RoHS – Wetgeving & praktijk RoHS from the Perspective of a Connector Manufacturer Jan Broeksteeg Engineering Manager CCCE EMEA Tyco Electronics Nederland

RoHS – Wetgeving & praktijk

RoHS RoHS from the Perspective from the Perspective of a Connector of a Connector ManufacturerManufacturer

Jan BroeksteegEngineering Manager CCCE EMEATyco Electronics Nederland BV


Tyco Electronics

• ‘Worlds leading manufacturer of electro-mechanical and passive components

• 25 Strong technology product segments.• Located in 53 countries.• > 250 Production Locations• > 80.000 Employees• > 5000 Sales people• > 7000 people active in de fields of Engineering and Development.


Overview Tyco Electronics Brands


Table of Contents

• Legislation and Industry Drivers

• Tyco Electronics Lead Free/RoHS Roadmap– Customer Schedule

– TE timing

• Product Implications– Hazardous materials

– LF processing issues

• Logistics – Part Numbering/coding


• Restriction on Hazardous Substances (RoHS) – EU Directive 2002/95/EC– By July 1, 2006, electronic products to be free of Lead, Cadmium,

Hexavalent Chrome, Mercury, PBB’s and PBDE’s• Recycling and disposal mandates in Europe (WEEE), Japan, and China.

– EU Directive 2002/96/EC– China proposing RoHS for 2006 – Increasing activity in US - e.g. Prop 65 and SB20 in CA

• EU End-of-Life Vehicle (ELV) – EU Directive 2000/53/EC– Automotive products required Lead Free by July 1, 2003– Exception was granted for lead in solder and plating on solderable

interfaces

Legislation / Industry Drivers


Key Driver - RoHS

• “Producer” of covered product when offered on market (EU) has to be in compliance

– In Tyco Electronics' case – as we are generally a component supplier, it is our customer (OEM) that is “Producer”

– OEM demanded and pushed compliance through-out supply chain– TE pushed through our supply chain as well


RoHS Definitions• Concentration limits defined for RoHS substances

– Allowable trace amounts:

lead

mercury 0.1% by weight (1000 ppm)

hexavalent chrome

PBB, PBDE

cadmium 0.01% cadmium(100 ppm)


Exemptions• EU directive 2000/95/EC RoHS

– Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.

– Lead in steel < 0,35 wt%, in aluminium < 0,4 wt%, in copper alloy < 4 wt%. high melting temp solders (i.e. tin-lead solder alloys > 85 % lead)

– Lead in solders for: servers, storage and storage array systems (until 2010); network infrastructure equipment for switching, signalling, transmission; network management for telecommunication

– Lead used in compliant pin connector systems. – Cadmium and its compounds in electrical contacts and cadmium plating

except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations

– Lead in electronic ceramic parts (e.g. piezoelectronic devices)

– Military and Aerospace applications excluded


Exemptions• EU directive 2000/95/EC RoHS

- Lead and cadmium in printing inks for the application of enamels on borosilicate glass

- Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems

- Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames

- Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors

- Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes


- Lead oxide in the glass envelope of Black Light Blue (BLB) lamps- Lead alloys as solder for transducers used in high-powered (designated to

operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers

- Hexavalent chromium in corrosion preventative coatings of unpainted metal sheetings and fasteners used for corrosion protection and

electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment). Exemption granted until 1 July 2007.

- Lead bound in crystal glass as defined in Annex 1 (Categories 1, 2, 3 and 4) of Council directive 69/493/EEC (*) *OJ L 326, 29.12.1969, p. 36. Directive as last amended by 2003 Act of Accession

Exemptions


Customer / Industry Timeline

Automotive Products ELV Compliant

Jul ’03 ELV

Jan ‘06

Jan ‘05

Jul ’06 RoHS

Japanese Leading Consumer Conversion

Computer/Telecom rolling outOn new Programs

Jan ‘04

Industrials - latest conversion

1. Mid-2004 major conversion started

2. Extended transition (mixed use of leaded and lead-free components, solders etc.)


TE Timeline (components)

Jan ‘06Jan ‘05 Jul ’06 RoHS

10% RoHS Compliant Product Shipments 90% RoHS

Inventory pull-down of non-compliant parts

Jul ‘05 Oct ‘05

RoHS compatible RoHS compatible Product availability Product availability (limited exceptions)(limited exceptions)

Manage Customer Transition

Conversion period – dual manufacturing

requirementsEngineering product

assessment.

