.8
1.0
1000
0
0
2017-06-23 6
Version 1.3 SFH 2200
Approximate Weight:
46 mg
Recommended Solder Pad
Dimensions in mm.
Version 1.3 SFH 2200
2017-06-23 7
Handling Indication
The package is casted with silicone. Mechanical stress at the silicone surface should be avoided. Pickup the device at the plastic frame.
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
OHA04612
Profile Feature
Profil-Charakteristik
Ramp-up rate to preheat*)
25 °C to 150 °C2 3 K/s
Time tS TSmin to TSmax
tS
tL
tP
TL
TP
100 12060
10 20 30
80 100
217
2 3
245 260
3 6
Time25 °C to TP
Time within 5 °C of the specified peaktemperature TP - 5 K
Ramp-down rate*TP to 100 °C
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature
Peak temperature
Time above liquidus temperature
Symbol
Symbol
Unit
Einheit
Pb-Free (SnAgCu) Assembly
Minimum MaximumRecommendation
K/s
K/s
s
s
s
s
°C
°C
480
2017-06-23 8
Version 1.3 SFH 2200
Taping
Dimensions in mm.
Tape and Reel
12 mm tape with 1500 pcs. on ∅ 180 mm reel
D0
2P
P0
1P
WFE
Direction of unreeling
N
W1
2W
A
OHAY0324
Label
Leader:Trailer:
13.0
Direction of unreeling
±0.2
5
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Version 1.3 SFH 2200
2017-06-23 9
Tape dimensions [mm]Tape dimensions in mm
Reel dimensions [mm]Reel dimensions in mm
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.
W P0 P1 P2 D0 E F
12 + 0.3 / - 0.1 4 ± 0.1 4 ± 0.1
or
8 ± 0.1
2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 5.5 ± 0.05
A W Nmin W1 W2max
180 12 60 12.4 + 2 18.4
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity IndicatorMIL-I-8835
If wet,
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or equiv
alent p
rocessin
g (peak p
ackage
2. Afte
r th
is b
ag is o
pened, devic
es that w
ill b
e subje
cted to
infrare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body tem
p.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 fo
r bake p
rocedure
.
Flo
or tim
e see b
elow
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Flo
or tim
e 1
Year
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICO
NDUCTORS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
2017-06-23 10
Version 1.3 SFH 2200
Transportation Packing and Materials
Dimensions of transportation box in mm
Width Length Height
195 ± 5 195 ± 5 30 ± 5
OHA02044
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
OSRAM
Packing
Sealing label
Barcode label
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or equiv
alent p
rocessin
g (peak p
ackage
2. Afte
r th
is b
ag is o
pened, devic
es that w
ill b
e subje
cted to
infrare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body tem
p.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 fo
r bake p
rocedure
.
Flo
or tim
e see b
elow
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Flo
or tim
e 1
Year
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICO
NDUCTORS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Barcode label
Version 1.3 SFH 2200
2017-06-23 11
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
2017-06-23 12
Version 1.3 SFH 2200
Glossary
1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
2017-06-23 13
Version 1.3 SFH 2200
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.