New PNs, codes, x-ref in StarTEC, E-Catalog

Last Build – Non-compliant parts

(some exemptions)

Apr ‘05

Customer Surveys


RoHS Compliance vs. Compatibility

Tyco terminology:

• RoHS Compliant means elimination of all hazardous

materials

• RoHS Compatible means resistant to higher solder

temperatures (approx 30 °C higher)


Alternative for tin-lead plating:

Identify suitable alternatives

Assess performance characteristics of the plating layers Solderability Whiskers Press-fit connections Separable interfaces (Durability / Friction) Contact Resistance

Compliance


Implications: solderability (1)

• SnPb finishes converted to pure Sn– No impact to product performance or customer

process plating is backward (SnPb) and forward (lead free) process compatible.

– Sn plated product meets existing product specification


Performance Criteria

Tin 93/7 Tin-Lead

60/40 Tin-Lead

Solderability Meets J-STD-002B

Meets J-STD-002B

Meets J-STD-002B

Shelf Life/Oxidation

1 Year 1 Year 1 Year

Solder Joint Reliability

Meets IPC-A-9701

Meets IPC-A-9701

Meets IPC-A-9701

Tin Whisker Risk

Low Rare Rare



Finish Aging Solder Zero Cross % coverageCondition Time (sec)

Sn-Pb 93/7 as plated SnPb 0.29 >95%Sn-Pb 93/7 heat aged SnPb 0.32 >95%Sn-Pb 93/7 steam aged SnPb 0.46 >95%

Sn as plated SnPb 0.58 >95%Sn heat aged SnPb 0.68 >95%Sn steam aged SnPb 0.83 >95%Sn as plated SnAgCu 0.16 >95%Sn heat aged SnAgCu 0.35 >95%Sn steam aged SnAgCu 0.21 >95%

Zero cross time


Wetting balance test results

time

wetting force


Implications: whiskers (1)


Lead-free tin plating bathsSeveral types commercially available

Pure Sn + easier to produce (no composition check)- risk of whiskers

SnCu3 sometimes preferred in Far East- alloy, so composition to be controlled - some types showed high contact resistance- risk of whiskers

SnAg3.5 - composition of plated layer difficult to control - cost

SnBi - low melting phases with Pb, fillet lifting

back


Implications: whiskers (2)• Major concern with move to Sn plating is Sn Whiskers

– No single root cause has been identified– Stresses on the Sn finish (internal or mechanical) are widely

accepted as contributors

• Extensive testing/evaluation of Sn plating baths has occurred in Tyco/industry over past several years– Whisker tests have been developed and are used for bath

qualification.– Ongoing audits of baths for whiskers is being implemented


cause:

• grain size

• thickness

• carbon content

• intermetallic compoundsinternal stress

remedy:•use min 0.5 m minimum Ni underlayer - 1.27 m already standard on

most products•control crystal structure of layer - development of special tin baths•avoid external stresses to the tin surface






• Tyco has tested and selected several

"whisker mitigating tin plating solutions“• Tyco reviewed and modified all products

to avoid external stress on the tin surface• Nickel underplate should be present in all

cases



Implications: press-fit connections (1)

press-fit types, press-in force



press-fit types, push-out force



board finishes, press-in force, new data (recent)



board finishes, push-out force


Separable interfaces

Coefficient of friction was tested for like on like interfaces

• Room temperature and humidity

• 100 g normal force

• 6mm ball on flat geometry

No significant difference between tin-lead and lead free finishes

coating friction wear

93/7 SnPb 0.46 control

Sn 0.52 Same

Sn/Cu 0.55 same


RoHS Compliance vs. Compatibility

• RoHS Compliant means elimination of all

hazardous materials

• RoHS Compatible means resistant to higher

solder temperatures (approx 30 °C higher)


12.63

5.473.72

227217

183

0

50

100

150

200

250

300T

m d

eg

C

0.00

10.00

20.00

30.00

40.00

50.00

60.00

meta

l co

st

$/k

g

Sn/3.8

Ag/0.5

Cu

Sn/0.7

Cu

Sn/3.5

Ag/0.7

Cu

Implications: resistance to soldering heat (1)

solder types


Generally accepted for reflow and wave soldering:

Tm T solder Tmax

"SAC" (SnAgCu ) 217 ºC 235 - 240 ºC 260 ºC

Sometimes preferred for wave soldering:

SnCu0.7 227 ºC 275 - 280 ºC 275 - 280 ºC

Conventional (reference):

Sn60Pb40 183 ºC 220 - 230 ºC 245 ºC

“outsiders”:

Sn96 Ag2.5 Bi1.01) Cu0.5 210 - 215 ºC 217 ºC 231 ºC

Sn93.5 Ag3.8 Bi2.01) Cu0.7 215 - 219 ºC 217 ºC 231 ºC

Sn93.5 Ag3.5 Bi31) 200 - 210 ºC 217 ºC 231 ºC

1) Concerns about interaction of Bi and Pb during transition from conventional to LF




Coldest spot on assembly is determining factor.

Depends on board design, which is out of our control.

0

50

100

150

200

250

300

0 50 100 150 200 250 300 350 400

time (sec)

tem

p d

eg C

conventional

leadfree smallcomponent

leadfree bigcomponent

"SnAgCu": Tm= 217

SnPb40: Tm= 183

reflow soldering


Local exposure to soldering heat.

T max mainly dependant product design .

Much testing necessary due togreat variation in connector design.

Prediction is not trivial.


wave soldering

contact retention force vs. immersion time

0

2

4

6

8

10

12

14

0 2 4 6 8 10 12

sec

N

265 C 240 C


• Jointly developed by Tyco, FCI, Molex and Amphenol• Download from: http://

www.tycoelectronics.com/environment/leadfree/techdata.stm



T melt

HDT (1.82 MPa)

T max < HDT(1.82 MPa) OK

T max > T melt NO

HDT(1.82 MPa) < T max < T melt TEST

T max

Higher solder temperature means higher temperature load on plastic.Present criteria:

• maximum temperature part is exposed to, (T max )• relative to melting point (T melt) • heat deflection temperature ([email protected])



Selected maximum temperature, for SMD: we prefer 260 degC for wave: can be 260 to 280

Generally accepted "danger temperature":280 deg C

back



Logistics Issues/Strategy – Connectors

• Conversions for ELV completed as “Running Change”– No part number change (mandated by our automotive customers)– Attempted FIFO inventory management and labeling to control

• Conversions for RoHS per Standard EC/PCN Process• TE Strategy : new part numbers for all parts which need

conversion to become RoHS compatible– Any material change must be coordinated w/ plating change– Updated product documentation & application specification will be

provided as appropriate

• Key for TE is NOT to support 2 versions of product (Sn&SnPb) for extended time period– Intent will be to obsolete non-compliant part by 7/1/2006 in most cases


Part coding/X-referencing

• Codes/Systems/X-references have been developed to capture and maintain this information

– RoHS/EVL Code – created/maintained in database

– Processing capability code – created/maintained in database

– X-reference (alternate part) created and maintained in database

• Above codes/information is disseminated to other systems

– E-Catalog (accessible by customers)

– Global part master (DMF)

– SAP and other manufacturing systems (codes only)




Product Labeling• Marking individual products will be cost prohibitive as infrastructure does not

exist today

• Compliant products manufactured will have RoHS compliant text/label at a minimum on shipping carton

• Can be an additional sticker or pre-printed in reverse print

• TE has no plans to implement JEDEC or IPC label spec for connector

– No room on product/label

– Information on label not useful for process setup, rework, or recycling

• Part number change precludes need to use labels for material control or process compatibility

Directive 2002/95/EC (RoHS) Compliant


The End

questions?

Documents

RoHS – Wetgeving & praktijk RoHS from the Perspective of a Connector Manufacturer Jan Broeksteeg Engineering Manager CCCE EMEA Tyco Electronics Nederland